CN111757656B - A conformal countercurrent liquid cooling radiator - Google Patents
A conformal countercurrent liquid cooling radiator Download PDFInfo
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- CN111757656B CN111757656B CN202010794262.5A CN202010794262A CN111757656B CN 111757656 B CN111757656 B CN 111757656B CN 202010794262 A CN202010794262 A CN 202010794262A CN 111757656 B CN111757656 B CN 111757656B
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- 239000007788 liquid Substances 0.000 title claims abstract description 43
- 238000001816 cooling Methods 0.000 title claims abstract description 36
- 238000005192 partition Methods 0.000 claims abstract description 18
- 238000000926 separation method Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000010146 3D printing Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 239000002826 coolant Substances 0.000 abstract description 5
- 238000004088 simulation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- YOBAEOGBNPPUQV-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe].[Fe] YOBAEOGBNPPUQV-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种共形逆流液冷散热器，包括盖板、隔板、基板，该盖板、隔板、基板与电子设备共形；盖板位于共形逆流液冷散热器的顶部，隔板包括汇流通道、分流通道、逆流通道、横向通道和纵向通道，基板包括进口接头和出口接头，汇流通道位于出口接头正下方，纵向通道位于进口接头正下方，分流通道位于汇流通道上方且相互错开，逆流通道由左流道、右流道、流道分层口和流道分液口组成，该结构能够使左流道和右流道内的冷却介质流向相反；本发明可作为曲面电子设备的液冷散热器，同时具有厚度小、温度均匀性好的优势和良好的综合散热性能。
The invention discloses a conformal countercurrent liquid cooling radiator, comprising a cover plate, a partition plate and a base plate, the cover plate, the partition plate and the base plate being conformal to electronic equipment; the cover plate is located on the top of the conformal countercurrent liquid cooling radiator, The partition plate includes a confluence channel, a branch channel, a counter-flow channel, a transverse channel and a longitudinal channel, the base plate includes an inlet joint and an outlet joint, the confluence channel is located directly below the outlet joint, the longitudinal channel is located directly below the inlet joint, and the split channel is located above the confluence channel and mutually Staggered, the countercurrent channel is composed of a left flow channel, a right flow channel, a flow channel layering port and a flow channel liquid separation port. This structure can make the cooling medium in the left flow channel and the right flow channel flow in opposite directions; the present invention can be used as a curved electronic device. The liquid cooling radiator has the advantages of small thickness, good temperature uniformity and good comprehensive heat dissipation performance.
Description
Technical Field
The invention belongs to the technical field of electronic equipment heat management, and particularly relates to a conformal countercurrent liquid cooling radiator in liquid cooling radiators, which can be applied to electronic equipment heat dissipation.
Background
With the rapid development of integrated circuits and electronic materials, the heat flux density of electronic components rises sharply, and the thermal management problem of electronic equipment is more prominent. Common heat dissipation methods for electronic devices include natural cooling, forced air cooling, cold plate cooling, and the like. The natural heat dissipation cost is low, the failure rate is low, but the heat dissipation device is only suitable for equipment with smaller heat consumption; forced air cooling is to fix the heating device on the radiator, and the cold air carries away heat when passing through the radiator to realize convective heat transfer; the liquid cooling of the cold plate is to design the liquid cooling runner in the metal sheet, and the heat of the device is taken away through the flow of the cooling liquid, so that the heat dissipation efficiency of the cold plate is extremely high compared with natural cooling and forced air cooling.
However, in order to meet the special structural requirements of airship, missile, satellite and the like, the traditional flat-plate liquid cooling radiator cannot meet the structural requirements of the antenna, and the requirements of temperature rise and temperature uniformity of electronic equipment and more importantly the structural requirements are considered.
For example, a patent applied by the limited liability company of permanent electricity and electricity in west ampere, named as a liquid-cooled radiator and a corresponding IGBT module, is filed as 2014, 28.02 and an authorization publication number of CN104882424B, discloses a liquid-cooled radiator and a corresponding IGBT module, wherein disturbance of cooling liquid is enhanced by arranging a turbulence member in a liquid flow channel, so that convection heat exchange coefficients at different positions are changed, and a heat dissipation effect of the liquid-cooled radiator is ensured. However, the disadvantage is that the liquid temperature rises gradually from the inlet along the S-shaped liquid flow channel and reaches the highest temperature at the outlet, which cannot ensure the temperature uniformity of the liquid cooling radiator.
