CN113710062A - Multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device - Google Patents
Multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device Download PDFInfo
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- CN113710062A CN113710062A CN202110979664.7A CN202110979664A CN113710062A CN 113710062 A CN113710062 A CN 113710062A CN 202110979664 A CN202110979664 A CN 202110979664A CN 113710062 A CN113710062 A CN 113710062A
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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Abstract
The invention discloses a multi-structure combined special-shaped micro-rib liquid cooling heat dissipation temperature equalizing device, which belongs to the field of chip heat dissipation and comprises a micro-rib liquid cooling radiator and a temperature equalizing device, wherein the micro-rib liquid cooling radiator comprises a radiator cover plate and a radiator base plate which are mutually spliced, the temperature equalizing device comprises a core body and a base plate which are mutually spliced, the radiator base plate and the core body are mutually spliced, a plurality of sections of main flow channels and a plurality of sections of micro-rib flow channels are arranged in a cavity, the plurality of sections of main flow channels and the plurality of sections of micro-rib flow channels jointly form a phase change loop, and a micro-rib structure is arranged in each micro-rib flow channel. According to the invention, through the mutually spliced micro-rib liquid cooling radiator and the temperature equalizing device, the whole radiating structure is compact, the whole noise is small, and the radiating performance and the temperature equalizing performance are improved; the invention can effectively solve the problem of uniform heat dissipation and temperature equalization of multi-heat-source chips with uneven distribution and uneven heating.
Description
Technical Field
The invention relates to the field of chip heat dissipation, in particular to a multi-structure combined special-shaped micro-rib liquid cooling heat dissipation temperature equalizing device.
Background
At present, the application of high-power PCB boards is more and more extensive, and the high-power PCB boards are indispensable in both civil fields and military fields, such as image processors, industrial personal computers, servers, communication base stations and the like, and are also applied to a plurality of high-end devices. A plurality of chips, transistors, inductors and other electronic components with larger heat productivity are integrated on the high-power PCB. Along with the progress of the technology, the performance of the electronic components is optimized continuously, the size is reduced continuously, the quantity is increased continuously, the heat power consumption and the heat flux density of the electronic components are greatly improved, the electronic components can be reduced in performance and shortened in service life when working in a high-temperature environment for a long time, and when the temperature rise exceeds the bearing limit of the electronic components, the electronic components can be directly failed. Therefore, the key of the current research is how to reasonably solve the heat dissipation problem and greatly improve the stability and reliability of modern electronic products without the need of heat dissipation design.
The traditional Vapor Chamber (Vapor Chamber) technology is similar to a heat pipe in principle, and the difference is that a heat source is one-dimensional linear conduction, while a vacuum Chamber Vapor Chamber is used for conducting heat on a two-dimensional plane, so that the heat dissipation efficiency is higher than that of a heat pipe. The operation principle is as follows: the bottom of the vapor chamber is heated, the cooling liquid in the vacuum cavity is heated and quickly evaporated in a low-pressure environment, the hot air rises and meets the condensation end of the vapor chamber and then is condensed into liquid again to finish the heat dissipation process, the condensed cooling liquid flows back to the evaporation end through a capillary structure pipeline, and a cycle is finished through heat absorption, heat transfer, heat conduction and heat dissipation, so that the purpose of heat dissipation is achieved repeatedly.
The liquid cooling temperature equalizing plate is the same as the micro-channel cold plate in principle, the heat of the heating element is absorbed by the cold plate in a heat conduction mode, the liquid in the cooling tank flows into the cold plate through the water pump and takes away the heat transferred to the cold plate from the heat source in a convection heat exchange mode, and the cooling liquid flows back to the cooling tank through the pipeline, so that the process is repeated.
However, the prior art does not provide an effective heat dissipation temperature equalization solution for the case where the heat dissipation object is a plurality of heat sources with uneven distribution and large difference in heating power.
Disclosure of Invention
The invention aims to: in order to solve the technical problems, the invention provides a multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device, which is used for solving the heat dissipation problem in the prior art when heat dissipation objects are multiple heat sources with uneven distribution and large heating power difference.
