TWM594852U - Water-cooling composite temperature control device - Google Patents

Abstract

This creative department provides a water-cooled composite temperature control device. Its main features include a first water jacket, a first temperature equalizing plate, a uniform cooling chip, a second temperature equalizing plate, and a heat dissipation module, of which the first to absorb thermal energy The liquid flows through the first water jacket, one side of the first temperature equalizing plate is attached to the first water jacket, and the other side of the first temperature equalizing plate is attached to the cooling wafer, according to which the first The temperature plate cools down and controls the temperature of the first liquid. One side of the second temperature equalization plate is in contact with the heat release side of the cooling chip. The heat dissipation module is provided on the other side of the second temperature equalization plate. According to this, the second temperature equalizing plate is cooled and cooled. This creation can control the temperature of the first liquid and improve the heat dissipation efficiency.

Description

Water-cooled composite temperature control device

This creation relates to a water cooling device, in particular to a revealer of an innovative structure type of a temperature-controllable water-cooled composite temperature control device.

With the improvement of the quality or thinness of various products, various devices that use electronic devices in conjunction with software to control the operation of mechanical devices can meet the needs of precision or yield in production or processing. The aforementioned electronic devices often operate A large amount of information needs to be processed and calculated quickly in a short time, but it also generates a large amount of heat energy. If the heat is not dissipated in a timely manner, not only the performance of the electronic device is affected, but also the electronic device may be damaged.

For all kinds of electronic equipment, including the aforementioned electronic devices, which can easily generate a large amount of heat energy, a water-cooled circulating heat dissipation device can be used to cool the electronic equipment. It mainly includes a water cooling jacket, a water pump, a cooling fin set and a fan , Where the water-cooling jacket is generally plate-shaped, the inside of the water-cooling jacket forms a winding flow channel, the two ends of the flow channel are connected to the water pump, the cooling water is provided in the flow channel, and one side of the water cooling jacket is attached to The heat dissipation surface of the electronic device generating heat energy, a plurality of heat dissipation fins juxtaposed, the heat dissipation fin group is arranged on the other side of the water cooling jacket, the fan is opposite to the heat dissipation fin group; The cooling water circulates in the flow channel and the water pump to absorb the heat energy generated by the operation of the electronic device, and the heat energy is transmitted to the heat dissipation fin group. The fan operates to generate an air flow. The heat energy absorbed by the heat dissipation fins, thereby cooling and cooling the electronic device.

This type of structure has found that the following problems still exist in practical use experience: cooling water enters the flow channel from one end of the flow channel, and leaves the flow channel from the other end of the flow channel, and the heat exit surface There is often a temperature difference in each part of the heat sink, which causes a temperature difference between the heat dissipation fins forming the heat dissipation fin group, which may cause some of the heat dissipation fins to have a higher temperature rise, and the overall heat dissipation efficiency is not easy to improve and the temperature cannot be controlled. .

Therefore, in view of the above-mentioned problems of the conventional water-cooled circulating heat sink structure, how to develop an innovative structure with more ideal and practicality is what users expect, and it is also the goal and direction of the related industry to make further efforts to develop breakthroughs ; In view of this, the creator has many years of experience in manufacturing development and design of related products. In response to the above goals, after detailed design and careful evaluation, he finally has a practical original creation.

The main purpose of this creation is to provide a water-cooled composite temperature control device, and the technical problem it wants to solve is to develop a new type of water cooling that can control the temperature of the cooling liquid and improve the heat dissipation efficiency, and is more ideal and practical. The structural type of the compound temperature control device is aimed at innovation and breakthrough.

Based on the foregoing purpose, the novel system provides a water-cooled composite temperature control device, which includes:

A first water jacket, the first water jacket is provided with a wraparound first flow channel, both ends of the first flow channel are respectively connected to a first pipeline, and the first flow channel and the first pipeline are provided inside The first liquid, so that the first liquid that absorbs heat energy flows through the first pipeline and the first flow channel;

A first temperature equalizing plate, the first temperature equalizing plate has a first side and a second side opposite to each other, the first side of the first temperature equalizing plate is attached to one side of the first water jacket, Accordingly, the thermal energy of the first liquid is absorbed and the thermal energy is quickly and uniformly transferred to the second side of the first temperature equalizing plate;

At least a uniform cooling chip, the cooling chip has an endothermic side and an exothermic side, the cooling chip is attached to a portion of the second side of the first temperature equalizing plate, and the endothermic side and the first The second side of the temperature plate is attached, and the second side of the first temperature equalizing plate is cooled, and the temperature of the second side is controlled;

A second temperature equalizing plate, the second temperature equalizing plate has a first side and a second side opposite to each other, the first side of the second temperature equalizing plate abuts on the heat release side, and accordingly The second side of the two temperature equalization plates transfers the heat energy quickly and at a uniform temperature; and

A heat dissipation module is disposed on the second side of the second temperature equalization plate, so that the second temperature equalization plate is cooled and cooled.

