CN114071955A - Cooling device and electronic equipment comprising same - Google Patents
Cooling device and electronic equipment comprising same Download PDFInfo
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- CN114071955A CN114071955A CN202111265434.0A CN202111265434A CN114071955A CN 114071955 A CN114071955 A CN 114071955A CN 202111265434 A CN202111265434 A CN 202111265434A CN 114071955 A CN114071955 A CN 114071955A
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- heat
- heat exchange
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- fin
- loop
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Abstract
The invention discloses a cooling device and electronic equipment comprising the same, wherein the cooling device comprises a heat-conducting substrate, a first heat-radiating fin and a cooling loop, the first heat-radiating fin is arranged on the heat-conducting substrate, the cooling loop comprises an inner loop and an outer loop which are communicated, the inner loop is arranged inside the heat-conducting substrate and is used for carrying out heat exchange with the heat-conducting substrate, the outer loop is provided with a heat exchange section, and a pipeline of the heat exchange section is arranged at one end part of the first heat-radiating fin, which is far away from the heat-conducting substrate; and/or the external loop is provided with a heat exchange section, a heat exchange assembly is arranged on a pipeline of the heat exchange section, and the heat exchange assembly is used for exchanging heat with the external loop. Compared with the traditional fin radiator, the cooling device has better radiating and cooling effects, does not need to heighten and encrypt the radiating fins, ensures the compactness of the radiator structure, and avoids changing the overall structure of the existing electronic equipment.
Description
Technical Field
The invention relates to a cooling device and an electronic device comprising the same.
Background
A series of high-power electronic devices such as IGBTs and the like are arranged inside a converter in the field of wind power photovoltaic, and the power electronic devices have high heat productivity and can reach dozens of kilowatts sometimes at the same time of high power. In order to ensure safe and stable operation of these devices in a reasonable temperature range, these high-power electronic devices are usually arranged at the core position of the converter, and the overall structural design of the converter is performed around the high-power electronic devices.
In the case of a converter with air cooling, the high-power electronic device is usually placed on the substrate of the heat sink and is closely attached to the surface of the substrate. The other side of the base plate is provided with radiating fins, and a fan in the converter sucks air into the converter from the external environment to carry out heat exchange on the surfaces of the fins, so that heat of devices is taken away. When the power of the electronic device is further increased and the heat productivity is further increased, the heat dissipation is enhanced to a certain extent by adopting a mode of encrypting and heightening fins.
However, the way of encrypting the heightened fins also has certain limitations. On one hand, the density of the fins can influence the circulation of air among the fins, so that the distance among the fins has a minimum value, and when the fin spacing is smaller than the value, the heat dissipation effect is deteriorated; on the other hand, since heat is conducted from the root to the tip of the fin, the fin root temperature is the highest and the fin tip temperature is the lowest. Thus the higher the fin height, the closer the fin tip is to the air temperature, and the less efficient the fin. Therefore, it is difficult to fundamentally improve the cooling performance of the heat sink by optimizing the fin structure.
Disclosure of Invention
The invention aims to overcome the defect of poor heat dissipation and cooling performance of a cooling device in the prior art, and provides the cooling device and electronic equipment comprising the same.
The invention solves the technical problems through the following technical scheme:
the invention provides a cooling device which comprises a heat-conducting substrate, a first radiating fin and a cooling loop, wherein the first radiating fin is arranged on the heat-conducting substrate, the cooling loop comprises an inner loop and an outer loop which are communicated, the inner loop is arranged inside the heat-conducting substrate and is used for carrying out heat exchange with the heat-conducting substrate, the outer loop is provided with a heat exchange section, and a pipeline of the heat exchange section is arranged at one end part of the first radiating fin, which is far away from the heat-conducting substrate;
and/or the external loop is provided with a heat exchange section, a heat exchange assembly is arranged on a pipeline of the heat exchange section, and the heat exchange assembly is used for exchanging heat with the external loop.
