TWM600069U - Heat dissipation structure of handheld device - Google Patents

Abstract

A heat dissipation structure for a handheld device, which includes: a hollow frame and a two-phase flow heat exchange unit; There is a hollow accommodating space at the center of the hollow frame; the two-phase flow heat exchange unit has at least one two-phase flow conduction area, and the two-phase flow heat exchange unit is disposed in the hollow accommodating space and the hollow frame. Combined with fixing, this creative system can improve the heat dissipation performance of the handheld device and the strength of the supporting structure.

Description

Hand-held device heat dissipation structure

A heat dissipation structure of a handheld device, in particular, a heat dissipation structure of a handheld device that can increase the heat dissipation efficiency of the handheld device and improve the structural strength.

With the doubling of the performance and processing speed of handheld mobile devices, the internal electronic components will also generate a high thermal response, which is transmitted to the entire handheld device, causing the user to become hot and the electronic components will burn out due to overheating. It is necessary to de-heat the internal electronic components. Current handheld mobile devices usually use a middle frame or a shell as the base to mount various electronic components and touch screens, and the middle frame or shell is usually an integrated structure through machining Therefore, the company adds auxiliary heat transfer elements such as copper sheets, graphite sheets, thin heat pipes, two-phase heat exchange units, etc. inside the mobile device to dissipate the heat generated by the internal electronic components or guide them to the remote Antipyretic heat conduction. The one-piece middle frame shell 3 is formed by a single material through machining such as milling or stamping. The single material is made of aluminum, aluminum alloy or copper alloy. Lightweight materials will lose structural strength. Materials with better strength increase the weight. If you choose a material with better heat transfer efficiency, such as pure copper, the heat transfer efficiency can be improved, but the weight is heavier, and the strength of the pure copper soft structure is not good, so choose a single material middle frame shell Body 3 cannot take into account both thermal conductivity and structural strength. Furthermore, please refer to Figure 11. The conventional middle frame housing 3 is used to carry various electronic components 4 and heat dissipation or heat conduction elements 5. When the material of the middle frame housing 3 has poor thermal conductivity, the heat dissipation or heat conduction elements must be used 5 Auxiliary heat conduction. The heat dissipation or heat conduction element 5 must first be attached to the middle frame housing 3 and then stacked with the electronic components 4 for heat conduction. This will increase the overall thickness and weight of the middle frame housing 3 and cannot achieve thinness. The effect of chemical and lightweight. In addition, since the handheld device is oriented toward thinness and weight reduction, how to select materials that can take into account weight reduction and thinness and have good structural strength is the primary improvement for the industry.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of this creation is to provide a heat dissipation structure of a handheld device that combines a plurality of materials together while providing better heat conduction and better structural strength. In order to achieve the above purpose, this creation provides a handheld device heat dissipation structure, which includes: a hollow frame, and a two-phase flow heat exchange unit; There is a hollow accommodating space at the center of the hollow frame, and the inner edge of the hollow frame has a joint; the two-phase flow heat exchange unit has at least one two-phase flow conduction area, and the outer edge of the two-phase flow conduction area has A lip, the two-phase flow heat exchange unit is arranged in the aforementioned hollow accommodating space, and the lip is combined and fixed with the aforementioned joint. By combining the hollow frame and the two-phase flow heat exchange unit with different materials, not only can the two-phase flow heat exchange unit improve the heat conduction performance, but also the hollow frame can be used to select a structure that is stronger The best material improves the structural strength.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 1 and 2, which are three-dimensional exploded and combined cross-sectional views of the first embodiment of the hand-held device heat dissipation structure created by this creation. As shown in the figure, the hand-held device heat dissipation structure includes: a hollow frame 1, a Two-phase flow heat exchange unit 2; The hollow frame body 1 has at least one hollow accommodating space 11 at any position. This creation system chooses to set a hollow accommodating space 11 in the center, and both ends of the hollow accommodating space 11 are open and transparent The hollow frame 1 has a joint 12 on the inner edge, and the joint 12 is used in contact with the two-phase flow heat exchange unit 2. The two-phase flow heat exchange unit 2 has at least one two-phase flow conduction area 21, the outer edge of the two-phase flow conduction area 21 has a lip 22, and the two-phase flow heat exchange unit 2 is arranged in the aforementioned hollow accommodating space 11, and the lip portion 22 is combined and fixed with the aforementioned joint portion 12, and the joint portion 12 and the lip portion 22 are combined by welding, bonding, snapping, tight fitting, embedding, and buckling. In the embodiment, the joint 12 is a groove, the lip 22 is fitted into the groove to be combined with the hollow frame 1, and the two-phase flow heat exchange unit 2 is a uniform temperature plate or a For flat-plate heat pipes, this embodiment is implemented with a uniform temperature plate as an illustration, but is not limited to it. The two-phase flow conduction area 21 has an airtight chamber 211, the inner wall of the airtight chamber 211 has a capillary structure 212, and the airtight chamber 211 is filled with a working fluid 213. The hollow frame body 1 and the two-phase flow heat exchange unit are made of copper, aluminum, stainless steel, ceramic, commercial pure titanium, titanium alloy, copper alloy, and aluminum alloy. The hollow frame body 1 and the two-phase flow The material selection of the flow heat exchange unit 2 is to use different materials to match each other, so as to obtain the required material characteristics individually while improving the heat transfer efficiency and structural strength. Please refer to Figure 3, which is a schematic cross-sectional view of the second embodiment of the hand-held device heat dissipation structure created. