TWM545361U - Air-cooling and liquid-cooling composite heat dissipator - Google Patents

Description

Air cooled liquid cooled composite radiator

This creation is about a kind of radiator, especially an air-cooled liquid-cooled composite radiator that has both air-cooling and water-cooling methods.

In the era of rapid technological development, the advancement of the computer industry has become an indicator of technological development. In order to improve the performance of computers, the world's major computer companies continue to develop new motherboards and chips (such as central processing units, display cards, sound cards and memory). For example, the central processor evolved from the original single-core processor to a dual-core processor and evolved into today's multi-core processor.

Although various electronic components on the computer motherboard are constantly being introduced, the thermal energy generated by the internal resistance of the electronic component itself cannot be avoided when the current is flowing. When the heat energy is too high, the temperature of the electronic component is increased, and the operation efficiency of the electronic component is liable to be lowered. What's more, when the temperature of the electronic component reaches a critical temperature, the electronic component will be destroyed due to the high temperature, and the computer will be down.

In order to solve the negative effects of thermal energy on electronic components, people install heat sinks on electronic components or motherboards. Among them, two types of radiators are most common. These two types of heat sinks are air-cooled and water-cooled. In order to explain in detail the air cooling For the heat sink, please refer to the first figure. The first figure shows the schematic diagram of the air-cooled heat sink provided by the prior art.

As shown in the figure, the prior art provides an air-cooled heat sink PA1. The air-cooled heat sink PA1 is disposed on an electronic component PA2 and includes a substrate PA11 and a plurality of heat pipes PA12 (only one of which is labeled here). , two heat sink fin assemblies PA13 (only one of which is labeled here), a positioning plate PA14 and a fan PA15. The heat transfer pipe PA12 is connected to the electronic component PA2 and is provided on the substrate PA11. The heat pipe PA12 extends away from the electronic component PA2 and is disposed on the positioning plate PA14 through the heat dissipation fin assembly PA13. The fan PA15 is coupled to the substrate PA11 and the positioning plate PA14.

When the electronic component PA2 conducts current to generate thermal energy, the heat pipe PA12 coupled to the electronic component PA2 transfers thermal energy to the heat sink fin assembly PA13. At this time, the fan PA15 generates the heat dissipation airflow PAF of the first-class heat dissipation fin assembly PA13, thereby dissipating the heat energy transmitted to the heat dissipation fin assembly PA13. At the same time, the heat dissipation airflow PAF will dissipate the thermal energy of the peripheral region of the electronic component PA2 because it flows through the area around the electronic component PA2.

However, since the heat pipe PA12 is relatively weak, the heat pipe PA12 is easily damaged. Therefore, although the air-cooled heat sink PA1 provided by the prior art can effectively dissipate the heat generated by the electronic component PA2 during operation, if the heat pipe PA12 is damaged, the heat dissipation performance of the air-cooled heat sink PA1 will be Rapid decline. The air-cooled heat sink PA1 damaged by the heat pipe PA12 may cause the temperature of the electronic component PA2 that conducts current to continuously rise due to the poor heat dissipation efficiency of the electronic component PA2, and finally Can cause damage to the electronic component PA2.

For a detailed description of the water-cooled heat sink, please refer to the second diagram, which is a schematic view of a water-cooled heat sink provided by the prior art. As shown, the prior art provides a water-cooled heat sink PA3. The water-cooled radiator PA3 includes a water-cooling head PA31, a first line PA32, a heat exchange unit PA33 and a second line PA34. The water cooling head PA31 includes a water cooling head body PA311 and a water cooling head line PA312.

The water-cooling head pipe PA312 is disposed in the water-cooling head body PA311 and communicates with one end of the first pipe PA32 and one end of the second pipe PA34. In addition, the other end of the first line PA32 and the other end of the second line PA34 are connected to the heat exchange unit PA33, so that a heat conductive water PAW flows through the water cooling head line PA312, the first line PA32, and the heat exchange unit PA33. With the second line PA34.

In order to illustrate the water-cooled heat sink PA3 in operation, please refer to the third figure, and the third figure shows the state of use of the water-cooled heat sink provided by the prior art. As shown, the water cooling head PA31 is disposed on an electronic component PA41 located on a circuit board PA4. When the electronic component PA41 generates thermal energy due to the conduction current, thermal energy is transmitted to the heat transfer water PAW via the water cooling head PA31. The hot water guiding PAW flows from the water cooling head line PA312 to the heat exchange unit PA33 via the first line PA32, transfers the heat energy to the heat exchange unit PA33, and dissipates heat through the heat exchange unit PA33. Finally, the heat transfer water PAW will flow back to the water cooling head PA31 from the heat exchange unit PA33 via the second line PA34, thereby continuing to transfer the heat energy generated by the electronic component PA41.

