TWI750694B - Cooling module and manufacturing method thereof - Google Patents

Abstract

A cooling module includes a thermal plate and a thermal tube. The thermal plate includes a main body and at least a pair of protruding structures. The main body has a first and a second surfaces opposite to each other. The main body has two inner walls opposite to each other. The inner walls are respectively adjacent between the first and the second surfaces. The inner walls define a through hole therebetween. The protruding structures locate at the through hole and respectively connect with the corresponding inner wall. Each of the protruding structures has two first and a second inclined surfaces. The first inclined surfaces are inclined and adjacent to the first surface. The second inclined surface is inclined and adjacent to the second surface. The second inclined surface is between the first inclined surfaces. The thermal tube abuts between the inner walls, the first and the second inclined surfaces.

Description

Heat dissipation module and manufacturing method thereof

The present invention relates to a heat dissipation module, and in particular, to a heat dissipation module for an electronic device and a manufacturing method thereof.

With the advancement of technology, electronic products have been greatly integrated into consumers' lives. In order to meet the needs of consumers, in addition to the continuous improvement of functions, electronic products are also becoming lighter and lighter in design.

Therefore, while maintaining the high performance of electronic products, how to reduce the appearance of electronic products to become thinner is undoubtedly a development issue that the industry attaches great importance to.

One of the objectives of the present invention is to provide a heat dissipation module, which can reduce the overall thickness so as to be advantageous for application in thin electronic devices.

According to an embodiment of the present invention, a heat dissipation module includes a heat conducting plate and a heat conducting pipe. The thermally conductive plate includes a main body and at least one pair of protruding structures. The main body has an opposite first surface and a second surface, the main body further has two opposite inner walls, the inner walls are respectively adjacent to the first surface and the second surface and extend along the extending direction respectively, and a hole is defined between the inner walls. The protruding structures are located in the through holes and are respectively connected to the corresponding inner walls, the protruding structures have two first inclined surfaces and a second inclined surface, the first inclined surfaces are respectively adjacent to and inclined to the first surface, and the second inclined surfaces are adjacent to and inclined to the second surface, And the second inclined planes are located between the first inclined planes in the extending direction. The heat pipe is at least partially abutted between the inner wall, the first inclined surface and the second inclined surface.

In one or more embodiments of the present invention, the thermal conductivity of the above-mentioned heat conducting pipe is greater than that of the heat conducting plate.

In one or more embodiments of the present invention, the above-mentioned heat pipe is a hollow structure.

In one or more embodiments of the present invention, the above-mentioned heat pipe has a third surface and a fourth surface opposite to each other, the third surface and the first surface are substantially coplanar, and the fourth surface and the second surface are substantially coplanar.

In one or more embodiments of the present invention, the above-mentioned protruding structure includes two first sub-protrusion structures and a second sub-protrusion structure. The first sub-projection structures are respectively connected to the corresponding inner walls, and respectively have fifth surfaces, the first inclined surfaces are located on the corresponding first sub-projection structures, the fifth surfaces are adjacent to the corresponding first inclined surfaces, and the fifth surface and the second The surfaces are substantially coplanar. The second sub-projection structures are connected to the corresponding inner walls and are located between the first sub-projection structures. The second inclined surface, and the sixth surface and the first surface are substantially coplanar.

Another object of the present invention is to provide a method for manufacturing a heat dissipation module, which is suitable for mass production of a heat dissipation module with a thin overall thickness with high efficiency and low cost, so that it is beneficial to be used in thin electronic devices.

According to another embodiment of the present invention, a method for manufacturing a heat dissipation module includes: (1) providing a heat-conducting plate, the heat-conducting plate including a main body and at least a pair of protruding structures. The main body has an opposite first surface and a second surface, the main body further has two opposite inner walls, the inner walls are respectively adjacent to the first surface and the second surface and extend along the extending direction respectively, and a hole is defined between the inner walls. The protruding structures are located in the through holes and are respectively connected to the corresponding inner walls, the protruding structures have two first inclined surfaces and a second inclined surface, the first inclined surfaces are respectively adjacent to and inclined to the first surface, and the second inclined surfaces are adjacent to and inclined to the second surface, And the second inclined planes are located between the first inclined planes in the extending direction. (2) Abutting the first mold with the second surface of the heat-conducting plate, and heating the first mold to the first temperature. (3) The heat pipe is placed on the first mold through the perforation parallel to the extending direction. (4) Heating the second mold to the second temperature, and moving the second mold relatively toward the first mold to press the heat pipe until the heat pipe is deformed and at least partially abuts against the inner wall, the first slope and the second slope. time, wherein the second temperature is greater than the first temperature.

