CN215264611U - Multi-stage Y-shaped liquid cooling heat dissipation system for cooling server - Google Patents
Multi-stage Y-shaped liquid cooling heat dissipation system for cooling server Download PDFInfo
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- CN215264611U CN215264611U CN202120852548.4U CN202120852548U CN215264611U CN 215264611 U CN215264611 U CN 215264611U CN 202120852548 U CN202120852548 U CN 202120852548U CN 215264611 U CN215264611 U CN 215264611U
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- server
- cold water
- liquid cooling
- radiator
- heat dissipation
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- 238000001816 cooling Methods 0.000 title claims abstract description 72
- 239000007788 liquid Substances 0.000 title claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 79
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 239000000741 silica gel Substances 0.000 claims 4
- 229910002027 silica gel Inorganic materials 0.000 claims 4
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a be used for server refrigerated multistage Y type liquid cooling system, including server unit, quick-witted case fan, advance/outlet pipe, quick-witted case fan, radiator fan, heat dissipation fin piece, Y type liquid cooling radiator, server chip, server memory, server powersupply, server hard disk etc.. The utility model discloses a three Y type liquid cooling radiator passes through the pipe connection, cools off the multiple heating element in the server simultaneously, and more make full use of is cold volume. Finally, the heat dissipation efficiency of the Y-shaped liquid cooling radiator is further improved by arranging the heat dissipation fins and the radiator fan on the Y-shaped liquid cooling radiator, and the radiator can continuously cool the server chip when the Y-shaped liquid cooling radiator breaks down and stops using.
Description
Technical Field
The utility model belongs to the technical field of data center refrigerated, particularly, relate to a be used for server refrigerated multistage Y type liquid cooling system.
Background
The rapid development of the data center enables the integration level of hardware in the server to be higher and the heat dissipation capacity to be larger and larger. When the hardware temperature is too high, even overheating and downtime problems may occur, which may seriously affect the working performance and the service life of the server. The traditional air cooling heat dissipation mode has a certain effect on reducing the energy consumption of the data center, but when the high-density large-scale data center is in continuous surge, the conventional air cooling is not satisfactory for some time, and the liquid cooling technology can bring a more direct heat dissipation advantage. In the beginning of the 21 st century, manufacturers applied water cooling technology to servers, but generally adopted an open structure, and the water cooling system was not precise enough.
In the prior art, chinese patent CN104882424B discloses a liquid-cooled radiator and a corresponding IGBT module, and the radiator of this patent enhances the disturbance of the cooling liquid by arranging a spoiler in the liquid flow channel, thereby changing the convective heat transfer coefficients at different positions, improving the temperature uniformity of the liquid-cooled radiator while ensuring the effect of the radiator, and prolonging the life of the cooling device. Chinese patent CN109982544B discloses a liquid-cooled heat sink, which designs the area ratio of the corresponding heat dissipation fin region in the water-cooled flow channel according to the distribution position of the heat generating chips, and has the advantages of reducing the flow velocity, reducing the flow resistance, and improving the heat dissipation efficiency. Although the existing liquid cooling heat dissipation technology improves the heat dissipation effect of the chip to a certain extent, the practicability is low, the cost is high, the system resistance is high, and the power consumption is high.
To the problem that above-mentioned research exists, the utility model discloses a be used for server refrigerated multistage Y type liquid cooling system, this system not only can cool off the multiple heating element in the server simultaneously, can further promote the radiating efficiency of radiator.
Disclosure of Invention
The utility model discloses a be used for server refrigerated multistage Y type liquid cooling system, three Y type liquid cooling radiator passes through the pipe connection in the system, cools off the multiple heating element in the server simultaneously, and more make full use of is cold volume. Finally, the heat dissipation efficiency of the Y-shaped liquid cooling radiator is further improved by arranging the heat dissipation fins and the radiator fan on the Y-shaped liquid cooling radiator, and the radiator can continuously cool the server chip when the Y-shaped liquid cooling radiator breaks down and stops using.
For realizing the purpose of the utility model, the utility model adopts the following technical scheme:
as a preferred example, the device includes a server chassis, a first chassis fan, a second chassis fan, a first cold water inlet pipe, a first cold water outlet pipe, a second cold water inlet pipe, a second cold water outlet pipe, a third cold water inlet pipe, a third cold water outlet pipe, a first radiator fan, a second radiator fan, a third radiator fan, a first heat dissipation fin, a second heat dissipation fin, a third heat dissipation fin, a first Y-type liquid-cooled radiator, a second Y-type liquid-cooled radiator, a third Y-type liquid-cooled radiator, a server chip, a server memory, a server power supply, and a server hard disk.