For example, the patent of the university of sienna electronics technology, entitled "a temperature homogenized microchannel heat sink", filed 2018, 20.04.7.an grant No. CN108650848B, discloses a temperature homogenized microchannel heat sink passing through a coolant distributor with an internal k-layer and 2kAnd the liquid distribution channel consisting of the-1 inverted T-shaped flow channel is connected with each group of heat dissipation channels, so that the heat dissipation device has the advantages of stronger heat dissipation capacity, better temperature uniformity and lower pressure drop. However, the disadvantage is that when the number of heat dissipation channels is too large, i.e. the k value becomes large, the thickness becomes large, and the practical use requirement cannot be met.
Disclosure of Invention
In order to solve the technical problems that the conventional liquid cooling radiator is large in thickness, insufficient in temperature uniformity and incapable of meeting the requirements of curved surface electronic equipment in structure, the invention aims to provide a conformal countercurrent liquid cooling radiator, which effectively ensures the temperature uniformity on the basis of solving the problem of conformality with the electronic equipment.
In order to achieve the aim, the invention adopts the following technical scheme:
a conformal countercurrent liquid cooling radiator comprises a cover plate, a partition plate and a substrate, and is characterized in that the cover plate, the partition plate and the substrate are conformal with electronic equipment; the cover plate is positioned at the top of the conformal countercurrent liquid cooling radiator; the partition plate comprises a confluence channel, a diversion channel, a countercurrent channel, a transverse channel and a longitudinal channel; the base plate comprises an inlet joint and two identical outlet joints; the confluence channel is positioned right below the outlet joint and is communicated with the outlet joint; the longitudinal channel is positioned right below the inlet joint and is communicated with the inlet joint; the flow distribution channel is positioned above the confluence channel, and the flow distribution channel and the confluence channel are staggered with each other; the countercurrent channel consists of a left runner, a right runner, a runner layering port and a runner liquid dividing port; the flow passage layering port is positioned right below the longitudinal channel; the runner liquid separation ports are respectively positioned at two ends of the left runner and the right runner, so that the flow directions in the left runner and the right runner are opposite, and the temperature uniformity of a heat source on the substrate is ensured.
The counterflow channel is positioned right below the heat source, the distance between the counterflow channels is W, W is 8.5mm, the length of the left flow channel and the right flow channel is L0, the width of the left flow channel and the right flow channel is D0, the height of the left flow channel and the right flow channel is H0, L0 is 186mm, D0 is 0.5mm, and H0 is 4 mm.
The longitudinal channel has a width W0 in the middle, a width W1 at both ends, W0 is 4mm, and W1 is W0/2.
The runner divides the liquid mouth to be located left lower extreme, the upper right end of left runner and the upper left end of right runner, right lower extreme, runner layering mouth is located the longitudinal axis direction of left runner, right runner.
The cover plate, the partition plate and the base plate are integrally formed by metal 3D printing, and aluminum alloy, copper alloy and stainless steel materials are selected.
Compared with the prior art, the invention has the following advantages
1. The partition board adopted by the invention comprises a confluence channel, a diversion channel, a counter-flow channel, a transverse channel and a longitudinal channel, wherein the diversion channel is positioned above the confluence channel, the diversion channel and the confluence channel are mutually staggered, the counter-flow channel consists of a left flow channel, a right flow channel, a flow channel layering port and a flow channel liquid separation port, the flow channel layering port is positioned under the longitudinal channel, the flow channel liquid separation ports are respectively positioned at the two ends of the left flow channel and the right flow channel, the flow channel liquid separation ports are positioned at the left lower end and the right upper end of the left flow channel and the left upper end and the right lower end of the right flow channel, and the flow directions of cooling media in the adjacent left flow channel and right flow channel are opposite by alternately arranging the left flow channel and the right flow channel.
