CN113311929A - Air-cooling and liquid-cooling integrated CPU radiator and radiating method - Google Patents
Air-cooling and liquid-cooling integrated CPU radiator and radiating method Download PDFInfo
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- CN113311929A CN113311929A CN202110709521.4A CN202110709521A CN113311929A CN 113311929 A CN113311929 A CN 113311929A CN 202110709521 A CN202110709521 A CN 202110709521A CN 113311929 A CN113311929 A CN 113311929A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention provides an air-cooling and liquid-cooling integrated CPU radiator and a radiating method. The invention has the following beneficial effects: the liquid cooling assembly transfers and transfers heat generated by the CPU, the heat generated by the CPU is absorbed by the radiator base and cooling liquid in the radiator base, the heat absorbed by the radiator base is transferred to the fins through the radiator frame, the cooling liquid absorbing heat in the radiator base is transferred into the fins along with the flowing of the cooling flow channel, the fins dissipate heat, and meanwhile, the air cooling assembly accelerates the flowing of air, so that the heat dissipation efficiency of the fins and the cooling liquid in the fins is accelerated.
Description
Technical Field
The invention relates to the technical field of CPU heat dissipation devices, in particular to an air-cooling and liquid-cooling integrated CPU radiator and a heat dissipation method.
Background
The development of chips is an important support for state-oriented technology. The chip is a core element of a system with electricity, power, control, feedback and the like, and plays a vital role in the industries of communication, electricity, energy, power and the like.
Thermal failure is one of the primary ways in which a chip may be damaged, with serious consequences. Along with the improvement of the chip integration performance, the chip heating power is also increased, so that the chip heat dissipation becomes one of the key points for improving the chip performance, and the reasonable design of the heat dissipation structure becomes an important content for developing the chip. In the field of advanced electronic industry, a scientific research team specially aiming at system thermal design is provided, and support is provided for development of chips in the direction of higher speed and higher power.
The CPU is the core of the computer work and is provided with a radiator and an overtemperature protection system to prevent overheating. Once the over-temperature protection mechanism is triggered, the computer protects the CPU by reducing performance, powering off, and the like. At present, CPU radiators are mainly of two types: air-cooled radiators and water-cooled radiators. The air-cooled radiator transfers heat to the fins through the heat pipes and takes away the heat by utilizing forced air cooling. The water cooling is to introduce cooling water into a conductor in contact with the CPU, and to bring the heat emitted by the CPU into the radiating fins with capillaries through the flow of the water, and then to radiate the heat through the forced air cooling outside the radiating fins.
With the improvement of CPU performance, the requirements on the performance of the CPU heat sink are higher and higher, and a more efficient CPU heat sink needs to be developed, and the heat dissipation capacity of the CPU changes with the change of load. Taking a multi-thread CPU as an example, when the number of working threads is different, the load and heat productivity of the CPU are significantly different, and therefore the problem of dynamic matching between the heat dissipation capacity and the change of the heat dissipation capacity needs to be considered.
Disclosure of Invention
The invention provides an air-cooling and liquid-cooling integrated CPU radiator and a radiating method, which solve the radiating problem of chips such as a CPU and the like in high-load work and variable-load work in the prior art.
The technical scheme of the invention is realized as follows:
the utility model provides an air-cooled liquid-cooled integrated CPU radiator, includes CPU and radiator base, and the CPU is fixed to be set up on the radiator base, and the fixed liquid cooling subassembly that is equipped with on the radiator base, the fixed air-cooled subassembly that is equipped with on the liquid cooling subassembly, liquid cooling subassembly and CPU carry out the heat exchange, make the CPU temperature reduce, and the air-cooled subassembly cools down the liquid cooling subassembly, improves the heat transfer volume between liquid cooling subassembly and the CPU, reinforcing radiating effect.
The liquid cooling subassembly includes radiator frame and a plurality of fin, the fixed setting of radiator frame is on the radiator base, the fin is fixed to be set up on the radiator frame, the radiator base, the inside of radiator frame and fin is equipped with the cooling runner of intercommunication each other, be provided with the coolant liquid in the cooling runner, the heat transfer that CPU produced is to the radiator base, the rethread cooling runner is transmitted and is dispelled the heat on radiator frame and the fin, the fin can effectively increase heat radiating area, the coolant liquid in the cooling runner is favorable to on the fin with heat transfer from the radiator base, the radiating efficiency is improved.
