CN113703550A - Hybrid liquid cooling device - Google Patents
Hybrid liquid cooling device Download PDFInfo
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- CN113703550A CN113703550A CN202110838033.3A CN202110838033A CN113703550A CN 113703550 A CN113703550 A CN 113703550A CN 202110838033 A CN202110838033 A CN 202110838033A CN 113703550 A CN113703550 A CN 113703550A
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- cooling
- liquid
- liquid cooling
- pipeline
- plate
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- 238000001816 cooling Methods 0.000 title claims abstract description 190
- 239000007788 liquid Substances 0.000 title claims abstract description 122
- 239000000110 cooling liquid Substances 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 238000013022 venting Methods 0.000 claims description 2
- 238000007664 blowing Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 239000002699 waste material Substances 0.000 abstract description 5
- 239000002826 coolant Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a mixed liquid cooling device.A main body part of a device to be cooled is immersed in cooling liquid to realize integral heat exchange and cooling; a liquid cooling pipeline is arranged in the cooling box, cooling liquid circulating in the liquid cooling pipeline is independent of cooling liquid in the cooling box, a liquid cooling plate is arranged on the liquid cooling pipeline, the liquid cooling plate is attached to a high-power-consumption element for heat exchange, and cooling liquid discharged from the circulating pipeline enters the liquid cooling pipeline and does not directly flow into the cooling box; the cooling liquid flows into the liquid cooling plate, exchanges heat in the liquid cooling plate and then is discharged, and then enters the cooling box; because the cooling plate contacts new low-temperature cooling liquid firstly, the cooling efficiency of the cooling plate is higher than that of other positions, and therefore targeted cooling heat dissipation is achieved according to the difference of the heat productivity of each device of the device to be cooled, resource waste is avoided, the whole device to be cooled is immersed in the cooling liquid, and influences caused by the external environment can be reduced.
Description
Technical Field
The invention relates to the field of servers, in particular to a hybrid liquid cooling device.
Background
More than 70% of the data in the future needs to be analyzed, processed and stored at the edge side. The edge computing scene is complex and various, and the method has certain application in the industries of energy transportation, communication, Internet, industrial manufacturing, finance, retail and the like. Particularly in the fields of energy transportation, automatic driving, industry and the like, which have certain requirements on portability, require edge computing products to have high-performance and high-power consumption chips and can also cope with environments such as high temperature, high altitude, serious dust, humidity and the like, which brings great difficulty to the thermal design of the current products.
The liquid cooling design scheme of the current edge calculation product in high-performance calculation mainly has two kinds: cooling a liquid plate and performing forced air cooling heat dissipation; ② immersion liquid cooling. Both of these liquid cooling schemes have certain drawbacks.
The liquid cooling plate and forced air cooling technology is an improvement aiming at the forced air cooling technology, and is mainly used for solving the problem that a product uses high-power consumption components such as a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU). The technology has the advantages of low cost, but the technology has the defects that a CPU and the like use a liquid cooling plate for heat dissipation, and other components need a fan for forced air cooling for heat dissipation. Therefore, under the conditions of high temperature and high dust, the fan brings outside air into the case, the service life of the fan and components is shortened, faults are easy to occur, and the reliability of products is reduced. Meanwhile, an external CDU (Coolant Distribution Unit) is required to manage the liquid cooling plate cooling loop, and the CDU generally includes components such as a water pump, a heat exchanger, a compressor, and a blower.
The immersed liquid cooling technology is that the interior of a product is filled with insulating cooling liquid, and then the cooling liquid is managed to enter and exit through an external CDU. The immersed liquid cooling has the advantages that components in the whole case can be cooled, but the flow rate of cooling liquid is low under general conditions, the cooling liquid near the high-power-consumption components such as a CPU (central processing unit), a GPU (graphics processing unit) and the like flows slowly, the cooling effect is obviously not the same as that of a liquid cooling plate with the high flow rate of the cooling liquid, in order to deal with the heat dissipation of high-power-consumption chips such as the CPU and the like, the flow rate of the whole cooling liquid must be increased, the power consumption of a pump can be greatly increased, and the operation cost of the whole system is obviously increased.