2. According to the invention, the liquid cooling radiator can be printed into a spherical curved surface, an ellipsoidal curved surface, a cylindrical curved surface and other irregular curved surfaces by a metal 3D printing technology, so that the liquid cooling radiator in a flat plate form is converted into the liquid cooling radiator in a curved surface form, and is conformal with electronic equipment.
3. The cover plate, the partition plate and the substrate adopted by the invention are conformal with the electronic equipment, so that the bearing effect can be achieved, and the space utilization rate is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of a portion of region I in FIG. 1;
FIG. 3 is an enlarged view of a portion of region II of FIG. 1;
FIG. 4 is an enlarged view of a portion of region III of FIG. 1;
FIG. 5 is a schematic structural diagram of the left and right flow passages in FIG. 1;
FIG. 6 is a graph of heat source temperature distribution from the simulation of the conformal counterflow liquid-cooled heat sink of FIG. 1.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings
With reference to FIGS. 1, 2, 3, 4 and 5
The conformal countercurrent liquid cooling radiator comprises a cover plate 1, a partition plate 2 and a substrate 3, and is characterized in that the cover plate 1, the partition plate 2 and the substrate 3 are conformal with electronic equipment; the cover plate 1 is positioned at the top of the conformal countercurrent liquid cooling radiator; the partition plate (2) comprises a confluence channel 2.1, a diversion channel 2.2, a counter flow channel 2.3, a transverse channel 2.4 and a longitudinal channel 2.5; the base plate 3 comprises an inlet connection 3.1 and two identical outlet connections 3.2; the confluence channel 2.1 is positioned right below the outlet connector 3.2 and is communicated with the outlet connector 3.2; the longitudinal channel 2.5 is positioned right below the inlet joint 3.1 and is communicated with the inlet joint 3.1; the flow dividing channel 2.2 is positioned above the converging channel 2.1, and the flow dividing channel 2.2 and the converging channel 2.1 are staggered with each other; the countercurrent channel 2.3 consists of a left flow channel 2.3.1, a right flow channel 2.3.2, a flow channel layering port 2.3.3 and a flow channel liquid separation port 2.3.4; the flow passage layering port 2.3.3 is positioned right below the longitudinal channel 2.5; the runner liquid-separating ports 2.3.4 are respectively positioned at two ends of the left runner 2.3.1 and the right runner 2.3.2, so that the flow directions of the left runner 2.3.1 and the right runner 2.3.2 are opposite, and the temperature uniformity of the heat source 4 on the substrate 3 is ensured.
A converging channel 2.1, a diverging channel 2.2, a counter-flow channel 2.3, a transverse channel 2.4 and a longitudinal channel 2.5 in the conformal counter-flow liquid cooling radiator distribute cooling media; cooling medium enters the conformal countercurrent liquid-cooled radiator through the inlet connector 3.1, passes through the longitudinal channel 2.5 and the transverse channel 2.4, enters the right flow channel 2.3.2 from the flow dividing channel 2.2 at the left end through the flow dividing port 2.3.4 at the left upper end, flows out of the confluence channel 2.1 at the right end through the flow dividing port 2.3.4 at the right lower end, and is discharged through the outlet connector 3.2 at the right end; or the liquid flows into the left flow channel 2.3.1 from the flow dividing channel 2.2 at the right end through the flow dividing port 2.3.4 at the upper right end, flows out from the confluence channel 2.1 at the left end after passing through the flow dividing port 2.3.4 at the lower left end, and is discharged through the outlet connector 3.2 at the left end. By alternately arranging the left flow channel 2.3.1 and the right flow channel 2.3.2, the flow directions of the cooling mediums in the adjacent left flow channel 2.3.1 and right flow channel 2.3.2 are opposite, and the temperature uniformity of the substrate 3 is improved.
The conformal countercurrent liquid cooling radiator is conformal with electronic equipment, and is suitable for spherical curved surfaces, ellipsoidal curved surfaces, cylindrical curved surfaces and other irregular curved surfaces.