The water-cooled radiator PA3 provided by the prior art can have Effectively dissipating the thermal energy generated by the electronic component PA41, but it is not possible to dissipate a plurality of peripheral electronic components PA42 (here only one of them) which are also disposed on the circuit board PA4 and located around the electronic component PA41. The generated thermal energy thus makes it difficult to lower the temperature of the peripheral electronic component PA42, thereby increasing the probability of damage of the peripheral electronic component PA42.

In addition, if the water-cooled radiator PA3 is unable to flow between the water-cooling head line PA312, the first line PA32, the heat exchange unit PA33, and the second line PA34 due to a failure (for example, pump damage), then The heat energy generated by the electronic component PA41 is hard to be dissipated, thereby causing the temperature of the electronic component PA41 to rise. The performance of the electronic component PA41 whose temperature rises continuously decreases, and if the temperature of the electronic component PA41 exceeds a critical temperature, the electronic component PA41 is damaged.

In summary, if the heat pipe is damaged, the heat dissipation efficiency of the air-cooled heat sink to the electronic component will be greatly reduced, thereby making it difficult to reduce the temperature of the electronic component, which not only affects the performance of the electronic component, but also causes the electronic component to be more Overheated and damaged. In addition, since it is difficult for the water-cooled heat sink to dissipate the thermal energy of the peripheral electronic components, the temperature of the peripheral electronic components is hard to be lowered, thereby reducing the performance of the peripheral electronic components. If the water-cooled heat sink fails and the heat-conducting water stops flowing, the heat energy generated by the electronic component is hard to be dissipated, thereby making it difficult to lower the temperature of the electronic component. High-temperature electronic components not only have reduced performance, but may also damage electronic components.

In view of the prior art, if the heat pipe is damaged, it is difficult for the air-cooled heat sink to effectively disperse the electronic components effectively. heat. It is difficult for the water-cooled heat sink to dissipate heat from the surrounding electronic components, and if the water-cooled heat sink fails and the working fluid stops flowing, the water-cooled heat sink is difficult to effectively dissipate heat from the electronic components.

In order to solve the problems of the prior art, the present invention adopts the necessary technical means to provide an air-cooled liquid-cooled composite heat sink for dissipating a heat energy generated by an electronic component during operation, and comprising a plurality of heat pipes. An air-cooled fin assembly, a liquid cold head, at least one liquid-cooled cooling line assembly, a liquid-cooled fin assembly, and an air flow generating component. The heat pipe is thermally coupled to the electronic component to transfer heat. The airflow generating element, when in operation, produces a radiant airflow that flows along an airflow path. The air-cooled fin assembly is located in an air flow path and is coupled to the heat pipe to absorb the heat energy transferred by the heat pipe.

The liquid cooling head is coupled to the heat pipe for transferring heat energy. The liquid-cooled cooling line assembly is coupled to the liquid cooling head for transferring thermal energy transferred by the liquid cooling head using a working fluid. The liquid-cooled fin assembly is located in the airflow path and is coupled to the liquid-cooled cooling line assembly for absorbing thermal energy transferred by the liquid-cooled cooling line assembly. Wherein, the heat dissipation airflow dissipates the heat energy absorbed by the air-cooled heat sink fin assembly and the liquid-cooled heat sink fin assembly.

The air-cooled liquid-cooled composite heat sink further includes the following preferred technical means as described below, on the basis of the above-mentioned necessary technical means. The electronic component is disposed on a setting surface of a circuit substrate, and the mask is arranged to have a normal direction. The airflow path is perpendicular to the normal direction.

Based on the above-mentioned necessary technical means, the air-cooled liquid-cooled composite heat sink further includes the following preferred technical hand segment. The liquid-cooled heat sink fin assembly, the air-cooled heat sink fin assembly and the airflow generating element are sequentially arranged in an arrangement direction in the air flow path.

Based on the above-mentioned necessary technical means, the air-cooled liquid-cooled composite heat sink further includes the following preferred technical means. The air-cooled liquid-cooled composite heat sink further comprises a heat-conducting substrate. The heat conductive substrate connects the electronic component and the heat pipe to transfer thermal energy from the electronic component to the heat pipe.