The fins are long-strip-shaped, and the fins are arranged in parallel, so that the long-strip-shaped fins can increase the heat dissipation area and enhance the heat dissipation effect. The cooling flow channel is uniformly paved in the radiator base, so that the cooling liquid in the cooling flow channel can exchange heat with the CPU as much as possible. The cooling flow channels in the radiator base are arranged in three stages step by step, and the flow of cooling liquid in the radiator base is smoother.
And a cooling channel outlet and a cooling channel inlet are arranged on the radiator frame, the cooling channel outlet and the cooling channel inlet are respectively communicated with the cooling channel, cooling liquid flows in from the cooling channel inlet, and the cooling liquid flows out from the cooling channel outlet. The liquid cooling subassembly still includes the pump, and the pump passes through pump inlet pipeline and cooling flow channel export intercommunication, and the pump passes through pump outlet pipeline and cooling flow channel import intercommunication, and the coolant liquid gets into the pump from pump inlet pipeline, flows out from pump outlet pipeline, and the pump provides power for the flow of coolant liquid in cooling flow channel, makes the coolant liquid continuous cycle in cooling flow channel.
The radiator base, the radiator frame and the fins are all made of high-heat-conducting-performance materials, the high-heat-conducting-performance materials are more favorable for heat transfer, and heat generated by the CPU is transferred to the radiator base, the radiator frame and the fins more quickly to dissipate heat.
The air cooling assembly comprises a fan, the fan is fixedly arranged on the radiator frame and corresponds to the fins, and the fan can accelerate air flow to enable the fins to dissipate heat quickly.
A heat dissipation method of an air-cooling and liquid-cooling integrated CPU radiator comprises a liquid-cooling process and an air-cooling process, wherein the liquid-cooling process is as follows: the CPU works to generate heat, one part of heat is transferred to the fins through the radiator base and the radiator frame, the other part of heat is subjected to sufficient heat exchange with cooling liquid in the radiator base, the cooling liquid flows in the cooling flow channel to transfer the heat to the fins, liquid cooling heat dissipation is realized, and the heat generated by the CPU is transferred to the fins through the combined action of the radiator and the cooling liquid in the radiator;
the air cooling process is as follows: the fan is started, the heat transmitted to the fins is dissipated in an accelerated mode through the fan, air cooling heat dissipation is achieved, heat generated by the CPU is transmitted to the fins in a centralized mode, the cooling heat dissipation of the fins is achieved through the fan, and the fin heat dissipation efficiency is improved.
The invention has the following beneficial effects: the radiator comprises a liquid cooling assembly and an air cooling assembly, the liquid cooling assembly transfers and transfers heat generated by a CPU, the heat generated by the CPU is absorbed by cooling liquid in a radiator base and the radiator base, the heat absorbed by the radiator base is transferred to fins through a radiator frame, the cooling liquid absorbing the heat in the radiator base is transferred to the fins along with the flowing of a cooling flow channel, the fins dissipate heat, and meanwhile, the air cooling assembly accelerates the flowing of air, so that the heat dissipation efficiency of the cooling liquid in the fins and the fins is accelerated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of an air-cooled liquid-cooled integrated CPU radiator according to the present invention.
FIG. 2 is a schematic diagram of an air-cooled liquid-cooled integrated CPU radiator according to the present invention.
FIG. 3 is a front view of the CPU heat sink frame and heat sink base of the present invention.
FIG. 4 is a cross-sectional view of the CPU heat sink frame and heat sink base A-A of FIG. 3 according to the present invention.
FIG. 5 is a cross-sectional view of the CPU heat sink base B-B of FIG. 4 in accordance with the present invention.
In the figure: the method comprises the following steps of 1-CPU, 2-radiator base, 3-radiator frame, 4-fins, 5-cooling flow channel, 6-cooling flow channel outlet, 7-pump inlet pipeline, 8-pump, 9-pump outlet pipeline, 10-cooling flow channel inlet and 11-fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
Embodiment 1, as shown in fig. 2, an air-cooling and liquid-cooling integrated CPU radiator includes a CPU1 and a radiator base 2, a CPU1 is fixedly disposed on the radiator base 2, heat generated by the CPU1 is transferred to the radiator base 2, a liquid cooling module is fixedly disposed on the radiator base 2, the heat on the radiator base 2 is transferred by the liquid cooling module to dissipate heat of the CPU1, an air-cooling module is fixedly disposed on the liquid cooling module to dissipate heat of the liquid cooling module, and heat dissipation efficiency of the liquid cooling module to the CPU1 is improved.