The counterflow channel 2.3 is located right below the heat source 4, the distance between the counterflow channels 2.3 is W, W is 8.5mm, the length of the left flow channel 2.3.1 and the right flow channel 2.3.2 is L0, the width is D0, the height is H0, L0 is 186mm, D0 is 0.5mm, and H0 is 4 mm.
The longitudinal channel 2.5 has a middle width W0, two ends width W1, W0 is 4mm, W1 is W0/2, and when the two ends width W1 is W0/2, the flow distribution is performed on the transverse channel 2.4.
The runner divides liquid mouth 2.3.4 to be located left lower extreme, the upper right end of left runner 2.3.1 and the upper left end, the lower right end of right runner 2.3.2, runner layering mouth 2.3.3 is located the longitudinal axis direction of left runner 2.3.1, right runner 2.3.2.
The cover plate 1, the partition plate 2 and the base plate 3 are integrally formed by metal 3D printing, and aluminum alloy, copper alloy and stainless steel materials are selected.
Refer to FIG. 6
In the figure, the abscissa represents a heat source number, the ordinate represents a heat source temperature, and the ANSYS Icepak software is adopted to carry out thermal simulation analysis, so that the technical effects of the invention are further explained:
1. a simulation model:
in this embodiment, the conformal countercurrent liquid cooling radiator is a cylindrical curved surface, the length is 212mm, the arc length is 114mm, the thickness is 6mm, the thickness of the cover plate 1 and the substrate 3 is 1mm, the width of the longitudinal channel 2.5 is 4mm and 2mm, the depth is 1.5mm, 4 groups of countercurrent channels 2.3 are provided, each group is provided with 8 left runners 2.3.1 and 8 right runners 2.3.2, the distance between the countercurrent channels 2.3 in each group is 8.5mm, the width of the left runner 2.3.1 and the width of the right runner 2.3.2 are 0.5mm, the height is 4mm, and each runner is 186 mm.
2. Simulation conditions are as follows:
(1) the conformal countercurrent liquid cooling radiator is made of Aluminum 6061-T6, and the heat source material is pure copper;
(2) the ambient temperature is 20 ℃;
(3) the cooling medium is 280K of water, and the volume flow of the inlet cooling medium is 0.0001m3/s；；
(4) The body heat sources are uniformly distributed on the substrate in a 4 x 8 square matrix, the size of each single body heat source is 4mm x 3.5mm x 2mm, the heating power of each single body heat source is 50W, and the total heating power is 1600W.
3. And (3) simulation results:
as can be seen from FIG. 6, the maximum temperature of 32 individual heat sources is 68.9-72.5 ℃; the minimum temperature is 48.1-51.6 ℃, and the average temperature is 64.1-67.6 ℃.
The simulation results show that the variance of the maximum temperature of the 32 individual heat sources is 0.986 ℃, the variance of the minimum temperature is 1.152 ℃, and the variance of the average temperature is 0.993 ℃, namely the conformal countercurrent liquid cooling radiator provided by the invention has the advantages of good comprehensive heat radiation performance and good temperature uniformity, and has the characteristics of small thickness and conformality with electronic equipment.
The foregoing description is only an example of the present invention and does not constitute any limitation to the present invention, and it will be apparent to those skilled in the art that various modifications and variations in form and detail may be made without departing from the principle and structure of the present invention after understanding the present invention, and such modifications and variations are within the scope and spirit of the invention.