As a preferred example, the output end of the first cold water inlet pipe is connected with the input end of a first Y-type liquid cooling radiator, the output end of the first Y-type liquid cooling radiator is connected with the input end of a first cold water outlet pipe, the first output end of the first cold water outlet pipe is connected with the input end of a second cold water inlet pipe, the output end of the second cold water inlet pipe is connected with the input end of a second Y-type liquid cooling radiator, and the output end of the second Y-type liquid cooling radiator is connected with the input end of the second cold water outlet pipe; the second output end of the first cold water outlet pipe is connected with the input end of a third cold water inlet pipe, the output end of the third cold water inlet pipe is connected with the input end of a third Y-shaped liquid cooling radiator, and the output end of the third Y-shaped liquid cooling radiator is connected with the input end of a third cold water outlet pipe; the input end of the first cold water inlet pipe is a water inlet, and the output ends of the second cold water outlet pipe and the third cold water outlet pipe are water return ports.
As a preferred example, the Y-shaped flow channel liquid cooling heat dissipation system for cooling the server can simultaneously cool and dissipate a plurality of hardware in the server. And circulating cold water enters the first Y-shaped radiator from the first cold water inlet pipe to cool and radiate the server chip and the memory of the server, and then flows out of the first cold water outlet pipe and flows into the second cold water inlet pipe and the third cold water inlet pipe respectively. The cold water is reused to enter the second Y-shaped radiator and the third Y-shaped radiator respectively for cooling the corresponding hardware: server power and server hard disk. Finally, cold water flows out of the second cold water outlet pipe and the third cold water outlet pipe respectively, and the circulation of the whole device is completed. The cold water used for cooling circulation in the radiator can be tap water at normal temperature, chilled water generated by a refrigerating unit or other cold sources; meanwhile, when the heat generated in the hardware is larger than the heat taken away by the Y-shaped radiator, the radiator fan connected with the Y-shaped radiator through the radiating fins can be opened to perform auxiliary heat radiation, and the running stability of the server is greatly improved.
The utility model has the advantages that: three Y-shaped liquid cooling radiators in the system are connected through pipelines, and meanwhile, various heating elements in the server are cooled, so that the cold energy is more fully utilized. Finally, the heat dissipation efficiency of the Y-shaped liquid cooling radiator is further improved by arranging the heat dissipation fins and the radiator fan on the Y-shaped liquid cooling radiator, and the radiator can continuously cool the server chip when the Y-shaped liquid cooling radiator breaks down and stops using.
Drawings
FIG. 1 is a schematic diagram of a multi-stage Y-type liquid-cooled heat dissipation system for server cooling.
FIG. 2 is a transverse cross-sectional view of a multi-stage Y-type liquid-cooled heat removal system for server cooling.
FIG. 3 is a longitudinal cross-sectional view of a multi-stage Y-type liquid-cooled heat dissipation system for server cooling.
FIG. 4 is a schematic diagram of a multi-stage Y-type liquid-cooled heat sink connection.
FIG. 5 is a schematic view of the connection of the Y-shaped liquid-cooled heat sink fins and the heat sink fan.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 5, the utility model discloses a multistage Y type liquid cooling system for server cooling, including server machine case (1), first quick-witted case fan (2), second quick-witted case fan (3), first cold water inlet tube (4), first cold water outlet pipe (5), second cold water inlet tube (6), second cold water outlet pipe (9), third cold water inlet tube (7), third cold water outlet pipe (8), first radiator fan (10), second radiator fan (11), third radiator fan (12), first heat dissipation fin piece (13), second heat dissipation fin piece (14), third heat dissipation fin piece (15), first Y type liquid cooling radiator (16), second Y type radiator (17), third Y type liquid cooling radiator (18), server chip (19), server memory (20), server power supply (21), A server hard disk (22).
As shown in FIG. 1, the Y-shaped flow channel liquid cooling heat dissipation system for server cooling can simultaneously cool and dissipate heat of a plurality of hardware in the server. After cold water with the temperature of 10 ℃ enters the first Y-shaped radiator (16) from the first cold water inlet pipe (4) to cool and radiate the server chip (19) and the server memory (20), the cold water flows out from the first cold water outlet pipe (5). At the moment, the temperature of the cold water is still lower than the surface temperature of the electronic devices in the server, so that the cold water is reused through the first cold water outlet pipe and then flows into the second cold water inlet pipe (6) and the third cold water inlet pipe (7) respectively, and enters the second Y-shaped radiator (17) and the third Y-shaped radiator (18) respectively to cool the server power supply (21) and the server hard disk (22). Finally, cold water respectively flows out of the second cold water outlet pipe (8) and the third cold water outlet pipe (9), and the circulation of the whole device is completed. The cold water used for cooling circulation in the radiator can be tap water at normal temperature, chilled water generated by a refrigerating unit or other cold sources; meanwhile, when the heat generated in the hardware is larger than the heat taken away by the Y-shaped radiator or the Y-shaped liquid cooling radiator fails, the small fan connected with the fins on the Y-shaped radiator can be opened to perform auxiliary heat dissipation, and the running stability of the server is greatly improved.
