KR101897931B1 - System for cooling a processor in electronic device - Google Patents

Abstract

Provided is a processor cooling system capable of effectively cooling a processor by effectively supplying fluids, which are cooled through a heat exchanger integrated with a circulation pump and a cooling core, to a radiating pad of a processor. The system includes: a core in which heat is exchanged; a cooling pump tank including an inlet for taking cooling fluids, an outlet for discharging the fluids, and a pumping area placed indoors, and forming a partition for separating circulation channels for a plurality of radiating pipes to surround the entire part of an end of the radiating pipes; a return tank including a return wall formed in a position corresponding to the formation of the partition to return cooling fluids, which flow in through an inflow radiating pipe among the radiating pipes, to a discharge radiating pipe to surround the entire part of the other end of the radiating pipes; and a heat exchanger comprising a cooling pump installed between the discharge radiating pipe and the outlet in the pumping area of the cooling pump tank to pump the cooling fluids in the discharge radiating pipe to send the fluids to the radiating pad of the processor.

Description

≪ Desc / Clms Page number 1 > SYSTEM FOR COOLING A PROCESSOR IN ELECTRONIC DEVICE <

The present invention relates to a processor cooling system used in an electronic device such as a computer, and more particularly, to a system and method for efficiently cooling a processor by efficiently supplying a fluid cooled by a heat exchanger, which includes a circulation pump and a cooling core, Lt; / RTI >

BACKGROUND OF THE INVENTION [0002] Electronic devices incorporating a processor, such as a computer, require electricity during operation, and some computer components, i.e., processors, require more electricity than other components. Electricity is transmitted through circuits and wires, which inevitably leads to resistances, which in turn produce heat.

Processors, for example, components such as a central processing unit (CPU) and a graphics processing unit (GPU), require much more electricity to operate and can be configured to perform this configuration There is a large difference in the amount of electricity used for the element.

If the temperature of a processor such as a CPU or a GUP can not be controlled to a certain level or less, the operation speed of the processor is significantly lowered, so that the heat radiating pad of the processor is coupled to various types of cooling devices. Therefore, as the size and complexity of microprocessors increase, the structure and cooling method of a cooling device for a processor is becoming important.

An example of a cooling device for a processor is an air cooling type cooling method using a heat sink and a water cooling method for cooling the processor by cooling the fluid by a radiator and bringing the cooling fluid into contact with the heat radiating pad of the processor.

Air-cooled systems typically incorporate a metal-made heat sink, such as aluminum, heat pipe, or the like, into the processor's thermal pad to absorb heat emitted from the thermal pad of the processor to cool the processor. At this time, a cooling fan may be coupled to the heat sink to increase the cooling efficiency of the heat sink.

A water-cooled type cooling device is a device installed in a processor of an electronic device such as a computer and cooling the heat generated by the processor using a cooling fluid. The water-cooled type cooling apparatus usually includes a water block, a radiator, a fan, a pump, a water tank, a control unit, and the like. Examples of such water cooling type cooling apparatuses include those disclosed in U.S. Patent No. 6,906,919 (registered on June 14, 2005) and Japanese Patent Laid-Open No. 10-1454326 (Registered on Apr. 17, 2014, Patent Document 2) .

However, the conventional technology disclosed in Patent Document 1 has a problem that an attach block for injecting a cooling fluid to a processor and a cooling fan for pumping a cooling fluid discharged from a heat exchanger that dissipates heat energy of the cooling fluid and exchanges the cooling fluid with a low- The pump is disassembled, so that there is inconvenience to install by the consumer.

Patent Document 2 discloses a technique of integrating a water block and a pump in contact with a heating element of an electronic device to solve the problem of Patent Document 1. However, Patent Document 2 discloses that cooling of a water block in which a water pump is in contact with a heat- When the pump located on the fluid flow path continuously operates and generates heat, the heat generated by the pump increases the temperature of the cooling fluid, so that the cooling efficiency is lowered. In addition, high frequencies such as electromagnetic waves due to the operation of the pump may affect the operating frequency of the processor.

