CN109671690A - A kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component - Google Patents
A kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component Download PDFInfo
- Publication number
- CN109671690A CN109671690A CN201811618127.4A CN201811618127A CN109671690A CN 109671690 A CN109671690 A CN 109671690A CN 201811618127 A CN201811618127 A CN 201811618127A CN 109671690 A CN109671690 A CN 109671690A
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- CN
- China
- Prior art keywords
- channel
- disk
- heat
- cooling fin
- cooling
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention discloses a kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component, including absorbing heat disk and cooling system, the absorbing heat disk includes cavity disk, central tube is connected in the middle part of the inner cavity of cavity disk, and the inner cavity of cavity disk is provided with several cooling fins, point-symmetrically shape is distributed cooling fin centered on inlet tube, and the bottom of cooling fin is fixedly connected with the intracavity bottom of cavity disk, and cooling fin extends to the top of cavity disk at the top of cavity disk, and adjacent cooling fin forms channel in cavity disk inner cavity；The channel is divided into forward channel and reverse channel, forward channel and reverse channel are staggered setting, the one end in the forward channel is connected to central tube, and forward channel far from one end of central tube is communicated with liquid outlet pipe, reverse channel is connected with liquid supply pipe far from one end of central tube, and reverse channel connects liquid outlet pipe close to one end of central tube.It is respectively arranged with forward channel and reverse channel, the flowing of coolant liquid opposite direction helps to improve the uniformity of heat dissipation.
Description
Technical field
The present invention relates to heat sink technology field, specially a kind of cooling electronic component is cold with multi-head spiral runner liquid
But device.
Background technique
With the rapid development of electronic technology, the heat-generating electronic elements speed of service such as central processing unit is getting faster, fortune
The heat generated when row is also increase accordingly, and in order to which these heats to be distributed to the normal operation to ensure electronic component, is needed
It radiates to electronic component, the quality of heat dissipation is directly related to the service life of computer and the quality of operation.With electronics member
The dominant frequency of part is higher and higher, and calorific value is also increasing.The amount of heat generated when if electronic component cannot work is timely
It exhales, just seriously affects its working performance.It is therefore prevented that overheat and the great difficulty to radiate into Computer Design
Topic, radiator have also obtained significant concern as the main devices of electronic cooling.
Summary of the invention
The purpose of the present invention is to provide a kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component, to solve
The problems mentioned above in the background art.
To achieve the above object, the invention provides the following technical scheme: a kind of cooling electronic component multi-head spiral stream
Road liquid chiller, including absorbing heat disk and cooling system, the absorbing heat disk include cavity disk, are connected in the middle part of the inner cavity of the cavity disk
It is connected to central tube, and the inner cavity of cavity disk is provided with several cooling fins, the cooling fin point-symmetrically shape centered on inlet tube
Distribution, and the bottom of cooling fin is fixedly connected with the intracavity bottom of cavity disk, and cooling fin extends at the top of cavity disk
The top of cavity disk, adjacent cooling fin form channel in cavity disk inner cavity；
The channel is divided into forward channel and reverse channel, and the forward channel and reverse channel are staggered setting, described forward to lead to
The one end in road is connected to central tube, and forward channel far from one end of central tube is communicated with liquid outlet pipe, and the reverse channel is separate
One end of central tube is connected with liquid supply pipe, and reverse channel connects liquid outlet pipe close to one end of central tube.
Preferably, the cooling system includes hydrothermal solution case and cooling liquid box, is arranged in parallel between the hydrothermal solution case and cooling liquid box
There are several heat-dissipating pipes, hydrothermal solution case is connected to by the heat-dissipating pipe with cooling liquid box, and the hydrothermal solution case is connected to liquid outlet pipe, the cold liquid
The outlet end of the liquid feeding end for being connected with water pump of case, the water pump connects central tube and liquid supply pipe, the heat-dissipating pipe by pipeline
Lower section be provided with radiator fan, the bottom of the radiator fan is fixedly connected with the top of cooling fin, and the top of radiator fan
Both ends are respectively fixedly connected with the bottom of hydrothermal solution case and cooling liquid box.
Preferably, radiating fin, and the inside of heat-dissipating pipe are fixedly connected on the top and bottom tube wall of the heat-dissipating pipe
Screw thread is provided on tube wall, the radiating fin is corrugated.
