TWI679393B - Middle bezel frame with heat dissipation structure - Google Patents

Abstract

A middle frame heat dissipation structure includes: a frame portion and at least one heat exchange portion, the frame portions are adjacent to and connected to the heat exchange portion, the heat exchange portion has an airtight chamber, and the airtight chamber has A capillary structure and a working fluid can provide a middle frame heat dissipation structure with strength and heat dissipation performance through the present invention.

Description

Middle frame heat dissipation structure

A middle frame heat dissipation structure, especially a middle frame heat dissipation structure having both structural strength and high thermal conductivity.

As current mobile devices become more powerful, internal computing chips must also provide high-efficiency execution speeds, and high heat must be generated in mobile devices, which must be deflated to prevent chip burnout. As they become thinner and thinner, the space for the internal electronic components is also narrower, and the heat dissipation components must also be designed to fit in the narrow space.

In the conventional technology, some manufacturers have designed the temperature equalizing plate to be used as the middle frame or back cover for mobile electronic components. First, some manufacturers have directly made a copper material with better heat transfer efficiency characteristics into a two-phase heat exchange cavity. The middle frame or back cover of the room, because the copper material itself is soft, the strength is not good, and it is easy to deform. Therefore, the support is not good. Therefore, other manufacturers first make aluminum or aluminum alloy materials with stronger structural strength first. The middle frame or back cover, and then the temperature equalizing plate or heat pipe is diffused to make the temperature equalizing plate and the aluminum middle frame or back cover combined, but the diffusion joint is prone to generate high heat. When the temperature plate or heat pipe performs diffusion bonding work, the working liquid inside the temperature equalizing plate or heat pipe is likely to evaporate or destroy the internal capillary structure, thereby increasing the defect rate.

Therefore, another manufacturer uses double-sided tape or liquid glue to glue the middle frame to the heat pipe or the temperature equalizing plate. However, the double-sided tape or liquid glue used for the bonding work can easily make the middle frame and the temperature equalizing plate or the heat pipe. Between The thermal resistance is generated and the heat conduction efficiency is reduced, and the superposition and adhesion of each other will also cause the thickness to be too thick to be installed in a narrow space such as a narrow space.

Therefore, how to install a heat dissipation unit with good thermal conductivity in a limited and narrow space, and also have the strength of the middle frame structure, then provide a middle frame or back cover with good heat dissipation efficiency and sufficient load capacity, which is the first priority for current industry players. aims.

Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a middle frame heat dissipation structure with good support strength and high thermal conductivity.

In order to achieve the above object, the present invention provides a middle frame heat dissipation structure, which includes: a frame portion and at least one heat exchange portion, the frame portions are adjacent to and connected to the heat exchange portion, and the heat exchange portion has an airtight inside. The chamber, and the airtight chamber has a capillary structure and a working fluid.

To achieve the above object, the present invention provides a middle frame heat dissipation structure, which includes: a frame portion and at least one heat exchange element and a joint portion, the frame portion is connected to the joint portion, and the heat exchange element is embedded in Within the joint portion, the outer edge of the heat exchange element is adjacent and connected to the frame portion by laser welding or mechanical compression bonding.

Through the heat dissipation structure of the middle frame of the present invention, a material with better structural strength is selected as the material of the frame portion, and a material with better thermal conductivity is used as the material of the heat exchange portion, and finally combined by laser welding to improve the conventional structure strength And those with poor thermal conductivity.

1‧‧‧ middle frame

11‧‧‧Frame

11a‧‧‧First plate

11b‧‧‧Second plate

12‧‧‧Heat Exchange Department

121‧‧‧airtight chamber

122‧‧‧ Capillary structure

123‧‧‧Working fluid

13‧‧‧Combination

131‧‧‧ open side

132‧‧‧ closed side

2‧‧‧ heat exchange element

21‧‧‧airtight chamber

22‧‧‧ Capillary structure

23‧‧‧working fluid

3‧‧‧Solid Post

4‧‧‧ wave board

5‧‧‧ intermediate support

6‧‧‧ hollow ring

Figure 1 is an exploded perspective view of the first embodiment of the middle frame heat dissipation structure of the present invention; Figure 2 is a perspective combined view of the first embodiment of the middle frame heat dissipation structure of the present invention; and Figure 3 is this A combined sectional view of the first embodiment of the middle frame heat dissipation structure of the invention; Fig. 4 is another perspective combination view of the first embodiment of the middle frame heat dissipation structure of the present invention; Fig. 5 is an exploded perspective view of the second embodiment of the middle frame heat dissipation structure of the present invention; This is an exploded perspective view of the third embodiment of the middle frame heat dissipation structure of the present invention; FIG. 7 is a combined sectional view of the third embodiment of the middle frame heat dissipation structure of the present invention; and FIG. 8 is the middle frame heat dissipation of the present invention The combined sectional view of the fourth embodiment of the structure; Figure 9 is a combined sectional view of the fifth embodiment of the middle frame heat dissipation structure of the present invention; and Figure 10 is the combination of the sixth embodiment of the middle frame heat dissipation structure of the present invention Sectional view; FIG. 11 is a combined sectional view of a seventh embodiment of the middle frame heat dissipation structure of the present invention.

