TW470846B - Plate-like loop heat pipe - Google Patents

Abstract

This invention relates to a plate-like loop heat pipe, which several guiding elements construct the passage and are provided In a hollow shell body, the guiding elements form at least one loop within the shell body, and the loop forms in series a evaporation zone, a vapor passage, a condensation zone, and a fluid return passage in sequence. In the shell body, proper amount of liquid is filled, and the fluid return passage and the vapor passage are independent passages respectively. The capillary structure is provided in the fluid return passage, and the flow resistance in the vapor passage is smaller than that of the fluid returned passage. All the fluids in the loop move steadily toward the same direction without conflict when the vapor zone is heated and the condensation zone is cooled, and all the fluids can flow through everywhere of the loop. Therefore, non-condensing gases existing in the loop flow along the loop so that they will not affect the temperature uniformity generated by the loop, so as to make better temperature uniformity and greater heat transfer rate of the heat pipe.

Description

470846 V. Description of the invention (1) The present invention relates to a flat loop heat pipe (2), in particular to a large heat transfer volume, good temperature uniformity, and the influence of non-condensable gases in the heat pipe on the characteristics of the loop system Small heat exchange structure. The conventional heat pipe has been widely used for heat dissipation components of electronic components due to its relatively good heat transfer properties. Generally, heat pipe-type heat dissipation components have a heat pipe 1 and a heat conducting block 11 and a heat conducting block 1 at the end of the electronic component. 1 is connected to one end of the heat pipe 1, the other end of the heat pipe 1 can be connected to the heat exchange device through another heat conducting block, or the other end of the heat pipe 1 is directly sandwiched with a plurality of heat dissipation fins 1 2 as shown in the first figure, That is, the cleaning and degassing industry of the heat pipe heat pipe with heat dissipation fin type 12. The cleanliness, the more able to ensure the non-condensable gas heat pipe in the venting area > Significantly poor gas is easy to transfer heat. After the steam is made in the cold area, it is guided to flow in the area inside the channel. There are quite high steps. The heat conduction body (non-channel) with vacuum degree will produce a large amount, and the shadow will accumulate in the cold range. The flow runs through the capillary channel to make up the capillary tissue, which is used to make up for the completion of the part. The end of the accumulated gas is condensed toward the other vapor stream. 1 3 The liquid in the evaporation zone is quickly filled with the heat pipe. High Stability, but condensing accumulates, its ringing to the heat pipe in the condensing zone channel is a hot zone, the evaporation end is a cold zone, forming a cold zone, the evaporation of the condensate is originally used for heat transfer in the heat pipe for cleaning and vacuuming. There is still a trace amount of good steam in non-condensable gases in the region and the heated end. Among them, the non-condensing flows in the condensing zone, which makes the temperature uniformity and the vapor flow produced by the zone, and then condenses the liquid stream, and then sets the liquid stream from the cold zone to the heat to gas part,

'Page 4 470846 V. Description of the invention (2) The flow constituting the cycle. When one end of the heat pipe 1 is heated, the liquid in the heat pipe evaporates, and the vapor flows toward the condensation area and condenses into a liquid. The liquid is returned to the evaporation area through the capillary tissue. Since the fluid return loop of the heat pipe is set in the same passage, the vapor The flow direction of the flow and liquid flow conflicts in this channel, so that the heat transfer volume is reduced, and the remaining non-condensable gas volume in the channel is stored in the condensation area, forming a region with a large temperature difference, which reduces the temperature uniformity and heat transfer property. As a result, it has also been greatly reduced. Therefore, traditionally, the manufacturing conditions and maintenance of heat pipes have been strictly required. Therefore, the cost has increased significantly, the price has increased, and it is quite uneconomical. In order to provide more practical items, the inventor conducted research and development. To solve the problem of poor heat transfer of the conventional heat pipe. The main object of the present invention is to provide a flat loop heat pipe (2), which forms a multi-channel and multi-loop structure in the heat pipe, and sequentially connects the evaporation zone, the steam channel, the condensation zone, and the fluid return channel into a loop in sequence, in which the steam The channels can be set in parallel with a single channel or more than two channels, and the fluid return channels can also be set in parallel with a single channel or more than two channels, which can form a single-loop series-parallel combination structure, which is more efficient in composition. In the heat exchange device, the circuit mainly uses the guiding effect of the channel flow resistance, that is, the flow resistance of the vapor channel is smaller than the fluid return channel, so that the fluid in the circuit automatically generates cyclic and stable unidirectional and same-direction flow. And the heat pipe hardly has the phenomenon of burning out, so it can produce good heat transfer properties, and it can have a great heat transfer capacity in a limited space. The vapor flow (vapor f 1 0 w) formed in the channel and the condensed liquid flow (1 i qu i d f 1 0w) both flow in the same direction without conflict. And the circuits on the same plane can