In the scheme, the cooling device adopts the structural form, heat generated by the heating component is conducted to the heat-conducting substrate, most of the heat is taken away by cooling liquid flowing in an internal loop in the heat-conducting substrate, the cooling liquid absorbs heat from the internal loop in the heat-conducting substrate, then flows to an external loop and then transfers the heat to the heat exchange assembly or the end part, far away from the heat-conducting substrate, of the first radiating fin for cooling, and the cooled cooling liquid returns to the internal loop again to cool the heat-conducting substrate; at the same time, a small amount of heat is conducted to the first heat dissipation fins on the heat conduction substrate, so that the temperature of the heat conduction substrate is further reduced. Compared with a traditional fin radiator, the radiator has a better radiating and cooling effect, does not need to be heightened and encrypted, ensures the compactness of the radiator structure, and avoids changing the overall structure of the existing electronic equipment.
Preferably, the first heat dissipation fins are provided with a plurality of first heat dissipation fins, the plurality of first heat dissipation fins are arranged in parallel, and an air flow channel is formed between two adjacent first heat dissipation fins.
In this scheme, adopt above-mentioned structural style, adopt a plurality of first radiating fin can strengthen cooling device's radiating effect, improve cooling performance. The air flow channel is formed to facilitate the air to take away the heat on the first radiating fin.
Preferably, the tubes of the heat exchange section pass through the first heat dissipation fins back and forth along the arrangement direction of the plurality of first heat dissipation fins.
In this scheme, adopt above-mentioned structure, can increase outside return circuit and first radiating fin's contact surface, cool down to the coolant liquid in the outside return circuit fast to the coolant liquid cools down to the heat conduction base plate in flowing to the inside return circuit.
Preferably, the pipeline of the heat exchange section includes a plurality of pipeline branches, the plurality of pipeline branches respectively penetrate through the plurality of first radiating fins along the arrangement direction of the plurality of first radiating fins, and the plurality of pipeline branches are sequentially communicated end to end.
By adopting the structure, the pipeline of the heat exchange section in the external loop is arranged in an S shape, the contact surface between the external loop and the first radiating fin is increased, and the temperature of the cooling liquid in the external loop is gradually reduced in the flowing process so as to meet the requirement.
Preferably, the pipeline of the heat exchange section includes a plurality of pipeline branches, the plurality of pipeline branches respectively penetrate through the plurality of first heat dissipation fins along the arrangement direction of the plurality of first heat dissipation fins, one ends of the plurality of pipeline branches are communicated through a first connection pipe, and the other ends of the plurality of pipeline branches are communicated through a second connection pipe.
Adopt above-mentioned structural style for the pipeline of heat transfer section is similar F shape structure setting in the external loop, disperses the coolant liquid in the external loop, increases the heat exchange efficiency of the coolant liquid in the external loop, makes coolant liquid rapid cooling.
Preferably, the heat exchange assembly is disposed on one side of the first heat dissipation fin, and the air flow channel is disposed opposite to the heat exchange assembly.
In this scheme, adopt above-mentioned structural style, avoid heat exchange assembly to possess all the other positions on the one hand, influence cooling device's compact structure nature, on the other hand can make the air that flows through the air runner flow through heat exchange assembly again and cool down heat exchange assembly.
Preferably, the heat exchange assembly is a fin assembly, the fin assembly includes a plurality of second heat dissipation fins, and the plurality of second heat dissipation fins are arranged at intervals in an extending direction of the first heat dissipation fins away from the heat conducting substrate.
In this scheme, heat exchange assembly adopts above-mentioned structure, simple structure, and is with low costs to a plurality of second radiating fin interval arrangement also can form the air runner, can make the air that flows through the air runner of first heat transfer fin flow through the air runner of second heat transfer fin again, thereby can cool down the second fin fast.
Preferably, the heat exchange assembly is a plate-fin heat exchanger.
In this scheme, heat exchange assembly adopts plate-fin heat exchanger, simple structure, simple to operate to plate-fin heat exchanger can carry out rapid cooling through heat transfer medium to the coolant liquid in the external loop, and the cooling efficiency is high.
Preferably, the heat exchange assembly is arranged on one side of the air outlet of the air flow channel.
In this scheme, adopt above-mentioned structure, can make the air dispel the heat to first radiating fin earlier to first radiating fin can directly take away more heats of heat conduction base plate.
