WO2023169313A1 - Heat dissipation device for electronic apparatus and electronic apparatus - Google Patents

Abstract

Disclosed in embodiments of the present disclosure are a heat dissipation device for an electronic apparatus and an electronic apparatus. The heat dissipation device for the electronic apparatus can comprise: a substrate, a liquid cooling assembly, a surface type cooler, and an air conveying device. The liquid cooling assembly can be used for mounting a first type of elements, a second area of the substrate can be used for mounting a second type of elements, and the air conveying device can convey air to the surface type cooler and the second type of elements at the same time, such that the first type of elements can be cooled in a liquid cooling mode, and the second type of elements can be cooled in an air cooling mode. Moreover, due to the configuration of the surface type cooler, the cooling effect of air cooling can be better. Compared with a full liquid cooling mode, the solution of the present disclosure can reduce the manufacturing cost, and better facilitate the maintenance of the elements of the electronic apparatus; compared with a full air cooling mode, the solution of the present disclosure can better realize cooling of the electronic apparatus.

Description

Cooling devices for electronic equipment and electronic equipment

Cross-references to related applications

This application claims priority to the Chinese patent application submitted on March 11, 2022, with the application number 202210244097.5 and the invention name "Heat dissipation device for electronic equipment and electronic equipment". The full text of the application is incorporated herein by reference. Applying.

Technical field

The present disclosure relates to the technical field of heat dissipation of electronic equipment, and in particular, to a heat dissipation device for electronic equipment and electronic equipment.

Background technique

With the development of science and technology, the Internet, cloud computing, 5G, artificial intelligence, etc. have also been widely used. The industry's demand for the computing power of electronic equipment is getting higher and higher. The power consumption of the main components of electronic equipment (such as chips) is getting higher and higher. is getting higher and higher. Therefore, how to dissipate heat for electronic equipment is a technical problem that needs to be solved urgently in the industry.

In the prior art, air cooling is usually used to solve the heat dissipation problem of electronic equipment. That is, ventilation is used to quickly transfer the heat generated by components of the electronic equipment, thereby realizing heat dissipation of the electronic equipment.

Contents of the invention

This Disclosure is provided to introduce in simplified form the concepts that are later described in detail in the Detailed Description. This disclosure section is not intended to identify key features or essential features of the claimed technical solution, nor is it intended to be used to limit the scope of the claimed technical solution.

Embodiments of the present disclosure provide a heat dissipation device for electronic equipment and electronic equipment, which can not only effectively cool down the electronic equipment, but also save the manufacturing cost of the heat dissipation device of the electronic equipment, so that users can more conveniently realize the cooling of electronic equipment. Cooling of equipment.

In a first aspect, an embodiment of the present disclosure provides a heat dissipation device for electronic equipment, including: a substrate, a liquid cooling component, a surface cooler, and an air delivery device; the above-mentioned liquid cooling component is installed in the first area of the above-mentioned substrate, and the above-mentioned liquid cooling component The cold assembly is used to install the first type of components of the above-mentioned electronic equipment; the second type of components of the above-mentioned electronic equipment is installed in the second area of the above-mentioned substrate; the above-mentioned surface cooler is installed in the third area of the above-mentioned substrate; the above-mentioned air delivery device The above-mentioned second area and the above-mentioned third area transport flowing gas.

In some optional embodiments, the above-mentioned surface cooler includes at least two condensation pipes, the above-mentioned at least two condensation pipes are arranged in an array, and adjacent condensation pipes are connected; the condensation pipes are used to store the above-mentioned preset liquid.

In some optional embodiments, the heat dissipation device includes a liquid delivery device; the liquid delivery device is connected to the surface cooler through a delivery pipe; and/or the liquid delivery device is connected to the liquid cooling component through a delivery pipe; Wherein, the above-mentioned liquid transport device is used to replace the above-mentioned preset liquid in the above-mentioned surface cooler and/or the above-mentioned liquid cooling assembly.

In some optional embodiments, the liquid delivery device includes an output port and a recovery port; the output port is connected to the surface cooler through a delivery pipe; the recovery port is connected to the liquid cooling component through a delivery pipe; the liquid cooling The component is connected to the above-mentioned surface cooler through a delivery pipeline; wherein the above-mentioned output port is used to output the above-mentioned preset liquid, and the above-mentioned recovery port is used to recover the above-mentioned preset liquid.