In one or more embodiments of the present invention, the range of the above-mentioned first temperature is between 80 degrees and 130 degrees.

In one or more embodiments of the present invention, the range of the above-mentioned second temperature is between 150 degrees and 200 degrees.

In one or more embodiments of the present invention, the above-mentioned step of moving the second mold toward the first mold includes pressing the second mold against the first surface.

In one or more embodiments of the present invention, the thermal conductivity of the above-mentioned heat conducting pipe is greater than that of the heat conducting plate.

In one or more embodiments of the present invention, the cross-section of the above-mentioned heat transfer pipe before being compressed is a hollow circle.

In one or more embodiments of the present invention, the cross-section of the above-mentioned heat transfer pipe before being compressed is hollow and flat.

In one or more embodiments of the present invention, the above-mentioned protruding structure includes two first sub-protrusion structures and a second sub-protrusion structure. The first sub-projection structures are respectively connected to the corresponding inner walls, and respectively have fifth surfaces, the first inclined surfaces are located on the corresponding first sub-projection structures, the fifth surfaces are adjacent to the corresponding first inclined surfaces, and the fifth surface and the second The surfaces are substantially coplanar. The second sub-projection structures are connected to the corresponding inner walls and are located between the first sub-projection structures. The second inclined surface, and the sixth surface and the first surface are substantially coplanar.

The above-mentioned embodiments of the present invention have at least the following advantages:

(1) The first and second slopes of the heat-conducting plate can limit the position of the deformed heat-conducting pipe to prevent the deformed heat-conducting pipe from separating from the heat-conducting plate from the first surface or the second surface. The inclined surfaces are located between the first inclined surfaces in the extending direction, so that the deformed heat-conducting pipe can be prevented from being separated from the heat-conducting plate in a rotating manner. In this way, the pressure-deformed heat-conducting pipe can be firmly clamped in the through hole of the heat-conducting plate.

(2) Since the heat transfer pipe is pressed between the heated first mold and the heated second mold, the heat transfer pipe generates pressure inside the heated heat pipe to form a support function, thereby effectively reducing the chance of the heat transfer pipe being squashed.

(3) Since the second temperature of the second mold is greater than the first temperature of the first mold, when the second mold presses the heat pipe, the heat pipe will be affected by the higher second temperature of the second mold, and It is easy to generate pressure inside the heat pipe to form a support function. Then, after the second mold is pressed against the heat-conducting plate and is away from the heat-conducting plate, the heat-conducting pipe abuts against the first mold with the lower first temperature, and is no longer affected by the higher second temperature of the second mold, so Unnecessary thermal expansion of the heat-conducting pipe that is fixed to the heat-conducting plate does not cause compression deformation.

(4) Since the manufacturing method can simply and easily manufacture the heat dissipation module, the manufacturing method is suitable for mass production of the heat dissipation module. Moreover, since the manufacturing method does not involve the complicated steps of fixing the heat pipe to the heat conducting plate, the manufacturing method can further improve the production efficiency and reduce the production cost.

(5) Since the heat-conducting pipe and the heat-conducting plate after compression deformation have substantially the same thickness, the overall thickness of the heat-dissipating module can be effectively thinned, which is beneficial to the application of the heat-dissipating module in thin electronic devices.

Several embodiments of the present invention will be disclosed in the drawings below, and for the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known and conventional structures and elements will be shown in a simple and schematic manner in the drawings, and the same reference numerals will be used to denote the same or similar elements in all the drawings. . And if possible in implementation, the features of different embodiments can be applied interactively.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings as can be understood by those skilled in the art. Furthermore, the definitions of the above words in commonly used dictionaries should be interpreted as meanings consistent with the relevant fields of the present invention in the content of this specification. Unless specifically defined, these terms are not to be construed in an idealized or overly formal sense.

Please refer to Figure 1. FIG. 1 is a flowchart illustrating a manufacturing method 100 of a heat dissipation module 300 (please refer to FIG. 8 ) according to an embodiment of the present invention. In this embodiment, as shown in FIG. 1, the manufacturing method 100 includes the following steps (it should be understood that the steps mentioned in some embodiments can be adjusted according to actual needs unless the sequence is specially stated their sequence, even simultaneously or partially):

(1) Provide the thermally conductive plate 310 (step 110 ).