Preferably, the heat conducting substrate has a first mounting surface and a second mounting surface which are away from each other, the first heat dissipation fin is arranged on the second mounting surface, and the first mounting surface is used for mounting a heat generating component to be dissipated.
Preferably, the external loop further includes two connecting sections, the two connecting sections are respectively connected with the inlet and the outlet of the internal loop, and two ends of the heat exchange section are respectively communicated with the internal loop through the two connecting sections.
In this scheme, adopt above-mentioned structure, make things convenient for outside return circuit and inside return circuit to install and be convenient for adjust the mounted position of outside return circuit.
Preferably, the heat exchange assembly is disposed on a pipe of the heat exchange section, or the pipe of the heat exchange section is disposed at an end of the first heat dissipation fin far away from the heat conductive substrate.
In this scheme, adopt above-mentioned structure, be convenient for cool down the coolant liquid in the external loop.
Preferably, the cooling device further comprises a circulation pump for driving the cooling liquid in the cooling circuit to circulate between the inner circuit and the outer circuit.
In this case, the coolant in the outer circuit and the inner circuit is circulated by the circulation pump.
Preferably, the internal loop is distributed inside the heat conducting substrate in an S shape.
In this scheme, the inside loop is S-shaped distribution and can makes the coolant liquid flow more multiposition in the heat conduction base plate, the better heat of taking away on the heat conduction base plate of being convenient for.
The invention also provides electronic equipment which comprises the cooling device, wherein the heat generating component of the electronic equipment is arranged on the heat conducting substrate.
In this scheme, adopt above-mentioned cooling device's electronic equipment, can effectively reduce the heat of the interior heating part of electronic equipment, need not to change the overall structure of current electronic equipment.
The positive progress effects of the invention are as follows: the cooling device adopts the structure, heat generated by the heating component is transferred to the heat-conducting substrate, most of the heat is taken away by cooling liquid flowing in an internal loop in the heat-conducting substrate, the cooling liquid absorbs heat from the internal loop in the heat-conducting substrate, then flows to an external loop and transfers the heat to the heat exchange assembly or the end part of the first radiating fin far away from the heat-conducting substrate for cooling, and the cooled cooling liquid returns to the internal loop again to cool the heat-conducting substrate; at the same time, a small amount of heat is conducted to the first heat dissipation fins on the heat conduction substrate, so that the temperature of the heat conduction substrate is further reduced. Compared with a traditional fin radiator, the radiator has a better radiating and cooling effect, does not need to be heightened and encrypted, ensures the compactness of the radiator structure, and avoids changing the overall structure of the existing electronic equipment.
Drawings
Fig. 1 is a schematic structural diagram of a cooling apparatus in embodiment 1 of the present invention.
Fig. 2 is a schematic structural diagram of another view angle of the cooling device in fig. 1.
Fig. 3 is a transverse cross-sectional view of the thermally conductive substrate of fig. 1.
Fig. 4 is a schematic structural diagram of a cooling apparatus in embodiment 2 of the present invention.
Fig. 5 is a schematic structural diagram of a cooling apparatus in embodiment 3 of the present invention.
Fig. 6 is a schematic structural diagram of a cooling apparatus in embodiment 4 of the present invention.
Description of reference numerals:
heat conductive substrate 100
First mounting surface 101
First heat dissipating fin 200
An outlet 312
First connecting pipe 322
Circulating pump 400
Heat generating component 500
Second heat dissipating fin 601
Detailed Description
The present invention is further illustrated by the following examples in conjunction with the accompanying drawings, but the invention is not limited thereby in the scope of the following examples.
Example 1
As shown in fig. 1 to 3, the present invention provides a cooling device, which includes a heat-conducting substrate 100, a first heat-dissipating fin 200 and a cooling circuit, wherein the first heat-dissipating fin 200 is mounted on the heat-conducting substrate 100. The heat conducting substrate 100 has a first mounting surface 101 and a second mounting surface 102 which are separated from each other, the first heat radiating fin 200 is disposed on the second mounting surface 102, and the first mounting surface 101 is used for mounting the heat generating component 500 to be radiated. In the present embodiment, the heat generating component 500 is a high power electronic device (such as an IGBT) inside the converter.