In some optional embodiments, the liquid delivery device includes an output port and a recovery port; the output port is connected to the liquid cooling component through a delivery pipe; the recovery port is connected to the surface cooler through a delivery pipe; the liquid cooling The component is connected to the above-mentioned surface cooler through a delivery pipe; wherein the above-mentioned output port is used to output the preset liquid, and the above-mentioned The recovery port is used to recover the above-mentioned preset liquid.

In some optional implementations, the above-mentioned second area is provided between the above-mentioned air conveying device and the above-mentioned third area.

In some optional implementations, the above-mentioned third area is provided between the above-mentioned air conveying device and the above-mentioned second area.

In some optional embodiments, the above-mentioned liquid cooling assembly includes at least one condensation plate;

The liquid storage areas of each condensation plate are connected to each other through delivery pipes, where the liquid storage areas are used to accommodate the above-mentioned preset liquid.

In some optional implementations, the number of first-type components installed on each condensation plate is less than a preset threshold.

In a second aspect, an embodiment of the present disclosure provides an electronic device, including the electronic device heat dissipation device described in the first aspect.

Embodiments of the present disclosure provide a heat dissipation device for electronic equipment and electronic equipment. The heat dissipation device for electronic equipment may include: a substrate, a liquid cooling component, a surface cooler, and an air delivery device; and because the liquid cooling component can be used For installing the first type of components, the second area of the base plate can be used for installing the second type of components, and the air delivery device can simultaneously deliver air to the surface cooler and the second type of components. In this way, the first type of components can be cooled by liquid cooling, while the second type of components can be cooled by air cooling. And due to the installation of a surface cooler, the cooling effect of air cooling can be better. Compared with the all-liquid cooling mode, the solution of the present disclosure can reduce manufacturing costs and make it easier to repair components of electronic equipment; and compared with the all-air cooling mode, the solution of the present disclosure can better achieve cooling of electronic equipment.

Description of the drawings

The above and other features, advantages, and aspects of various embodiments of the present disclosure will become more apparent with reference to the following detailed description taken in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numbers refer to the same or similar elements. It should be understood that the drawings are schematic and original and elemental Elements are not necessarily drawn to scale.

Figure 1 is a schematic structural diagram of a heat dissipation device for electronic equipment according to an embodiment of the present disclosure;

Figure 2 is a schematic structural diagram of a heat dissipation device for electronic equipment according to yet another embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a heat dissipation device for electronic equipment according to yet another embodiment of the present disclosure.

Summary of reference signs:
10-heat dissipation device; 100-substrate; 110-first area; 120-second area; 130-third area; 200-liquid cooling component; 300-surface cooler; 400-air supply device.

Detailed ways

Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the disclosure are shown in the drawings, it should be understood that the disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, which rather are provided for A more thorough and complete understanding of this disclosure. It should be understood that the drawings and embodiments of the present disclosure are for illustrative purposes only and are not intended to limit the scope of the present disclosure.

It should be understood that various steps described in the method implementations of the present disclosure may be executed in different orders and/or in parallel. Furthermore, method embodiments may include additional steps and/or omit performance of illustrated steps. The scope of the present disclosure is not limited in this regard.

As used herein, the term "include" and its variations are open-ended, ie, "including but not limited to." The term "based on" means "based at least in part on." The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; and the term "some embodiments" means "at least some embodiments". Relevant definitions of other terms will be given in the description below.

It should be noted that concepts such as “first” and “second” mentioned in this disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units. Or interdependence.

It should be noted that the modifications of "one" and "plurality" mentioned in this disclosure are illustrative and not restrictive. Those skilled in the art will understand that unless the context clearly indicates otherwise, it should be understood as "one or Multiple”.

In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the disclosed product is customarily placed when used. It is only for the convenience of describing the present disclosure and simplifying the description, and is not intended to indicate or imply. The devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation and therefore are not to be construed as limitations on the disclosure.

In the description of the present disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "set", "installation", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this disclosure can be understood on a case-by-case basis.