Based on the above-mentioned necessary technical means, the air-cooled liquid-cooled composite heat sink further includes the following preferred technical means. The airflow generating component has an air inlet side on the airflow path and an air outlet side on the airflow path and opposite to the air inlet side, and the air cooling fin assembly includes a plurality of first air cooling fins and a plurality of second air Cold fins. The first air-cooled fins are arranged adjacent to the air outlet side, and a plurality of first heat pipe passages are formed in common to allow the heat pipe to pass through the first heat pipe through passage. The second air-cooled fins are arranged adjacent to the air inlet side, and a plurality of second heat pipe passages are formed in common to allow the heat pipe to pass through the second heat pipe through passage.

Based on the above-mentioned necessary technical means, the air-cooled liquid-cooled composite heat sink further includes the following preferred technical means. The airflow generating element has an air inlet side on the airflow path and an air outlet side on the airflow path and on the air inlet side. The liquid-cooled heat sink fin assembly includes a plurality of first liquid cold fins and a plurality of second liquid cold fins. The first liquid cooling fins are arranged adjacent to the air outlet side, and at least one first liquid cooling pipeline passage passage is jointly opened, so that the liquid cooling cooling pipeline assembly is disposed through the first liquid cooling pipeline aisle. Second liquid cold fin adjacent Arranging on the air inlet side, and jointly opening at least one second liquid cooling pipeline passage passage, so that the liquid cooling cooling pipeline assembly is disposed through the second liquid cooling pipeline passage passage.

Based on the above-mentioned necessary technical means, the air-cooled liquid-cooled composite heat sink further includes the following preferred technical means. The liquid-cooled cooling line assembly comprises a first line, a liquid receiving tank, a second line and at least one pump. The first pipeline is connected to the liquid cooling head and is disposed through the first liquid cooling pipeline. The liquid receiving tank is connected to the first pipeline. The second pipeline is connected to the liquid accommodating tank, communicates with the liquid cooling head to communicate with the first pipeline, and is disposed through the second liquid cooling pipeline. The pump is disposed in the first pipeline, the liquid receiving tank or the second pipeline, so that the working fluid flows between the first pipeline, the liquid receiving tank and the second pipeline. In addition, the liquid cooling head is a water cooling head, and the working liquid is water.

Based on the above-mentioned necessary technical means, the air-cooled liquid-cooled composite heat sink further includes the following preferred technical means. The air-cooled liquid-cooled composite radiator further includes a stage. The stage includes a first stage surface and a second stage surface opposite the first stage surface. The liquid receiving box is fixed to the first loading table. The airflow generating element is at least partially coupled to the second stage surface. One end of the heat pipe extends and is coupled to the second stage.

As described above, the air-cooled liquid-cooled composite heat sink provided by the present invention has an air-cooled fin assembly and a liquid-cooled fin assembly, and the air-cooled fin assembly and the liquid-cooled fin. The heat sink fin assemblies are all in the airflow path. Thermal energy is transferred to the air-cooled fin assembly via the heat pipe, and also via the liquid-cooled cooling tube from the liquid cooling head The road assembly is passed to a water-cooled fin assembly. Then, the heat dissipation airflow generated by the airflow generating component is dissipated in the airflow path and transmitted to the heat energy of the air-cooled heat sink fin assembly and the water-cooled heat sink fin assembly.

Compared with the prior art, the air-cooled liquid-cooled composite radiator provided by the present invention is mainly composed of air-cooling heat dissipation means, supplemented by water-cooling heat dissipation means. Therefore, at the same time, both cooling and water cooling are available. Therefore, the heat dissipation efficiency of the air-cooled liquid-cooled composite heat sink is better than that of the air-cooled heat sink and the water-cooled heat sink provided by the prior art. In addition, the heat-dissipating airflow flows through the peripheral area of the electronic component to dissipate the electronic components around the electronic component, thereby solving the problem that the water-cooled heat sink provided by the prior art is difficult to dissipate heat from the surrounding electronic components.

