CN111163618A - 3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation and method - Google Patents
3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation and method Download PDFInfo
- Publication number
- CN111163618A CN111163618A CN201911387813.XA CN201911387813A CN111163618A CN 111163618 A CN111163618 A CN 111163618A CN 201911387813 A CN201911387813 A CN 201911387813A CN 111163618 A CN111163618 A CN 111163618A
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- flow channel
- power supply
- cold plate
- heat dissipation
- serpentine flow
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of power supply heat dissipation, and discloses a 3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation and a method thereof, wherein the liquid cooling power supply shell adopted by the method comprises a cold plate shell, a plurality of snakelike runners are arranged in the cold plate shell, the snakelike runner at the head end is long, the snakelike runner at the tail end is short, and the length of the snakelike runner at the middle part is between the snakelike runner at the head end and the snakelike runner at the tail end; one ends of the head-end serpentine flow channel, the middle serpentine flow channel and the tail-end serpentine flow channel are flush, and the other ends of the head-end serpentine flow channel, the middle serpentine flow channel and the tail-end serpentine flow channel are of step ladder structures; the head end serpentine channel is communicated with the fluid connector to form a circulating liquid inlet end; the tail end serpentine flow channel is communicated with the fluid connector to form a circulating liquid outlet end; the liquid cooling heat dissipation technology solves the heat dissipation problem of the high-power supply, has strong heat dissipation capability and convenient disassembly, assembly and maintenance, enables the power supply power to be larger, and has wide application prospect in the heat dissipation aspect of the high-power supply.
Description
Technical Field
The invention relates to the technical field of power supply heat dissipation, in particular to a 3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation and a method.
Background
With the development of miniaturization of power modules, the heat density of the modules is higher and higher, the traditional power heat dissipation mode mostly adopts air-cooling and air-cooling heat dissipation, and the heat dissipation capacity is limited, so that the output power of the power supply is limited. In addition, the requirement of a high-power 3U-VPX power supply is more and more.
Disclosure of Invention
In view of the above technical problems, an object of the present invention is to provide a liquid-cooled heat dissipation-based 3U-VPX liquid-cooled power supply housing and method, which can meet the heat dissipation requirements of a high-power 3U-VPX power supply.
In order to achieve the purpose of the invention, the invention adopts the following scheme:
A3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation comprises a cold plate shell 7, wherein the cold plate shell 7 is of a rectangular plate structure, a plurality of snake-shaped flow passages are arranged in the rectangular plate structure, the head end snake-shaped flow passage is long, the tail end snake-shaped flow passage is short, and the length of the middle snake-shaped flow passage is between the head end snake-shaped flow passage and the tail end snake-shaped flow passage; one ends of the head-end serpentine flow channel, the middle serpentine flow channel and the tail-end serpentine flow channel are flush, and the other ends of the head-end serpentine flow channel, the middle serpentine flow channel and the tail-end serpentine flow channel are of step ladder structures; the head end serpentine channel is communicated with the fluid connector 1 to form a circulating liquid inlet end; the tail end serpentine flow channel is communicated with the fluid connector 1 to form a circulating liquid outlet end;
a plate pulling clamp 8 arranged on the cold plate shell 7 is connected with one side of the liquid cooling cover plate 9 above in a clamping manner; a printed circuit board 5 is arranged between the cold plate shell 7 and the cover plate 4 below the cold plate shell, and one end of the printed circuit board 5 is provided with a power supply butt-plug connector 2; the fluid connector 1 at the head end and the fluid connector 1 at the tail end are provided with locking strips 6 on the outside.
A3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation is characterized in that a round cover plate 3 is arranged on one side of a fluid connector 1.
A3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation is disclosed, wherein a power supply cold plate 7 is a mounting base of an electronic device and is a heat exchange carrier.