Specifically, please refer to FIG. 2 . FIG. 2 is a three-dimensional schematic diagram illustrating a thermally conductive plate 310 according to an embodiment of the present invention. In this embodiment, as shown in FIG. 2 , the thermally conductive plate 310 includes a main body 311 and at least a pair of protruding structures 312 . The main body 311 has an opposite first surface S1 and a second surface S2, the main body 311 further has two opposite inner walls W, the inner walls W are adjacent to the first surface S1 and the second surface S2 respectively and extend along the extension direction E respectively , and the hole H is defined between the inner walls W. The protruding structures 312 are located in the through holes H and are respectively connected to the corresponding inner walls W. The protruding structures 312 have two first inclined surfaces G1 and a second inclined surface G2. On the first surface S1, the second inclined surface G2 of the protruding structure 312 is adjacent to and inclined to the second surface S2 of the main body 311, and the second inclined surface G2 is located between the first inclined surfaces G1 in the extending direction E. In other embodiments, the number of the protruding structures 312 along the extending direction E may be plural, and the plural protruding structures 312 may be connected to or separated from each other, but the invention is not limited thereto.

More specifically, as shown in FIG. 2 , the protruding structure 312 includes two first sub-protrusion structures 312a and a second sub-protrusion structure 312b, and the second sub-protrusion structure 312b is located in the first sub-protrusion in the extending direction E. Between the protruding structures 312a, the second sub-protruding structures 312b and the first sub-protruding structures 312a are spaced apart from each other. Please refer to Figure 3. FIG. 3 is a cross-sectional view along line A-A of FIG. 2 . In this embodiment, as shown in FIGS. 2 to 3, the first sub-projection structures 312a are respectively connected to the corresponding inner walls W, and respectively have fifth surfaces S5, and the first inclined surfaces G1 are located on the corresponding first sub-projections structure 312a, the fifth surface S5 of the first sub-projection structure 312a is adjacent to the corresponding first slope G1, and the fifth surface S5 of the first sub-projection structure 312a and the second surface S2 of the main body 311 are substantially coplanar.

Also, please refer to Figure 4. FIG. 4 is a cross-sectional view along line B-B of FIG. 2 . In this embodiment, as shown in FIGS. 2 and 4 , the second sub-projection structures 312b are connected to the corresponding inner walls W and are located between the first sub-projection structures 312a, and the second sub-projection structures 312b have a sixth sub-projection structure 312b. surface, the second slope G2 is located on the second sub-projection structure 312b, and the sixth surface S6 of the second sub-projection structure 312b is adjacent to the corresponding second slope G2, and the sixth surface S6 of the two sub-projection structures 312b and the main body 311 The first surfaces S1 of the are substantially coplanar.

Please refer to Figure 5. FIG. 5 is a schematic diagram illustrating the manufacturing method 100 of FIG. 1 , wherein the heat pipe 320 is not pressurized. As shown in FIG. 5 , in practical applications, the manufacturing method 100 can be performed using a hot press 500 . The hot press 500 includes a first mold 510 and a second mold 520, and the manufacturing method 100 further includes:

(2) Abutting the first mold 510 of the hot press 500 with the second surface S of the heat-conducting plate 310 , and heating the first mold 510 to a first temperature (step 120 ).

(3) The heat transfer pipe 320 is placed on the first mold 510 of the hot press 500 through the through hole H parallel to the extending direction E (step 130 ). In this embodiment, as shown in FIG. 5 , the cross-section of the heat transfer pipe 320 before being pressed is a hollow circle, but the present invention is not limited to this. In other embodiments, according to the actual situation, the cross section of the heat pipe 320 before being compressed can also be hollow and flat, that is, the cross section of the heat pipe 320 before being compressed has opposite upper and lower planes, as shown in FIG. 6 . FIG. 6 is a schematic cross-sectional view of the heat pipe 320 according to another embodiment of the present invention before being compressed.