Claims (5)
1. A conformal countercurrent liquid cooling radiator comprises a cover plate (1), a partition plate (2) and a substrate (3), and is characterized in that the cover plate (1), the partition plate (2) and the substrate (3) are conformal with electronic equipment; the cover plate (1) is positioned at the top of the conformal countercurrent liquid cooling radiator; the partition plate (2) comprises a confluence channel (2.1), a diversion channel (2.2), a countercurrent channel (2.3), a transverse channel (2.4) and a longitudinal channel (2.5); the base plate (3) comprises an inlet connection (3.1) and two identical outlet connections (3.2); the confluence channel (2.1) is positioned right below the outlet connector (3.2) and is communicated with the outlet connector (3.2); the longitudinal channel (2.5) is positioned right below the inlet joint (3.1) and is communicated with the inlet joint (3.1); the flow dividing channel (2.2) is positioned above the confluence channel (2.1), and the flow dividing channel (2.2) and the confluence channel (2.1) are staggered; the countercurrent channel (2.3) consists of a left flow channel (2.3.1), a right flow channel (2.3.2), a flow channel layering port (2.3.3) and a flow channel liquid separation port (2.3.4), and the countercurrent channel (2.3) and the transverse channel (2.4) are positioned at two sides of the transverse axis of the partition plate (2) and are alternately arranged; the flow passage layering port (2.3.3) is positioned right below the longitudinal channel (2.5); the runner liquid separation ports (2.3.4) are respectively positioned at two ends of the left runner (2.3.1) and the right runner (2.3.2), so that the flow directions in the left runner (2.3.1) and the right runner (2.3.2) are opposite, and the temperature uniformity of the heat source (4) on the substrate (3) is ensured.
2. The conformal countercurrent liquid-cooled heat sink of claim 1, wherein said countercurrent channels (2.3) are located directly below the heat source (4), the distance between the countercurrent channels (2.3) is W, W is 8.5mm, the left (2.3.1) and right (2.3.2) flow channels have a length L0, a width D0, a height H0, an L0 of 186mm, a D0 of 0.5mm, and an H0 of 4 mm.
3. The conformal countercurrent liquid-cooled heat sink of claim 1, wherein said longitudinal channel (2.5) has a width W0 in the middle, a width W1 at both ends, a width W0 of 4mm, and a width W1/2 of W0/2.
4. The conformal countercurrent liquid-cooled heat sink of claim 1, wherein the flow channel liquid-separating ports (2.3.4) are located at the left lower end and the right upper end of the left flow channel (2.3.1) and the left upper end and the right lower end of the right flow channel (2.3.2), and the flow channel layering ports (2.3.3) are located in the longitudinal axis direction of the left flow channel (2.3.1) and the right flow channel (2.3.2).
5. The conformal countercurrent liquid-cooled heat sink of claim 1, wherein the cover plate (1), the partition plate (2) and the substrate (3) are integrally formed by 3D printing of metal, and are made of aluminum alloy, copper alloy and stainless steel.
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| CN114111099B (en) * | 2021-11-29 | 2023-06-06 | 上海交通大学 | Countercurrent communication microchannel evaporator device |
| CN114325590B (en) * | 2021-12-27 | 2023-05-30 | 北京微焓科技有限公司 | Phased array radar cold plate and phased array radar |
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|---|---|---|---|---|
| CN107509366A (en) * | 2017-08-30 | 2017-12-22 | 中国电子科技集团公司第二十九研究所 | A kind of conformal heat exchanger based on porous flat pipe |
| CN108650848A (en) * | 2018-04-20 | 2018-10-12 | 西安电子科技大学 | A kind of microchannel heat sink of equalizing temperature |
| CN108766946A (en) * | 2018-07-24 | 2018-11-06 | 苏州汇川联合动力系统有限公司 | Liquid-cooling heat radiator and electric machine controller |
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| KR100365022B1 (en) * | 2000-05-04 | 2002-12-16 | 한국기계연구원 | Loop heat transfer device with high efficiency fin |
| US8109325B2 (en) * | 2000-06-30 | 2012-02-07 | Alliant Techsystems Inc. | Heat transfer system |
| CN1195196C (en) * | 2002-01-10 | 2005-03-30 | 杨洪武 | Integzated type heat pipe and heat exchange method |
| WO2005043059A2 (en) * | 2003-10-28 | 2005-05-12 | Swales & Associates, Inc. | Manufacture of a heat transfer system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107509366A (en) * | 2017-08-30 | 2017-12-22 | 中国电子科技集团公司第二十九研究所 | A kind of conformal heat exchanger based on porous flat pipe |
| CN108650848A (en) * | 2018-04-20 | 2018-10-12 | 西安电子科技大学 | A kind of microchannel heat sink of equalizing temperature |
| CN108766946A (en) * | 2018-07-24 | 2018-11-06 | 苏州汇川联合动力系统有限公司 | Liquid-cooling heat radiator and electric machine controller |
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