TW202022306A - Middle bezel frame with heat dissipation structure - Google Patents

Abstract

A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.

Description

Middle frame heat dissipation structure

A middle frame heat dissipation structure, especially a middle frame heat dissipation structure with both structural strength and high thermal conductivity.

As the performance of current mobile devices becomes stronger, the internal computing chip must also provide high-efficiency execution speed, and high heat generation in the mobile device must be deheated to prevent the chip from burning. The lighter and thinner, the smaller the space for installing various electronic components inside, and the heat dissipation components must also be designed and placed in a way that conforms to the narrow space. In the prior art, the industry has designed the temperature equalization plate as the middle frame or back cover of the electronic components of the mobile device. First, the industry directly made the copper material with better heat conduction efficiency characteristics directly into a two-phase heat exchange cavity. The middle frame or back cover of the chamber is not strong due to the soft characteristics of the copper material itself, and it is easy to deform and therefore has poor support. Therefore, other companies first make aluminum or aluminum alloy materials with strong structural strength. The middle frame or back cover, and then the uniform temperature plate or heat pipe is combined with the aluminum middle frame or back cover through diffusion bonding, but the diffusion bonding is prone to generate high heat. When the warm plate or heat pipe is used for diffusion bonding, it is easy to cause the working liquid inside the uniform temperature plate or heat pipe to evaporate or destroy the internal capillary structure, thereby increasing the defect rate. Therefore, other companies use double-sided tape or liquid glue to bond the middle frame and the heat pipe or the heat pipe. However, the double-sided tape or liquid glue used in the bonding work can easily make the middle frame and the heat pipe or the heat pipe Thermal resistance is generated between them, which reduces the efficiency of heat conduction, and the mutual overlap and adhesion will also cause the thickness to be too thick to be installed in a narrow space. Therefore, how to install a heat dissipation unit with good heat conduction efficiency in a limited and narrow space, and also have the structural strength of the middle frame, and provide a middle frame or back cover with good heat dissipation performance and sufficient load capacity, is the first priority for the current industry. aims.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a middle frame heat dissipation structure with good supporting strength and high thermal conductivity. In order to achieve the above object, the present invention provides a middle frame heat dissipation structure, which includes: a body having a frame portion and at least one heat exchange portion, the frame portions are adjacent and connected to the heat exchange portion, the The heat exchange part has an airtight chamber, and the airtight chamber has a capillary structure and a working fluid. In order to achieve the above objective, the present invention provides a middle frame heat dissipation structure, which includes: a body; the body has a frame portion, at least one heat exchange element, and a coupling portion, the frame portion is connected to the coupling portion, and the heat The exchange element is embedded in the joint part, and the outer edge of the heat exchange element is adjacent and connected to the frame part through laser welding or mechanical pressing. Through the frame heat dissipation structure of the present invention, a material with better structural strength is selected as the material of the frame, and a material with better thermal conductivity is selected as the material of the heat exchange part, and finally combined by laser welding, thereby improving the strength of the conventional structure And the lack of poor thermal conductivity.