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the two-phase flow conduction area 21 in this embodiment is composed of a plurality of independent airtight chambers 211, and the independent airtight chambers 211 are divided into two-phase flow heat. In each part of the exchange unit 2, the lip 22 surrounds the independent airtight chambers 211, that is, the two-phase flow conduction area 21 of the two-phase flow heat exchange unit 2 of this embodiment has a plurality of independent airtight chambers 211 and Each is independently distributed in different parts of the two-phase flow heat exchange unit 2, thereby providing a heat transfer effect corresponding to the high thermal conductivity where electronic components need to be installed. Please refer to Figure 4, which is a schematic cross-sectional view of the third embodiment of the heat dissipation structure of the handheld device created by this invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the two-phase flow conduction area 21 in this embodiment has a first airtight chamber 21a and a second airtight chamber 21b, the first and second airtight chambers The chambers 21a and 21b are separately provided with the upper and lower ends of the two-phase flow heat exchange unit 2, and the first airtight chamber 21a is higher than the second airtight chamber 21b. The first and second airtight chambers of this embodiment The heights of the dense chambers 21a and 21b are not the same, and the corresponding assembly of electronic components of different heights or thicknesses can be provided, thereby providing corresponding heat conduction areas in a limited space. Please refer to Figures 5 and 6, which are a three-dimensional exploded and combined schematic diagram of the fourth embodiment of the hand-held device heat dissipation structure created for this creation. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be omitted here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that the two-phase flow heat exchange unit 2 has a first uniform temperature plate 2a and a second uniform temperature plate 2b. The lips 2aa, 2ba of the warm plates 2a, 2b are joined to each other, and the peripheral lips 2aa, 2ba of the first and second uniform temperature plates 2a, 2b are joined with the joint 12 of the hollow frame 1, that is, the first , The lips 2aa, 2ba of the two uniform temperature plates 2a, 2b corresponding to each other are integrated in advance by welding, bonding, clamping, tight fitting, and inlaid, and the first and second uniform temperature plates 2a, 2b are peripheral The lips 2aa, 2ba are then combined with the hollow frame 1 through any of welding, bonding, snapping, tight fitting, and embedding. Please refer to Figures 7 and 8, which are three-dimensional exploded and combined cross-sectional views of the fifth embodiment of the hand-held device heat dissipation structure created. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be described here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that the lip 22 has a clamping end 221, the aforementioned joint 12 has a clamping groove 121, and the clamping end 221 is elastic and is clamped. The clamping groove 121 is combined and fixed with the clamping groove 121, so that the hollow frame 1 and the two-phase flow heat exchange unit 2 are combined into one body. Please refer to Figures 9 and 10, which are a three-dimensional exploded and combined cross-sectional view of the sixth embodiment of the hand-held device heat dissipation structure created. As shown in the figure, part of the structure of this embodiment is the same as that of the foregoing first embodiment, so it will not be described here. To repeat, the difference between this embodiment and the aforementioned first embodiment is that the lip 22 has a buckle end 222, the aforementioned joint 12 has a buckle hole 122, and the buckle end 222 is fastened to the buckle hole 122. The middle and the button hole 122 are combined and fixed, so that the hollow frame 1 and the two-phase flow heat exchange unit 2 are combined into one body. This creation is mainly based on combining the hollow frame and the two-phase flow heat exchange unit through independent manufacturing. Such a configuration can choose to use different materials to make the hollow frame 1 and the two-phase flow heat exchange unit 2. The material characteristics of different materials provide the performance of improving the structural strength and heat conduction respectively. If the parts with better structural strength are required, stainless steel or titanium or titanium alloy can be used to provide better support strength. The hollow frame 1 in this case combines two-phase flow The heat exchange unit 2 as a combination can directly pass through the two-phase flow heat exchange unit 2 with the two-phase flow heat exchange effect to provide the work of carrying electronic components and heat conduction at the same time, without increasing the thickness of the heat transfer element and eliminating it. The arrangement of heat dissipation and heat transfer components greatly reduces the overall weight and thickness, achieving the purpose of lightening and thinning, and then improving the conventional use of a single material that can only provide the lack of single material characteristics.