In Patent Documents 1 and 2, since the heat recovery path of the heat exchanger or the radiator for lowering the temperature by recovering the thermal energy of the cooling fluid raised to a high temperature is composed of 2 paths, the heat recovery efficiency of the cooling fluid is poor The overall cooling efficiency of the processor was not good.

US Patent 6,906,919 B1 (registered on June 14, 2005) Patent Registration No. 10-1454326 (Oct. 17, 2014)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a processor cooling system for an electronic device having a structure in which a user can easily install the processor in a computer.

Another object of the present invention is to recover the heat energy of the cooling fluid by a plurality of collecting paths so that the inflow pressure of the cooling fluid becomes very large compared with the discharge pressure so that the recovery rate of heat energy is increased by a slow flow rate, And a pump for increasing the discharge pressure of the cooling fluid is installed in a heat exchanger capable of efficiently lowering the temperature of the heat exchanger.

According to an aspect of the present invention, there is provided a processor cooling system including: a plurality of radiating tubes spaced apart from each other by at least one hollow formed through the cooling fluid to flow therethrough, A plurality of radiating fins joined between the heat radiating tubes to increase a contact area with the atmosphere to radiate thermal energy of the cooling fluid in the radiating tubes; and a plurality of fitting holes through which the plurality of radiating tubes are inserted, A heat exchange core comprising a pair of head plates coupled to both ends of a plurality of heat dissipation tubes; A partition wall for separating and forming the circulation passages of the plurality of heat dissipation pipes is formed so that the one end portion of the plurality of heat dissipation pipes A cooling pump tank coupled in a wraparound manner; And a return wall formed at a position corresponding to the partition wall for returning the cooling fluid introduced through the input heat dissipation pipe among the plurality of heat dissipation pipes to the exhaust heat dissipation pipe is formed inside, A return tank in the form of wrapping the entire end portion; And a cooling pump installed between the discharge heat pipe and the discharge port in the pumping area provided in the cooling pump tank for pumping the cooling fluid in the discharge heat pipe and sending the pumped fluid toward the heat radiation pad of the processor .

Wherein the cooling pump tank stores a cooling fluid flowing into the inlet port by a first partition wall spaced at a predetermined interval from a side wall of the cooling pump tank toward a direction in which the plurality of heat pipes are arranged, And a second partition provided at a side of the storage area at a distance equal to or wider than a spacing distance between the first partition and the second partition, A circulation zone for circulating the cooling fluid of the first pass corresponding inlet heat radiating pipe to the second pass and the third pass corresponding circulation heat radiating pipe having the partition and partitioned by the circulating heat exchanger, And a discharge area for discharging the discharged heat to the discharge port through the discharge compliant heat dissipating pipe, Area is characterized in that set so as to gradually decrease toward the outlet from the inlet.

The cooling pump includes a prechamber coupled to one end of the fourth path corresponding discharge heat pipe and configured to receive a cooling fluid flowing therein, and a cooling fluid, which is rotated in a predetermined axial direction in the prechamber, A pump chamber including an impeller which discharges through a discharge port formed in a cooling pump tank, and a stator which is provided at one side of the pump chamber and provides a driving force for rotating the impeller.

The heat dissipation tube may be a cylindrical welding tube or an extrusion tube having at least one through-hole formed between the one end and the other end.

One end of a pair of flexible tubes is connected to the inlet and the outlet, and the other end of the pair of flexible tubes is connected to a pair of ports formed in a fluid receiving space of the cooling plate contacting the heat- .

Wherein a pair of cooling fan brackets are coupled to both sides of the plurality of heat-radiating fins forming the heat-exchanging core to surround the radiating fins so as to mount the cooling fan, and the pair of cooling fan brackets are coupled to the cooling fan brackets And a cooling fan which is rotated to supply wind to the heat radiating fin and the heat radiating pipe is installed.