In addition, when the heat pipe of the air-cooled liquid-cooled composite heat sink is damaged, the heat energy can be transferred to the liquid-cooled heat sink fin assembly by the working liquid, and the heat is dissipated by the heat-dissipating airflow. Thereby, the problem that the heat pipe is damaged and the electronic component is damaged is solved. When the pumping failure of the air-cooled liquid-cooled composite heat sink stops the working fluid, the heat energy can still be transferred to the air-cooled heat sink fin assembly through the heat pipe, and the heat is dissipated by the heat dissipation airflow. Thereby, the problem of damage to the electronic components caused by the failure of the water-cooled radiator is solved.

PA1‧‧‧Air-cooled radiator

PA11‧‧‧ substrate

PA12‧‧‧heat pipe

PA13‧‧‧Finishing fin assembly

PA14‧‧‧ Positioning Plate

PA15‧‧‧fan

PA2‧‧‧ electronic components

PA3‧‧‧Water-cooled radiator

PA31‧‧‧ water-cooled head

PA311‧‧‧Water-cooled head body

PA312‧‧‧Water cooled head pipe

PA32‧‧‧First line

PA33‧‧‧Heat exchange components

PA34‧‧‧Second line

PA4‧‧‧ circuit board

PA41‧‧‧Electronic components

PA42‧‧‧ peripheral electronic components

PAF‧‧‧heating airflow

PAW‧‧‧Heat water

1‧‧‧Air-cooled liquid-cooled composite radiator

11‧‧‧thermal substrate

12‧‧‧Heat pipe

13‧‧‧Air-cooled fin assembly

131‧‧‧First air-cooled fins

132‧‧‧Second air-cooled fins

14‧‧‧ liquid cold head

15‧‧‧Liquid cooling cooling line assembly

151‧‧‧First line

152‧‧‧Liquid accommodating box

153‧‧‧Second line

154‧‧‧ pump

16‧‧‧Liquid cooling fin assembly

161‧‧‧First liquid cold fins

162‧‧‧Second liquid cold fins

17‧‧‧Airflow generating components

18‧‧‧

19‧‧‧ Cover

2‧‧‧ boards

21‧‧‧Electronic components

22‧‧‧ peripheral electronic components

A‧‧‧ liquid cold fin arrangement direction

B1, B2‧‧‧ direction

C1‧‧‧First heat pipe through passage

C2‧‧‧Second heat pipe through passage

C3‧‧‧First liquid cooling pipeline through passage

C4‧‧‧Second liquid cooling pipeline through passage

F‧‧‧heating airflow

I‧‧‧wind side

N1‧‧‧ substrate normal direction

N2‧‧‧ normal direction

O‧‧‧ wind side

P‧‧‧Setting surface

S‧‧‧ airflow path

T1‧‧‧ first loading surface

T2‧‧‧second loading table

W‧‧‧Working liquid

The first figure shows a schematic view of an air-cooled heat sink provided by the prior art; The second figure shows a schematic diagram of a water-cooled heat sink provided by the prior art; the third figure shows a schematic view of the state of use of the water-cooled heat sink provided by the prior art; and the fourth figure shows the gas provided by the preferred embodiment of the present invention. A perspective view of a cold liquid-cooled composite heat sink; a fifth view showing a side view of the air-cooled liquid-cooled composite heat sink provided by the preferred embodiment of the present invention; and a sixth figure showing the preferred embodiment of the present invention. A partial perspective view of an air-cooled liquid-cooled composite heat sink; and a seventh diagram showing a state of use of the air-cooled liquid-cooled composite heat sink provided by the preferred embodiment of the present invention.

Please refer to the fourth figure. The fourth figure shows a perspective view of the air-cooled liquid-cooled composite heat sink provided by the preferred embodiment of the present invention. As shown, the preferred embodiment of the present invention provides an air-cooled liquid-cooled composite heat sink 1. The air-cooled liquid-cooled composite heat sink 1 comprises a heat-conducting substrate 11 , a plurality of heat-conducting tubes 12 (only one of which is labeled here), an air-cooled fin assembly 13 , a liquid cooling head 14 , and a liquid-cooled cooling system. The pipe assembly 15, a liquid-cooled fin assembly 16, an airflow generating component 17, a carrier 18 and a cover 19.

The heat conductive substrate 11 is coupled to the heat transfer pipe 12 and the liquid cooling head 14. Wherein, since copper is a good conductor of heat, in the present embodiment, the heat conductive substrate 11 is made of copper, but in other embodiments, this is not Limited. The stage 18 includes a first stage surface T1 that faces the thermal substrate 11 and a second stage surface T2 that faces the thermally conductive substrate 11. The airflow generating component 17 is partially coupled to the second loading surface T2 and located in an airflow path S, and has an air inlet side I on the airflow path S and an air outlet side O on the airflow path S and opposite to the air inlet side I. . In the present embodiment, the airflow generating component 17 is a fan, which is not limited in other embodiments.