Further, as shown in fig. 3 and 4, the liquid cooling assembly includes a radiator frame 3 and a plurality of fins 4, the radiator frame 3 is fixedly disposed on the radiator base 2, the fins 4 are fixedly disposed on the radiator frame 3, and the fins 4 are arranged in parallel, cooling channels 5 which are mutually communicated are disposed inside the radiator base 2, the radiator frame 3 and the fins 4, cooling liquid is disposed in the cooling channels, heat exchange is performed between the CPU1 and the cooling liquid in the radiator base 2, so that the CPU1 is cooled, and the cooling liquid flows from the radiator base 2 to the cooling channels 5 of the fins 4 through the radiator frame 3, and is radiated at the fins 4. The fins 4 are long strips, the fins 4 are arranged in parallel, and the long-strip fins 4 effectively increase the heat dissipation area and enhance the heat dissipation effect.
In embodiment 2, as shown in fig. 5, the cooling flow path 5 is uniformly spread inside the heat sink base 2, so that the cooling liquid in the heat sink base 2 exchanges heat with the CPU1 as much as possible, thereby improving the heat dissipation efficiency of the heat sink. The cooling runner 5 becomes tertiary gradual hierarchical setting in radiator base 2, and in this embodiment, the first grade divide into two branches, forms two second grade branches, and the branch of second grade branch forms four tertiary branches, and the branch of tertiary branch forms eight level four branches, makes the interval between the branch less, increases the area of contact that coolant liquid and CPU1 produced heat exchange, makes the coolant liquid turn left one-way flow from the right side, makes the coolant liquid flow more smooth, and is more even.
Further, as shown in fig. 1, a cooling channel outlet 6 and a cooling channel inlet 10 are provided on the radiator frame 3, the cooling channel outlet 6 and the cooling channel inlet 10 are located on the radiator frame 3, and the cooling channel outlet 6 and the cooling channel inlet 10 are respectively communicated with the cooling channel 5. The cooling liquid flows into the cooling flow channel 5 from the cooling flow channel inlet 10, flows to the fins 4 through the radiator base 2 and the radiator frame 3, and flows out from the cooling flow channel outlet 6 after the cooling liquid radiates at the fins 4.
Further, the liquid cooling subassembly still includes pump 8, and pump 8 passes through pump inlet pipeline 7 and cooling runner export 6 intercommunication, and pump 8 passes through pump outlet pipeline 9 and cooling runner import 10 intercommunication, and the coolant liquid that flows out from cooling runner export 6 gets into pump 8 through pump inlet pipeline 7, then flows into cooling runner 5 from cooling runner import 10 through pump outlet pipeline 9. The pump 8 powers the circulation of the cooling liquid.
Further, radiator base 2, radiator frame 3 and fin 4 are high thermal conductivity material, and high thermal conductivity material more is favorable to thermal biography, and the heat that CPU1 produced can be transmitted to fin 4 through radiator base 2 and radiator frame 3 to cool down in fin 4 department.
Further, the air cooling assembly comprises a fan 11, the fan 11 is fixedly arranged on the radiator frame 3, the fan 11 corresponds to the fins 4, the fan 11 is started to accelerate air flow, and cooling of the fins 4 is accelerated. The other structure is the same as embodiment 1.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The utility model provides an air-cooling liquid cooling integration CPU radiator, its characterized in that includes CPU (1) and radiator base (2), and CPU (1) is fixed to be set up on radiator base (2), and fixed being equipped with the liquid cooling subassembly on radiator base (2), the last fixed air-cooling subassembly that is equipped with of liquid cooling subassembly.
2. The integrated air-cooling and liquid-cooling CPU radiator as claimed in claim 1, wherein the liquid-cooling assembly comprises a radiator frame (3) and a plurality of fins (4), the radiator frame (3) is fixedly arranged on the radiator base (2), the fins (4) are fixedly arranged on the radiator frame (3), and mutually communicated cooling channels (5) are arranged inside the radiator base (2), the radiator frame (3) and the fins (4).
3. The air-cooled liquid-cooled integrated CPU radiator according to claim 2, wherein the fins (4) are long, and the fins (4) are arranged in parallel.
4. The air-cooled and liquid-cooled integrated CPU radiator as claimed in claim 2 or 3, wherein the cooling flow channel (5) is uniformly filled in the radiator base (2).