With this innovative structural type and technical features, the author can control the temperature of the first liquid and improve the heat dissipation efficiency compared to the previous technology, so as to achieve practical progress.

Please refer to Figures 1 to 5 for an example of the creation of a water-cooled composite temperature control device. However, these examples are for illustrative purposes only, and are not limited by this structure in patent applications.

As shown in FIGS. 1 to 3, the first embodiment of the present invention includes a first water jacket 10, a first temperature equalizing plate 20, two cooling chips 30, a second temperature equalizing plate 40 and a heat dissipation mold Group 50, wherein the first water jacket 10 is provided with a wrap-around first flow channel 12, both ends of the first flow channel 12 are respectively connected to a first pipeline 60, the first flow channel 12 and the first pipeline 60 There is a first liquid (not shown in the figure) inside, the first liquid can circulate along the first flow path 12 and the first pipeline 60, the first pipeline 60 is extended and installed in a heating device ( (Not shown in the figure), so that the first liquid absorbs the thermal energy generated by the operation of the heating device, and the first liquid that absorbs the thermal energy flows through the first pipe 60 and the first flow channel 12.

The first temperature equalizing plate 20 has a first side 22 and a second side 24 opposite to each other. The first side 22 is attached to one side of the first water jacket 10. According to this, the first temperature equalizing plate 20 20 absorbs the thermal energy of the first liquid on the first side 22 and quickly and uniformly transfers the thermal energy to the second side 24.

Each of the cooling wafers 30 has a heat absorbing side 32 and a heat radiating side 34, each of the cooling wafers 30 is attached to a portion of the second side 24 of the first temperature equalizing plate 20, and the heat absorbing side 32 is attached to the second side 24 of the first temperature equalizing plate 20, according to which the second side 24 of the first temperature equalizing plate 20 is cooled, and the current intensity through the cooling chip 30 can be controlled by controlling The temperature of the heat-absorbing side 32, thereby controlling the temperature of the second side 24; the number of the cooling wafers 30 can be increased or decreased as needed, and limited to at least one cooling wafer 30.

The second temperature equalizing plate 40 has a first side 42 and a second side 44 opposite to each other. The first side 42 of the second temperature equalizing plate 40 abuts the heat dissipating side 34 so that the cooling wafer 30 Heat energy is released to the first side 42 of the second temperature equalization plate 40, and the second temperature equalization plate 40 quickly transfers the heat energy to the second side 44 at a uniform temperature.

The heat dissipation module 50 is disposed on the second side 44 of the second temperature equalization plate 40. The heat dissipation module 50 absorbs the heat energy of the second side 44, so that the second temperature equalization plate 40 dissipates heat and cools down.

Based on the structure and technical characteristics of the above structure, the use of this work is described as follows: the first liquid absorbs the heat energy of the heating device and carries the heat energy to the first water jacket 10, the first liquid passes through the In the first flow path 12, heat energy is transferred to the first temperature equalizing plate 20, the first temperature equalizing plate 20 further equalizes the heat energy and then transfers to each of the cooling wafers 30, so that the first liquid can pass through the The temperature of the first flow channel 12 can be lowered, and the first liquid after cooling can be circulated to the heating device as the heat absorbing medium through the first pipeline 60, or by changing the configuration of the first pipeline 60, the temperature can be reduced The first liquid is provided for other purposes, and the cooling wafer 30 can control the temperature of the heat-absorbing side 32, thereby controlling the temperature of the first liquid leaving the first water jacket 10, so that the first liquid can be cooled To a preset temperature, to facilitate the subsequent use of the first liquid, it is not limited to being used only to cool the heating device.

Furthermore, as the first liquid flows from one end to the other end of the first flow channel 12, the first liquid releases heat energy and gradually cools down, and the first liquid in the first flow channel 12 is in a state of uneven temperature , The first temperature equalizing plate 20 serves as a path for heat exchange between the first water jacket 10 and the cooling wafer 30, and the use of the first temperature equalizing plate 20 to quickly spread the heat uniformly can make the first The heat exchange between the water jacket 10 and the cooling chip 30 is more efficient, and the cooling chip 30 only needs to be attached to a part of the second side 24 and does not need to be covered with the second side 24 Refrigerating wafer 30 can make sufficient heat exchange between the first water jacket 10 and the refrigerating wafer 30; in this example, the refrigerating wafer 30 is attached to the first temperature equalizing plate 20 The central area of the second side 24, and each of the cooling wafers 30 are spaced on the second side 24 of the first temperature equalizing plate 20 is preferably.

The heat energy released by the cooling chip 30 on the heat dissipation side 34 is quickly transferred to the heat dissipation module 50 through the second temperature equalization plate 40 and the temperature equalization plate 40 is utilized to make the second temperature equalization plate 40 Heat dissipation and cooling, the heat dissipation module 50 forms a heat exchange with the heat release side 34 of the cooling chip 30 through the second temperature equalizing plate 40, so that the cooling chip 30 can continue to operate.