Referring to fig. 1, in the present embodiment, the first heat dissipation fins 200 have a plurality of first heat dissipation fins 200, the plurality of first heat dissipation fins 200 are disposed in parallel, and an air flow channel 210 is formed between two adjacent first heat dissipation fins 200. The plurality of first heat dissipation fins 200 can enhance the heat dissipation effect of the cooling device and improve the cooling performance. The formation of the air flow channel 210 facilitates the passage of air to take away heat from the first heat dissipating fin 200. The cooling fan in the inverter drives the external air to flow through the first heat dissipation fins 200 to remove heat from the first heat dissipation fins 200.
In the present embodiment, the cooling circuit includes an inner circuit 310 and an outer circuit communicating with each other, and the inner circuit 310 is disposed inside the heat conductive substrate 100 and is used to perform heat exchange with the heat conductive substrate 100. As shown in fig. 3, the inner circuit 310 is distributed inside the heat conductive substrate 100 in an S shape. The S-shaped distribution of the inner circuit 310 allows the cooling fluid to flow at a greater position within the heat-conductive substrate 100, thereby facilitating better heat removal from the heat-conductive substrate 100.
Of course, in some other embodiments, the structure of the inner circuit 310 is not limited to the S-shaped flow channel in this embodiment, and may be other structures such as an F-shaped flow channel, as long as the inner circuit 310 can exchange heat with the heat conductive substrate 100 sufficiently.
In this embodiment, the external circuit has a heat exchange section 320, and the pipe of the heat exchange section 320 is disposed at an end of the first heat dissipation fin 200 away from the heat conductive substrate 100, so that the first heat dissipation fin 200 exchanges heat with the cooling liquid in the external circuit. The cooling device adopts the above structure, the heat generated by the heat generating component 500 is conducted to the heat conducting substrate 100, wherein most of the heat is taken away by the cooling liquid flowing in the internal loop 310 in the heat conducting substrate 100, the cooling liquid absorbs heat from the internal loop 310 in the heat conducting substrate 100, then flows to the external loop, and then transfers the heat to the end of the first heat dissipation fin 200 away from the heat conducting substrate 100 for cooling, and the cooled cooling liquid returns to the internal loop 310 again for cooling the heat conducting substrate 100; at the same time, a small amount of heat is also conducted to the first heat dissipation fins 200 on the heat conductive substrate 100, which further reduces the temperature of the heat conductive substrate 100. Compared with a traditional fin radiator, the radiator has a better radiating and cooling effect, does not need to be heightened and encrypted, ensures the compactness of the radiator structure, and avoids changing the overall structure of the existing electronic equipment.
Specifically, the high-power electronic device is fixed and closely attached to the front surface (the first mounting surface 101) of the heat conducting substrate 100, heat generated by the power electronic device is conducted to the heat conducting substrate 100, most of the heat is taken away by the cooling liquid flowing inside the heat conducting substrate 100, and at the same time, a small amount of heat is conducted to the first heat dissipation fins 200 on the back surface (the second mounting surface 102) of the heat conducting substrate 100, because the amount of heat directly transferred to the first heat dissipation fins 200 is small, the heat can be taken away by external air cooling only after being transferred to a partial area of the first heat dissipation fins 200 close to one end of the heat conducting substrate 100, and the heat cannot be transferred to the far end area of the first heat dissipation fins 200. The heat exchange section 320 is installed at a far end of the first heat dissipation fin 200, when the cooling liquid absorbs heat from the inner loop 310 of the heat conduction substrate 100 and flows to the outer loop, heat is transferred to a far end portion of the first heat dissipation fin 200 and then taken away by outside air, so that the cooling of the cooling liquid is realized, in the process, because the temperature change of the high specific heat capacity cooling liquid in the outer loop is small, the heat transferred to the far end portion of the first heat dissipation fin 200 is also small, and the heat of the far end portion of the first heat dissipation fin 200 cannot be transferred too much to an area of one end of the first heat dissipation fin 200 close to the heat conduction substrate 100, so that the heat dissipation performance of the end areas at two ends of the first heat dissipation fin 200 cannot be influenced too much, and the cooling device with the structure has a better cooling effect. The cooling fan inside the inverter drives the outside air to take away the heat on the first heat dissipating fins 200.