Preferably, the inner hollow of the cooling fin, and the inner cavity of cooling fin has been placed equidistant with several heat conducting bars, it is described to lead
The both ends of hot rod are fixedly connected with the inner wall of cooling fin, and the lumen loading fluidised form heat-conducting medium of cooling fin.
Preferably, the cooling fin is in arcuation, and the surface of cooling fin is arranged in plucking.
Compared with prior art, the beneficial effects of the present invention are:
1. radiating in the form of the combination of air-cooled and liquid cooling, help to enhance radiating rate.
2. being respectively arranged with forward channel and reverse channel, the flowing of coolant liquid opposite direction helps to improve the uniformity of heat dissipation.
Detailed description of the invention
Fig. 1 is absorbing heat disk structural schematic diagram of the present invention；
Fig. 2 is inventive pipeline connection schematic diagram；
Fig. 3 is schematic cross-section of the present invention；
Fig. 4 is the schematic cross-section of cooling fin of the present invention；
Figure label: forward channel, 15 reverse channels, 16 go out liquid for 1 absorbing heat disk, 11 cavity disks, 12 central tubes, 13 cooling fins, 14
Pipeline, 17 liquid supply pipes, 2 hydrothermal solution casees, 3 cooling liquid box, 4 heat-dissipating pipes, 5 water pumps, 6 radiator fans, 7 radiating fins, 8 heat conducting bars.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-4 is please referred to, the present invention provides a kind of technical solution: a kind of cooling electronic component multi-head spiral runner liquid
Body cooler, including absorbing heat disk 1 and cooling system, the absorbing heat disk 1 include cavity disk 11, the inner cavity middle part of the cavity disk 11
Central tube 12 is connected with, and the inner cavity of cavity disk 11 is provided with several cooling fins 13, during the cooling fin 13 with central tube 12 is
Point-symmetrically shape is distributed the heart, and the bottom of cooling fin 13 is fixedly connected with the intracavity bottom of cavity disk 11, and cooling fin 13 runs through
The top of cavity disk 11 extends to the top of cavity disk 11, and cooling fin 13 is thermally conductive from the bottom to top, and the heat in cavity disk 11 is led
Out, adjacent cooling fin 13 forms channel in 11 inner cavity of cavity disk；The cooling fin 13 is in arcuation, and the surface of cooling fin 13 is in
Plucking setting, increases the contact area with medium, helps to improve radiating efficiency, and cavity disk 11 and cooling fin 13 use aluminium alloy
Material, the inner hollow of the cooling fin 13, and the inner cavity of cooling fin 13 have been placed equidistant with several heat conducting bars 8, the heat conducting bar 8
Both ends be fixedly connected with the inner wall of cooling fin 13, and the lumen loading fluidised form heat-conducting medium of cooling fin 13.This place fluidised form is led
Thermal medium uses water, and the water of 13 intracavity bottom of cooling fin, which absorbs heat, to float, and heat conducting bar 8 gradually dissipates heat derives in floating-upward process
Hair, reduces coolant-temperature gage, becomes the cold water of lower temperature, and cold water, which sinks to then absorbing heat, to float.
The channel is divided into forward channel 14 and reverse channel 15, and the forward channel 14 and reverse channel 15 are staggered and set
It sets, the one end in the forward channel 14 is connected to central tube 12, and forward channel 14 far from one end of central tube 12 is communicated with out liquid
Pipeline 16, the reverse channel 15 is connected with liquid supply pipe 17 far from one end of central tube 12, and reverse channel 15 is close to central tube
12 one end connects liquid outlet pipe 16, is respectively arranged with forward channel 14 and reverse channel 15, coolant liquid opposite direction flowing, wherein suitable
Coolant liquid into channel 14 is flowed from the center of cavity disk 11 to its outside, and the coolant liquid in reverse channel 15 is by cavity disk 11
Portion is flowed thereto in outside, effectively reduce the middle part of cavity disk 11 and the external temperature difference, help to improve the uniformity of heat dissipation.
Liquid outlet pipe 16, central tube 12 and liquid supply pipe 17 are all made of vinyl tube.