In this example, the heat dissipation module 50 includes a heat dissipation fin group 51 and a fan 52, wherein the heat dissipation fin group 51 has a plurality of heat dissipation fins 53 in parallel, the heat dissipation fin group 51 and the second average temperature The second side 44 of the board 40 is connected, and the fan 52 is opposed to each of the heat dissipation fins 53. According to the airflow passing through the peripheral side of each heat dissipation fin 53, the second temperature equalizing plate 40 is cooled and dissipated.

As shown in FIG. 4 and FIG. 5, the main difference between the second embodiment of the present invention is that the heat dissipation module 50 includes a second water jacket 54, and the second water jacket 54 is provided with a wrap-around second flow Channel 55, both ends of the second flow channel 55 are respectively connected to a second pipeline 80, and a second liquid (not shown) is provided in the second flow channel 55 and the second pipeline 80, the The second liquid flows through the second pipe 80 and the second flow channel 55, so that the second liquid absorbs heat energy and heats up.

In this example, in addition to providing the first liquid at a specific temperature as in the first embodiment, the heat energy released by the cooling wafer 30 on the heat release side 34 can be further used to cause the second liquid to absorb the heat energy and raise the temperature to control the cooling through the cooling The current intensity of the wafer 30 can control the temperature of the heat release side 34, thereby controlling the temperature of the second liquid leaving the second water jacket 54 so that the second liquid can be heated to a preset temperature to facilitate the first Subsequent utilization of the two liquids; according to this, this example can provide the first liquid and the second liquid at different temperatures, which is beneficial to industrial utilization.

10: The first water jacket 12: First runner 20: The first average temperature plate 22: First side 24: Second side 30: Refrigerated chip 32: endothermic side 34: Heat release side 40: Second temperature-average plate 42: First side 44: Second side 50: cooling module 51: cooling fin set 52: Fan 53: cooling fins 54: second water jacket 55: Second channel 60: First pipeline 80: Second pipeline

Figure 1 is a three-dimensional schematic diagram of the first embodiment of the creation. Figure 2 is a three-dimensional exploded view of the first embodiment of the creation. FIG. 3 is a bottom perspective view of the first temperature equalizing plate and the cooling chip of the first embodiment of the present creation. Figure 4 is a three-dimensional schematic diagram of the second embodiment of the present creation. Fig. 5 is a three-dimensional exploded schematic diagram of the second embodiment of the present creation.

10: The first water jacket

20: The first average temperature plate

40: Second temperature-average plate

50: cooling module

51: cooling fin set

52: Fan

53: cooling fins

60: First pipeline

Claims (5)

A water-cooled composite temperature control device, including: A first water jacket, the first water jacket is provided with a wraparound first flow channel, both ends of the first flow channel are respectively connected to a first pipeline, and the first flow channel and the first pipeline are provided inside The first liquid, so that the first liquid that absorbs heat energy flows through the first pipeline and the first flow channel; A first temperature equalizing plate, the first temperature equalizing plate has a first side and a second side opposite to each other, the first side of the first temperature equalizing plate is attached to one side of the first water jacket, Accordingly, the thermal energy of the first liquid is absorbed and the thermal energy is quickly and uniformly transferred to the second side of the first temperature equalizing plate; At least a uniform cooling chip, the cooling chip has an endothermic side and an exothermic side, the cooling chip is attached to a portion of the second side of the first temperature equalizing plate, and the endothermic side and the first The second side of the temperature plate is attached, and the second side of the first temperature equalizing plate is cooled, and the temperature of the second side is controlled; A second temperature equalizing plate, the second temperature equalizing plate has a first side and a second side opposite to each other, the first side of the second temperature equalizing plate abuts on the heat release side, and accordingly The second side of the two temperature equalization plates transfers the heat energy quickly and at a uniform temperature; and A heat dissipation module is disposed on the second side of the second temperature equalization plate, so that the second temperature equalization plate is cooled and cooled. The water-cooled composite temperature control device as described in item 1 of the patent application scope, wherein the refrigerated wafer is attached to the central area of the second side of the first temperature equalizing plate. The water-cooled composite temperature control device as described in item 1 or 2 of the patent application scope includes two of the cooling wafers, wherein each of the cooling wafers is spaced on the second side of the first temperature equalizing plate. The water-cooled composite temperature control device as described in Item 3 of the patent scope, wherein the heat dissipation module includes a heat dissipation fin group and a fan, wherein the heat dissipation fin group has a plurality of parallel heat dissipation fins, and the heat dissipation fins The set is connected to the second side of the second temperature equalizing plate, and the fan is opposed to each of the heat dissipating fins, so that the airflow passes through the peripheral side of each heat dissipating fin to cool the second temperature equalizing plate. The water-cooled composite temperature control device as described in item 3 of the patent application scope, wherein the heat dissipation module includes a second water jacket, the second water jacket is provided with a wrap-around second flow channel, and two of the second flow channel The ends are respectively connected to a second pipeline, and a second liquid is provided inside the second flow channel and the second pipeline, so that the second liquid flows through the second pipeline and the second flow channel, so that The second liquid is heated by absorbing heat energy.

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