For those skilled in the art, how to cool different heating elements in a targeted manner while avoiding resource waste is a technical problem to be solved at present.
Disclosure of Invention
The invention provides a mixed liquid cooling device, which can cool different heating elements in a targeted manner, and avoids resource waste while ensuring the cooling effect, and the specific scheme is as follows:
a mixed liquid cooling device comprises a cooling box for containing cooling liquid, wherein a device to be cooled placed in the cooling box is immersed in the cooling liquid;
a circulating pipeline is arranged outside the cooling tank, a radiator and a power pump are arranged on the circulating pipeline, the power pump drives cooling liquid to circularly flow between the circulating pipeline and the cooling tank, and the cooling liquid radiates heat outwards through the radiator;
a liquid cooling pipeline is arranged in the cooling box, a liquid cooling plate is arranged on the liquid cooling pipeline, and the liquid cooling plate is attached to a high-power-consumption element for heat exchange;
and the cooling liquid flow discharged from the circulating pipeline enters the liquid cooling pipeline and flows into the liquid cooling plate, and is discharged after heat exchange in the liquid cooling plate and enters the cooling box.
Optionally, more than two liquid cooling plates are arranged in the cooling box, and each liquid cooling plate supplies cooling liquid through the same liquid cooling pipeline or multiple sections of liquid cooling pipelines.
Optionally, the inside of the liquid cooling plate is provided with a curvilinearly distributed channel.
Optionally, the outer surface of the liquid cooling plate is provided with fins.
Optionally, a pressure relief valve is provided in the upper portion of the cooling tank for venting internal high pressure.
Optionally, the heat spreader is made of aluminum, copper or graphite.
Optionally, a heat sink flow channel is integrally arranged inside the heat spreader, and the heat sink flow channel is butted with the circulation pipeline.
Optionally, a fan is disposed corresponding to the heat sink, and the fan blows a cooling airflow to the heat sink.
Optionally, the circulation pipeline is connected to the liquid inlet of the cooling tank and is located below the liquid outlet.
The invention provides a mixed liquid cooling device.A device to be cooled which is arranged in a cooling box is immersed in cooling liquid, and the main body part of the device to be cooled is immersed in the cooling liquid to realize integral heat exchange and cooling; the outside of cooler bin sets up the circulating line, discharges the coolant liquid that absorbs heat in the cooler bin, and the outside heat that gives off of process radiator accomplishes the cooling, gets into the cooler bin again, constantly circulates. A liquid cooling pipeline is arranged in the cooling box, cooling liquid circulating in the liquid cooling pipeline is independent of cooling liquid in the cooling box, a liquid cooling plate is arranged on the liquid cooling pipeline, the liquid cooling plate is attached to a high-power-consumption element for heat exchange, and cooling liquid discharged from the circulating pipeline enters the liquid cooling pipeline and does not directly flow into the cooling box; the cooling liquid flows into the liquid cooling plate, exchanges heat in the liquid cooling plate and then is discharged, and then enters the cooling box; because the cooling plate contacts new low-temperature cooling liquid firstly, the cooling efficiency of the cooling plate is higher than that of other positions, and therefore targeted cooling heat dissipation is achieved according to the difference of the heat productivity of each device of the device to be cooled, resource waste is avoided, the whole device to be cooled is immersed in the cooling liquid, and influences caused by the external environment can be reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a hybrid liquid cooling apparatus according to the present invention;
fig. 2 is a schematic top view of the hybrid liquid cooling apparatus according to the present invention.
The figure includes:
the cooling system comprises a cooling box 1, a pressure release valve 11, a circulating pipeline 2, a radiator 21, a power pump 22, a fan 23, a liquid cooling pipeline 3 and a liquid cooling plate 4.
Detailed Description
The core of the invention is to provide a hybrid liquid cooling device which can cool different heating elements in a targeted manner, so that the cooling effect is ensured and the resource waste is avoided.
In order to make those skilled in the art better understand the technical solution of the present invention, the hybrid liquid cooling device of the present invention will be described in detail with reference to the accompanying drawings and the specific embodiments.