For a traditional heat sink with fins on a substrate, the heat dissipation process needs heat conduction from the substrate to the fins and heat convection on the surfaces of the fins, and the temperature of the substrate is highest. The cooling liquid with high specific heat capacity has smaller temperature change after absorbing heat, can quickly take away the heat of the heat-conducting substrate 100, transfers the heat to the end part of the first radiating fin 200 far away from the heat-conducting substrate 100, and is superposed with the air cooling on the back surface of the heat-conducting substrate 100, so that the temperature of the heat-conducting substrate 100 is lower, and the cooling effect is better compared with the traditional fin radiator.
As shown in fig. 1 to 3, the side surface of the heat conductive substrate 100 is provided with an inlet 311 and an outlet 312 communicating with the internal circuit 310. Outside the heat conductive substrate 100, the inlet 311 and the outlet 312 communicate with each other through an external circuit. The external circuit further includes two connection sections 330, the two connection sections 330 are respectively connected with the inlet 311 and the outlet 312 of the internal circuit 310, and two ends of the heat exchange section 320 are respectively communicated with the internal circuit 310 through the two connection sections 330. The external loop adopts the structure, so that the external loop and the internal loop 310 can be conveniently installed, and the installation position of the external loop can be conveniently adjusted.
The heat exchange section 320 is disposed at an end of the first heat dissipation fin 200 away from the heat conductive substrate 100, so as to cool the coolant in the external circuit.
The tubes of the heat exchange section 320 pass through the first heat dissipation fins 200 back and forth along the arrangement direction of the plurality of first heat dissipation fins 200. By adopting the structure, the contact surface between the external loop and the first heat dissipation fin 200 can be increased, and the cooling liquid in the external loop can be rapidly cooled, so that the cooling liquid can flow into the internal loop 310 to cool the heat conduction substrate 100.
As shown in fig. 2, in the present embodiment, the heat exchange section 320 includes a plurality of pipe branches 321, the plurality of pipe branches 321 respectively penetrate through the plurality of first heat dissipation fins 200 along the arrangement direction of the plurality of first heat dissipation fins 200, and the plurality of pipe branches 321 are sequentially connected end to end. The heat exchanging section 320 is disposed in an S shape, and a contact surface between the external circuit and the first heat dissipating fin 200 is increased, so that the temperature of the cooling liquid in the external circuit is gradually lowered in the flowing process to meet the requirement.
As shown in fig. 1, the cooling apparatus further includes a circulation pump 400, and the circulation pump 400 is used for driving the cooling liquid in the cooling circuit to circulate between the inner circuit 310 and the outer circuit. The cooling liquid in the outer and inner circuits 310 is circulated by the circulation pump 400. The circulation pump 400 may be a micro pump, and the circulation pump 400 is provided on one of the connection sections 330 of the external circuit.
The invention also provides an electronic device comprising the cooling device, wherein the heat generating component 500 of the electronic device is arranged on the heat conducting substrate 100. The electronic equipment adopting the cooling device can effectively reduce the heat of the heating component 500 in the electronic equipment without changing the whole structure of the existing electronic equipment.
Example 2
In the present embodiment, the cooling device has substantially the same structure as that of embodiment 1, except that: the tubes of the heat exchange section 320 include a plurality of tube branches 321, the plurality of tube branches 321 penetrate through the plurality of first heat dissipation fins 200 along the arrangement direction of the plurality of first heat dissipation fins 200, one ends of the tube branches 321 are communicated through a first connection tube 322, and the other ends of the tube branches 321 are communicated through a second connection tube 333.
As shown in fig. 4, one ends of the plurality of pipe branches 321 located on the same side are communicated through one first connection pipe 322, and the other ends of the plurality of pipe branches 321 located on the same side are communicated through two second connection pipes 323.
In this embodiment, the heat exchange section 320 is disposed in a similar F shape, and disperses the cooling liquid in the external circuit, thereby increasing the heat exchange efficiency of the cooling liquid in the external circuit and rapidly cooling the cooling liquid.