The cooling system includes hydrothermal solution case 2 and cooling liquid box 3, if being arranged in parallel between the hydrothermal solution case 2 and cooling liquid box 3
Hydrothermal solution case 2 is connected to by dry root heat-dissipating pipe 4, the heat-dissipating pipe 4 with cooling liquid box 3, and the hydrothermal solution case 2 is connected to liquid outlet pipe 16, described
The outlet end of the liquid feeding end for being connected with water pump 5 of cooling liquid box 3, the water pump 5 connects central tube 12 and liquid supply pipe 17 by pipeline,
The lower section of the heat-dissipating pipe 4 is provided with radiator fan 6, and the bottom of the radiator fan 6 is fixedly connected with the top of cooling fin 13, and
The top both ends of radiator fan 6 are respectively fixedly connected with the bottom of hydrothermal solution case 2 and cooling liquid box 3, the top and bottom of the heat-dissipating pipe 4
It is fixedly connected to radiating fin 7 on tube wall, and is provided with screw thread in the inner pipe wall of heat-dissipating pipe 4, the radiating fin 7 is in ripple
Shape increases the contact area with medium, helps to improve radiating efficiency.Wherein heat-dissipating pipe 4 and radiating fin 7 are all made of copper material.
Working principle: coolant liquid is flowed out from cooling liquid box 3, and forward channel 14 and reverse channel are entered under the action of water pump 5
15, coolant liquid is absorbed heat in forward channel 14 and reverse channel 15, is then passed through liquid outlet pipe 16 and is entered hydrothermal solution case 2, and then leads to
Heat-dissipating pipe 4 is crossed, then coolant liquid returns cooling liquid box 3 in the cooling heat release of heat-dissipating pipe 4.
Radiator fan 6 flows air, and cold air passes sequentially through heat-dissipating pipe 4 and cooling fin 13, takes away heat-dissipating pipe 4 and heat dissipation
Heat on piece 13.
The technical program is radiated in the form of the combination of air-cooled and liquid cooling, is helped to enhance radiating rate, is improved heat dissipation
Efficiency.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component, it is characterised in that: including absorbing heat disk (1) and dissipate
Hot systems, the absorbing heat disk (1) include cavity disk (11), are connected with central tube (12) in the middle part of the inner cavity of the cavity disk (11),
And the inner cavity of cavity disk (11) is provided with several cooling fins (13), the cooling fin (13) is in point pair centered on central tube (12)
Claim shape distribution, and the bottom of cooling fin (13) is fixedly connected with the intracavity bottom of cavity disk (11), and cooling fin (13) is through sky
The top of cavity disk (11) is extended at the top of chamber disk (11), adjacent cooling fin (13) forms logical in cavity disk (11) inner cavity
Road；
The channel is divided into forward channel (14) and reverse channel (15), and the forward channel (14) and reverse channel (15) are staggered
One end of setting, the forward channel (14) is connected to central tube (12), and the forward one end of channel (14) far from central tube (12)
It is communicated with liquid outlet pipe (16), the reverse channel (15) is connected with liquid supply pipe (17) far from the one end of central tube (12), and inverse
Liquid outlet pipe (16) are connected close to the one end of central tube (12) to channel (15).
2. a kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component according to claim 1, feature exist
In: the cooling system includes hydrothermal solution case (2) and cooling liquid box (3), is arranged in parallel between the hydrothermal solution case (2) and cooling liquid box (3)
There are several heat-dissipating pipes (4), hydrothermal solution case (2) is connected to by the heat-dissipating pipe (4) with cooling liquid box (3), and the hydrothermal solution case (2) is connected to out
The outlet end in liquid pipe road (16), the liquid feeding end for being connected with water pump (5) of the cooling liquid box (3), the water pump (5) is connected by pipeline
Central tube (12) and liquid supply pipe (17) are connect, is provided with radiator fan (6) below the heat-dissipating pipe (4), the radiator fan (6)
Bottom be fixedly connected with the tops of cooling fin (13), and the top both ends of radiator fan (6) be respectively fixedly connected with hydrothermal solution case (2) and
The bottom of cooling liquid box (3).
3. a kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component according to claim 2, feature exist
In: it is fixedly connected to radiating fin (7) on the top and bottom tube wall of the heat-dissipating pipe (4), and the inner pipe wall of heat-dissipating pipe (4)
On be provided with screw thread, the radiating fin (7) is corrugated.
4. a kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component according to claim 1, feature exist
In: the inner hollow of the cooling fin (13), and the inner cavity of cooling fin (13) has been placed equidistant with several heat conducting bars (8), it is described to lead
The both ends of hot rod (8) are fixedly connected with the inner wall of cooling fin (13), and the lumen loading fluidised form heat-conducting medium of cooling fin (13).