Please refer to FIG. 1 , which shows a schematic structural diagram of a heat dissipation device 10 for electronic equipment according to the present disclosure. As can be seen from FIG. 1 , the heat dissipation device 10 for electronic equipment may include: a substrate 100 , a liquid cooling component 200 , a surface type cooler 300 and air delivery device 400; the liquid cooling component 200 can be installed in the first area 110 of the substrate 100, and the liquid cooling component 200 can be used to install the first type of components of the electronic equipment; the second type of components of the electronic equipment can be installed on the second area 120 of the base plate; the surface cooler 300 can be installed on the third area 130 of the base plate; the air delivery device 400 can deliver flowing gas to the second area 120 and the third area 130 .

As an example, the first type of components of electronic equipment can be understood as components that generate more heat during operation. Correspondingly, the second type of components of electronic equipment can be understood as components that generate relatively low heat during operation.

As an example, the maximum power of the first type of components of the electronic device may not be lower than the preset power threshold, and the maximum power of the second type of components of the electronic device may be less than the preset power threshold.

That is to say, it can be understood that high-power components (high-heat-generating components) can be installed on the liquid cooling assembly 200, and the high-power components (high-heat-generating components) can be cooled by liquid cooling, while low-power components (low heat-generating components) can be cooled by liquid cooling. It can be installed in the second area 120 of the substrate 100, and can cool down the low-power components (low heat-generating components) through air cooling.

As an example, the preset power threshold can be set according to the actual situation. The preset power threshold is not limited here and only needs to be set reasonably according to the actual situation.

As an example, the liquid cooling assembly 200 can be understood as a liquid cooling plate. The first type of components is installed on the liquid cooling plate. The inside of the liquid cooling plate can be filled with liquid. Then the liquid in the liquid cooling plate can be used to place the first type of components on the liquid cooling plate. The heat generated during the working process is transferred out, thereby cooling the first type of components.

As an example, the surface cooler 300 can be understood as a temperature reducer, that is, after the gas blows through the surface cooler 300, the temperature of the gas can be reduced.

As an example, the center of the second area 120, the center of the third area 130 and the center of the air delivery device 400 may be on the same straight line. In this way, the air supply device 400 can supply air to the second area 120 and the third area 130 at the same time. If the second area 120 is between the air supply device 400 and the third area 130, the flowing gas blown out by the air supply device 400 will first pass through the second type of components in the second area 120, and then the temperature of the flowing gas will increase. , then, the flowing gas with a higher temperature will pass through the surface cooler 300 installed in the third area 130, and the temperature of the flowing gas will drop again. In this way, the temperature of the environment will not increase with the operation of the second type of component. Correspondingly, if the third area 130 is between the air conveying device 400 and the second area 120, then The flowing gas blown out by the air delivery device 400 will first pass through the surface cooler 300 in the third area 130, and then the temperature of the flowing gas will be reduced. After that, the flowing gas with reduced temperature will pass through the second cooler 300 installed in the second area 120. In this way, the temperature of the gas flowing through the second type of element can be lowered, thereby achieving a better cooling effect on the second type of element.

It should be noted that the specific areas, shapes and positions of the first region 110, the second region 120 and the third region 130 on the substrate can be limited according to the actual situation, and the first region 110, the second region 130 are not defined here. 120 and the third region 130 are defined by their area, shape, and location on the substrate.

As an example, the air conveying device 400 can be understood as an electric fan; of course, the specific type of the air conveying device 400 can be limited according to the actual situation. The specific type of the air conveying device 400 is not limited here, and only needs to be reasonably determined according to the actual situation. Just set it.

In some related technologies, when cooling electronic equipment, a full liquid cooling mode may be used for cooling. In this way, when some electronic components of the electronic equipment are broken, repairs are extremely inconvenient; moreover, due to the electronic components It needs to be immersed in liquid, so the requirements for liquid are relatively high; this also increases the cost. In other related technologies, fans are used to blow the electronic equipment, thereby cooling the electronic equipment. However, the cooling effect on the electronic equipment is not obvious.