The hybrid liquid cooling device comprises a cooling box 1, a circulating pipeline 2, a liquid cooling pipeline 3, a liquid cooling plate 4 and the like, wherein the cooling box 1 is of a closed structure with a cavity inside, the cooling box 1 is used for containing cooling liquid, and the hybrid liquid cooling device is shown in a front view direction schematic diagram in combination with a figure 1, and a figure 2 is a top view direction schematic diagram in the hybrid liquid cooling device provided by the invention; a device to be cooled placed inside the cooling box 1 is immersed in the cooling liquid; the wavy line A in the figure represents the liquid level, and B represents the component to be cooled, typically a main plate; the hollow arrows in the figure indicate the flow direction of the cooling liquid; the whole of the device to be cooled is completely immersed below the liquid level of the cooling liquid, and cooling and heat dissipation are carried out by the cooling liquid in the cooling box 1.
A circulating pipeline 2 is arranged outside the cooling box 1, the circulating pipeline 2 is formed by splicing a plurality of sections, a radiator 21 and a power pump 22 are arranged on the circulating pipeline 2, the power pump 22 is used as a power source, the power pump 22 drives cooling liquid to circularly flow between the circulating pipeline 2 and the cooling box 1, and the flowing direction of the cooling liquid in the circulating pipeline 2 is shown as an arrow; the coolant passes through the radiator 21 to radiate heat to the outside, and when the coolant passes through the radiator 21, the radiator 21 radiates heat to the outside to cool the coolant, and the cooled new coolant flows to the cooling tank 1 repeatedly.
The invention sets up the liquid cooling pipeline 3 in the inside of the cooler bin 1, the coolant in the liquid cooling pipeline 3 flows independently; the liquid cooling pipeline 3 is provided with a liquid cooling plate 4, the liquid cooling plate 4 is made of materials with high heat conductivity, such as copper, aluminum and the like, a cavity is arranged in the liquid cooling plate 4, cooling liquid enters the liquid cooling plate 4, heat exchange is realized in the liquid cooling plate 4, and the cooling liquid absorbs and heats; the cooling liquid passing through the liquid cooling pipeline 3 finally flows into the liquid cooling plate 4, carries out heat exchange in the liquid cooling plate 4 and is discharged into the cooling box 1; different elements are arranged on the device to be cooled, the heating values of the elements are not completely equal, the liquid cooling plate 4 is attached to a high-power-consumption element for heat exchange, such as a CPU (central processing unit), a GPU (graphic processing unit) and the like, the heating values of other low-power-consumption components such as a memory, a hard disk and a wireless module are smaller, and the cooling liquid stored in the cooling box 1 is used for cooling, so that the heat dissipation requirement can be met.
The coolant flow discharged from the circulating pipeline 2 enters the liquid cooling pipeline 3, the coolant does not directly enter the cooling box 1, flows into the liquid cooling plate 4 through the liquid cooling pipeline 3, is discharged after heat exchange inside the liquid cooling plate 4, and then enters the main space of the cooling box 1 after being discharged.
The invention adopts different heat dissipation means aiming at elements with different heat productivity, the element with high heat productivity is attached with the liquid cooling plate 4, the temperature of the cooling liquid which radiates heat through the radiator 21 is reduced, the new low-temperature cooling liquid directly flows to the liquid cooling plate 4, the heat radiated by the element with high power consumption is absorbed in the liquid cooling plate 4, the element with high power consumption and high heat productivity is cooled more fully, the cooling liquid which absorbs the heat of the element with high power consumption flows into the main space of the cooling box 1 again and is contacted with other parts of the device to be cooled, the function of absorbing heat is also realized, but the cooling capacity is weaker than that of the liquid cooling plate 4. The invention can radiate the elements with different heat values differently, and the power consumption is not increased as much as possible under the condition of meeting the radiating requirement of each element. And because the device to be cooled is completely immersed in the cooling liquid, the device to be cooled works in a clean environment, and the influence of impurities such as external dust can be reduced.