Please refer to Figure 7. FIG. 7 is a schematic diagram illustrating the manufacturing method 100 of FIG. 1 , wherein the second mold 520 is pressed against the first surface S1 of the thermally conductive plate 310 . In this embodiment, as shown in FIG. 7, the manufacturing method 100 further includes:

(4) Heating the second mold 520 to a second temperature, and moving the second mold 520 relatively toward the first mold 510 to press the heat pipe 320 until the heat pipe 320 is deformed and at least partially abuts against the inner wall of the heat transfer plate 310 W, between the first inclined surface G1 and the second inclined surface G2, wherein the second temperature of the second mold 520 is greater than the first temperature of the first mold 510 (step 140). Further, the first inclined surface G1 and the second inclined surface G2 of the heat conduction plate 310 can limit the position of the deformed heat conduction pipe 320 (see FIGS. 9 to 10 ), so as to prevent the deformed heat conduction pipe 320 The first surface S1 or the second surface S2 is separated from the heat conduction plate 310 , and since the second inclined surface G2 is located between the first inclined surfaces G1 in the extending direction E, the deformed heat conduction pipe 320 can be prevented from being separated from the heat conduction plate 310 in a rotating manner. . In this way, the heat-conducting pipe 320 after being deformed under pressure can be firmly engaged in the through hole H of the heat-conducting plate 310 . At this time, the heat dissipation module 300 is also completed, as shown in FIG. 8 . FIG. 8 is a schematic diagram illustrating an application of the heat dissipation module 300 according to an embodiment of the present invention, wherein the electronic component 700 is disposed on the heat dissipation module 300 .

It is worth noting that, since the heat transfer pipe 320 is pressed between the heated first mold 510 and the heated second mold 520, the heat transfer pipe 320 is heated to generate pressure inside to form a support function, thereby effectively reducing the heat transfer rate of the heat transfer pipe 320. Squeeze opportunity. In this embodiment, after the heat dissipation module 300 is manufactured, the heat pipe 320 of the heat dissipation module 300 is maintained as a hollow structure.

Furthermore, since the manufacturing method 100 can simply and easily manufacture the heat dissipation module 300 , the manufacturing method 100 is suitable for mass production of the heat dissipation module 300 . Moreover, since the manufacturing method 100 does not involve complicated steps, namely, fixing the heat pipe 320 to the heat conducting plate 310 , the manufacturing method 100 can further improve the production efficiency and reduce the production cost.

More specifically, as shown in FIG. 7 , the step of moving the second mold 520 toward the first mold 510 (ie, step 140 ) further includes:

(5) The second mold 520 is pressed against the first surface S1 of the thermally conductive plate 310 (step 141 ). In this way, after the heat dissipation module 300 is manufactured, the heat-conducting pipe 320 and the heat-conducting plate 310 after being deformed under pressure have substantially the same thickness. Therefore, through the manufacturing method 100, the overall thickness of the heat dissipation module 300 can be effectively thinned , which is beneficial to apply the heat dissipation module 300 in a thin electronic device (not shown).

It is worth noting that, as described above, the second temperature of the second mold 520 is greater than the first temperature of the first mold 510 . In practical applications, the range of the first temperature may be between 80 degrees and 130 degrees, and the range of the second temperature may be between 150 degrees and 200 degrees. In this way, when the second mold 520 is pressed against the heat pipe 320, the heat pipe 320 will be affected by the higher second temperature of the second mold 520, so that the heat pipe 320 is easily heated to generate pressure inside the heat pipe 320, thus forming the above-mentioned supporting effect. . Subsequently, after the second mold 520 is pressed against the thermally conductive plate 310 and away from the thermally conductive plate 310 , the thermally conductive pipe 320 abuts against the first mold 510 with the lower first temperature and is no longer affected by the higher first temperature of the second mold 520 . Due to the influence of the two temperature, unnecessary thermal expansion of the heat-conducting pipe 320 fixed to the heat-conducting plate 310 due to pressure deformation will not be caused.

In practical applications, as shown in FIG. 8 , the electronic component 700 is at least partially disposed on the heat pipe 320 of the heat dissipation module 300 . In this embodiment, the thermal conductivity of the heat-conducting pipe 320 is greater than that of the heat-conducting plate 310 . Therefore, when the electronic component 700 operates to generate heat, the heat-conducting pipe 320 can effectively transmit the heat to the heat-conducting plate 310 evenly, thereby effectively The temperature of the electronic component 700 is lowered.

Please refer to Figures 9 to 10. FIG. 9 is a cross-sectional view along line C-C of FIG. 8 . FIG. 10 is a cross-sectional view along line D-D of FIG. 8 . In this embodiment, as shown in FIGS. 9 to 10 , the heat transfer pipe 320 after compression and deformation has opposite third surfaces S3 and S4 , the third surface S3 of the heat transfer pipe 320 and the third surface S3 of the heat transfer plate 310 are opposite to each other. One surface S1 is substantially coplanar, while the fourth surface S4 of the heat pipe 320 and the second surface S2 of the heat transfer plate 310 are substantially coplanar. That is, as described above, the heat pipe 320 and the heat transfer plate 310 have substantially the same thickness.