Please refer to the fifth figure, which is a side view showing the air-cooled liquid-cooled composite heat sink provided by the preferred embodiment of the present invention. As shown in the figure, the heat pipe 12 is disposed on the heat conductive substrate 11 and partially extends along a normal direction N1 of the substrate perpendicular to the heat conductive substrate 11 and is coupled to the second stage surface T2. The heat pipe 12 is thermally coupled to the heat source via the heat conductive substrate 11. In other embodiments, the heat pipe 12 can be directly in contact with the heat source. In addition, in the present embodiment, the heat pipe 12 is a heat pipe which is generally used in the industry, and may be a solid metal strip or a hollow metal tube in other embodiments, but is not limited thereto.

The air-cooled fin assembly 13 includes a plurality of first air-cooled fins 131 (only one of which is labeled here) and a plurality of second air-cooled fins 132 (only one of which is labeled herein). The first air-cooling fins 131 are located at the airflow path S adjacent to the air outlet side O, and are arranged along the normal direction N1 of the substrate, and jointly open a plurality of first heat pipe passages C1 (only one of which is indicated here) By). The heat pipe 12 is bored and connected to the first heat pipe through passage C1. The second air-cooling fins 132 are located at the airflow path S adjacent to the air inlet side I, and are arranged along the normal direction of the substrate N1, and jointly open a plurality of second heat pipe passages C2, wherein the heat pipe 12 is worn. The second heat pipe is disposed through the passage C2.

Please refer to FIG. 5 and FIG. 6 together. FIG. 6 is a partial perspective view showing the air-cooled liquid-cooled composite heat sink provided by the preferred embodiment of the present invention. As shown in the figure, the liquid cooling head 14 is disposed on the heat conductive substrate 11 and is coupled to the heat transfer pipe 12. In the present embodiment, the liquid cooling head 14 is internally provided with an internal piping structure similar to the prior art water-cooling head line PA312 (shown in the second drawing). The heat pipe 12 connected to the liquid cooling head 14 can directly contact a working liquid W accommodated in the internal pipe structure. In other embodiments, the heat pipe 12 can be heat exchanged with the working liquid W accommodated in the internal pipe structure in a non-contact manner, but is not limited thereto. In the present embodiment, the liquid cooling head 14 is a water-cooling head, and the working liquid W is water. In other embodiments, the working liquid W may be oil, alcohol or other organic solution, but is not limited thereto.

The liquid-cooled cooling line assembly 15 includes a first line 151, a liquid receiving tank 152, a second line 153 and a pump 154. A first conduit 151 and a second conduit 153 communicate with the internal conduit structure of the liquid cooling head 14 and the liquid containment tank 152 to form a circulating conduit. The liquid receiving box 152 and the pump 154 are fixed to the first stage surface T1, and the first stage surface T1 is covered by the cover body 19. The liquid accommodating tank 152 is used to replenish the working fluid W. In the present embodiment, the liquid accommodating tank 152 is a water tank. In the present embodiment, the pump 154 is located in the first line 151, which is not limited thereto in other embodiments.

The liquid-cooled heat sink fin assembly 16 includes a plurality of first liquid-cooled fins 161 and a plurality of second liquid-cooled fins 162. The first liquid cooling fin 161 is located adjacent to the air outlet side O of the air flow path S, and is arranged along a liquid cooling fin arrangement direction A perpendicular to the substrate normal direction N1 and the air flow path S. Columns, and jointly set up four first liquid-cooled pipelines through the passage C3 (only one of which is indicated here). The first line 151 extends from the liquid cooling head 14 and passes through the first liquid cooling line through passage C3 to communicate with the liquid receiving box 152 located on the first stage surface T1. The first conduit 151 is coupled to the first liquid cooling fin 161. Since the copper is a good conductor of heat, in the present embodiment, the first conduit 151 is a copper tube, but it is not limited thereto in other embodiments.