It can be seen that the heat dissipation device of the electronic equipment of the present disclosure can include: a substrate, a liquid cooling component, a surface cooler, and an air delivery device; and because the liquid cooling component can be used to install the first type of components, the second type of the substrate The area can be used to install the second type of components, and the air delivery device can deliver air to both the surface cooler and the second type of components. In this way, the first type of components can be cooled by liquid cooling, while the second type of components can be cooled by air cooling. And due to the installation of a surface cooler, the cooling effect of air cooling can be better. Compared with the full liquid cooling mode, the solution of the present disclosure can reduce manufacturing costs and make it easier to repair components of electronic equipment; and compared with the full air cooling mode, the solution of the present disclosure can reduce the cost of electronic equipment. Be prepared to achieve better cooling.

In some embodiments, the surface cooler may include at least two condensation pipes, and adjacent condensation pipes are connected; the condensation pipes may be used to store preset liquids.

As an example, at least two condensation pipes are provided to increase the contact area between the surface cooler and the gas, so that the wind blown from the air delivery device can be cooled more efficiently. In this way, not only the surface cooler The cooling effect is better, so electronic equipment can be better dissipated.

As an example, the preset liquid may be deionized pure water. Since the preset liquid is stored in the condenser tube, the preset liquid does not need to be an insulating liquid. In this way, the manufacturing cost of the heat dissipation device of the electronic device can be saved. Of course, in the specific implementation, the specific form of the preset liquid can be set according to the actual situation.

As an example, the specific number and size of the condensation pipes can be reasonably set according to the actual situation. The specific number and size of the condensation pipes are not limited here.

In some embodiments, the condensation ducts can be arranged in an array, and the condensation ducts can be perpendicular to the air delivery direction of the air delivery device. In this way, the contact area between the gas and the surface cooler can be further increased, so that the gas passing through the surface cooler can be Gas can be cooled down better.

In some embodiments, the heat dissipation device of the electronic device may further include a liquid delivery device, and the liquid delivery device may be connected to the surface cooler through a delivery pipe; and/or, the liquid delivery device may be connected to the liquid cooling component through a delivery pipe.

Here, the liquid delivery device is used to replace the preset liquid in the surface cooler and/or liquid cooling assembly.

As an example, the liquid cooling assembly may include a liquid containing area, so that the heat generated by the first type of components installed on the liquid cooling assembly can be transferred to the preset liquid in the liquid containing area, so that the third type of component can be controlled. A type of component is cooled.

As an example, the liquid delivery device may be connected to the surface cooler via a delivery pipe; And/or, the liquid delivery device can be connected with the liquid cooling component through a delivery pipe, which can be understood as: the liquid delivery device is connected with the condensation tube of the surface cooler and/or the liquid containing area of the cold plate assembly. In this way, the preset liquid in the condensation tube and/or the liquid containing area can be replaced in time, so that the temperature of the preset liquid in the condensing tube and/or the liquid containing area will not keep rising as the components work; In this way, the heat dissipation effect of the heat dissipation device can be better.

In some embodiments, the liquid delivery device may also include an output port and a recovery port; the output port is connected to the surface cooler through a delivery pipeline; the recovery port is connected to the liquid cooling component through the delivery pipeline; the liquid cooling component and the surface cooler are connected through The transmission pipeline is connected.

Here, the output port can be used to output the preset liquid, and the recovery port can be used to recover the preset liquid.

As an example, the liquid cooling assembly and the condensation pipe of the surface cooler are connected, so that the preset liquid in the surface cooler and the liquid cooling assembly can be replaced by using an output port and a recovery port.

In some embodiments, the liquid delivery device may include an output port and a recovery port; the output port is connected to the liquid cooling component through a delivery pipeline; the recovery port is connected to the surface cooler through the delivery pipeline; the liquid cooling component and the surface cooler are connected through delivery Pipeline connection.

Here, the output port can be used to output the preset liquid, and the recovery port can be used to recover the preset liquid.

As an example, the liquid delivery device may include a water delivery motor and a liquid storage tank; the water delivery motor may deliver the liquid in the liquid storage tank through the output port of the water delivery motor, and the liquid storage tank may include a receiving port, so that Liquid circulation can be achieved. That is, the output port of the water delivery motor can be understood as the output port of the liquid delivery device, and the receiving port of the liquid storage tank can be understood as the recovery port of the liquid delivery device. In this way, the liquid in the liquid storage tank can be transported to the surface cooler and liquid cooling assembly through the output port of the water delivery motor, and then the liquid in the liquid cooling assembly and surface cooler will flow back to the liquid storage tank .