5. a kind of Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component according to claim 1, feature exist
In: the cooling fin (13) is in arcuation, and the surface of cooling fin (13) is arranged in plucking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811618127.4A CN109671690B (en) | 2018-12-28 | 2018-12-28 | Multi-head spiral flow channel liquid cooler for heat dissipation of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811618127.4A CN109671690B (en) | 2018-12-28 | 2018-12-28 | Multi-head spiral flow channel liquid cooler for heat dissipation of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109671690A true CN109671690A (en) | 2019-04-23 |
| CN109671690B CN109671690B (en) | 2020-12-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811618127.4A Active CN109671690B (en) | 2018-12-28 | 2018-12-28 | Multi-head spiral flow channel liquid cooler for heat dissipation of electronic component |
Country Status (1)
| Country | Link |
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| CN (1) | CN109671690B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111787756A (en) * | 2020-06-12 | 2020-10-16 | 林乐霄 | Cooler for heat dissipation of electronic components |
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| CN1205549A (en) * | 1997-07-14 | 1999-01-20 | 三菱电机株式会社 | Cooling plate |
| JP3143538U (en) * | 2008-05-16 | 2008-07-24 | 珍通能源技術股▲ふん▼有限公司 | Heat sink device having bidirectional air flow discharge path |
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| CN102394230A (en) * | 2011-11-11 | 2012-03-28 | 电子科技大学 | Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component |
| CN202462754U (en) * | 2012-02-11 | 2012-10-03 | 广东仕诚塑料机械有限公司 | Cast film cooling roller provided with two-way spiral cooling water flow channel |
| CN107396600A (en) * | 2017-07-16 | 2017-11-24 | 中车永济电机有限公司 | Bidirectional screw runner water-cooling heat radiating device |
| CN107768334A (en) * | 2017-11-23 | 2018-03-06 | 贵州大学 | Bifurcated passage radiator based on leaf vein topological structure |
| CN108194522A (en) * | 2018-03-08 | 2018-06-22 | 广东基泰智能设备有限公司 | One kind is used for high speed rotation spraying equipment bearing cooler |
| CN207800588U (en) * | 2016-07-22 | 2018-08-31 | 成都博盈复希科技有限公司 | A kind of liquid metal heat radiation device |
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2018
- 2018-12-28 CN CN201811618127.4A patent/CN109671690B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1205549A (en) * | 1997-07-14 | 1999-01-20 | 三菱电机株式会社 | Cooling plate |
| JP3143538U (en) * | 2008-05-16 | 2008-07-24 | 珍通能源技術股▲ふん▼有限公司 | Heat sink device having bidirectional air flow discharge path |
| CN102076205A (en) * | 2009-11-19 | 2011-05-25 | 富准精密工业(深圳)有限公司 | A heat radiation apparatus and a manufacturing method for the same |
| CN102394230A (en) * | 2011-11-11 | 2012-03-28 | 电子科技大学 | Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component |
| CN202462754U (en) * | 2012-02-11 | 2012-10-03 | 广东仕诚塑料机械有限公司 | Cast film cooling roller provided with two-way spiral cooling water flow channel |
| CN207800588U (en) * | 2016-07-22 | 2018-08-31 | 成都博盈复希科技有限公司 | A kind of liquid metal heat radiation device |
| CN107396600A (en) * | 2017-07-16 | 2017-11-24 | 中车永济电机有限公司 | Bidirectional screw runner water-cooling heat radiating device |
| CN107768334A (en) * | 2017-11-23 | 2018-03-06 | 贵州大学 | Bifurcated passage radiator based on leaf vein topological structure |
| CN108194522A (en) * | 2018-03-08 | 2018-06-22 | 广东基泰智能设备有限公司 | One kind is used for high speed rotation spraying equipment bearing cooler |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111787756A (en) * | 2020-06-12 | 2020-10-16 | 林乐霄 | Cooler for heat dissipation of electronic components |
| CN111787756B (en) * | 2020-06-12 | 2022-05-24 | 林乐霄 | Cooler for heat dissipation of electronic components |
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| Publication number | Publication date |
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| CN109671690B (en) | 2020-12-04 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20201119 Address after: 214000 Jiangsu city of Wuxi province Liangxi Road No. 12 Applicant after: STATE GRID JIANGSU ELECTRIC POWER CO., LTD. WUXI POWER SUPPLY Co. Address before: 215000 room 601-9, lotus building, 393 Chunshen Middle Road, Xiangcheng District, Suzhou, Jiangsu. Applicant before: SUZHOU BILEI AISI ELECTRONIC TECHNOLOGY Co.,Ltd. |
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