The second liquid cooling fins 162 are located adjacent to the air inlet side I of the air flow path S, and are arranged along a water cooling fin arrangement direction A perpendicular to the substrate normal direction N1 and the air flow path S, and jointly open four second The liquid cooling line is routed through channel C4 (only one of which is indicated here). The second line 153 extends from the liquid containing tank 152 and passes through the second liquid cooling line through passage C4 to communicate with the liquid cooling head 14. The second conduit 153 is coupled to the second liquid cooling fin 162. Since the copper is a good conductor of heat, in the present embodiment, the second conduit 153 is a copper tube, but it is not limited thereto in other embodiments.

In general, the liquid-cooling fin assembly 16, the air-cooling fin assembly 13 and the airflow generating element 17 are sequentially arranged in an airflow path S in an array direction. In other words, the first air-cooled fins 131 are adjacent to the air outlet side O and are located between the first liquid cooling fins 161 and the airflow generating element 17, and the second air-cooling fins 132 are adjacent to the air inlet side I. It is located between the second liquid cooling fin 162 and the airflow generating element 17. In more detail, the first liquid cooling fins 161, the first air cooling fins 131 and the airflow generating elements 17 are sequentially arranged along an arrangement direction B1, and the second liquid cooling fins 162 and the second air cooling fins 132 are The airflow generating element 17 is arranged in an opposite direction The direction B1 is arranged in the direction B2.

Please refer to FIG. 6 and FIG. 7 together. FIG. 7 is a schematic view showing the use state of the air-cooled liquid-cooled composite heat sink provided by the preferred embodiment of the present invention. As shown, the air-cooled liquid-cooled composite heat sink 1 is disposed on an electronic component 21. The electronic component 21 is disposed on a mounting surface P of a circuit board 2, and the mounting surface P has a normal direction N2. In the embodiment, the normal direction N1 of the substrate is the same as the direction indicated by the normal direction N2. The embodiment is not limited thereto. Therein, a plurality of peripheral electronic components 22 (only one of which is labeled here) are disposed on the circuit board 2 and at the periphery of the electronic component 21. The electronic component 21 is, for example, a central processing unit and a memory, but is not limited thereto.

When the electronic component 21 is in operation, a thermal energy is generated. Thermal energy is transmitted to the heat transfer pipe 12 and the liquid cooling head 14 via the heat conductive substrate 11 coupled to the electronic component 21. A portion of the thermal energy is transferred to the first air-cooled fins 131 and the second air-cooled fins 132 via the heat transfer tubes 12. Another portion of the thermal energy (from the thermally conductive substrate 11 and the heat transfer tube 12) is transferred to the working fluid W contained in the internal piping structure of the liquid cooling head 14.

Next, the working fluid W is sequentially returned from the liquid cooling head 14 to the liquid cooling head 14 via the first line 151, the liquid containing tank 152, and the second line 153 by the pump 154. When the working liquid W flows to the first line 151, heat energy partially contained in the working liquid W is transmitted to the first liquid cooling fins 161. When the working liquid W flows to the second line 153, heat energy partially contained in the working liquid W is transmitted to the second liquid cooling fins 162.

The airflow generating element 17 generates a heat radiating airflow F that flows along the airflow path S. The heat dissipation airflow F flows from the air inlet side I to the air outlet side O, The heat dissipation air flow F flows through the second liquid cooling fins 162 , the second air cooling fins 132 , the air flow generating elements 17 , the first air cooling fins 131 , and the first liquid cooling fins 161 in sequence. Thereby, the heat dissipation air F is dissipated to the thermal energy of the second liquid cooling fins 162, the second air cooling fins 132, the first air cooling fins 131, and the first liquid cooling fins 161. Since the airflow path S is perpendicular to the normal direction N2, the heat dissipation airflow F flows through the peripheral electronic components 22, thereby dissipating the thermal energy generated by the peripheral electronic components 22.

It is worth mentioning that the user can adjust the power of the pump 154 and the airflow generating element 17 according to the temperature or the degree of use of the electronic component 21 (for example, the amount of calculation of the central processing unit). The flow rate of the working fluid W in the liquid cooling head 14, the first line 151, the liquid containing tank 152, and the second line 153 is controlled by adjusting the pump 154. The velocity of the heat radiating airflow F in the airflow path S is controlled by adjusting the airflow generating element 17.

When the temperature of the electronic component 21 is lower than a predetermined temperature, the pump 154 may be turned off and only the heat transfer tube 12 transfers heat energy to the air-cooled heat sink fin assembly 13. When the temperature of the electronic component 21 is higher than a preset temperature, the output power of the airflow generating component 17 can be enhanced, the pump 154 can be operated to operate or the output power of the pump 154 can be enhanced, thereby increasing the air-cooled liquid-cooled composite heat sink 1 The heat dissipation efficiency of the electronic component 21.