'Page 5 470846 V. Description of the invention (3) Form an uneven configuration state to meet actual needs. Another object of the present invention is to provide the above-mentioned flat-plate loop type heat pipe (2), which can be manufactured at a low cost under the consideration of economics, but still maintains the heat transfer function of the heat pipe, and Can produce faster guidance, using the asymmetry of the heat flow in the channels in the circuit and the guidance on the circuit structure, so that the steam channels, condensation zones, fluid return channels, and evaporation zones in heat exchange are connected in series in a loop. The channel can make the non-condensable gas in the shell unable to be fixed and accumulated in the condensation area of the channel, and the non-condensable gas can continuously flow along the channel according to the design direction, which greatly improves the uniformity of the heat pipe. Therefore, even if there is non-condensable gas in the shell of the heat pipe, it has little effect on the functional characteristics of the heat pipe. And can extend the life of the heat pipe. Another object of the present invention is to provide the above-mentioned flat-plate loop-type heat pipe (2), which can obtain a thinner structure than the conventional one under the same amount of heat conduction, because the present invention can only use the housing and the channel guide element. The composition does not require capillary tissue, so that the thickness of the heat pipe is thinner than the conventional one, and the conventionally produced fluid flows back and forth in conflict, which has a large flow resistance and naturally forms a thicker structure. The present invention is a circuit guide of the same plane Flow, so under the same flow resistance, the thickness of the hot plate is also thinner than conventional. In order to achieve the above object, the structure of the present invention includes: a casing and a plurality of guide elements constituting a plurality of channels and placed in a hollow casing, so that the guide element forms at least one loop in the casing, and the loops are formed as a series of evaporation in series Zone, vapor channel, condensation zone, fluid return channel, and the housing is filled with an appropriate amount of liquid, wherein the fluid return channel and the vapor channel are independent of each other.

Page 6 470846 V. Description of the invention (4) Non-common use and let the steam pass through the condensation area to dissipate heat without conflict, non-condensing action, and return. Among them, the steam channel is an example taken for the purpose of the two-way connection and the advantages are shown in the figure. When the second heat pipe (two) can be filled, the shell 3 is filled with at least one lead to guide the shell 3 of the periphery and the bottom shell. On the inner surface 8 of the second shell 32, to increase its ability to straighten capillary tissues (the flow of the fluid back to the fluid can flow through the channel with good temperature and temperature uniformity. After further improving the effect, it is 3, The bottom case 3 is formed in the case without the guide element in the shell. After the connection, it is shown that the inner shell can be set to 3. In addition, there is a capillary structure inside. When the evaporation area is heated, the flow is stable in the same direction, so there is a large circuit. And along the heat exchange device with a large circuit flow rate, the fluid returns to the present invention in order to achieve a predetermined and feasible implementation of the purpose, features and channels, the flow of the channel, so that all the gas return to the road hot plate gas channel above The technical formula of your review is detailed from this figure to the first. It has the liquid guide element 4 filled with the top shell 3 2 bis and the connection with the guided heat transfer function as the second and can be less than the road resistance. All of the circuits of the body are capable of setting up two members in parallel, and the means are described as follows: a case body (see Figure 4, drawing the case 3 31 and the peripheral phase of the third picture element), which is in the case back to the case. The channels and channels of the channel are all connected to the circuit, and the heat transfer is understood in parallel. Here is an illustration of the letter of the present invention. The body 3 is shown, but it has 4 to 2 groups. It is formed in the housing. On the block surface, if the second type of flat hollow seal is necessary, it is necessary to connect it to the lower one. Take the top plate-shaped hair of the casing 33 as a picture. The plate-plate loop-type closed body is connected to the component. ); Inside the shell 3, the path 2, among which the top shell 3 1 〇 shell 3 1, the bottom fine tissue 7, the fine tissue 8, a kind of full-face-like capillary tissue circle __1 1 1_Country 1 · §8 1 lil 议 隐 __ 1 liBil 11 'page 7 470846 V. Description of the invention (5) 7 is provided with a number of wide channels, which is equivalent to the wide channel of the guide element 4, and can also be provided on the inner surface of the housing 3 respectively. It can also be installed on the inner surface of one side of the housing, or it can be integrated with the housing. The plate-like capillary tissue 7 or 8. The guide element 4 is formed in the second figure to form a plate body 40, and a plurality of channels of protrusions or depressions are opened on the plate body 40, and each of the channels is arranged to be formed to meet the needs of the circuit; In addition, another type of the guide element 4 is a strip-shaped or arc-shaped guide element, which is connected to the inner surface of the housing 3 according to the design requirements, or directly processed and formed by the inner surface of the housing in a protruding or recessed manner. In general, a thin casing 3 is more suitable for forming the guide element 4 by stamping, and each circuit can be made at the same time, that is, the form of the guide element 4 shown in the second figure can be directly provided on the casing 3, not The limitation is that it is placed on the top or bottom shell alone. The guide element 4 in the second figure is square, but it is not limited to this shape, but can be circular or the like; and the plate body 40 is formed into four quarters of each loop using state, and each loop group consists of two areas The partition strips 40 a and b and the two edge strips 4 7 are adjacent to each other, and a pair of partition strips 40 a and b form a central gap 48 of a via hole. In the space surrounded by the partition bars 40a, b and the angular two edge bars 47, four first partition bars 41, 42, 43, 43 and the vertical partition bars 40a are juxtaposed therebetween. Four wide channels are formed, and two sides of a second partition strip 4 5 are juxtaposed with the first partition strip 4 4 and the edge strip 4 7 respectively to form two sub-wide channels, and the horizontal partition strip 4 0 b on the other side A bottom spacer 4 6 is arranged side by side, so that it is partitioned into a narrow channel, and the bottom spacer