The above objects, structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings. Please refer to Figures 1, 2, 3, and 4, which are a three-dimensional exploded and assembled view of the first embodiment of the middle frame heat dissipation structure of the present invention. As shown in the figure, the middle frame heat dissipation structure includes: a body 1; The body 1 has a frame portion 11 and at least one heat exchange portion 12, the frame portion 11 is adjacent to and connected to the heat exchange portion 12, the heat exchange portion 12 has an airtight chamber 121, and the air The dense chamber 121 has at least one capillary structure 122 and a working fluid 123 (which can be gas (refrigerant) or liquid such as acetone, pure water, water tank, alcohol, etc.). The heat exchange part 12 and the frame part 11 The materials are of the same or different materials, and the materials of the heat exchange portion 12 and the frame portion 11 are any of gold, silver, copper, aluminum, titanium, and titanium alloys or combinations thereof. The body 1 has a first plate body 11a and a second plate body 11b, and the materials of the first and second plate bodies 11a, 11b are gold, silver, copper, stainless steel, aluminum, commercial pure titanium, and titanium For any one or a combination of alloys, the first and second plates 11a and 11b are made of the same or different materials. The first and second plates 11a, 11b overlap each other to define the airtight chamber 121, and the first plate 11a is made of materials with better support strength, such as any one of the aforementioned stainless steel or titanium alloy. The plate body 11b is made of materials with better thermal conductivity, such as any of the aforementioned gold, silver, copper, and commercial pure titanium, and the first and second plates 11a, 11b are superimposed to form an airtight chamber 121 where vapor and liquid are generated The heat exchange part 12 is formed cyclically. The setting of the corresponding heat source can be one or more heat exchange parts 12, which means that the second plate 11b can be a plurality of corresponding to any of the upper and lower sides of the first plate 11a. One part is joined by laser welding or mechanical pressing, as shown in Figure 4. Please refer to Figure 5, which is a three-dimensional decomposition of the second embodiment of the frame heat dissipation structure of the present invention. As shown in the figure, some of the structural and technical features of this embodiment are the same as the foregoing first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the frame portion 11 is combined with a heat exchange element 2. The main body 1 is recessed with a coupling portion 13 and the coupling portion 13 is connected to the frame portion 11. The coupling portion 13 is a groove having an open side 131 and a closed side 132. The heat exchange element 2 One side is attached to the closed side 132 and the other side is selected to protrude or be in line with or lower than the open side 131, and the outer edge of the heat exchange element 2 is integrated with the frame 11 through laser welding. Please refer to Figures 6 and 7, which are a three-dimensional exploded and combined cross-sectional view of the third embodiment of the frame heat dissipation structure of the present invention. As shown in the figure, this embodiment is the same as the foregoing second embodiment with some structural technical features. This will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the coupling portion 13 of the body 1 is a through hole which penetrates the upper and lower sides of the body 1, and the heat exchange The element 2 is embedded or embedded in the through hole, and the two sides of the heat exchange element 2 are selected to be aligned or protruding or lower than the upper and lower sides of the body 1. In the second and third embodiments described above, the heat exchange element 2 has an airtight chamber 21, and the airtight chamber 21 has a capillary structure 22 and a working fluid 23. The heat exchange element 2 is a Either the temperature equalizing plate or a flat plate heat pipe. In this embodiment, the equalizing plate is taken as an illustrative embodiment but not limited to it. The equalizing plate or flat plate heat pipe penetrates the area without the airtight chamber 21 (Namely, the invalid end area), that is, the outer edge of the uniform temperature plate and the frame portion 11 are combined by laser or laser welding or mechanical stamping. The heat exchange element 2 of the above second and third embodiments can also be replaced with other good thermal conductors such as copper block or graphite block or graphene sheet or commercial pure titanium. The airtight chambers 121 and 21 in the above-mentioned first to third embodiments can be provided with support structures through which the support structure can be a solid column 3, a wave plate 4, and an intermediate support 5 with horizontal and vertical ventilation holes , The hollow ring 6 and other elements are placed in the airtight chamber 121, 21, or the inner surface of one side plate protrudes to the other side to abut the inner surface or capillary of the corresponding side, and the aforementioned elements are used as lifting The support strength of the airtight chamber 121, 21 is used (as shown in Figures 8, 9, 10, and 11). The present invention mainly solves the problem of poor strength of the middle frame caused by only using materials with good thermal conductivity in the conventional middle frame structure, and uses materials with better structural strength such as stainless steel or titanium or aluminum or aluminum alloy as the main structure of the middle frame, and then heat conduction The material with better effect is combined into one body to make a middle frame structure with airtight chamber with uniform temperature effect or the heat exchange element and the middle frame are combined into one body, thereby improving the lack of conventional middle frame strength and poor heat dissipation efficiency, and In addition, because materials with better thermal conductivity are more expensive, the use of materials with different characteristics in different regions can also greatly save material costs. And through the process of forming heat exchange elements and laser welding, the conventional method can be used to combine the middle frame and the heat exchange element by ordinary welding or diffusion bonding or make the middle frame into a heat-absorbing area with an airtight chamber , And then due to the high temperature generated by diffusion bonding or ordinary welding, the internal working fluid evaporates or the capillary structure is damaged.