The invention specifically adopts the following technical scheme for realizing the purpose: the utility model provides a little rib liquid cooling heat dissipation samming device of multi-structure combined type abnormal shape, includes little rib liquid cooling radiator and samming device, little rib liquid cooling radiator is including the radiator apron and the radiator base plate of mutual amalgamation, the samming device is including the core and the bottom plate of mutual amalgamation, the radiator base plate with the core is amalgamation each other, the radiator base plate with be formed with the cavity between the bottom plate, the cavity is the vacuum, the cavity conduct phase transition medium's among the samming device working space, be provided with the little rib runner of multistage sprue and multistage in the cavity, the multistage sprue with the little rib runner of multistage forms phase transition return circuit jointly, little rib runner sets up in the heat source, arbitrary section be provided with little rib structure in the little rib runner.
As a feasible technical scheme, the micro-rib structure is a trapezoidal micro-rib which is arranged and distributed in an equidistant and crossed manner.
As a possible technical solution, multiple sections of the main flow channels are connected in parallel, and the main flow channels are connected in series with the micro-rib flow channels.
As a feasible technical scheme, be provided with the support column in the cavity, the support column is used for supporting the radiator base plate, the support column includes first support column and a plurality of second support column, first support column set up in the center of cavity, a plurality of the second support column is the double-row linear arrangement of vertical cross and with the second support column is the center of crossing, wherein one row the bilateral symmetry of second support column is provided with a plurality of backward flow post.
As a possible technical solution, the core includes a copper powder sintering support structure and a copper powder sintering inner wall, the copper powder sintering support structure is arranged to be divergently arranged around the center of the first support column, the copper powder sintering support structure is arranged between the two rows of the second support columns, and the copper powder sintering inner wall is arranged around the outer side of the copper powder sintering support structure.
As a feasible technical scheme, the radiator cover plate is provided with a liquid inlet and a liquid outlet.
As a feasible technical solution, a sealing groove is formed in the heat sink substrate, a sealing ring is arranged in the sealing groove, and the sealing ring is used for sealing a space formed between the heat sink substrate and the heat sink bottom plate.
As a feasible technical solution, the liquid-cooled coolant material in the micro-ribbed liquid-cooled radiator is nanofluid.
As a possible technical solution, the nanofluid is graphene nanofluid with a concentration of 0.2%.
As a possible solution, the phase-change medium is a mixture of paraffin and CNTs (nanotubes).
The invention has the following beneficial effects:
1. according to the invention, the micro-rib liquid cooling radiator and the temperature equalizing device are spliced with each other, wherein the substrate of the micro-rib liquid cooling radiator is equivalent to the cover plate of the temperature equalizing device, and the micro-rib liquid cooling radiator and the temperature equalizing device are respectively designed in an integrated manner, so that the material is saved, the thermal resistance is reduced, the whole radiating structure is compact, the whole noise is low, and the radiating performance and the temperature equalizing performance are improved; the invention is suitable for the situation of multiple heat sources with uneven distribution at will, the whole flow channel planning can be changed along with the change of the heat source, the micro-rib channel is arranged by being attached to the heating part of the core, the arrangement can cause the disturbance of the flowing liquid, destroy the thermal boundary layer of the fluid and enhance the convection heat transfer coefficient; therefore, the invention can effectively solve the problems of uneven distribution and uneven heating of the heat dissipation and temperature equalization of the multi-heat-source chip.
2. In the phase change temperature equalizing device, the inner cavity is partially vacuumized, a certain amount of phase change medium is added into the inner cavity, and after the heat absorption end of the phase change temperature equalizing device is heated, the phase change medium absorbs heat in a vacuum state and has higher heat dissipation efficiency; because the base plate of the micro-rib liquid cooling radiator is equivalent to the cover plate of the temperature equalizing device, the heat of the condensation end of the phase change device is directly transferred to the liquid cooling micro-channel cold plate (namely the radiator base plate), the structure of the radiator base plate can effectively improve the problem of the multi-heat source heating temperature equalization, the liquid cooling micro-channel adopts the nano fluid, the heat conductivity of the nano fluid is far higher than that of water, the heat dissipation flow of the whole liquid cooling micro-channel cold plate is that the heat released by the condensation end of the phase change device is transferred to the liquid cooling micro-channel cold plate through heat conduction, the heat is taken away by the liquid cooling micro-channel cold plate through flowing liquid, and therefore the heat dissipation temperature equalization effect of the whole radiator is improved.