In summary, in the air-cooled liquid-cooled composite heat sink provided by the preferred embodiment of the present invention, the first air-cooled fin, the second air-cooled fin, and the first liquid-cooled fin are located in the airflow path. Cold fins with the second liquid. The thermal energy generated by the electronic component is transmitted to the first air-cooled fin and the second air-cooled fin via the heat pipe. In addition, thermal energy is transferred from the liquid cooling head to the first pipeline and the second pipeline to the first pipeline by working fluid The second line. The thermal energy in the first conduit is transferred to the first liquid cooled fin, and the thermal energy in the second conduit is transferred to the second liquid cooled fin.

Immediately thereafter, the airflow generating element generates a heat dissipation airflow that flows along the airflow path. The heat dissipation airflow sequentially flows through the second liquid cold fin, the second air cooled fin, the first air cooled fin and the first liquid cold fin, thereby dissipating the second liquid cold fin and the second air cooled fin The heat of the sheet, the first air-cooled fin and the first liquid cold fin. In addition, since the heat dissipating airflow passes through the peripheral electronic components located around the electronic components around the electronic components, the heat dissipating airflow can also dissipate the thermal energy generated by the peripheral electronic components.

Compared with the prior art, the air-cooled liquid-cooled composite heat sink provided by the preferred embodiment of the present invention uses a heat pipe to transfer thermal energy to the air-cooled heat sink fin assembly, and dissipates air-cooled heat dissipation through the heat dissipation airflow. The thermal energy of the fin assembly. In addition, thermal energy can be transferred to the liquid-cooled heat sink fin assembly by the working fluid, and the heat energy of the liquid-cooled heat sink fin assembly is dissipated by the heat dissipation airflow. Therefore, the heat dissipation efficiency is much higher than that of the air-cooled radiator and the water-cooled radiator provided by the prior art. In addition, the heat-dissipating airflow flows through the peripheral electronic components located around the periphery of the electronic component, so that the heat-dissipating airflow dissipates heat to the surrounding electronic components. Thereby, the problem that the water-cooled heat sink provided by the prior art is difficult to dissipate and heat the peripheral electronic components is solved.

In addition, when the heat pipe of the air-cooled liquid-cooled composite heat sink is damaged and the heat energy cannot be transmitted to the first air-cooled fin and the second air-cooled fin, the heat energy can still be transferred to the first liquid-cooled by the working liquid. The fin and the second liquid cold fin, and the heat energy of the first liquid cold fin and the second liquid cold fin are dissipated by the heat dissipation airflow. Thereby, the air cooling is solved when the heat pipe is damaged. The heat sink is difficult to effectively dissipate heat from the electronic components and cause damage to the electronic components.

When the pumping fault of the air-cooled liquid-cooled composite radiator causes the working fluid to flow in the liquid cooling head, the first pipeline, the liquid receiving tank and the second pipeline, the heat energy can still be transmitted through the heat pipe The first air-cooled fin and the second air-cooled fin are cooled by the heat-dissipating airflow. Thereby, the problem that when the water-cooled radiator fails, the working fluid stops flowing, and the cold radiator is difficult to effectively dissipate the electronic components, thereby causing damage to the electronic components.

The features and spirit of the present invention are more clearly described in the above detailed description of the preferred embodiments, and the scope of the present invention is not limited by the preferred embodiments disclosed herein. On the contrary, it is intended to cover all kinds of changes and equivalences within the scope of the patent application to which the present invention is intended.

1‧‧‧Air-cooled liquid-cooled composite radiator

11‧‧‧thermal substrate

12‧‧‧Heat pipe

131‧‧‧First air-cooled fins

132‧‧‧Second air-cooled fins

14‧‧‧ liquid cold head

151‧‧‧First line

153‧‧‧Second line

154‧‧‧ pump

161‧‧‧First liquid cold fins

162‧‧‧Second liquid cold fins

17‧‧‧Airflow generating components

18‧‧‧

19‧‧‧ Cover

C3‧‧‧First liquid cooling pipeline through passage

C4‧‧‧Second liquid cooling pipeline through passage

I‧‧‧wind side

N1‧‧‧ substrate normal direction

O‧‧‧ wind side

S‧‧‧ airflow path

T1‧‧‧ first loading surface

T2‧‧‧second loading table

Claims (11)