The above-mentioned object of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the drawings.

Please refer to Figures 1, 2, 3, and 4 for a three-dimensional exploded and combined view of the first embodiment of the middle frame heat dissipation structure of the present invention. As shown in the figure, the middle frame heat dissipation structure includes: Frame 1; the middle frame 1 has a frame portion 11 and at least one heat exchange portion 12, the frame portion 11 is adjacent to and connected to the heat exchange portion 12, and the heat exchange portion 12 has an airtight chamber 121 therein, and The airtight chamber 121 has at least one capillary structure 122 and a working fluid 123 (can be a gas (refrigerant) or a liquid such as acetone, pure water, water tank essence, alcohol, etc.). The heat exchange portion 12 and the frame The portion 11 is any one of the same or different materials, and the material of the heat exchange portion 12 and the frame portion 11 is any one or a combination of gold, silver, copper, aluminum, titanium, and titanium alloy.

The middle frame 1 has a first plate body 11a and a second plate body 11b, and the material of the first and second plate bodies 11a, 11b is gold, silver, copper, stainless steel, aluminum, commercial pure titanium, Any one or a combination of titanium alloys, the first and second plates 11a and 11b are made of the same or different materials.

The first and second plates 11a and 11b overlap each other to define the aforementioned airtight chamber 121, and the first plate 11a is made of a material with better support strength such as any one of the aforementioned stainless steel or titanium alloy, and the second The plate body 11b is made of a material with better thermal conductivity, such as any of the foregoing gold, silver, copper, and commercial pure titanium. This heat exchange section 12 is formed in a cycle.

The corresponding arrangement of the heat source can be one or a plurality of heat exchange portions 12, which means that the second plate body 11b can correspond to any one of the upper and lower sides of the first plate body 11a. One part is combined by laser welding or mechanical compression as shown in Figure 4.

Please refer to FIG. 5, which is a three-dimensional exploded view of the second embodiment of the middle frame heat dissipation structure of the present invention. As shown in the figure, this embodiment has the same structural technical features as the first embodiment, so it will not be repeated here. This embodiment is different from the aforementioned first embodiment in that the frame portion 11 is combined with a heat exchange element 2.

The middle frame 1 is recessed with a joint portion 13 and the joint portion 13 is connected to the frame portion 11. The joint portion 13 is a groove. The groove has an open side 131 and a closed side 132. One side of the element 2 is attached to the closed side 132 and the other side is selected to be convex or cut or lower than the open side 131. The outer edge of the heat exchange element 2 is integrated with the frame portion 11 by laser welding.

Please refer to FIG. 6 and FIG. 7, which are three-dimensional exploded and combined cross-sectional views of the third embodiment of the middle frame heat dissipation structure of the present invention. As shown in the figure, this embodiment has the same structural technical features as the second embodiment. This will not be repeated here. The difference between this embodiment and the first embodiment is that the joint portion 13 of the middle frame 1 is a through hole, and the through hole penetrates the upper and lower sides of the middle frame 1. The heat exchange element 2 is embedded or set in the through hole, and both sides of the heat exchange element 2 are selected to be aligned or projected or lower than the upper and lower sides of the middle frame 1.

The heat exchange element 2 in the above second and third embodiments has an airtight chamber 21 therein, and the airtight chamber 21 has a capillary structure 22 and a working fluid 23, and the heat exchange element 2 is a Either a temperature equalizing plate or a flat heat pipe, this embodiment uses the temperature equalizing plate as an illustrative embodiment but is not limited thereto, and the temperature equalizing plate or the flat heat pipe passes through the area where the airtight chamber 21 is not provided. (Ie, the invalid end region), that is, the outer edge of the temperature equalizing plate is combined with the frame portion 11 by laser or laser welding or mechanical punching.

The heat exchange element 2 in the second and third embodiments described above can also be replaced with any other good thermal conductor such as copper block or graphite block or graphene sheet or commercial pure titanium.