3. As a preferable scheme of the invention, the nanofluid used in the invention is graphene nanofluid with the concentration of 0.2%, the thermal conductivity of the nanofluid is improved by 74.3%, and the nanofluid is used as cooling liquid of the microchannel liquid cooling heat dissipation device, so that the heat dissipation performance can be greatly improved on the premise of less loss and pressure drop.
4. In addition, the temperature equalizing device and the liquid cooling micro-channel device are designed in an integrated mode, a core body of the temperature equalizing device is provided with a copper powder sintered support column which is provided with a certain gap, and a phase change material is added into the temperature equalizing device.
Drawings
FIG. 1 is an exploded view of the multi-structure composite special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device of the present invention;
FIG. 2 is a schematic diagram of a liquid-cooled microchannel heat sink cover plate according to the present invention;
FIG. 3 is a schematic perspective view of a liquid-cooled microchannel heat sink substrate according to the present invention;
FIG. 4 is an enlarged partial schematic view of FIG. 3 at A;
FIG. 5 is a schematic perspective view of a cover plate of the phase change temperature uniforming device according to the present invention;
FIG. 6 is a schematic plan view of a liquid-cooled microchannel heat sink according to the present invention;
FIG. 7 is a schematic cross-sectional view taken along line A-A of FIG. 6;
FIG. 8 is a schematic perspective view of a phase change temperature uniforming device according to the present invention;
FIG. 9 is a schematic heat source distribution according to an embodiment of the present invention.
The labels in the figure are: 1-radiator cover plate; 2-a heat sink substrate; 3-a bottom plate; 4-a core body; 11-a liquid inlet; 12-a liquid outlet; 21-a main flow channel; 22-a seal groove; 23-radiator mounting holes; 24-trapezoidal micro-ribs; 25-a first support column; 26-a second support column; 27-reflux column; 28-a cavity; 31-a temperature equalizing device mounting hole; 41-copper powder sintering support column; 42-a second support post positioning slot; 43-a first support column positioning slot; 44-reflux column positioning groove; 9-micro-ribbed channel.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, as shown in fig. 9, the following embodiments of the present invention are illustrated by taking a multi-heat-source chip generating unevenly distributed heat in fig. 9 as an example, in fig. 9, i, ii, iii, iv, v, vi, vii, viii, ix represent different heat sources, respectively, wherein the magnitude of the heat generation power is heat source vii > heat source ix > heat source ii > heat source vi > heat source iii > heat source iv > heat source i > heat source viii > heat source v, and the heat generation power of the heat source vii and the heat source v, the heat source viii, the heat source i, and the heat source iv are not in one order of magnitude; the heat source distribution in the disclosed embodiment of the present invention is only for illustrating an exemplary arrangement of the present invention, and is not intended to limit the scope of the present invention, and no inventive changes are made within the concept of the arrangement of the main flow channel and the micro-rib flow channel of the present invention, and all such changes are within the scope of the present invention.
Example 1
As shown in fig. 1 to 9, the multi-structure composite special-shaped micro-rib liquid-cooling heat dissipation and temperature equalization device provided in this embodiment includes a micro-rib liquid-cooling heat sink and a temperature equalization device, the micro-rib liquid cooling radiator comprises a radiator cover plate 1 and a radiator base plate 2 which are spliced with each other, the temperature equalizing device comprises a core body 4 and a bottom plate 3 which are spliced with each other, the radiator base plate 2 and the core 4 are spliced with each other, a cavity 28 is formed between the radiator base plate 2 and the bottom plate 3, the cavity 28 is vacuum, the cavity 28 is used as a working space of a phase change medium in the temperature equalizing device, the cavity 28 is internally provided with a multi-section main flow passage 21 and a multi-section micro-rib flow passage 9, the multi-section main flow passage 21 and the multi-section micro-rib flow passage 9 jointly form a phase change loop, the micro-rib flow channel 9 is arranged on a heat source, and a micro-rib structure is arranged in any section of the micro-rib flow channel 9.