Page 8 470846 V. Description of the invention (6) Article 4 6 is connected to the first spacer 4 4 in an L shape to form a series circuit consisting of a wide channel, a second wide channel, and a narrow channel, and is formed on both sides A recessed side groove is the connecting area 49; however, the above structure is only a preferred embodiment. Among them, a wide channel forms a vapor channel 2 2, a narrow channel forms a fluid return channel 24, the gap 48 is an evaporation area 2 1, and the edge of the plate where the next wide channel is located is a condensation area 2 3, which is filled in the liquid in the shell. The flow direction is shown in the fourth figure. In addition, the part of the wide channel relying on the condensation zone already has the function of a condensation zone. Circuit 2 consists of evaporation zone 2 1, steam channel 2 2, condensation zone 2 3, and fluid return channel 2 4 which are connected in series. The circuit 2 is filled with a proper amount of liquid. Capillary tissue that can appear and exist within the range of about 80-90% by volume in the channels of the circuits that fill the guiding element. Among them, the fluid return channel 24 and the vapor channel 2 2 are non-shared channels, that is, the vapor channel 22 is an independent channel, and the fluid return channel 24 is also an independent channel, which is different from the conventional traditional heat pipe. The structure of the vapor channel and the fluid return channel share the same channel. In the area of circuit 2 of the present invention, in the fourth figure, two sets of circuits 2 are formed on the upper and lower sides, and one pair of circuits on the upper or lower side is symmetrically arranged, that is, the middle evaporation area 21 and the surrounding condensation are formed. Zone 2 3, so that the steam enters the steam channel 2 2 composed of four wide channels in parallel, and then enters the second wide channel of the condensation zone 23. The condensed liquid returns to the channel 2 4 along with the fluid formed by the narrow channel and returns to evaporation. Zone 2 1, then complete one cycle