The processor cooling system of an electronic device according to an embodiment of the present invention is characterized in that the cooling fluid flow of the heat exchanger is at least four or more passes so that the fluid pressure of the four passes from the flow at the cooling fluid inlet side towards the cooling fluid outlet So that the flow velocity on the side of the discharge port is increased, so that the discharge of the cooling fluid can be smoothly performed. In addition, since a cooling pump for supplying a cooling fluid to a cooler connected to the heat radiating pad of the processor is incorporated in the heat exchanger, temperature rise of the cooling fluid supplied to the cooler by rotation of the coolant pump is prevented, have.

1 is a view illustrating a processor cooling system according to a preferred embodiment of the present invention installed in a computer main body.
Fig. 2 is a plan view showing the structure of the heat exchanger shown in Fig. 1. Fig.
3 is a cross-sectional view of the heat-exchanging core shown in Fig. 1, in which the radiating fin is removed from the line AA.
4 is a sectional view taken along the line BB of the core shown in the heat exchanger shown in Fig.
5 is a view for explaining the operation of the processor cooling system shown in FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. It is also to be understood that the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It should be noted that the embodiments of the present invention described below are intended to sufficiently convey the spirit of the present invention to those skilled in the art.

1 is a perspective view showing the exterior and interior of a computer main body 1 equipped with the processor cooling system 100 according to the present invention.

Referring to FIG. 1, a cooling plate 3 is provided in contact with the surface of a processor 2 provided in the computer main body 1. Here, the surface of the processor 2 refers to a heat radiating pad, and the cooling plate 3 absorbs the temperature of the heat radiating pad of the processor 2 by supplying a cooling fluid having a low temperature, Means a block of water. The cooling plate 3 is fixedly connected or fixed to the substrate by a support jacket (not shown in the figure) as a water jacket for contacting the cooling fluid to the processor 2. [ The inlet 3a and the outlet 3b of the cooling plate 3 are respectively connected to the outlet of the heat exchanger 7 (not shown in Fig. 1) and the inlet (Fig. 1 Not shown, respectively).

With this configuration, the cooling fluid of the cooling plate 3 absorbs the heat of the processor 2 and is introduced into the heat exchanger 7 through the tube 6 of the pair of flexible tubes 5, 6, And then supplied to the cooling plate 3 again after being cooled by the forced circulation airflow by the cooling fan 8 fixed to the heat exchanger 7 by the bracket 10, It is possible to continuously perform the cooling action by the heat exchanger. 1, reference numeral 9 denotes a power supply unit.

The cooling fluid may be either a refrigerant or water, which is made of a well-known inert gas.

The processor cooling system 100 according to the embodiment of the present invention shown in FIG. 1 includes a cooling pump for supplying a cooling fluid cooled by a heat radiation function and a cooling action to the tube 5 in the heat exchanger 7 Respectively.

The cooling action of the heat exchanger 7 and the processor 2 according to the preferred embodiment of the present invention will be described in more detail with reference to FIGS. 2 to 5. FIG.

Fig. 2 shows a specific configuration of the heat exchanger 7 shown in Fig.

2, the heat exchanger 7 according to the present invention includes a plurality of heat dissipation tubes 21, a plurality of heat dissipation fins 22 longitudinally coupled to the heat dissipation tubes 21, And a pair of cooling fan brackets 23 surrounding the peripheral side surface of the cooling fan bracket 23 in a diagonal shape. Both ends of the heat radiating tubes 21 of the core 20 are coupled through holes or holes formed in the head plates 24 and 25.

The heat-dissipating tube 21 may be a cylindrical welding tube or an extrusion tube having at least one through-hole formed therethrough to allow a cooling fluid to flow therethrough. However, an extrusion tube having excellent thermal conductivity may be used .

At this time, it is preferable that the plurality of heat-radiating pipes 21 have the same size for the uniformity of heat energy recovery efficiency.

The radiating fins (22) are coupled between the plurality of radiating tubes (21) to increase the contact area with the atmosphere, thereby dissipating thermal energy of the cooling water in the radiating tubes.