The radiator cover plate 1 and the radiator base plate 2 are spliced through the radiator mounting hole 23, and any fixed connection mode can be adopted for splicing, for example, welding, mortise and tenon joint, bolts, pin shafts and other modes are spliced, and the invention is not particularly limited to this; the core 4 and the bottom plate 3 are spliced through the temperature equalizing device mounting hole 31, and any fixed connection mode can be adopted for splicing, for example, welding, mortise and tenon joint, bolts, pin shafts and the like, which is not specifically limited in the invention.
Optionally, the micro-rib structure is a trapezoidal micro-rib 24 distributed in an equidistant and crossed arrangement. It can be understood that the micro-rib structure is configured as the trapezoidal micro-ribs 24 in the embodiment, because the variable cross-section channels are formed between the trapezoidal micro-ribs 24 which are arranged and distributed in an equidistant and crossed manner, the structural change of the variable cross-section channels can improve the heat dissipation performance of the temperature equalizing device; the comprehensive heat dissipation and temperature uniformity of the trapezoidal micro-ribs 24 are superior to those of the cubic micro-ribs and the cylindrical micro-ribs, but under the technical idea of the invention, the trapezoidal micro-ribs and the cylindrical micro-ribs can also be selected.
Specifically, the cube micro-ribs have good heat exchange performance, and the average Knoop number of the cube micro-ribs is higher than that of other micro-ribs through simulation, namely the average Knoop number: cube>Step ladder>Cylindrical, but its pressure drop is large: cube>Step ladder>Cylinders, in order to compare the overall heat dissipation of the individual micro-ribs, i.e. to obtain the highest possible heat dissipation with a low pump output loss, the overall heat dissipation is calculated by the formula average nussel number per pressure drop1/3。
It can be understood that under the technical idea of the invention, different heat dissipation effects can be obtained by changing the number and the size of the micro-rib structures, and different temperature equalization adjustment capacities can be effectively obtained for different types of heat sources.
Furthermore, a liquid inlet 11 and a liquid outlet 12 are arranged on the radiator cover plate 1.
Further, a sealing groove 22 is formed in the radiator base plate 2, a sealing ring is arranged in the sealing groove 22, and the sealing ring is used for sealing a space formed between the radiator base plate 2 and the radiator bottom plate 3.
Further, be provided with the support column in the cavity 28, the support column is used for supporting radiator base plate 2, the support column includes first support column 25 and a plurality of second support column 26, first support column 25 set up in the center of cavity 28, a plurality of second support column 26 is the double row linear arrangement of vertical cross and with second support column 26 is the center of crossing, one of them row the bilateral symmetry of second support column 26 is provided with a plurality of backward flow post 27.
Wherein, the first support column 25 is installed and positioned through the first support column positioning groove 43, the second support column 26 is installed and positioned through the second support column positioning groove 42, and the reflux column 27 is installed and positioned through the reflux column positioning groove 44.
Further, the core 4 includes a copper powder sintering support structure 41 and a copper powder sintering inner wall, the copper powder sintering support structure 41 is disposed in a diverging manner around the center of the first support column 25, the copper powder sintering support structure 41 is disposed between the second support columns 26 in a double row shape, and the copper powder sintering inner wall is disposed around the outer side of the copper powder sintering support structure 41.
The flow channel design of the present embodiment is directed to fig. 9, and there are three high heat positions in fig. 9, so accordingly, the micro-rib flow channel should be designed at these three high heat positions. During operation, the multi-heat-source chip of the embodiment generates unevenly distributed heat, and in terms of the whole transmission process, the heat generated by the heat source is transferred in the direction of the heat source (I to ix) -the bottom plate 3 of the phase-change temperature-equalizing module-the phase-change temperature-equalizing core 4-the first support column 25, the second support column 26, the reflux column 27-the cover plate of the phase-change temperature-equalizing module (i.e. the radiator base plate 2 of the liquid-cooling microchannel) -the cooling liquid-the external environment.
Example 2
As shown in fig. 9, this embodiment is based on embodiment 1, and is an exemplary embodiment of a main flow channel 21 and a micro-rib flow channel 9, specifically, this embodiment connects a plurality of sections of the main flow channels 21 in parallel with each other, and the main flow channels 21 are connected in series with the micro-rib flow channels 9.