It can be seen that the liquid delivery device can input the preset liquid into the surface cooler through the output port, and the temperature of the preset liquid in the surface cooler is usually not high; therefore, the preset liquid in the surface cooler can flow into As for the liquid cooling component, at this time, the first type of components installed on the liquid cooling component can also be cooled. The output port is used to first input the preset liquid into the liquid cooling component. At this time, the temperature of the preset liquid input into the liquid cooling component decreases, so that the first type of components installed on the liquid cooling component can be quickly Cooling; and because the preset liquid output from the liquid cooling component is input to the surface cooler, and the surface cooler has multiple condenser tubes, therefore, after the preset liquid is input to the surface cooler, it can be Cooling is achieved in the gas surface cooler, so that the gas can also be cooled. It can be seen that whether the liquid delivery device can be connected to a surface cooler or a liquid cooling component through an output port, electronic equipment can be cooled. Therefore, reasonable selection can be made in combination with the actual situation in the specific implementation.

In some embodiments, the second area may be disposed between the air delivery device and the third area.

As an example, since the second area is provided between the air conveying device and the third area, the wind passes through the second area and then enters the environment through the third area. That is, when the gas blown from the air conveying device passes through the second area After the gas continues to pass through the third area, the temperature of the gas will decrease; thus, the heat dissipation device will have less impact on the ambient temperature during the process of dissipating heat from the electronic equipment.

In some embodiments, the third area may be disposed between the air delivery device and the second area.

As an example, since the third area is provided between the air supply device and the second area, the wind passes through the third area and then enters the environment through the second area; the gas blown from the air supply device first passes through the third area. Cooling, after passing through the second type of components installed in the second area; in this way, the cooling effect on the second type of components can be better.

For ease of understanding, the description can be made in conjunction with Figures 2 and 3. Figure 2 is a schematic diagram of the second area 120 being arranged between the air supply device and the third area 130. Figure 3 is a schematic diagram of the third area 130 being arranged. A schematic diagram placed between the air supply device and the second area 120. It should be noted that in Figures 2 and 3, the area indicated by the second area 120 can be understood as the area in the wire frame 120 excluding the liquid cooling assembly 200. other areas.

As can be seen from Figure 2, the second area 120 can be disposed between the air conveying device and the third area 130. In this way, the wind output by the air conveying device can be transported by the third area 130 after passing through the second area 120. Cooling is performed, so that the gas passing through the third area 130 will be cooled before entering the environment, thus preventing the ambient temperature from rising during use of the heat dissipation device. It can be seen from Figure 3 that the temperature of the wind output by the air supply device will be reduced after passing through the third area 130. After that, when the temperature of the wind is reduced when passing through the second area 120, the second area can be installed. 120 class 1 components cool down quickly.

It can also be seen from FIG. 2 and FIG. 3 that the surface cooler 300 may include multiple condenser tubes 310 , and the liquid cooling assembly 200 may also include multiple liquid cooling plates 210 .

In some embodiments, the liquid cooling assembly may include at least one condensation plate; the liquid storage areas of each liquid cooling plate are connected to each other through delivery pipes.

Here, the liquid reservoir is used to hold a preset liquid.

As an example, since the transport channels between the liquid storage areas of each liquid cooling plate are interconnected, it is easy to replace the preset liquid in the liquid storage area of each liquid cooling plate.

As an example, at least one condensation plate is provided, so that the first type of components can be distributed on different condensation plates. In this way, it is easy to cool down the first type of components; it is also possible to improve the cooling of the first type of components. cooling efficiency.

In some embodiments, the number of first-type components installed on each condensation plate is less than a preset threshold.

As an example, the number of first-type components installed on each condensation plate is less than the preset threshold. In this way, only a small number of first-class components can be installed on each condensation plate. In this way, the condensation plate can be set to Smaller, so that the liquid storage in the condensation plate can be efficiently realized The liquid in the liquid storage area is replaced, which improves the replacement efficiency of the liquid in the liquid storage area, so that the heat generated by the first type of components during the working process can be transferred out faster, so that the first type of components can The heat dissipation effect is better.