Although not shown in FIGS. 2 to 4, the cooling fan 8 coupled to the cooling fan bracket 23 of the core 20 as shown in FIG. 5 winds the radiating fins 22, It is possible to cool the cooling fluid flowing to the heat exchanger 21 more easily.

The cooling tank 30 and the return tank 40 are coupled to both ends of the core 20 constructed as described above.

As shown in FIGS. 2 and 3, the cooling pump tank 30 is provided with an inlet 35 and an outlet 36 on the outside, and a pumping area 31 is provided therein. At least two cooling passages are formed inside the cooling pump tank 30 for cooling the cooling fluid flowing into the inlet port 35 by heating to a high temperature and discharging the cooling fluid to the outlet port 36.

The two or more cooling passes may be configured as follows. The cooling pass of the core 20 according to the embodiment of the present invention shown in Figs. 2 and 3 has four passes P1 to P4.

The first partition wall 32 is spaced apart from the first partition wall 32 by a predetermined distance toward the lining of the plurality of heat pipes 21 at one side wall of the cooling pump tank 30, (37) for storing a cooling fluid flowing into the heat exchanger (35) and a part of the plurality of heat pipes (21) is set as a first pass (P1).

The plurality of first partition walls 32 are formed in the cooling pump tank 30 in such a manner that the first partition walls 32 are formed on the side wall of the storage region 37, And a second partition wall 33 spaced apart in the direction in which the heat radiation pipes 21 are arranged. A return wall 41 is formed in the return tank 40 at a position corresponding to a half length of the second partition wall 33.

The first partition 32, the second partition 33 and the return wall 41 divide the group formed by the plurality of heat pipes 21 in the heat exchange core 7 into a plurality of small groups of predetermined areas .

In the embodiment of the present invention, the total of twelve heat dissipating tubes 21 provided in the heat exchange core 7 are used to connect the first path P1 to four heat dissipating tubes, the second path P2 and the third path P3 Is divided into three heat pipes and a fourth heat pipe P4 is divided into two heat pipe groups.

The first and second partition walls 30 and 32 are formed in the interior of the cooling pump tank 30 such that the plurality of heat pipes 21 constituting the core 20 are divided into four paths P1 to P4, 32 and 33 and one return wall 41 is formed inside the return tank 40. The return wall 41 may be selectively changed depending on the size of the core 20, .

A cooling pump (50) is installed in the pumping area (31) of the cooling pump tank (30).

The cooling pump 50 includes a prechamber 51 coupled to one end of the heat transfer tubes 21 corresponding to the fourth pass P4 and adapted to receive the introduced cooling fluid, And an impeller (53) rotatably rotated in the rotation axis direction of the rotor (55) to discharge the cooling fluid accommodated in the prechamber (51) through an outlet (36) formed in the cooling pump tank (30) A chamber 52 and a stator 54 formed at one side of the pump chamber 52 and providing a driving force for rotating the rotor 55.

2, 4, and 5, a cooling fluid discharge port 36 is formed on the upper portion of the pump chamber 52. As shown in FIG.

An inlet port 35 and an outlet port 36 formed in the cooling pump tank 30 and a pair of ports formed in the cooling plate 3, for example, between the discharge port and the inlet port, A pair of flexible tubes 5, 6 are tubed.

The tubes 5, 6 are easy to bend, easily routed, do not tear or twist substantially, have an extremely low foil delivery speed, and can be manufactured at low cost. For example, the tubes 48 and 50 may be made of one or more of the following materials: FEP, PVDF, ETFE, PTFE (such as, for example, Viton available from DuPont) Or a fluoro-elastomer.

Various types of cooling blocks can be used for the cooling plate 3 applied in the present invention. In other words, it suffices to have a structure in which the cooling fluid is brought into contact with the heat radiating pad of the processor by the cooling fluid input to the input port, and is discharged to the outside through the output port heated by the thermal energy of the heat radiating pad.