1: Ontology 11: Frame 11a: The first board 11b: second board 12: Heat Exchange Department 121: airtight chamber 122: Capillary structure 123: working fluid 13: Joint 131: open side 132: closed side 2: Heat exchange element 21: Airtight chamber 22: Capillary structure 23: working fluid 3: solid column 4: Wave board 5: Intermediate support 6: Hollow ring

Figure 1 is a three-dimensional exploded view of the first embodiment of the frame heat dissipation structure of the present invention; Figure 2 is a three-dimensional assembly view of the first embodiment of the frame heat dissipation structure of the present invention; Figure 3 is this The combined cross-sectional view of the first embodiment of the middle frame heat dissipation structure of the present invention; Figure 4 is another three-dimensional combined view of the first embodiment of the middle frame heat dissipation structure of the present invention; Figure 5 is the middle frame heat dissipation of the present invention A perspective exploded view of the second embodiment of the structure; Figure 6 is a perspective exploded view of the third embodiment of the middle frame heat dissipation structure of the present invention; Fig. 7 is the third embodiment of the middle frame heat dissipation structure of the present invention Figure 8 is a combined cross-sectional view of the fourth embodiment of the middle frame heat dissipation structure of the present invention; Figure 9 is a combined cross-sectional view of the fifth embodiment of the middle frame heat dissipation structure of the present invention; Is a combined cross-sectional view of the sixth embodiment of the frame heat dissipation structure of the present invention; FIG. 11 is a combined cross-sectional view of the seventh embodiment of the frame heat dissipation structure of the present invention.

1: Ontology

11: Frame

11a: The first board

11b: second board

12: Heat Exchange Department

Claims (10)

A middle-frame heat dissipation structure includes: a body having a frame portion and at least one heat exchange portion, the frame portion is adjacent to and connected to the heat exchange portion, the heat exchange portion has an airtight chamber, and There is a capillary structure and a working fluid in the airtight chamber. As described in item 1 of the scope of patent application, the middle frame heat dissipation structure, wherein the main body has a first plate body and a second plate body, and the first and second plate systems are of the same or different materials . As described in the first item of the scope of patent application, the middle frame heat dissipation structure, wherein the heat exchange part and the frame part are made of the same or different materials, and the material of the heat exchange part and the frame part is gold , Silver, copper, aluminum, titanium, titanium alloys or any combination thereof. As described in item 1 of the scope of patent application, the middle frame heat dissipation structure, wherein the working flow system is gas or liquid, and the liquid is any one of refrigerant, acetone, pure water, water tank essence, and alcohol. A middle-frame heat dissipation structure includes: a body having a frame portion, at least one heat exchange element, and a joint part, the frame part is connected to the joint part, and the heat exchange element is embedded in the joint part, and The outer edge of the heat exchange element is adjacent and connected to the frame part through laser welding. As described in item 5 of the scope of patent application, the middle frame heat dissipation structure, wherein the heat exchange element has an airtight chamber, and the airtight chamber has at least one capillary structure and a working fluid, and the heat exchange element is Either a uniform temperature plate or a flat heat pipe. As described in item 5 of the scope of patent application, the middle frame heat dissipation structure, wherein the coupling portion is recessed on one side of the body, the recess is a groove, and the groove has an open side and a closed side, One side of the heat exchanging element is attached to the closed side and the other side is selected to protrude or be in line with or lower than the open side. As described in the fifth item of the scope of patent application, the middle frame heat dissipation structure, wherein the coupling part is a through hole, the through hole penetrates the upper and lower sides of the body, and the heat exchange element is embedded in the through hole And the two sides of the heat exchange element are selected to be aligned or protruding or lower than the upper and lower sides of the body. As described in item 5 of the scope of patent application, the heat-exchanging element is any one of copper block or graphite block or graphene sheet or commercial pure titanium. As described in item 5 of the scope of patent application, the middle frame heat dissipation structure, wherein the workflow system is gas or liquid, and the liquid is any one of refrigerant, acetone, pure water, water tank essence, and alcohol.

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