TWI720866B - Heat dissipation structure of handheld device - Google Patents

Abstract

A heat dissipation structure of handheld device includes a hollow frame body and a two-phase flow heat exchange unit. The hollow frame body has a hollow receiving space at the center. The two-phase flow heat exchange unit has at least one two-phase flow conduction section. The two-phase flow heat exchange unit is disposed in the hollow receiving space and securely connected with the hollow frame body. The heat dissipation structure of handheld device can enhance the heat dissipation performance and the support structural strength of the handheld device.

Description

Hand-held device heat dissipation structure

A heat dissipation structure of a handheld device, in particular, a heat dissipation structure of a handheld device that can increase the heat dissipation efficiency of the handheld device and enhance the structural strength.

With the doubling of the performance and processing speed of handheld mobile devices, the internal electronic components will also generate a high thermal response, which is transmitted to the entire handheld device, causing the user to burn hands and the electronic components will burn out due to overheating. It is necessary to de-heat the internal electronic components.

Current handheld mobile devices usually use a middle frame or a casing as the base to mount various electronic components and touch screens. The middle frame or casing is usually an integrated structure through machining. Therefore, the company adds auxiliary heat transfer elements such as copper sheets, graphite sheets, thin heat pipes, two-phase flow heat exchange units, etc. inside the mobile device to diffuse and dissipate the heat generated by the internal electronic components or guide it to the remote end. Antipyretic heat conduction.

The one-piece middle frame shell 3 is formed by a single material through machining such as milling or stamping. The single material is made of aluminum, aluminum alloy, or copper alloy. Lightweight materials will lose structural strength. Materials with better strength increase the weight. If you choose a material with better heat transfer efficiency, such as pure copper, the heat transfer efficiency can be improved, but the weight is heavier, and the strength of the pure copper soft structure is not good, so choose a single-material middle frame shell Body 3 cannot take into account both thermal conductivity and structural strength.

Furthermore, please refer to Figure 11. The conventional middle frame housing 3 is used to carry various electronic components 4 and heat dissipation or heat conduction elements 5. When the material of the middle frame housing 3 has poor thermal conductivity, the heat dissipation or heat conduction elements must be used 5 auxiliary To facilitate heat conduction, the heat dissipating or heat conducting element 5 must first be attached to the middle frame housing 3 and then stacked with the electronic components 4 for heat conduction. This will increase the overall thickness and weight of the middle frame housing 3, making it impossible to achieve thinning And lightweight effect.

In addition, since the handheld device is oriented toward thinness and weight reduction, how to choose materials that can take into account lightness and thinness and have good structural strength is the primary improvement for the industry.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a heat dissipation structure of a handheld device that combines a plurality of materials together and provides better heat conduction and better structural strength at the same time.

To achieve the above objective, the present invention provides a heat dissipation structure for a handheld device, which includes: a hollow frame and a two-phase flow heat exchange unit; the hollow frame has a hollow accommodating space in the center, and the hollow frame is The rim has a joint; the two-phase flow heat exchange unit has at least one two-phase flow conduction area, the outer edge of the two-phase flow conduction area has a lip, and the two-phase flow heat exchange unit is arranged in the aforementioned hollow housing In the space, and the lip part is combined and fixed with the aforementioned joint part.

By combining the hollow frame and the two-phase flow heat exchange unit with different materials, not only can the two-phase flow heat exchange unit improve the heat conduction performance, but also the hollow frame can be used to select a structure with higher strength The best material enhances the structural strength.