As an example of the cooling plate 3 as described above, Patent Document 10-0456342 entitled "Water-cooled cooling block of semiconductor chip"

The cooling fluid is filled in the heat exchanger 7 and the tubes 5 and 6 of the cooling system 100 of the electronic device processor of the present invention constructed as shown in Figs. 2 to 5, When heat is started to be radiated from the heat radiation pad by the operation of the processor 2 and the cooling pump 50 is operated in a state where the heat radiation pad is connected to the heat radiation pad of the processor 2 of the computer apparatus as shown in Fig. Is cooled to an appropriate temperature.

That is, when the cooling pump 50 is operated, the cooling pump 50 pumps the cooling fluid filled in the heat radiating tube 21 forming the four passes in the core 20 to form the discharge port 36, the tubes 5, 6 to the cooling plate 3 connected to the heating pad of the processor 2. The cooling fluid supplied to the cooling plate 3 flows through a flow path formed inside the cooling plate 3 so that the cooling plate 3 cools the heating pad of the processor 2. [

By this cooling process, the thermal energy of the heating pad of the processor 2 is transferred to the cooling fluid flowing in the cooling plate 3, thereby raising the temperature of the cooling fluid. The increased temperature of the cooling fluid is transmitted to the heat exchanger 70 through the tube 6 connected to the discharge port of the cooling plate 3 by the pressure caused by the rotation of the impeller 53 of the cooling pump 50 and the natural convection phenomenon, And flows into the inlet port 35 side.

The cooling fluid heated by the heat exchange passes through the storage region 37 of the cooling pump tank 30 to the return tank (not shown) through the four heat pipes 21 forming the first pass P1 of the core 20 40). The cooling fluid introduced into the return tank 40 through the first path P1 is divided into three heat pipes 21 forming the second path P2 by the return wall 41 and the second partition 33, As shown in FIG. The cooling fluid passing through the second path P2 is discharged through the third path P3 and the fourth path P4 formed by the second partition 33 and the return wall 41 and finally through the discharge heat pipe 21 into the prechamber 51 of the cooling pump 50 through the discharge port.

The cooling fluid contained in the prechamber 51 flows into the pump chamber 52 through the opening 56 formed in the inflow side of the pump chamber 52 when the impeller 53 is rotated by the rotation of the rotor 55 And the cooling fluid introduced into the pump chamber 52 is supplied to the cooling plate 3 through the discharge port 36. [

In this case, the first path P1 is four discharge tubes 21, the second and third paths P2 and P3 are three discharge tubes 21, and the fourth path P4 is two discharge tubes 21, Tube. That is, the first to fourth passes P1 to P4 are formed such that the total cross-sectional area through which the cooling fluid flows gradually decreases toward the downstream.

The flow rate of the cooling fluid flowing through the first path P1 is the slowest and the pressure is the highest. As a result, as the flow proceeds to the second, third and fourth passes P2 to P4 located on the downstream side, The flow rate of the fluid gradually increases and the pressure gradually decreases. With this flow rate and pressure, when the cooling fan 8 coupled to the core 50 of the heat exchanger 7 is rotated to send cold wind around it to the fins 22 of the core 20, Since the flow velocity of the first path P1 constituted by the heat-radiating pipe 21 is the slowest and the pressure is high, the cooling fluid having a high density and being transported slowly is quickly cooled.

That is, the present invention improves the cooling efficiency by appropriately adjusting the flow rate and pressure of the cooling fluid introduced into the heat exchanger according to the passage of time.

As a result of simulating the cooling efficiency of a cooler having a 2-pass core-thinner heat exchanger and an external pump and a pump having a 4-pass core structure built in a heat exchanger as in the present invention, the cooling efficiency is about 62% And the results are shown in Table 1 below.