The main flow channel 21 and the micro-rib flow channel 9 are different from the traditional micro-channel, the invention is a flow channel with uneven distribution, and the flow channel is designed according to the position of a heat source in order to adapt to a heat source with uneven distribution and better solve the temperature uniformity problem. The main flow channel 21 of the micro-rib liquid cooling radiator adopts adaptive design, is designed into a flow channel combining series connection and parallel connection, adopts a mode of parallel connection and series connection firstly, one main flow channel 21 is attached to a heat source I and a heat source II, one main flow channel 21 is attached to a heat source VIII and a heat source IX, the two main flow channels 21 are in parallel connection, one micro-rib flow channel is attached to a heat source III, a heat source IV, a heat source V and a heat source VI, the other micro-rib flow channel is attached to a heat source VII of a core heating area, the micro-rib flow channel of the core heating area is a gathering area of the two parallel main flow channels 21, as the heating power and the heat flux density of the heat source VII are far higher than those of other heat sources, a micro-rib flow channel is required to be further arranged in the gathering area of the main flow channel 21, and a terrace micro-rib structure 24 is adopted in the micro-rib flow channel.
Example 3
This example is based on any of examples 1-2, wherein the phase-change medium is a mixture of paraffin and CNTs.
The phase-Change temperature-equalizing device comprises a phase-Change temperature-equalizing device cover plate (namely a radiator base plate 2), a phase-Change temperature-equalizing device core body 4 and a phase-Change temperature-equalizing device base plate 3, a certain amount of composite PCM (phase Change material) material is injected into a phase-Change material accommodating cavity (namely a cavity 28), the phase-Change temperature-equalizing device core body is welded and sealed by adopting a welding technology, heat generated by a heat source firstly enters the phase-Change material accommodating cavity (namely the cavity 28) through heat-conducting silicone grease and then enters the phase-Change material accommodating cavity through the phase-Change temperature-equalizing device base plate 3, the heated composite PCM is changed from a solid state to a liquid state at the moment, the heated composite PCM can flow in the whole cavity and absorbs a large amount of heat in the process of changing the solid state into the liquid state, the divergent copper powder sintering support column 41 can enable the liquid composite PCM working medium to be distributed more uniformly, the surface temperature of the reflux column 27 is low, the solidification and backflow of the composite PCM material can be helpful for the next cycle use, and the divergent copper powder sintering support column 41 has a large number of pores, the pores can generate adsorption force, so that the liquid PCM working medium can be better adsorbed, the flow of the liquid PCM working medium is more uniform, the reflux rate is accelerated, and the purposes of better heat conduction and uniform temperature heat dissipation are achieved. After the heat passes through the phase change temperature equalizing device, heat conduction is directly carried out to the liquid cooling micro-channel radiator substrate 2, so that the thermal resistance loss can be effectively reduced, and then, through the micro-channel liquid cooling technology, the heat is taken away by the cooling liquid flowing circularly.
Example 4
The liquid cooling liquid material in the micro-rib liquid cooling radiator is graphene nanofluid with the concentration of 0.2%.
The invention aims to solve the problems of uneven heating and uneven heat source distribution, the liquid cooling liquid adopts 0.2% graphene nano fluid, and the graphene nano fluid with the concentration can optimize the comprehensive heat dissipation performance under certain conditions. The substrate and the cover plate of the phase-change temperature equalizing module are welded into a whole by using a welding technology, a mixture of paraffin and CNT is required to be added into a substrate core before welding, the paraffin is high in economical and practical performance, the thermal conductivity of the substrate core can be obviously improved after the CNT is added, the nano fluid used in the invention is graphene nano fluid with the concentration of 0.2%, the thermal conductivity of the graphene nano fluid is improved by 74.3%,
due to the addition of the nanofluid, a fluid with high heat conductivity can be formed, and the heat convection efficiency of the fluid is enhanced.