The working process of the utility model is as follows:
the server system is arranged at a working position, the power supply is switched on, the power switch is turned on, and the server starts to work. The first cold water inlet pipe is filled with cold water with the temperature of 10 ℃ for circulating heat dissipation, and the cold water takes away heat stored in the server chip and the server through a multi-branch structure pipeline of the first Y-shaped radiator, so that the liquid cooling heat dissipation effect is achieved. At the moment, the temperature of the cold water is still lower than the surface temperature of the electronic devices in the server, so that the cold water is reused through the first cold water outlet pipe, flows to the second cold water inlet pipe and the third cold water inlet pipe respectively, and enters the second Y-shaped radiator and the third Y-shaped radiator respectively to cool the server power supply and the server hard disk. Meanwhile, when the heat generated in the hardware is larger than the heat taken away by the Y-shaped liquid cooling radiator or the Y-shaped liquid cooling radiator fails, the radiator fan on the Y-shaped liquid cooling radiator can be turned on to perform auxiliary heat dissipation, the hardware is prevented from being damaged due to overheating, the running stability of the server is improved, and the detailed connection mode can be read from the specific implementation mode in the right specification.
Claims (4)
1. The utility model provides a multistage Y type liquid cooling system for server cooling, characterized by: the server comprises a server case, two case fans, three cold water inlet pipes, three cold water outlet pipes, three radiator fans, three radiating fins, three Y-shaped liquid cooling radiators, a server chip, a server memory, a server power supply and a server hard disk;
the three liquid cooling radiators are mutually linked, the output end of a first cold water inlet pipe (4) is connected with the input end of a first Y-shaped liquid cooling radiator (16), the output end of the first Y-shaped liquid cooling radiator (16) is connected with the input end of a first cold water outlet pipe (5), the first output end of the first cold water outlet pipe (5) is connected with the input end of a second cold water inlet pipe (6), the output end of the second cold water inlet pipe (6) is connected with the input end of a second Y-shaped liquid cooling radiator (17), and the output end of the second Y-shaped liquid cooling radiator (17) is connected with the input end of a second cold water outlet pipe (9); the second output end of the first cold water outlet pipe (5) is connected with the input end of a third cold water inlet pipe (7), the output end of the third cold water inlet pipe (7) is connected with the input end of a third Y-shaped liquid cooling radiator (18), and the output end of the third Y-shaped liquid cooling radiator (18) is connected with the input end of a third cold water outlet pipe (8); the input end of the first cold water inlet pipe (4) is a water inlet, and the output ends of the second cold water outlet pipe (9) and the third cold water outlet pipe (8) are water return ports.
2. The multistage Y-type liquid-cooled heat dissipation system for server cooling as claimed in claim 1, wherein the first heat dissipation fins (13) are disposed on the upper portion of the first Y-type liquid-cooled heat sink (16) and are tightly connected by a heat conductive silicone, and the first heat sink fan (10) is disposed on the upper portion of the first heat dissipation fins (13) and is tightly connected by a heat conductive silicone; the second heat dissipation fin (14) is arranged on the upper part of the second Y-shaped liquid cooling radiator (17) and is tightly connected with the second heat dissipation fin through heat conduction silica gel, and the second radiator fan (11) is arranged on the upper part of the second heat dissipation fin (14) and is tightly connected with the second heat dissipation fin through heat conduction silica gel; the third heat dissipation fin (15) is arranged on the upper portion of the third Y-shaped liquid cooling radiator (18) and is tightly connected through heat conduction silica gel, and the third radiator fan (12) is arranged on the upper portion of the third heat dissipation fin (15) and is tightly connected through heat conduction silica gel.
3. The multi-stage Y-type liquid-cooled heat dissipation system for server cooling as claimed in claim 1, wherein the first chassis fan (2) and the second chassis fan (3) are located on the server chassis (1).
4. The multi-stage Y-type liquid-cooled heat dissipation system for server cooling as claimed in claim 1, wherein the first Y-type liquid-cooled heat sink (16) is located above the server chip (19) and the server memory (20) for cooling the server chip (19) and the server memory (20); the second Y-shaped liquid cooling radiator (17) is arranged on the upper part of the server power supply (21) and used for cooling the server power supply (21); the third Y-shaped liquid cooling radiator (18) is arranged on the upper part of the server hard disk (22) and cools the server hard disk (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120852548.4U CN215264611U (en) | 2021-04-23 | 2021-04-23 | Multi-stage Y-shaped liquid cooling heat dissipation system for cooling server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120852548.4U CN215264611U (en) | 2021-04-23 | 2021-04-23 | Multi-stage Y-shaped liquid cooling heat dissipation system for cooling server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215264611U true CN215264611U (en) | 2021-12-21 |
Family
ID=79510705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120852548.4U Expired - Fee Related CN215264611U (en) | 2021-04-23 | 2021-04-23 | Multi-stage Y-shaped liquid cooling heat dissipation system for cooling server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215264611U (en) |
-
2021
- 2021-04-23 CN CN202120852548.4U patent/CN215264611U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211221 |