A liquid cooling heat dissipation-based circulating liquid cooling method of a 3U-VPX liquid cooling power supply shell comprises the steps that circulating liquid enters a flow channel of a cold plate shell 7 through a fluid connector 1 at one end, meanwhile, a power supply heating device is transferred to the cold plate shell 7 through heat conduction, the circulating liquid exchanges heat with a power supply of a printed circuit board 5 through a snake-shaped flow channel on the cold plate shell 7, then the circulating liquid flows out from the other end of the snake-shaped flow channel and flows out through the fluid connector 1 at the other end, one-time circulation is completed, and heat is taken away; finally, the temperature of the power supply is stabilized within a specified reasonable interval.
Design factors in the cold plate housing:
(1) the contact surface of the cold plate and the heating device is smooth;
(2) the cold plate and the heating device need to have certain combined pressing force, so that the contact thermal resistance is reduced as much as possible;
(3) the design of the flow channel should pass through the heat absorption surface of the cold plate as much as possible, namely corresponding to the layout of the heating element;
(4) the runner should adopt the short length scale as much as possible, the whole course of the runner flows uniformly, and has good guidance quality to reduce the pressure loss, and the runner itself should have as large a heat exchange area as possible to improve the heat convection coefficient;
(5) the flow channel design should consider manufacturability, be convenient for the subsequent processing after the welding, the processing flow channel is unblocked even, has good gas tightness simultaneously.
For the strips (1) and (2), heat-conducting silicone grease is adopted as a heat-conducting interface material on the contact surface of the heating element and the cold plate, and the assembly pressure is considered so as to reduce the contact thermal resistance and improve the heat transfer efficiency;
for the above (3) and (4), the cold plate is directly opposite to the heating device on the printed board, the heating points are more, the local heating amount is larger, the serpentine flow channel is integrally adopted during the flow channel design, the fluid flow is accelerated for the liquid outlet, and the heat dissipation efficiency is improved.
By adopting the technical scheme, the invention has the following beneficial effects:
A3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation and a method thereof are disclosed. Finally, the temperature of the power supply is stabilized in a reasonable interval, the heat dissipation problem of the high-power VPX-3U power supply is solved, and the overall temperature of the power supply is controlled in a more reasonable temperature range. The application of the liquid cooling heat dissipation technology can obviously improve the heat dissipation capacity of the power supply, so that the power supply power can be larger.
The invention is designed according to VATA48, has small size, light weight, strong heat dissipation capability and convenient disassembly, assembly and maintenance, and has wide application prospect in the aspect of heat dissipation of high-power supplies.
Drawings
FIG. 1 is a schematic diagram of an assembly structure of a 3U-VPX liquid cooling power supply housing based on liquid cooling heat dissipation;
fig. 2 is a schematic view of a cold plate housing flow passage configuration.
Detailed Description
The patent is further described below with reference to the accompanying drawings.
As shown in fig. 1 and 2, a 3U-VPX liquid cooling power supply housing based on liquid cooling heat dissipation comprises a cold plate housing 7, wherein the cold plate housing 7 is of a rectangular plate structure, a plurality of serpentine channels are arranged in the rectangular plate structure, the first-end serpentine channel is 7.1 long, the tail-end serpentine channel is 7.3 short, and the length of the middle serpentine channel 7.2 is between the first-end serpentine channel 7.1 and the tail-end serpentine channel 7.3; one ends of the head-end serpentine flow channel, the middle serpentine flow channel and the tail-end serpentine flow channel are flush, and the other ends of the head-end serpentine flow channel, the middle serpentine flow channel and the tail-end serpentine flow channel are of step ladder structures; the head end serpentine channel is communicated with the fluid connector 1 to form a circulating liquid inlet end; the tail end serpentine flow channel is communicated with the fluid connector 1 to form a circulating liquid outlet end;
a plate pulling clamp 8 arranged on the cold plate shell 7 is connected with one side of the liquid cooling cover plate 9 above in a clamping manner; a printed circuit board 5 is arranged between the cold plate shell 7 and the cover plate 4 below the cold plate shell, and one end of the printed circuit board 5 is provided with a power supply butt-plug connector 2; the fluid connector 1 at the head end and the fluid connector 1 at the tail end are provided with locking strips 6 on the outside.