On the basis of the scheme, more than two liquid cooling plates 4 are arranged in the cooling box 1, and each liquid cooling plate 4 supplies cooling liquid through the same liquid cooling pipeline 3 or multiple sections of liquid cooling pipelines 3; as shown in fig. 1 and fig. 2, a plurality of high power consumption elements often exist on the device to be cooled, and therefore a plurality of liquid cooling plates 4 need to be arranged, only one interface of the liquid cooling pipeline 3 is connected to the circulation pipeline 2, and the liquid cooling pipeline 3 may be a complete pipeline or formed by splicing a plurality of pipelines. If the pipe is a complete pipe, a plurality of liquid outlet joints are respectively arranged at different positions on the side wall of the liquid cooling pipe 3, each joint is correspondingly connected with one liquid cooling plate 4, and cooling liquid is conveyed to each liquid cooling plate 4; if the cooling system is formed by splicing a plurality of sections of pipelines, a three-way joint is arranged between the sections and is respectively connected with the two sections of pipelines and one liquid cooling plate 4.
The liquid cooling pipes 3 may be flexible pipes or rigid pipes, and these embodiments are all included in the scope of the present invention.
Preferably, the liquid cooling plate 4 of the present invention is internally provided with channels distributed in a curved shape, for example, in an "S" shape or a spiral shape, so as to increase the flowing distance of the cooling liquid, increase the surface area, and enhance the cooling and heat dissipation effects.
Preferably, fins may be further provided on the outer surface of the liquid cooling plate 4, so that the liquid cooling plate 4 can better exchange heat with the cooling liquid inside the cooling box 1.
On the basis of any one of the above technical solutions and the combination thereof, the invention arranges the pressure relief valve 11 for discharging the internal high pressure at the upper part of the cooling box 1, and because a small amount of air exists in the cooling box 1, when the internal air pressure is increased to exceed the safety value, the pressure relief valve 11 opens the discharged air, so that the air pressure in the cooling box 1 is kept within the safety range.
The heat sink 21 is made of aluminum, copper, or graphite to ensure a good heat dissipation effect. Fins are provided on the outside of the heat sink 21 to increase the heat exchange area.
The heat sink flow channel is integrally arranged in the radiator 21 and is butted with the circulating pipeline 2, and the heat sink flow channel and the main body part of the radiator 21 are integrally formed, so that a good radiating effect is ensured when the radiator 21 passes through.
Further, the radiator 21 is provided with a fan 23, the fan 23 blows a cooling air flow to the radiator 21, and the fan 23 is provided opposite to the radiator 21, so that the cooling air flow can be blown to the radiator 21, and the heat dissipating capacity of the radiator 21 can be enhanced by the fan 23.
Referring to fig. 1, the circulation pipe 2 is connected to the cooling tank 1 such that the liquid inlet is located below the liquid outlet, the low-temperature coolant is more concentrated in the lower portion, and the high-temperature coolant is concentrated in the upper portion to discharge the high-temperature coolant in time.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The hybrid liquid cooling device is characterized by comprising a cooling box (1) for containing cooling liquid inside, wherein a device to be cooled placed inside the cooling box (1) is immersed in the cooling liquid;
a circulating pipeline (2) is arranged outside the cooling tank (1), a radiator (21) and a power pump (22) are arranged on the circulating pipeline (2), the power pump (22) drives cooling liquid to circularly flow between the circulating pipeline (2) and the cooling tank (1), and the cooling liquid radiates heat outwards through the radiator (21);
a liquid cooling pipeline (3) is arranged in the cooling box (1), a liquid cooling plate (4) is installed on the liquid cooling pipeline (3), and the liquid cooling plate (4) is attached to a high-power-consumption element for heat exchange;
and the cooling liquid flow discharged from the circulating pipeline (2) enters the liquid cooling pipeline (3) and flows into the liquid cooling plate (4), and is discharged after heat exchange inside the liquid cooling plate (4) and enters the cooling box (1).
2. A hybrid liquid cooling device according to claim 1, wherein more than two liquid cooling plates (4) are provided in said cooling tank (1), each of said liquid cooling plates (4) being supplied with cooling liquid through the same liquid cooling pipe (3) or through a plurality of sections of said liquid cooling pipes (3).