5. The air-cooled liquid-cooled integrated CPU radiator according to claim 4, wherein the cooling flow channels (5) in the radiator base (2) are arranged in a stepwise manner in a plurality of three stages.
6. The air-cooled liquid-cooled integrated CPU radiator according to claim 4, wherein the radiator frame (3) is provided with a cooling channel outlet (6) and a cooling channel inlet (10), and the cooling channel outlet (6) and the cooling channel inlet (10) are respectively communicated with the cooling channel (5).
7. The air-cooled liquid-cooled integrated CPU radiator of claim 6, wherein the liquid-cooled assembly further comprises a pump (8), the pump (8) is communicated with the cooling channel outlet (6) through a pump inlet pipeline (7), and the pump (8) is communicated with the cooling channel inlet (10) through a pump outlet pipeline (9).
8. The air-cooled liquid-cooled integrated CPU radiator according to any one of claims 1 to 3, 6 and 7, wherein the radiator base (2), the radiator frame (3) and the fins (4) are all made of high heat-conducting materials.
9. The integrated air-cooled and liquid-cooled CPU radiator according to claim 8, wherein the air-cooled assembly comprises a fan (11), the fan (11) is fixedly arranged on the radiator frame (3), and the fan (11) corresponds to the fins (4).
10. The heat dissipation method of the air-cooled liquid-cooled integrated CPU radiator as claimed in any one of claims 1 to 9, comprising a liquid cooling process and an air cooling process, wherein the liquid cooling process is as follows: the CPU (1) works to generate heat, one part of heat is transferred to the fins (4) through the radiator base (2) and the radiator frame (3), the other part of heat is fully exchanged with cooling liquid in the radiator base (2), and the cooling liquid flows in the cooling flow channel (5) to transfer the heat to the fins (4) so as to realize liquid cooling heat dissipation;
the air cooling process is as follows: and starting the fan (11), and accelerating heat dissipation of the heat transferred to the fins (4) by the fan (11) to realize air-cooled heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110709521.4A CN113311929A (en) | 2021-06-25 | 2021-06-25 | Air-cooling and liquid-cooling integrated CPU radiator and radiating method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110709521.4A CN113311929A (en) | 2021-06-25 | 2021-06-25 | Air-cooling and liquid-cooling integrated CPU radiator and radiating method |
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| CN113311929A true CN113311929A (en) | 2021-08-27 |
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| CN202110709521.4A Pending CN113311929A (en) | 2021-06-25 | 2021-06-25 | Air-cooling and liquid-cooling integrated CPU radiator and radiating method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113959666A (en) * | 2021-09-09 | 2022-01-21 | 北京航天希尔测试技术有限公司 | Twelve-shaft-driven air-cooled vibration test device |
| CN114727554A (en) * | 2022-04-13 | 2022-07-08 | 苏州浪潮智能科技有限公司 | Heat dissipation device, system and method |
| CN114895512A (en) * | 2022-06-09 | 2022-08-12 | 中国科学院长春光学精密机械与物理研究所 | Active and passive mixed cooling heat dissipation rear cover of industrial camera |
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| CN101167184A (en) * | 2005-04-21 | 2008-04-23 | 日本轻金属株式会社 | Liquid-cooled jacket |
| CN106648000A (en) * | 2016-12-27 | 2017-05-10 | 上海豊恒信息科技有限公司 | Built-in radiator of notebook computer |
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2021
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1588267A (en) * | 2004-09-08 | 2005-03-02 | 西安交通大学 | Water cooling type CPU radiator |
| CN101167184A (en) * | 2005-04-21 | 2008-04-23 | 日本轻金属株式会社 | Liquid-cooled jacket |
| CN1909218A (en) * | 2005-08-03 | 2007-02-07 | 富准精密工业(深圳)有限公司 | Integrated liquid cooling heat abstractor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113959666A (en) * | 2021-09-09 | 2022-01-21 | 北京航天希尔测试技术有限公司 | Twelve-shaft-driven air-cooled vibration test device |
| CN114727554A (en) * | 2022-04-13 | 2022-07-08 | 苏州浪潮智能科技有限公司 | Heat dissipation device, system and method |
| CN114727554B (en) * | 2022-04-13 | 2023-11-17 | 苏州浪潮智能科技有限公司 | Heat dissipation device, system and method |
| CN114895512A (en) * | 2022-06-09 | 2022-08-12 | 中国科学院长春光学精密机械与物理研究所 | Active and passive mixed cooling heat dissipation rear cover of industrial camera |
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