Furthermore, as mentioned above, when the heat pipe 320 is pressed between the second mold 520 and the first mold 510, the heat pipe 320 is heated to generate pressure inside, which forms a supporting function, and the ductility of the heat pipe 320 itself is added. The heat transfer pipe 320 can be deformed as shown in FIG. 9 to at least partially abut between the first inclined surfaces G1 when under pressure, and deformed as shown in FIG. 10 to at least partially abut between the second inclined surfaces G2 , thereby effectively reducing the chance of the heat pipe 320 being squeezed inward under pressure.

To sum up, the technical solutions disclosed by the above embodiments of the present invention have at least the following advantages:

(1) The first and second slopes of the heat-conducting plate can limit the position of the deformed heat-conducting pipe to prevent the deformed heat-conducting pipe from separating from the heat-conducting plate from the first surface or the second surface. The inclined surfaces are located between the first inclined surfaces in the extending direction, so that the deformed heat-conducting pipe can be prevented from being separated from the heat-conducting plate in a rotating manner. In this way, the pressure-deformed heat-conducting pipe can be firmly clamped in the through hole of the heat-conducting plate.

(2) Since the heat transfer pipe is pressed between the heated first mold and the heated second mold, the heat transfer pipe generates pressure inside the heated heat pipe to form a support function, thereby effectively reducing the chance of the heat transfer pipe being squashed.

(3) Since the second temperature of the second mold is greater than the first temperature of the first mold, when the second mold presses the heat pipe, the heat pipe will be affected by the higher second temperature of the second mold, and It is easy to generate pressure inside the heat pipe to form a support function. Then, after the second mold is pressed against the heat-conducting plate and is away from the heat-conducting plate, the heat-conducting pipe abuts against the first mold with the lower first temperature, and is no longer affected by the higher second temperature of the second mold, so Unnecessary thermal expansion of the heat-conducting pipe that is fixed to the heat-conducting plate does not cause compression deformation.

(4) Since the manufacturing method can simply and easily manufacture the heat dissipation module, the manufacturing method is suitable for mass production of the heat dissipation module. Moreover, since the manufacturing method does not involve the complicated steps of fixing the heat pipe to the heat conducting plate, the manufacturing method can further improve the production efficiency and reduce the production cost.

(5) Since the heat-conducting pipe and the heat-conducting plate after being deformed under pressure have substantially the same thickness, the overall thickness of the heat-dissipating module can be effectively thinned, which is beneficial to the application of the heat-dissipating module in thin electronic devices.

100: Manufacturing Method 110~140,141: Steps 300: cooling module 310: Thermal plate 311: Subject 312: Protruding structure 312a: first sub-protrusion structure 312b: Second sub-protrusion structure 320: heat pipe 500: heat press 510: The first mold 520: Second mold 700: Electronic Components A-A, B-B, C-C, D-D: line segments E: extension direction H: perforated G1: The first slope G2: Second bevel S1: first surface S2: Second surface S3: Third surface S4: Fourth surface S5: Fifth surface S6: Sixth Surface W: inner wall

FIG. 1 is a flowchart illustrating a manufacturing method of a heat dissipation module according to an embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram illustrating a thermally conductive plate according to an embodiment of the present invention. FIG. 3 is a cross-sectional view along line A-A of FIG. 2 . FIG. 4 is a cross-sectional view along line B-B of FIG. 2 . FIG. 5 is a schematic diagram illustrating the manufacturing method of FIG. 1, wherein the heat pipe is not pressurized. FIG. 6 is a schematic cross-sectional view of a heat pipe according to another embodiment of the present invention before being compressed. FIG. 7 is a schematic diagram illustrating the manufacturing method of FIG. 1 , wherein the second mold is pressed against the first surface of the thermally conductive plate. FIG. 8 is a schematic diagram illustrating an application of a heat dissipation module according to an embodiment of the present invention, wherein electronic components are disposed on the heat dissipation module. FIG. 9 is a cross-sectional view along line C-C of FIG. 8 . FIG. 10 is a cross-sectional view along line D-D of FIG. 8 .