Simulation results of the cooling system and the general cooling system according to the present invention Compare contents The cooling system Overseas cooling system Built-in pump + core core

Core Pass: 4 Core Pass: 2 Simulation result

1: computer main body, 2: processor,
3: cooling plate, 5, 6: tube
7: Heat exchanger, 8: Cooling fan,
9: power supply unit, 10: bracket,
20: Core, 21: Heat pipe,
22: radiating fin, 23: cooling fan bracket,
24, 25: a head plate, 30: a cooling pump tank,
31: pumping region, 32, 33: first and second partition walls,
35: inlet, 36: outlet,
37: storage area, 40: return tank,
41: Return wall, 50: Cooling pump,
51: prechamber, 52: pump chamber,
53: impeller, 54: stator,
55: rotor, 56: aperture

Claims (6)

A processor cooling system of an electronic device,
A plurality of heat dissipation tubes which are formed by spacing at least one hollow portion through which the cooling fluid flows so as to be spaced apart from each other and which function as an input and an exhaustion; a plurality of heat dissipation fins coupled between the plurality of heat dissipation tubes to radiate thermal energy of the cooling fluid in the heat dissipation tube; A heat exchange core formed of a pair of head plates formed with a plurality of engagement holes through which the plurality of heat dissipation tubes are inserted and coupled to both ends of the plurality of heat dissipation tubes;
An inlet port through which the cooling fluid flows and a discharge port through which the cooling fluid is discharged are formed and a pumping region is provided therein and at least two partitions for separating and forming the plurality of heat pipes into the inlet, A cooling pump tank coupled to the one end of the plurality of heat dissipation tubes to surround the entire one end thereof;
And a return wall formed at a position corresponding to the partition wall for returning the cooling fluid flowing through the plurality of heat dissipation pipes through the heat dissipation pipe to the exhaust heat dissipation pipe and surrounding the entire other end of the plurality of heat dissipation pipes A return tank in the form;
And a cooling pump installed between the exhaust heat discharging pipe and the discharging pipe in a pumping area provided in the cooling pump tank, for pumping the cooling fluid in the discharge heat pipe and sending it to the heat radiating pad of the processor,
Wherein the cooling pump tank stores a cooling fluid flowing into the inlet port by a first partition wall spaced at a predetermined interval from a side wall of the cooling pump tank toward a direction in which the plurality of heat pipes are arranged, And a plurality of heat dissipation pipes arranged in a direction in which the plurality of heat dissipation pipes are lined up at an interval equal to or wider than a spacing distance between the first partition walls at a side of the storage area, A circulation zone for circulating the cooling fluid of the first pass corresponding inlet heat radiating pipe to the second pass and the third pass corresponding circulation heat radiating pipe having the first and second partition corresponding to the first pass and the second pass, And a discharge area through which the refrigerant is discharged to the discharge port through the 4-pass corresponding discharge heat pipe, and each of the first to fourth pass corresponding heat radiation pipes The total cross-sectional area processor cooling system for an electronic device, characterized in that set so as to gradually decrease toward the outlet from the inlet. delete 2. The refrigerator of claim 1, wherein the cooling pump comprises: a pre-chamber coupled to one end of the fourth-path corresponding discharge heat pipe and receiving the introduced cooling fluid; And a stator that is provided at one side of the pump chamber and provides a driving force to rotate the impeller. The pump chamber includes a pump chamber having an impeller for discharging a cooling fluid accommodated in the pump chamber through an outlet formed in the cooling pump tank, Processor cooling system for electronic devices. The electronic device according to claim 1, wherein the heat dissipation tube is one of a cylindrical welding tube or an extrusion tube in which at least one through hole is formed between one end of the plurality of heat dissipation tubes and the other end thereof Processor cooling system. The refrigerator according to any one of claims 1 to 3, wherein one end of a pair of flexible tubes is connected to the inlet and the outlet, and the other end of the pair of flexible tubes is connected to a heat dissipation And connected to a pair of ports formed in the fluid receiving space of the cooling plate in contact with the pad. The cooling fan according to claim 5, wherein a pair of cooling fan brackets are coupled to both sides of the plurality of heat-radiating fins forming the heat-exchanging core to surround the heat-radiating fins to secure the cooling fan, Wherein the bracket is provided with a cooling fan which is rotated by a driving voltage to supply wind to the radiating fin and the radiating tube.

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