Example 3
As shown in fig. 5, the cooling device of the present embodiment has substantially the same structure as that of embodiment 1, except that: in this embodiment, the tubes of the heat exchange section 320 are not disposed at an end of the first heat dissipation fin 200 away from the heat conductive substrate 100, and a heat exchange assembly 600 is disposed on the tubes of the heat exchange section 320, where the heat exchange assembly 600 is used for exchanging heat with an external circuit. Wherein the heat exchange assembly 600 is provided on the tubes of the heat exchange section 320 of the outer loop.
In this embodiment, the heat exchange assembly 600 is a fin assembly, and the fin assembly includes a plurality of second heat dissipation fins 601, and the plurality of second heat dissipation fins 601 are arranged at intervals in the extending direction of the first heat dissipation fins 200 away from the heat conducting substrate 100. The heat exchange assembly 600 has the advantages that the structure is simple, the cost is low, the air flow channels are formed by the second heat dissipation fins 601 which are arranged at intervals, air flowing through the air flow channels 210 of the first heat dissipation fins can flow through the air flow channels of the second heat dissipation fins again, and therefore the second fins can be cooled rapidly.
In a preferred embodiment, the heat exchange assembly 600 is disposed on one side of the first heat dissipation fin 200, and the air flow channel 210 is disposed opposite to the heat exchange assembly 600. By adopting the above structure, on one hand, the heat exchange assembly 600 is prevented from occupying other positions and affecting the structural compactness of the cooling device, and on the other hand, the air flowing through the air flow channel 210 can flow through the heat exchange assembly 600 again to cool the heat exchange assembly 600.
In a preferred embodiment, the heat exchange assembly 600 is disposed at the outlet side of the air flow channel 210. The air can firstly dissipate the heat of the first heat dissipating fin 200, so that the first heat dissipating fin 200 can directly take away more heat of the heat conducting substrate 100.
Of course, in some embodiments, the heat exchange assembly 600 may also be disposed at the air inlet side of the air flow channel 210.
Example 4
As shown in fig. 6, the cooling device of the present embodiment has substantially the same structure as that of embodiment 2, except that: in this embodiment, the heat exchange assembly 600 is a plate-fin heat exchanger. The heat exchange assembly 600 adopts a plate-fin heat exchanger, the structure is simple, the installation is convenient, the plate-fin heat exchanger can rapidly cool the cooling liquid in the external loop through the heat exchange medium, and the cooling efficiency is high.
This embodiment uses a circulating coolant to rapidly remove heat from the thermally conductive substrate 100 and transfer it to the plate and fin heat exchanger away from the thermally conductive substrate 100. The cooling air passes through the first heat dissipating fins 200 on the back surface of the heat conductive substrate 100, and then passes through the plate-fin heat exchanger. The superposition of air cooling on the back surface of the heat conducting substrate 100 and liquid cooling of the heat conducting substrate 100 enables the heat conducting substrate 100 to obtain a lower temperature, and has a better cooling effect on high-power electronic devices.
Example 5
The cooling device of the present embodiment has substantially the same structure as that of embodiment 1, except that: in this embodiment, there are two sets of external loops, wherein the tubes of the first set of external loop heat exchange segments 320 are disposed at an end of the first heat dissipation fins 200 away from the heat conductive substrate 100, and heat exchange is performed on the coolant in the first set of heat exchange segments 320 through the first heat dissipation fins 200, and the tubes of the second set of external loop heat exchange segments 320 are provided with a heat exchange assembly 600, and the heat exchange assembly 600 is used for performing heat exchange with the coolant in the second set of heat exchange segments 320.
In this embodiment, the heat exchange assembly 600 may be configured by adopting the scheme in embodiment 3, and may also be configured by adopting the scheme in embodiment 4.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.
Claims (15)
1. A cooling device comprises a heat conduction substrate, a first heat dissipation fin and a cooling loop, wherein the first heat dissipation fin is installed on the heat conduction substrate, the cooling loop comprises an inner loop and an outer loop which are communicated, the inner loop is arranged inside the heat conduction substrate and used for carrying out heat exchange with the heat conduction substrate, the cooling device is characterized in that the outer loop is provided with a heat exchange section, and a pipeline of the heat exchange section is arranged at one end part, far away from the heat conduction substrate, of the first heat dissipation fin;
and/or the external loop is provided with a heat exchange section, a heat exchange assembly is arranged on a pipeline of the heat exchange section, and the heat exchange assembly is used for exchanging heat with the external loop.