1: Hollow frame

11: Hollow housing space

12: Joint

2: Two-phase flow heat exchange unit

2a: The first uniform temperature plate

2aa: lips

2b: The second uniform temperature plate

2ba: lips

21: Two-phase flow conduction area

21a: The first airtight chamber

21b: The second airtight chamber

211: Airtight Chamber

212: Capillary structure

213: working fluid

22: Lips

3: Middle frame shell

4: electronic components

5: Heat dissipation or heat conduction components

Figure 1 is a perspective exploded view of the first embodiment of the heat dissipation structure of the handheld device of the present invention; Figure 2 is a combined cross-sectional view of the first embodiment of the heat dissipation structure of the handheld device of the present invention; Figure 3 is the handheld device of the present invention The cross-sectional schematic diagram of the second embodiment of the device heat dissipation structure; FIG. 4 is the cross-sectional schematic diagram of the third embodiment of the handheld device heat dissipation structure of the present invention; Fig. 5 is a three-dimensional exploded schematic view of the fourth embodiment of the heat dissipation structure of a handheld device of the present invention; Fig. 6 is a three-dimensional assembly schematic view of the fourth embodiment of the heat dissipation structure of a handheld device of the present invention; A perspective exploded view of the fifth embodiment of a handheld device heat dissipation structure; Fig. 8 is a combined cross-sectional view of the fifth embodiment of a handheld device heat dissipation structure of the present invention; Fig. 9 is a perspective exploded view of a sixth embodiment of the handheld device heat dissipation structure of the present invention Figure 10 is a combined cross-sectional view of the sixth embodiment of the heat dissipation structure of the handheld device of the present invention; Figure 11 is a schematic cross-sectional view of the conventional technology.

The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 and 2, which are a three-dimensional exploded and combined cross-sectional view of the first embodiment of the hand-held device heat dissipation structure of the present invention. As shown in the figure, the hand-held device heat dissipation structure includes: a hollow frame 1, a Two-phase flow heat exchange unit 2;

The hollow frame body 1 has at least one hollow accommodating space 11 at any position. The present invention chooses to provide a hollow accommodating space 11 at the center, and both ends of the hollow accommodating space 11 are open and transparent The hollow frame 1 has a joint 12 on the inner edge, and the joint 12 is used in contact with the two-phase flow heat exchange unit 2.

The two-phase flow heat exchange unit 2 has at least one two-phase flow conduction area 21, the outer edge of the two-phase flow conduction area 21 has a lip 22, and the two-phase flow heat exchange unit 2 is arranged in the aforementioned hollow accommodating space 11, and the lip portion 22 is combined and fixed with the aforementioned joint portion 12. The joint portion 12 and the lip portion 22 are combined by welding, bonding, snapping, tight fitting, embedding, and snapping. In the embodiment, the joint 12 is a groove, and the lip 22 is fitted into the groove to be combined with the hollow frame 1, and the two-phase flow heat exchange The unit 2 is a uniform temperature plate or a flat-plate heat pipe, and this embodiment uses the uniform temperature plate as an illustration but is not limited to it.

The two-phase flow conduction area 21 has an airtight chamber 211, the inner wall of the airtight chamber 211 has a capillary structure 212, and the airtight chamber 211 is filled with a working fluid 213.

The hollow frame body 1 and the two-phase flow heat exchange unit are made of copper, aluminum, stainless steel, ceramic, commercial pure titanium, titanium alloy, copper alloy, and aluminum alloy. The hollow frame body 1 and the two-phase flow The material selection of the flow heat exchange unit 2 is to use different materials to match each other, so as to obtain the required material characteristics individually while improving the heat conduction efficiency and structural strength.

Please refer to FIG. 3, which is a schematic cross-sectional view of the second embodiment of the heat dissipation structure of the handheld device of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. The difference between this embodiment and the foregoing first embodiment is that the two-phase flow conduction area 21 in this embodiment is composed of a plurality of independent airtight chambers 211, and the independent airtight chambers 211 are divided into two-phase flow heat. For each part of the exchange unit 2, the lip 22 surrounds the independent airtight chambers 211, that is, the two-phase flow conduction area 21 of the two-phase flow heat exchange unit 2 of this embodiment has a plurality of independent airtight chambers 211 and Each is independently distributed in different parts of the two-phase flow heat exchange unit 2, thereby providing a heat transfer effect corresponding to the high thermal conductivity where electronic components need to be installed.

Please refer to Figure 4, which is a schematic cross-sectional view of the third embodiment of the heat dissipation structure of the handheld device of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the two-phase flow conduction area 21 of this embodiment has a first airtight chamber 21a and a second airtight chamber 21b, the first and second airtight chambers The chambers 21a and 21b are respectively provided with the upper and lower ends of the two-phase flow heat exchange unit 2, and the height of the first airtight chamber 21a is higher than that of the second airtight chamber 21b. The heights of the closed chambers 21a and 21b are not the same, the system can provide different Electronic components of the same height or thickness are arranged correspondingly, thereby providing a corresponding heat conduction area in a limited space.

Please refer to Figures 5 and 6, which are the three-dimensional exploded and assembled schematic diagrams of the fourth embodiment of the heat dissipation structure of the handheld device of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be described here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that the two-phase flow heat exchange unit 2 has a first uniform temperature plate 2a and a second uniform temperature plate 2b. The lips 2aa, 2ba of the warm plates 2a, 2b are joined to each other, and the peripheral lips 2aa, 2ba of the first and second uniform temperature plates 2a, 2b are joined with the joint 12 of the hollow frame 1, that is, the first , The lips 2aa, 2ba of the two uniform temperature plates 2a, 2b corresponding to each other are integrated in advance through any of welding, bonding, clamping, tight fitting, and embedding, and the outer periphery of the first and second uniform temperature plates 2a, 2b The lips 2aa, 2ba are combined with the hollow frame 1 through any of welding, bonding, snapping, tight fitting, and inlay connection.