3. A hybrid liquid cooling device according to claim 1, characterized in that the interior of the liquid cooling plate (4) is provided with channels distributed in a curve.
4. A hybrid liquid cooling device as claimed in claim 1, wherein the outer surface of the liquid cooling plate (4) is finned.
5. A hybrid liquid cooling device according to any of claims 1 to 4, characterized in that the upper part of the cooling tank (1) is provided with a relief valve (11) for venting internal high pressure.
6. A hybrid liquid cooling device as set forth in claim 5, characterized in that the heat sink (21) is made of aluminum, copper or graphite.
7. A hybrid liquid cooling device as claimed in claim 5, characterized in that the heat sink flow channel is integrally provided inside the heat spreader (21), said heat sink flow channel being butted to the circulation pipe (2).
8. A hybrid liquid cooling device as recited in claim 5, wherein a fan (23) is provided in association with said heat sink (21), said fan (23) blowing a cooling air flow towards said heat sink (21).
9. A hybrid liquid cooling device according to claim 5, wherein the circulation conduit (2) is connected to the cooling tank (1) at an inlet below the outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110838033.3A CN113703550A (en) | 2021-07-23 | 2021-07-23 | Hybrid liquid cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110838033.3A CN113703550A (en) | 2021-07-23 | 2021-07-23 | Hybrid liquid cooling device |
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| Publication Number | Publication Date |
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| CN113703550A true CN113703550A (en) | 2021-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110838033.3A Pending CN113703550A (en) | 2021-07-23 | 2021-07-23 | Hybrid liquid cooling device |
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| CN (1) | CN113703550A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114156560A (en) * | 2021-11-30 | 2022-03-08 | 中国电力科学研究院有限公司 | Immersed liquid cooling heat dissipation module and heat dissipation method |
| WO2022228164A1 (en) * | 2021-04-28 | 2022-11-03 | 华为云计算技术有限公司 | Cooling apparatus and server comprising same |
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| CN104317374A (en) * | 2014-10-28 | 2015-01-28 | 曙光信息产业(北京)有限公司 | Radiating device and method |
| CN107666024A (en) * | 2016-07-29 | 2018-02-06 | 深圳市沃特玛电池有限公司 | A kind of liquid-cooled heat management system of battery bag |
| WO2018098911A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Partial immersion liquid-cooling system for cooling server |
| CN111221398A (en) * | 2020-01-19 | 2020-06-02 | 苏州浪潮智能科技有限公司 | Water-cooling and air-cooling dual-purpose redundant radiator of traditional server and use method thereof |
| KR102206706B1 (en) * | 2020-05-25 | 2021-01-22 | 이강선 | Centralized cooling system of immersion type |
| CN113075984A (en) * | 2021-04-01 | 2021-07-06 | 山东英信计算机技术有限公司 | Immersed liquid cooling system |
-
2021
- 2021-07-23 CN CN202110838033.3A patent/CN113703550A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104317374A (en) * | 2014-10-28 | 2015-01-28 | 曙光信息产业(北京)有限公司 | Radiating device and method |
| CN107666024A (en) * | 2016-07-29 | 2018-02-06 | 深圳市沃特玛电池有限公司 | A kind of liquid-cooled heat management system of battery bag |
| WO2018098911A1 (en) * | 2016-11-29 | 2018-06-07 | 广东合一新材料研究院有限公司 | Partial immersion liquid-cooling system for cooling server |
| CN111221398A (en) * | 2020-01-19 | 2020-06-02 | 苏州浪潮智能科技有限公司 | Water-cooling and air-cooling dual-purpose redundant radiator of traditional server and use method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022228164A1 (en) * | 2021-04-28 | 2022-11-03 | 华为云计算技术有限公司 | Cooling apparatus and server comprising same |
| CN114156560A (en) * | 2021-11-30 | 2022-03-08 | 中国电力科学研究院有限公司 | Immersed liquid cooling heat dissipation module and heat dissipation method |
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Application publication date: 20211126 |