2. The cooling device according to claim 1, wherein the first heat dissipating fin has a plurality of first heat dissipating fins, the plurality of first heat dissipating fins are arranged in parallel, and an air flow passage is formed between two adjacent first heat dissipating fins.
3. The cooling apparatus as claimed in claim 2, wherein the tubes of the heat exchange section are inserted back and forth through the first heat dissipating fins along the arrangement direction of the plurality of first heat dissipating fins.
4. The cooling device according to claim 3, wherein the tubes of the heat exchange section include a plurality of tube branches, the plurality of tube branches respectively penetrate through the plurality of first heat dissipation fins along the arrangement direction of the plurality of first heat dissipation fins, and the plurality of tube branches are sequentially communicated end to end.
5. The cooling apparatus as claimed in claim 3, wherein the tubes of the heat exchange section include a plurality of tube branches, the plurality of tube branches respectively penetrate the plurality of first heat dissipation fins along the arrangement direction of the plurality of first heat dissipation fins, one ends of the plurality of tube branches are connected by a first connection tube, and the other ends of the plurality of tube branches are connected by a second connection tube.
6. The cooling device as claimed in claim 2, wherein the heat exchange member is disposed at one side of the first heat dissipating fin, and the air flow passage is disposed opposite to the heat exchange member.
7. The cooling apparatus as claimed in claim 6, wherein the heat exchanging member is a fin member, and the fin member includes a plurality of second heat dissipating fins, and the plurality of second heat dissipating fins are arranged at intervals in an extending direction of the first heat dissipating fins away from the heat conductive substrate.
8. The cooling apparatus of claim 6, wherein the heat exchange assembly is a plate-fin heat exchanger.
9. The cooling device as claimed in claim 6, wherein the heat exchanging assembly is disposed at an outlet side of the air flow passage.
10. The cooling device as claimed in claim 1, wherein the heat conducting substrate has a first mounting surface and a second mounting surface which are opposite to each other, the first heat dissipating fin is provided on the second mounting surface, and the first mounting surface is used for mounting a heat generating component to be dissipated.
11. The cooling apparatus as claimed in claim 1, wherein the external circuit further comprises two connection sections, the two connection sections are respectively connected with the inlet and the outlet of the internal circuit, and two ends of the heat exchange section are respectively communicated with the internal circuit through the two connection sections.
12. The cooling apparatus as claimed in claim 11, wherein the heat exchange assembly is disposed on the tubes of the heat exchange section, or the tubes of the heat exchange section are disposed on an end of the first heat dissipating fin away from the heat conductive substrate.
13. The cooling apparatus of claim 1, further comprising a circulation pump for driving the coolant in the cooling circuit to circulate between the inner circuit and the outer circuit.
14. The cooling apparatus as claimed in claim 1, wherein the internal circuit is distributed inside the heat conductive substrate in an S-shape.
15. An electronic device comprising the cooling apparatus as claimed in any one of claims 1 to 14, wherein a heat generating component of the electronic device is mounted on the heat conductive substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111265434.0A CN114071955A (en) | 2021-10-28 | 2021-10-28 | Cooling device and electronic equipment comprising same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111265434.0A CN114071955A (en) | 2021-10-28 | 2021-10-28 | Cooling device and electronic equipment comprising same |
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| CN114071955A true CN114071955A (en) | 2022-02-18 |
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| CN202111265434.0A Pending CN114071955A (en) | 2021-10-28 | 2021-10-28 | Cooling device and electronic equipment comprising same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115016203A (en) * | 2022-07-08 | 2022-09-06 | 深圳市未林森科技有限公司 | Packaging device for multifunctional integrated LED camera lamp |
-
2021
- 2021-10-28 CN CN202111265434.0A patent/CN114071955A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115016203A (en) * | 2022-07-08 | 2022-09-06 | 深圳市未林森科技有限公司 | Packaging device for multifunctional integrated LED camera lamp |
| CN115016203B (en) * | 2022-07-08 | 2023-09-19 | 深圳市未林森科技有限公司 | Multifunctional integrated LED camera lamp packaging device |
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