1: Hollow frame 11: Hollow storage space 12: Joint 2: Two-phase flow heat exchange unit 2a: The first uniform temperature plate 2aa: lips 2b: The second uniform temperature plate 2ba: lips 21: Two-phase flow conduction area 21a: The first airtight chamber 21b: The second airtight chamber 211: Airtight Chamber 212: Capillary structure 213: working fluid 22: Lips 3: Middle frame shell 4: electronic components 5: Heat dissipation or heat conduction components

Figure 1 is a three-dimensional exploded view of the first embodiment of the hand-held device heat dissipation structure created; Figure 2 is a combined cross-sectional view of the first embodiment of the hand-held device heat dissipation structure created; Figure 3 is a schematic cross-sectional view of the second embodiment of the hand-held device heat dissipation structure created; Figure 4 is a schematic cross-sectional view of the third embodiment of the hand-held device heat dissipation structure created; Figure 5 is a three-dimensional exploded schematic diagram of the fourth embodiment of the hand-held device heat dissipation structure created; Figure 6 is a three-dimensional assembly diagram of the fourth embodiment of the hand-held device heat dissipation structure created; Figure 7 is a three-dimensional exploded view of the fifth embodiment of the hand-held device heat dissipation structure created; Figure 8 is a combined cross-sectional view of the fifth embodiment of the hand-held device heat dissipation structure created; Figure 9 is a three-dimensional exploded view of the sixth embodiment of the hand-held device heat dissipation structure created; Figure 10 is a combined cross-sectional view of the sixth embodiment of the hand-held device heat dissipation structure created; Figure 11 is a schematic cross-sectional view of the conventional technology.

1: Hollow frame

11: Hollow storage space

12: Joint

2: Two-phase flow heat exchange unit

21: Two-phase flow conduction area

22: Lips

Claims (10)

A heat dissipation structure of a handheld device, which includes: A hollow frame with a hollow accommodating space, the inner edge of the hollow frame has a joint; At least one two-phase flow heat exchange unit has at least one two-phase flow conduction area, and the two-phase flow heat exchange unit is arranged in the aforementioned hollow accommodating space in combination with the hollow frame. The hand-held device heat dissipation structure according to claim 1, wherein the inner edge of the hollow frame has a joint, the outer edge of the two-phase flow conduction region has a lip, and the lip is combined with the joint, the The joint part and the lip part are combined through any one of welding, bonding, clamping, tight fitting, embedding, and buckling. The heat dissipation structure of the handheld device according to claim 1, wherein the hollow frame and the two-phase flow heat exchange unit are made of different materials. The hand-held device heat dissipation structure according to claim 1, wherein the joint is a groove, and the lip is fitted in the groove to be combined with the hollow frame. The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow conduction area has an airtight chamber, the inner wall of the airtight chamber has a capillary structure, and the airtight chamber is filled with a working fluid . The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow conduction area is composed of a plurality of independent airtight chambers, and the independent airtight chambers are divided into the two-phase flow heat exchange unit In each part, the lip surrounds the outside of the independent airtight chambers. The heat dissipation structure of the handheld device according to claim 1, wherein the hollow frame and the two-phase flow heat exchange unit are made of copper, aluminum, stainless steel, ceramic, commercial pure titanium, titanium alloy, copper alloy, aluminum alloy Either. The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow conduction area has a first airtight chamber and a second airtight chamber, and the first and second airtight chambers are divided into The upper and lower ends of the two-phase flow heat exchange unit are provided, and the height of the first airtight chamber is higher than the second airtight chamber. The heat dissipation structure of the handheld device according to claim 1, wherein the two-phase flow heat exchange unit has a first uniform temperature plate and a second uniform temperature plate, and the lips of the first and second uniform temperature plates They are joined to each other, and the peripheral lip portions of the first and second uniform temperature plates are joined to the joint portion of the hollow frame. The hand-held device heat dissipation structure according to claim 1, wherein the two-phase flow heat exchange unit is a uniform temperature plate or a flat heat pipe.

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