Please refer to Figures 7 and 8, which are a three-dimensional exploded and combined cross-sectional view of the fifth embodiment of the heat dissipation structure of the handheld device of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be omitted here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that the lip 22 has a clamping end 221, the aforementioned joint 12 has a clamping groove 121, and the clamping end 221 is elastic and is clamped. The clamping groove 121 is combined and fixed with the clamping groove 121, so that the hollow frame 1 and the two-phase flow heat exchange unit 2 are combined into one body.

Please refer to Figures 9 and 10, which are three-dimensional exploded and combined cross-sectional views of the sixth embodiment of the heat dissipation structure of the handheld device of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be described here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that the lip 22 has a buckle end 222, the aforementioned joint portion 12 has a buckle hole 122, and the buckle end 222 is fastened to the buckle hole 122. The middle and the button hole 122 are combined and fixed, so that the hollow frame body 1 and the two-phase flow heat exchange unit 2 are combined into one body.

The present invention is mainly to combine the hollow frame body and the two-phase flow heat exchange unit through independent manufacturing. Such a configuration can choose to use different materials to manufacture the hollow frame body 1 and the two-phase flow heat exchange unit 2, through The material characteristics of different materials provide the performance of improving the structural strength and heat conduction respectively. If the parts with better structural strength are required, stainless steel or titanium or titanium alloy can be used to provide better support strength. The hollow frame 1 in this case combines two-phase flow The heat exchange unit 2 as a combination can directly pass through the two-phase flow heat exchange unit 2 with the two-phase flow heat exchange effect to provide the work of carrying electronic components and heat conduction at the same time, without increasing the thickness of the heat transfer element and eliminating it. The arrangement of heat dissipation and heat transfer elements greatly reduces the overall weight and thickness, achieving the purpose of lightening and thinning, and then improving the conventional choice of a single material that can only provide the lack of a single material characteristic.

1: Hollow frame

11: Hollow housing space

12: Joint

2: Two-phase flow heat exchange unit

21: Two-phase flow conduction area

22: Lips

Claims (9)

A heat dissipation structure for a handheld device includes: a hollow frame with a hollow accommodating space, the inner edge of the hollow frame has a joint; at least one two-phase flow heat exchange unit with at least one two-phase flow conduction area, so The two-phase flow heat exchange unit is arranged in the aforementioned hollow accommodating space to be combined and fixed with the hollow frame, the outer edge of the two-phase flow conduction area has a lip portion, and the lip portion is combined with the aforementioned joint portion, the joint portion The lip is combined with the lip through any of welding, bonding, clamping, tight fitting, embedding, and buckling. The heat dissipation structure of the handheld device according to claim 1, wherein the hollow frame and the two-phase flow heat exchange unit are made of different materials. The hand-held device heat dissipation structure according to claim 1, wherein the joint is a groove, and the lip is fitted into the groove to be combined with the hollow frame. The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow conduction area has an airtight chamber, the inner wall of the airtight chamber has a capillary structure, and the airtight chamber is filled with a working fluid . The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow conduction area is composed of a plurality of independent airtight chambers, and the independent airtight chambers are divided into the two-phase flow heat exchange unit In each part, the lip surrounds the outside of the independent airtight chambers. The heat dissipation structure of the handheld device according to claim 1, wherein the hollow frame and the two-phase flow heat exchange unit are made of copper, aluminum, stainless steel, ceramic, commercial pure titanium, titanium alloy, copper alloy, and aluminum alloy Either. The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow conduction area has a first airtight chamber and a second airtight chamber, the first airtight chamber and the second airtight chamber Two airtight The chamber is divided into upper and lower ends of the two-phase flow heat exchange unit, and the height of the first airtight chamber is higher than the second airtight chamber. The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow heat exchange unit has a first uniform temperature plate and a second uniform temperature plate, and the first uniform temperature plate and the second uniform temperature plate The lips of the warming plate are joined to each other, and the peripheral lip of the first and second uniform temperature plates are joined to the joining part of the hollow frame. The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow heat exchange unit is a uniform temperature plate or a flat heat pipe.

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