An air-cooled liquid-cooled composite heat sink for dissipating a heat energy generated when an electronic component operates, and comprising: a plurality of heat pipes connected to the electronic component to transfer the heat energy; an air-cooled type a heat dissipating fin assembly is coupled to the heat conducting tubes to absorb the heat energy transmitted by the heat conducting tubes; a liquid cooling head is coupled to the heat conducting tubes for transmitting the heat energy; at least one liquid cooling type a pipe assembly coupled to the liquid cooling head for transferring the heat energy transmitted by the liquid cooling head with a working fluid; a liquid cooling fin assembly coupled to the at least one liquid cooling cooling line a component for absorbing the thermal energy transmitted by the at least one liquid-cooled cooling line assembly; and an air flow generating component for generating a heat-dissipating airflow flowing along an air flow path during operation, and the air-cooling heat-dissipating fin The component and the liquid-cooled heat sink fin assembly are located in the air flow path, so that the heat dissipation airflow dissipates the heat energy absorbed by the air-cooled heat sink fin assembly and the liquid-cooled heat sink fin assembly. The air-cooled liquid-cooled composite heat sink according to claim 1, wherein the electronic component is disposed on a surface of a circuit board, the mask has a normal direction, and the airflow path is perpendicular to The normal direction. The air-cooled liquid-cooled composite heat sink according to claim 1, wherein the liquid-cooled heat sink fin assembly, the air-cooled type The heat fin assembly and the airflow generating element are sequentially arranged in an array direction in the air flow path. The air-cooled liquid-cooled composite heat sink according to claim 1, further comprising a heat-conducting substrate connecting the electronic component and the heat-conducting tubes, thereby transferring the thermal energy from the electronic component to the heat-transfer pipes . The air-cooled liquid-cooled composite heat sink according to claim 1, wherein the airflow generating component has a wind inlet side on the airflow path and a gas flow path and opposite to the airflow side. The air-cooling fin assembly comprises: a plurality of first air-cooling fins arranged adjacent to the air outlet side, and jointly opening a plurality of first heat pipe passage passages, thereby The heat pipes are disposed in the first heat pipe passages; and the plurality of second air-cool fins are arranged adjacent to the air inlet side, and a plurality of second heat pipe passages are formed together. Therefore, the heat pipes are disposed through the second heat pipe through passages. The air-cooled liquid-cooled composite heat sink according to claim 1, wherein the airflow generating component has a wind inlet side on the airflow path and a gas flow path and opposite to the airflow side. The air-cooling fin assembly comprises: a plurality of first liquid cooling fins arranged adjacent to the air outlet side, and jointly opening at least one first liquid cooling pipeline passage passage, thereby For the a first liquid-cooled cooling pipe assembly is disposed through the at least one first liquid-cooled pipe passage passage; and a plurality of second liquid-cooled fins are arranged adjacent to the air inlet side, and jointly open at least A second liquid cooling pipe is disposed through the passage, so that the at least one liquid cooling cooling pipe assembly is disposed through the at least one second liquid cooling pipe passage. The air-cooled liquid-cooled composite heat sink according to claim 6, wherein each of the at least one liquid-cooled cooling pipe assembly comprises: a first pipe connected to the liquid cooling head and worn Provided in the at least one first liquid-cooling pipeline passage passage; a liquid accommodating tank connected to the first pipeline; a second pipeline connected to the liquid accommodating tank and communicating with the liquid Coolingly communicating with the first conduit and passing through the at least one second liquid cooling conduit passage passage; and at least one pump disposed in the first conduit, the liquid receiving tank and the At least one of the second conduits for flowing the working fluid between the first conduit, the liquid containment tank, and the second conduit. The air-cooled liquid-cooled composite heat sink according to claim 7, further comprising a stage, the stage comprising a first loading surface, the liquid receiving box being fixed to the first loading surface. The air-cooled liquid-cooled composite heat sink according to claim 8 , wherein the stage further comprises a second surface opposite to the first loading surface The loading surface, the airflow generating component is at least partially coupled to the second loading surface. The air-cooled liquid-cooled composite heat sink according to claim 8, wherein one of the heat transfer tubes extends and is coupled to the second stage surface. The air-cooled liquid-cooled composite radiator according to claim 1, wherein the liquid cooling head is a water-cooling head, and the working liquid is water.