TW200722702A - Heat pipe and method for manufacturing the same - Google Patents
Heat pipe and method for manufacturing the sameInfo
- Publication number
- TW200722702A TW200722702A TW095135116A TW95135116A TW200722702A TW 200722702 A TW200722702 A TW 200722702A TW 095135116 A TW095135116 A TW 095135116A TW 95135116 A TW95135116 A TW 95135116A TW 200722702 A TW200722702 A TW 200722702A
- Authority
- TW
- Taiwan
- Prior art keywords
- recessed parts
- side lattice
- intermediate plate
- member side
- upper member
- Prior art date
Links
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
To provide a small-sized and thin heat pipe (1) enabling a remarkable increase in heat conductivity. An upper intermediate plate (7) and a lower intermediate plate (8) in which a plurality of steam diffusing flow passages (10) in a horizontal direction communicating with the upper member side lattice-like recessed parts (21) in an upper member (2) and lower member side lattice-like recessed parts (17) in a lower member (3) are formed are interposed between the upper member (2) having the upper member side lattice-like recessed parts (21) in its lower inner surface and the lower member (3) having the lower member side lattice-like recessed parts (17) in its upper inner surface, and a refrigerant is sealed in sealed spaces between the upper member (2) and the lower member (3). Capillary tube flow passages (11) in a vertical direction or in both vertical and horizontal directions communicating with the upper member side lattice-like recessed parts (21) in the upper member (2) and the lower member side lattice-like recessed parts (17) in the lower member (3) are formed in those portions of the upper intermediate plate (7) and the lower intermediate plate (8) other than the portions where the steam diffusing flow passages (10) are formed.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005350157 | 2005-12-05 | ||
PCT/JP2006/301925 WO2007029359A1 (en) | 2005-09-01 | 2006-01-31 | Heat pipe and method for manufacturing same |
PCT/JP2006/317249 WO2007026833A1 (en) | 2005-09-01 | 2006-08-31 | Heat pipe and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200722702A true TW200722702A (en) | 2007-06-16 |
TWI409425B TWI409425B (en) | 2013-09-21 |
Family
ID=49626756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095135116A TWI409425B (en) | 2005-12-05 | 2006-09-22 | Heat pipe |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI409425B (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI486114B (en) * | 2012-12-12 | 2015-05-21 | Inventec Corp | Electronic device |
TWI486116B (en) * | 2012-12-12 | 2015-05-21 | Inventec Corp | Electronic device |
TWI486115B (en) * | 2012-12-12 | 2015-05-21 | Inventec Corp | Electronic device |
TWI486117B (en) * | 2012-12-12 | 2015-05-21 | Inventec Corp | Electronic device |
TWI588438B (en) * | 2014-06-06 | 2017-06-21 | 超眾科技股份有限公司 | Sealing method of heat conducting plate and structures thereof |
TWI648512B (en) * | 2016-07-01 | 2019-01-21 | 古河電氣工業股份有限公司 | Steam room |
TWI750694B (en) * | 2020-06-12 | 2021-12-21 | 維峰科技股份有限公司 | Cooling module and manufacturing method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3890685B2 (en) * | 1997-07-11 | 2007-03-07 | 株式会社デンソー | Boiling cooler |
WO2001063195A1 (en) * | 2000-02-25 | 2001-08-30 | Fujitsu Limited | Thin heat pipe and method of manufacturing the heat pipe |
JP2004353902A (en) * | 2003-05-27 | 2004-12-16 | Sony Corp | Cooling system |
-
2006
- 2006-09-22 TW TW095135116A patent/TWI409425B/en active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI486114B (en) * | 2012-12-12 | 2015-05-21 | Inventec Corp | Electronic device |
TWI486116B (en) * | 2012-12-12 | 2015-05-21 | Inventec Corp | Electronic device |
TWI486115B (en) * | 2012-12-12 | 2015-05-21 | Inventec Corp | Electronic device |
TWI486117B (en) * | 2012-12-12 | 2015-05-21 | Inventec Corp | Electronic device |
TWI588438B (en) * | 2014-06-06 | 2017-06-21 | 超眾科技股份有限公司 | Sealing method of heat conducting plate and structures thereof |
TWI648512B (en) * | 2016-07-01 | 2019-01-21 | 古河電氣工業股份有限公司 | Steam room |
US10667430B2 (en) | 2016-07-01 | 2020-05-26 | Furukawa Electric Co., Ltd. | Vapor chamber |
TWI750694B (en) * | 2020-06-12 | 2021-12-21 | 維峰科技股份有限公司 | Cooling module and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI409425B (en) | 2013-09-21 |
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