A round cover plate 3 is arranged on one side of the fluid connector 1. The power supply cold plate 7 is a mounting base of an electronic device and is also a heat exchange carrier. The liquid cooling circulating liquid is low-temperature-65-degree liquid cooling antifreezing liquid.
A liquid cooling heat dissipation-based circulating liquid cooling method of a 3U-VPX liquid cooling power supply shell comprises the steps that circulating liquid enters a flow channel of a cold plate shell 7 through a fluid connector 1 at one end, meanwhile, a power supply heating device is transferred to the cold plate shell 7 through heat conduction, the circulating liquid exchanges heat with a power supply of a printed circuit board 5 through a snake-shaped flow channel on the cold plate shell 7, then the circulating liquid flows out from the other end of the snake-shaped flow channel and flows out through the fluid connector 1 at the other end, one-time circulation is completed, and heat is taken away; finally, the temperature of the power supply is stabilized within a specified reasonable interval.
Design factors in the cold plate housing:
(1) the contact surface of the cold plate and the heating device is smooth;
(2) the cold plate and the heating device need to have certain combined pressing force, so that the contact thermal resistance is reduced as much as possible;
(3) the design of the flow channel should pass through the heat absorption surface of the cold plate as much as possible, namely corresponding to the layout of the heating element;
(4) the runner should adopt the short length scale as much as possible, the whole course of the runner flows uniformly, and has good guidance quality to reduce the pressure loss, and the runner itself should have as large a heat exchange area as possible to improve the heat convection coefficient;
(5) the flow channel design should consider manufacturability, be convenient for the subsequent processing after the welding, the processing flow channel is unblocked even, has good gas tightness simultaneously.
For the strips (1) and (2), heat-conducting silicone grease is adopted as a heat-conducting interface material on the contact surface of the heating element and the cold plate, and the assembly pressure is considered so as to reduce the contact thermal resistance and improve the heat transfer efficiency;
for the above (3) and (4), the cold plate is directly opposite to the heating device on the printed board, the heating points are more, the local heating amount is larger, the serpentine flow channel is integrally adopted during the flow channel design, the fluid flow is accelerated for the liquid outlet, and the heat dissipation efficiency is improved.
The structure of the flow channel and the bent part of the flow channel directly influence the heat dissipation of the flow channel and the flow resistance and pressure drop of the flow channel. The longer the straight channel part of the flow channel is, the smaller the flow resistance is, and the smaller the pressure drop is; the more the curved channels of the flow channel are, the better the heat dissipation performance is, but the larger the flow resistance is, the larger the pressure drop is; the larger the sectional area of the flow channel is, the better the heat dissipation performance is, the smaller the flow resistance is, and the smaller the pressure drop is. The serpentine flow channel has a good flow equalizing effect, ensures a large proportion of the length of the straight channel part, reduces the resistance of the flow channel, reduces the pressure drop of the flow channel and also reduces the process difficulty.
The invention is designed according to VATA48, has small size, light weight, strong heat dissipation capability and convenient disassembly, assembly and maintenance, and has wide application prospect in the aspect of heat dissipation of high-power supplies.
Claims (4)
1. A3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation is characterized in that: the cooling plate comprises a cooling plate shell 7, wherein the cooling plate shell 7 is of a rectangular plate structure, a plurality of snake-shaped flow passages are arranged in the rectangular plate structure, the head end snake-shaped flow passage is long, the tail end snake-shaped flow passage is short, and the length of the middle snake-shaped flow passage is between the head end snake-shaped flow passage and the tail end snake-shaped flow passage; one ends of the head-end serpentine flow channel, the middle serpentine flow channel and the tail-end serpentine flow channel are flush, and the other ends of the head-end serpentine flow channel, the middle serpentine flow channel and the tail-end serpentine flow channel are of step ladder structures; the head end serpentine channel is communicated with the fluid connector 1 to form a circulating liquid inlet end; the tail end serpentine flow channel is communicated with the fluid connector 1 to form a circulating liquid outlet end;
a plate pulling clamp 8 arranged on the cold plate shell 7 is connected with one side of the liquid cooling cover plate 9 above in a clamping manner; a printed circuit board 5 is arranged between the cold plate shell 7 and the cover plate 4 below the cold plate shell, and one end of the printed circuit board 5 is provided with a power supply butt-plug connector 2; the fluid connector 1 at the head end and the fluid connector 1 at the tail end are provided with locking strips 6 on the outside.