Furthermore, since the first type components of the electronic equipment are dispersedly installed on each condensation plate, it can also be more convenient for workers to inspect the first type components of the electronic equipment; for example, during the maintenance process, since one condensation plate only Installing a small number of first-class components makes it easier for workers to load and unload first-class components, thereby speeding up the maintenance efficiency of electronic equipment.

In some implementations, the present disclosure also provides an electronic device, which may include the above-mentioned heat dissipation device for electronic equipment; and the first type of components of the electronic device may be installed on the liquid cooling component of the heat dissipation device. The second type of component is installed in the second area of the electronic device.

In this way, the electronic equipment can be prevented from being overheated during operation, thereby extending the service life of the electronic equipment. Since the electronic equipment can be effectively cooled, the temperature of the electronic equipment will not be too high. High, which can save the energy consumption of electronic equipment to a certain extent.

The above description is only a description of the preferred embodiments of the present disclosure and the technical principles applied. Those skilled in the art should understand that the disclosure scope involved in the present disclosure is not limited to technical solutions composed of specific combinations of the above technical features, but should also cover solutions composed of the above technical features or without departing from the above disclosed concept. Other technical solutions formed by any combination of equivalent features. For example, a technical solution is formed by replacing the above features with technical features with similar functions disclosed in this disclosure (but not limited to).

Furthermore, although operations are depicted in a specific order, this should not be understood as requiring that these operations be performed in the specific order shown or performed in a sequential order. Under certain circumstances, multitasking and parallel processing may be advantageous. Likewise, although several specific implementation details are included in the above discussion, these should not be construed as limiting the scope of the present disclosure. limits. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination.

Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are merely example forms of implementing the claims.

Claims (10)

1. A heat dissipation device for electronic equipment, characterized in that it includes: a substrate, a liquid cooling component, a surface cooler, and an air delivery device;

   The liquid cooling component is installed on the first area of the substrate, and the liquid cooling component is used to install the first type of components of the electronic device;

   The second type of component of the electronic device is mounted on the second area of the substrate;

   The surface cooler is installed in the third area of the base plate;

   The air delivery device delivers flowing gas to the second area and the third area.
2. The heat dissipation device according to claim 1, wherein the heat dissipation device includes a liquid delivery device;

   The liquid delivery device is connected to the surface cooler through a delivery pipeline; and/or the liquid delivery device is connected to the liquid cooling component through a delivery pipeline;

   Wherein, the liquid delivery device is used to replace the preset liquid in the surface cooler and/or the liquid cooling assembly.
3. The heat dissipation device according to claim 2, wherein the liquid delivery device includes an output port and a recovery port; the output port is connected to the surface cooler through a delivery pipe; and the recovery port is connected to the surface cooler through a delivery pipe. The liquid cooling component is connected; the liquid cooling component and the surface cooler are connected through a delivery pipe;

   Wherein, the output port is used to output the preset liquid, and the recovery port is used to recover the preset liquid.
4. The heat dissipation device according to claim 2, wherein the liquid delivery device includes an output port and a recovery port; the output port and the liquid cooling component pass through a delivery tube. The recovery port is connected to the surface cooler through a delivery pipe; the liquid cooling component and the surface cooler are connected to each other through a delivery pipe;

   Wherein, the output port is used to output the preset liquid, and the recovery port is used to recover the preset liquid.
5. The heat dissipation device according to claim 1, wherein the second area is provided between the air delivery device and the third area.
6. The heat dissipation device according to claim 1, characterized in that the third area is provided between the air delivery device and the second area.
7. The heat dissipation device according to claim 1, wherein the liquid cooling assembly includes at least one condensation plate;

   The liquid storage areas of each condensation plate are connected to each other through delivery pipes, wherein the liquid storage areas are used to accommodate the preset liquid.
8. The heat dissipation device according to claim 7, wherein the number of first-type components installed on each condensation plate is less than a preset threshold.
9. The heat dissipation device according to claim 1, wherein the surface cooler includes at least two condensation pipes, adjacent condensation pipes are connected; the condensation pipes are used to store preset liquid.
10. An electronic device, characterized by comprising the heat dissipation device according to any one of claims 1-9.