470846 V. Description of the invention (7) Ring action, and the shape of the circuit can be set to meet the needs. In the figure, the evaporation area is set at the center, it can also be eccentric, or it can be applied to the corners. Ways to form a variety of shapes. In addition, the present invention makes the flow resistance in the fluid return channel 24 greater than that of the vapor channel 2 2. This is to deliberately cause an imbalance in the heat flow in the shell channel to form an asymmetric structure of the fluid flow in the channel 3 of the shell. The vapor formed in zone 2 1 flows easily and naturally in one direction towards the condensation zone 23 and condenses in the condensation zone. 2 3 forms a condensed liquid stream, allowing the condensed liquid stream and non-condensable gas to flow together with the uncondensed vapor Under the different flow resistance of the circuit and guided by the channel structure, the flow flows steadily and unidirectionally toward the fluid return channel 2 4 and flows back to the evaporation area 2 1 through the fluid return channel 2 4 as referred to in the present invention. The evaporation area 21 is the heated part of the circuit 2. As shown in the third figure, it can be connected to a center of an end surface (bottom surface) of the casing 3 by a heat source 5, and the heat source refers to the easily heated surface of the electronic component. , Usually refers to the central processing unit, but is not limited to this component. Therefore, the evaporation area is connected to the heat exchange device to be radiated. The heat exchange device to be radiated may be a heat transfer block of a heat source, a heated fin group, a hot water jacket, or a condensing area such as another group of circuits of the present invention. The other set of circuits refers to the serial connection of the two circuits of the present invention. In addition, the condensation zone 23 of the present invention is the position of the circuit heat dissipation. This part is the main heat dissipation area. Of course, the channel itself is also a good heat dissipation structure. Connect the condensation area (or the other end surface (top surface) of the casing 3) with a heat exchange device 6, as shown in the third figure, that is, the condensation area and a

Page 10 470846 V. Description of the invention (8) The heat exchange devices are connected for heat dissipation, and the heat exchange devices are integrated radiators, fin groups, cooling water towers or evaporation areas such as another group of circuits of the present invention. In addition, the steam passage 22 shown in the second figure is a number of passages, that is, one or two or more steam passages 2 2 connected in parallel can be provided so that the total flow resistance of each steam passage is smaller than the fluid return passage, of which Flow resistance control is to change the total cross-sectional area or total length of the circuit or a combination thereof to form a state where the flow resistance in the vapor channel is small and the flow velocity is large, and the state where the fluid returns to the channel is large and the flow velocity is small, so that the circuit deliberately The formed heat flow is not aligned, which promotes the determination of the flow direction. Moreover, the fluid return channel 24 is a number of channels in the figure, but it can also be provided with more than two fluid return channels connected in parallel with each other, as long as it meets the aforementioned conditions of greater flow resistance. And, the condensed liquid can only return to the evaporation area through the fluid return channel, and the guided flow of the circuit naturally occurs, and the phenomenon of this flow is a stable unidirectional flow, and Deliberately restricted, only the direction of flow of the design, not the design of the freely flowing violation occurred. Or let the fluid return channel be filled with liquid to form a liquid seal, which can be completely filled with a capillary tissue (not shown in the figure, but similar to the plate-like capillary tissue of the second figure) to form, and can also reduce the gas The space is used to achieve the above-mentioned liquid sealing effect, that is, to increase the asymmetry of the flow resistance, so that the fluid circulation flows more stably toward the design direction, but at this time, the liquid return channel will affect the passage of non-condensable gases, making this implementation The temperature uniformity is poor, and the non-condensable gas can be eliminated through the degassing program of the circuit to improve the temperature uniformity. Because the circuit 2 has been set in series and has a single direction

'Page 11 470846 V. Description of the invention (9) Circulation flow, so that the non-condensable gas existing in the circuit does not accumulate and stay in space and time. It can only flow along the vapor flow or condensed liquid flow in the circuit, so, The invention can form a vapor channel space containing most of the vapor stream gas and a small amount of liquid and non-condensable gas in the condensed liquid stream in the circuit, and most of the fluid return channel space is the condensed liquid and A small amount of vapor flow gas and non-condensable gas constitute a rapid unidirectional circulation flow. All fluids in the heat pipe flow in the same direction without conflict, and all fluids can pass through any channel in the system at any time, so the heat transfer is good, the heat transfer is large, and the temperature difference is small. The invention can put a capillary tissue (not shown) on the fluid return channel 24, and the length of the capillary tissue is only the length of the fluid return channel 24 where the condensed liquid flow is located, so that the inner channel becomes smaller and the flow resistance is smaller. It becomes larger, or extends to the evaporation zone or the condensation zone alone, or to both the evaporation zone and the condensation zone. Capillary tissue can also be provided in the entire circuit, but the flow resistance of the vapor channel is smaller than the fluid return channel . Among them, the capillary structure can be pottery sack, sintered powder, foamed metal, woven mesh, sintered mesh, grooved plate, fiber bundle or spiral. The fluid return channel shall be provided with a space for vapor and non-condensable gas to pass through. A converging space of the evaporation area 21 is formed at the center gap 48, and each partition is directly arranged on the plate body 40 to form a protruding shape on both sides, and the condensation area is formed on the plate body 40 on the front and back sides. The condensing zone 2 3 a lacking the channel-like channel, so that the condensing zone has more space in the second half of the evaporation channel, and it is separated from the peripheral edge of the vertical partition bar 40 a by two adjacent ones. Confluence effect between circuits.