310: Thermal plate 311: Subject 312: Protruding structure 312a: first sub-protrusion structure 312b: Second sub-protrusion structure A-A,B-B: line segment E: extension direction H: perforated G1: The first slope G2: Second bevel S1: first surface S2: Second surface W: inner wall

Claims (13)

A heat dissipation module, comprising: A thermally conductive plate, comprising: A main body has an opposite first surface and a second surface, the main body further has two opposite inner walls, the inner walls are respectively adjacent to the first surface and the second surface and along an extending direction extending, a perforation is defined between the inner walls; and At least one pair of protruding structures are located in the through holes and are respectively connected to the corresponding inner walls, each of the protruding structures has two first inclined surfaces and a second inclined surface, the first inclined surfaces are respectively adjacent to and inclined to the first inclined surface a surface, the second inclined surface is adjacent to and inclined to the second surface, and the second inclined surface is located between the first inclined surfaces in the extending direction; and A heat conducting pipe at least partially abuts between the inner walls, the first inclined surfaces and the second inclined surfaces. The heat dissipation module according to claim 1, wherein the thermal conductivity of the heat pipe is greater than that of the heat transfer plate. The heat dissipation module according to claim 1, wherein the heat pipe is a hollow structure. The heat dissipation module of claim 1, wherein the heat pipe has a third surface and a fourth surface opposite to each other, the third surface and the first surface are substantially coplanar, and the fourth surface and the second surface The surfaces are substantially coplanar. The heat dissipation module of claim 1, wherein each of the protruding structures comprises: Two first sub-projection structures are respectively connected to the corresponding inner walls and have a fifth surface respectively, each of the first inclined surfaces is located on the corresponding first sub-projection structure, and each of the fifth surfaces is adjacent to corresponding to the first slope, and each of the fifth surfaces is substantially coplanar with the second surface; and A second sub-projection structure is connected to the corresponding inner wall and located between the first sub-projection structures, the second sub-projection structure has a sixth surface, and the second inclined surface is located on the second sub-projection The sixth surface is adjacent to the corresponding second inclined surface, and the sixth surface and the first surface are substantially coplanar. A manufacturing method of a heat dissipation module, comprising: A thermally conductive plate is provided, the thermally conductive plate comprising: A main body has an opposite first surface and a second surface, the main body further has two opposite inner walls, the inner walls are respectively adjacent to the first surface and the second surface and along an extending direction extending, a perforation is defined between the inner walls; and At least one pair of protruding structures are located in the through holes and are respectively connected to the corresponding inner walls, each of the protruding structures has two first inclined surfaces and a second inclined surface, the first inclined surfaces are respectively adjacent to and inclined to the first inclined surface a surface, the second inclined surface is adjacent to and inclined to the second surface, and the second inclined surface is located between the first inclined surfaces in the extending direction; abutting a first mold with the second surface of the heat-conducting plate, and heating the first mold to a first temperature; placing a heat pipe parallel to the extending direction and passing through the perforation on the first mold; and A second mold is heated to a second temperature, and the second mold is relatively moved toward the first mold to press against the heat transfer pipe, until the heat transfer pipe is deformed and at least partially abuts against the inner walls, the heat pipes Between the first inclined plane and the second inclined planes, the second temperature is greater than the first temperature. The manufacturing method according to claim 6, wherein the range of the first temperature is between 80 degrees and 130 degrees. The manufacturing method according to claim 6, wherein the range of the second temperature is between 150 degrees and 200 degrees. The manufacturing method of claim 6, wherein moving the second mold toward the first mold comprises: The second mold presses against the first surface. The manufacturing method according to claim 6, wherein the thermal conductivity of the heat-conducting pipe is greater than that of the heat-conducting plate. The manufacturing method according to claim 6, wherein the cross-section of the heat pipe before being compressed is a hollow circle. The manufacturing method according to claim 6, wherein the cross-section of the heat-conducting pipe before being compressed is hollow and flat. The manufacturing method of claim 6, wherein each of the protruding structures comprises: Two first sub-projection structures are respectively connected to the corresponding inner walls and have a fifth surface respectively, each of the first inclined surfaces is located on the corresponding first sub-projection structure, and each of the fifth surfaces is adjacent to corresponding to the first slope, and each of the fifth surfaces is substantially coplanar with the second surface; and A second sub-projection structure is connected to the corresponding inner wall and located between the first sub-projection structures, the second sub-projection structure has a sixth surface, and the second inclined surface is located on the second sub-projection The sixth surface is adjacent to the corresponding second inclined surface, and the sixth surface and the first surface are substantially coplanar.

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