2. The liquid-cooled heat dissipation-based 3U-VPX liquid-cooled power supply housing of claim 1, wherein: a round cover plate 3 is arranged on one side of the fluid connector 1.
3. The liquid-cooled heat dissipation based 3U-VPX liquid-cooled power supply housing of claim 1, wherein said power cold plate 7 is a mounting base for electronic devices and a heat exchange carrier.
4. The method of claim 1, wherein the method further comprises the steps of: circulating liquid enters a flow channel of the cold plate shell 7 through the fluid connector 1 at one end, meanwhile, a power supply heating device is transferred to the cold plate shell 7 through heat conduction, the circulating liquid exchanges heat with a power supply of the printed circuit board 5 through the serpentine flow channel on the cold plate shell 7, then the circulating liquid flows out from the other end of the serpentine flow channel and flows out through the fluid connector 1 at the other end, primary circulation is completed, and heat is taken away; finally, the temperature of the power supply is stabilized in a specified reasonable interval;
design factors in the cold plate housing:
(1) the contact surface of the cold plate and the heating device is smooth;
(2) the cold plate and the heating device need to have certain combined pressing force, so that the contact thermal resistance is reduced as much as possible;
(3) the design of the flow channel should pass through the heat absorption surface of the cold plate as much as possible, namely corresponding to the layout of the heating element;
(4) the runner should adopt the short length scale as much as possible, the whole course of the runner flows uniformly, and has good guidance quality to reduce the pressure loss, and the runner itself should have as large a heat exchange area as possible to improve the heat convection coefficient;
(5) the flow channel design should consider the manufacturability, facilitate the subsequent processing after welding, the processing flow channel is unblocked and uniform, have good gas tightness at the same time;
for the strips (1) and (2), heat-conducting silicone grease is adopted as a heat-conducting interface material on the contact surface of the heating element and the cold plate, and the assembly pressure is considered so as to reduce the contact thermal resistance and improve the heat transfer efficiency;
for the above (3) and (4), the cold plate is directly opposite to the heating device on the printed board, the heating points are more, the local heating amount is larger, the serpentine flow channel is integrally adopted during the flow channel design, the fluid flow is accelerated for the liquid outlet, and the heat dissipation efficiency is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911387813.XA CN111163618A (en) | 2019-12-30 | 2019-12-30 | 3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911387813.XA CN111163618A (en) | 2019-12-30 | 2019-12-30 | 3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation and method |
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| CN111163618A true CN111163618A (en) | 2020-05-15 |
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| CN201911387813.XA Pending CN111163618A (en) | 2019-12-30 | 2019-12-30 | 3U-VPX liquid cooling power supply shell based on liquid cooling heat dissipation and method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111525789A (en) * | 2020-05-29 | 2020-08-11 | 西安微电子技术研究所 | DC/DC power module heat radiation structure in VPX power supply |
| CN113613463A (en) * | 2021-07-31 | 2021-11-05 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | General cold plate of airborne through liquid cooling module |
| CN114667035A (en) * | 2022-03-02 | 2022-06-24 | 中国电子科技集团公司第二十九研究所 | Flow resistance adjustable simulation leads to fluid device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111525789A (en) * | 2020-05-29 | 2020-08-11 | 西安微电子技术研究所 | DC/DC power module heat radiation structure in VPX power supply |
| CN113613463A (en) * | 2021-07-31 | 2021-11-05 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | General cold plate of airborne through liquid cooling module |
| CN113613463B (en) * | 2021-07-31 | 2023-09-26 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | General cold plate of airborne through liquid cooling module |
| CN114667035A (en) * | 2022-03-02 | 2022-06-24 | 中国电子科技集团公司第二十九研究所 | Flow resistance adjustable simulation leads to fluid device |
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Application publication date: 20200515 |