Page 12 470846 V. Explanation of the invention (ίο) Therefore, in the fourth picture, the top shell 3 1 is not viewed from above, and the markings of the various action areas are circled in the middle. In the gas channel 22, the inner half of the channel is the evaporation area of the evaporation flow, which is the generalized evaporation area 2 1 a, and in the vapor channel 22, the outer half of the channel is the vapor flow condensation area, which is also the same as the original condensation area. The generalized condensation area 2 3 a is composed of condensate flow and non-condensate flow return areas 2 6 on both sides, and a communication channel 27 is provided between the vapor channel 22 and the fluid return channel 24 (as shown in the second figure). (Shown.), But in a broad sense, it is provided with a connection area 4 9, which contains the above-mentioned channel 27 or the edge of the plate 40, such as a trough-shaped condensation area 2 3, which is also bounded by the evaporation area 2 1 a and the condensation area Between 2 3 a, as shown in the fourth figure. Whereas the guide element 4 can be made of powder sintered so that it has a capillary structure, it can also cooperate with the aforementioned capillary structure to cover the two sides of the guide element. In summary of the structure described above, the present invention uses an independent flow dividing mechanism, and constitutes a structure in which the flow resistance between the vapor channel and the fluid return channel is not equal, and cooperates with the generated heat flow imbalance and capillary phenomenon to form a series sequence. A unidirectional fluid circulation structure, and the vapor channel and the fluid return channel can also form a multi-channel parallel structure, as long as the flow resistance in the fluid return channel 24 is greater than that of the vapor channel 22, a connection can be generated. In this way, in the production process, the present invention can operate heat transfer without going through the degassing process. If the circuit goes through the degassing process, the thermal conductivity is better and the operating temperature range is wider; so, Makes the circuit easier to compose. Compared with the conventional heat pipe in actual use, the heat conduction flow speed is faster than the conventional heat pipe. The thermal uniformity is high and the heat transfer is good.

Page 13 470846 V. Description of the invention (11) Faster, so the present invention does not require a degassing process, and the cleaning process of cleaning is not important, making the process simple, the cost is low, the price can be reduced, and it has a better It is economical and has better functional characteristics, so the present invention can provide good usability. The present invention is completely different from the conventional heat pipe. The above are detailed descriptions and drawings of the preferred embodiments of the present invention, and are not intended to limit the present invention. All the scope of the present invention shall be subject to the following patent scope. Any embodiment of the spirit of the patent scope and its similar changes And similar structures should be included in the present invention.

Page 14 470846 Brief description of the drawings The first picture is a conventional sectional view. The second figure is an exploded perspective view of the present invention. The third figure is a sectional view taken along line 3-3 of the second figure of the present invention. The fourth figure is a top view without the top shell of the second figure of the present invention, showing the flow direction of the liquid in the guide element. [[No. 1 speaking and knowing 2 The present invention · The heat-conducting block capillary structure of the heat-sinking fins of the heat pipe 2 a 2 6 7 3 3 4 4 4 4 4 0 Circuit evaporation area 22 Evaporation area 23a Condensation area 24 Condensate flow and non-condensation flow Channel in the return area. Top case 3 2 Bottom case guide element plate 4 0 a 、 b Partition strip 4 4 First partition 45 Second partition bottom partition 47 Edge gap center gap 49 Connection area vapor channel condensation Zone fluid return channel

'Page 15 470846

Claims (1)