The airtight chambers 121 and 21 in the first to third embodiments can be provided with a support structure. The support structure can be a solid column 3, a wave plate 4, an intermediate support 5 with horizontal and vertical vent holes. Elements such as hollow ring 6 are placed in the airtight chambers 121 and 21, or the inner surface of one side plate protrudes to the other side against the inner surface or capillary of the corresponding side, and the aforementioned elements are used as a lift The support strength of the airtight chambers 121 and 21 is used (as shown in Figs. 8, 9, 10, and 11).

The invention mainly solves the lack of poor strength of the middle frame by only selecting materials with good thermal conductivity in the conventional middle frame structure, and by using a material with better structural strength such as stainless steel or titanium or aluminum or aluminum alloy as the main frame frame structure, the heat conduction is further improved. The materials with better effect are combined into a middle frame structure with air-tight chamber and uniform temperature effect, or the heat exchange element and the middle frame are integrated into one body, thereby improving the lack of known middle frame strength and poor heat dissipation efficiency, and And because the material with better thermal conductivity has a higher cost, the use of materials with different characteristics in different regions can also save material costs significantly.

And by forming the heat exchange element and the laser welding method, the conventional method can be used to combine the middle frame with the heat exchange element or make the middle frame into a heat-absorbing area with an airtight chamber. In addition, the internal working liquid is evaporated or the capillary structure is damaged due to the high temperature generated by diffusion bonding or ordinary welding.

Claims (8)

A middle frame heat dissipation structure is applied to a handheld mobile device and includes: a frame portion; and at least one heat exchange portion, the frame portion is adjacent to and connected to the heat exchange portion, and the heat exchange portion has an airtight chamber therein. The airtight chamber has a capillary structure and a working fluid, and the frame portion is used as a supporting structure of the handheld mobile device. According to the middle frame heat dissipation structure described in item 1 of the scope of patent application, it further includes a first plate body and a second plate body, and the first and second plate systems are made of the same or different materials. According to the middle frame heat dissipation structure described in item 1 of the scope of patent application, wherein the heat exchange portion and the frame portion are of the same or different materials, and the material of the heat exchange portion and the frame portion is gold , Silver, copper, aluminum, titanium, titanium alloy or any combination thereof. According to the middle frame heat dissipation structure described in item 1 of the scope of the patent application, wherein the workflow system is a gas or a liquid, and the liquid is any of a refrigerant, acetone, pure water, water tank essence, and alcohol. A middle frame heat dissipation structure is applied to a handheld mobile device and includes: a frame portion; at least one heat exchange element; and a combination portion, the frame portion is connected to the combination portion, and the heat exchange element is embedded in the combination portion. And the outer edge of the heat exchange element is adjacent and connected to the frame portion through laser welding, the joint portion is a through hole, the through hole penetrates the upper and lower sides of the frame portion, and the heat exchange element is embedded The heat exchange element is arranged in the through hole, and two sides of the heat exchange element are selected to be aligned or protruded or lower than the upper and lower sides of the frame portion, and the frame portion serves as a supporting structure of the handheld mobile device. A middle frame heat dissipation structure is applied to a handheld mobile device and includes: a frame portion; at least one heat exchange element; and a combination portion, the frame portion is connected to the combination portion, and the heat exchange element is embedded in the combination portion. And the outer edge of the heat exchange element is adjacent and connected to the frame portion by laser welding, the heat exchange element has an air-tight chamber therein, and the air-tight chamber has at least one capillary structure and a working fluid. The heat exchange element is any one of a temperature equalizing plate or a flat heat pipe, and the frame portion is used as a supporting structure of a handheld mobile device. A middle frame heat dissipation structure is applied to a handheld mobile device and includes: a frame portion; at least one heat exchange element; and a combination portion, the frame portion is connected to the combination portion, and the heat exchange element is embedded in the combination portion. And the outer edge of the heat exchange element is adjacent and connected to the frame portion through laser welding, the joint portion is recessed on one side of the frame portion, the recess portion is a groove, and the groove has an open side And a closed side, one side of the heat exchange element is attached to the other side of the closed side, and the other side is selected to be convex or cut evenly or lower than the open side, and the heat exchange element is a copper block or a graphite block or a graphene sheet or a commercial Any of pure titanium, the frame part is used as a supporting structure of a handheld mobile device. According to the middle frame heat dissipation structure described in item 5 of the scope of the patent application, wherein the workflow system is a gas or a liquid, and the liquid is any of a refrigerant, acetone, pure water, water tank essence, and alcohol.