The calculation formula of the nano fluid thermal conductivity is the nano fluid thermal conductivity (1+241 solution mass fraction) (solution temperature/ambient temperature)1.0233
The heat conductivity of the nano fluid is predicted through the calculation formula, and meanwhile, comparison is carried out according to experiments, and the growth trend of the nano fluid basically accords with the predicted value.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, and any modifications, equivalents and improvements made by those skilled in the art within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a little rib liquid cooling heat dissipation samming device of multi-structure combined type abnormal shape, its characterized in that, includes little rib liquid cooling radiator and samming device, little rib liquid cooling radiator is including radiator apron (1) and radiator base plate (2) of mutual amalgamation, the samming device is including core (4) and bottom plate (3) of mutual amalgamation, radiator base plate (2) with core (4) amalgamation each other, radiator base plate (2) with be formed with cavity (28) between bottom plate (3), cavity (28) are the vacuum, cavity (28) are as the working space of phase change medium among the samming device, be provided with multistage sprue (21) and multistage little rib runner (9) in cavity (28), multistage sprue (21) and multistage little rib runner (9) form the phase transition return circuit jointly, little rib runner (9) set up in the heat source, a micro-rib structure is arranged in any section of the micro-rib flow passage (9).
2. The multi-structure combined special-shaped micro-rib liquid-cooling heat dissipation and temperature equalization device as claimed in claim 1, wherein the micro-rib structure is a trapezoidal micro-rib (24) which is arranged and distributed in an equidistant and crossed manner.
3. The multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device as claimed in claim 1, wherein the multiple sections of the main flow channels (21) are connected in parallel, and the main flow channels (21) are connected in series with the micro-rib flow channels (9).
4. The device of claim 1, wherein a support column is disposed in the cavity (28) and used for supporting the heat sink base plate (2), the support column comprises a first support column (25) and a plurality of second support columns (26), the first support column (25) is disposed in the center of the cavity (28), the second support columns (26) are vertically crossed and arranged in a double-row shape, and the second support columns (26) are crossed, and a plurality of backflow columns (27) are symmetrically disposed on two sides of the second support columns (26).
5. The multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device as claimed in claim 4, wherein the core (4) comprises a copper powder sintering support structure (41) and a copper powder sintering inner wall, the copper powder sintering support structure (41) is arranged to be divergently arranged around the center of the first support column (25), the copper powder sintering support structure (41) is arranged between the second support columns (26) in a double-row shape, and the copper powder sintering inner wall is arranged to surround the outer side of the copper powder sintering support structure (41).
6. The multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device as claimed in claim 1, wherein a liquid inlet (11) and a liquid outlet (12) are formed in the radiator cover plate (1).
7. The multi-structure combined type special-shaped micro-rib liquid cooling heat dissipation and temperature equalization device as claimed in claim 1, wherein a sealing groove (22) is formed in the heat sink substrate (2), and a sealing ring is arranged in the sealing groove (22) and used for sealing a space formed between the heat sink substrate (2) and the heat sink bottom plate (3).
8. The multi-structure composite special-shaped micro-rib liquid-cooling heat dissipation and equalization device as claimed in any one of claims 1 to 7, wherein the liquid-cooling liquid material in the micro-rib liquid-cooling radiator is a nano fluid.
9. The multi-structure composite special-shaped micro-rib liquid-cooling heat dissipation and temperature equalization device as claimed in claim 8, wherein the nanofluid is graphene nanofluid with a concentration of 0.2%.
10. The liquid cooling and heat dissipating device with multiple structural combinations and profiles having micro-ribs according to any one of claims 1 to 7, wherein the phase change medium is a mixture of paraffin and nanotubes.
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| CN115003127A (en) * | 2022-06-27 | 2022-09-02 | 南京佳力图机房环境技术股份有限公司 | Cold drawing heat abstractor for liquid cooling system |
| WO2023115526A1 (en) * | 2021-12-24 | 2023-06-29 | 无锡星驱科技有限公司 | Electric motor controller and heat dissipation system thereof |
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| CN110035642A (en) * | 2019-05-21 | 2019-07-19 | 广东工业大学 | A kind of liquid-cooled heat-conducting block and water-cooling type radiator |
| WO2020256638A1 (en) * | 2019-06-20 | 2020-12-24 | National University Of Singapore | A cold plate for liquid cooling |
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