470846 VI. Scope of patent application1. A flat loop heat pipe (2), including: a casing, which is a hollow closed body, and is filled with liquid therein; and at least one guide element, which is connected to Inside the casing, a circuit is formed in the casing with a guiding element. The circuit is composed of an evaporation region's vapor channel, a condensation region, and a fluid return channel in series. The fluid return channel and the vapor channel are provided with independent channels. And the flow resistance in the fluid return channel is greater than that of the vapor channel, so that the circuit forms an asymmetrical guiding effect. When the liquid is heated by the vaporization zone, the vapor stream flows to the condensation zone to form a condensed liquid stream, allowing the condensed liquid stream to flow. With the non-condensable gas in the shell circuit, together with the uncondensed part of the steam flow, under the asymmetric guidance of the loop heat flow, it flows in a single and the same direction toward the fluid return channel, and then returns to the evaporation area, and then It flows into the evaporation channel and forms a circulating flow. 2 · The flat loop heat pipe (2) as described in item 1 of the scope of patent application, in which the shell is eccentrically disposed relative to the evaporation area of the circuit. 3 · The flat loop heat pipe as described in item 1 of the patent application (2), in which the shell is connected to a heat source by an evaporation area on one end face, and the other end face of the shell is connected to a heat exchange device For the purpose of heat exchange and dispersal 〇I 4 · The flat loop heat pipe (2) as described in item 1 of the scope of patent application, where the filling amount of liquid in the shell refers to the amount filled by the shell. Capillary tissue that can appear and exist to fill 80 to 90% of the volume in each circuit of the guide element. 'Page 17 470846 t. Patent application scope 5. The flat loop heat pipe (2) as described in item 1 of the patent application scope, in which the guiding element is composed of a plurality of spacers, and each spacer is connected to the shell The inner surface is made in one piece. 6 * The flat loop heat pipe (2) as described in item 1 of the scope of patent application, wherein the guiding element is made directly and integrally, and the channels of each circuit are formed on the guiding element by protrusions or depressions, in which the vapor channel and the There are communication channels between the fluid return channels. 7 · The flat loop heat pipe (2) according to item 6 of the scope of patent application, wherein the guide element is made of a capillary material. 8 · The flat loop heat pipe (2) according to item 7 of the scope of patent application, wherein the capillary material is ceramic, sintered powder or foamed metal. 9 · The flat loop heat pipe (2) as described in item 1 of the scope of the patent application, wherein the guide element forms a recessed side groove IX at the side of at least one side (Heart 1 ^ — heat and shape, and road, One of the ring-shaped flat-panel heart flats has some items described in the first part—I Yuan, Fan Li, the secondary technical school, please ask for it ', such as the two Γ-Η tube-heated road ring-shaped flat flats. '—I's road to Fan Fanli is an expert, so D is missing one of the fine hairs, such as Ea. Set back to the surface flow path, but return to the area. The liquid in the body is good, so), the second weaving IX tube heat type road ring type plate flat as described above ο Lu Ditong surrounding Qi Fan steaming is beneficial to junior colleges, please apply for the phase of the road to the two roads for the road ventilation steaming Piece guide. In the middle of its setting P, wash x) y and two mutual Page 470846 VI. Patent application scope 1 3. The flat loop heat pipe as described in item 1 of the patent application scope (2), in which a capillary tissue is provided in the fluid return channel of the guide element to form a larger flow Resistance, and at the same time guide the condensed liquid back to the evaporation zone. 14. The flat loop heat pipe (2) according to item 13 of the scope of patent application, wherein the capillary structure extends to the evaporation area and / or the condensation area, and the capillary structure is ceramic, sintered powder, foamed metal, Woven mesh, sintered mesh, grooved plate, fiber bundle or spiral. 15. The flat loop heat pipe (2) as described in item 1 of the scope of patent application, wherein the flow resistance of the fluid return channel of the guide element is greater than that of the vapor channel, which means that the cross-sectional area of the channel of the fluid return channel is reduced or the channel is reduced. Increase in length or combination. 1 6 · The flat loop heat pipe (2) as described in item 1 of the scope of patent application, wherein the fluid return channel of the guide element is formed with a liquid to form a liquid seal. 1 7 · The flat loop heat pipe (2) according to item 1 of the scope of patent application, wherein the fluid return channel of the guide element is arranged in parallel with two or more channels. 1 8 · The flat loop heat pipe (2) according to item 1 of the scope of patent application, wherein at least one plate-shaped capillary tissue is further provided between at least one inner surface of the housing and the guide element, so as to Increased heat transfer function 〇1 9 * The flat loop heat pipe as described in item 18 of the patent application scope (2), in which the plate-like capillary structure is directly arranged in the casing Page 19 470846 6. Scope of patent application 2 ◦ • The flat loop heat pipe (2) as described in item 18 of the scope of patent application, in which the plate-shaped capillary tissue is provided with a channel.