CN111880625B - Liquid cooling heat dissipation device capable of dissipating heat from multiple heat sources - Google Patents
Liquid cooling heat dissipation device capable of dissipating heat from multiple heat sources Download PDFInfo
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- CN111880625B CN111880625B CN202010668407.7A CN202010668407A CN111880625B CN 111880625 B CN111880625 B CN 111880625B CN 202010668407 A CN202010668407 A CN 202010668407A CN 111880625 B CN111880625 B CN 111880625B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention relates to a liquid cooling heat dissipating device capable of dissipating heat by multiple heat sources, which comprises a first water tank, a second water tank, a water cooling row assembly, a heat absorbing assembly and a water pump, wherein the first water tank is provided with a plurality of first water storage tanks which are adjacent to each other but are not communicated with each other; the second water tank is arranged at intervals with the first water tank and is provided with a plurality of second water storage tanks, and the second water storage tanks are mutually adjacent but not communicated; each water cooling row component is arranged between the first water tank and the second water tank in parallel, and the water cooling row components are communicated with the first water storage tank and the second water storage tank; the heat absorbing component is communicated with the second water storage tank; the water pump is installed in each water storage tank. Therefore, the device can be simultaneously provided for different heat sources, and has compact structure and small occupied space.
Description
Technical Field
The present invention relates to a liquid cooling device, and more particularly to a liquid cooling device with multiple heat sources.
Background
With the continuous increase of the operation speed of electronic devices, the generated heat is also higher and higher, and in order to effectively solve the problem of high heat productivity, in the industry, besides developing heat pipes or temperature equalizing plates with high heat conduction and heat dissipation efficiency, technicians have also designed and studied in the direction of water cooling heat dissipation devices.
The existing water cooling device mainly comprises a water cooling head, a water pump, a water tank, a water cooling row and a plurality of water delivery hoses, wherein the water cooling head, the water pump and the water cooling row are communicated with each other through the water delivery hoses and joints. In order to solve the heat dissipation requirement of the server device, the above-mentioned water cooling devices are arranged, stacked and combined to form a liquid cooling device for multi-heat source heat dissipation.
However, the existing liquid cooling heat dissipation device capable of dissipating heat from multiple heat sources can provide various heat dissipation simultaneously, but the combined liquid cooling heat dissipation device has large volume, and the whole device becomes more huge when being applied to a server device; in addition, the joints are more and exposed, so that the problem of liquid leakage exists.
That is, some heat dissipation devices exist in the prior art to dissipate heat of different heat sources. For example, in the patent application No. 201910744755.5 filed before this company, the invention of the liquid cooling heat sink is that a plurality of groups of heat absorbing structures are installed between the first water tank and the second water tank to realize heat dissipation to a plurality of heat sources, but this technical solution has a defect that the heat dissipation temperature cannot be kept uniform for different heat sources because the heat absorbing effects of different heat absorbing structures are different. For example, in the patent application No. 201810462540.X entitled "a liquid cooling heat dissipating system and a water tank thereof" filed earlier by the company, heat dissipation to multiple heat sources is also achieved by connecting a plurality of heat dissipating devices to the water tank through pipes, and similarly, the heat dissipating temperature cannot be kept uniform for different heat sources due to different heat absorbing effects of different heat absorbing structures in this technical scheme. For another example, in the patent application No. CN201110065367.8 entitled "a high-power loop heat pipe radiator and a method for manufacturing the same", in order to solve the problem of heat dissipation of multiple heat sources, a group of loop heat pipe radiators including multiple independent condensers are used to provide heat dissipation for multiple heat sources, and because each condenser is independently arranged, the radiator can provide various different heat dissipation for multiple heat sources at the same time, and can also achieve the effect of keeping the heat dissipation requirements consistent for different heat sources, but the combined heat sources have large volume, and the whole equipment becomes more huge when applied to server equipment.
In view of the above, the present inventors have made intensive studies and have made an effort to solve the above-mentioned problems by combining the application of the theories, aiming at the above-mentioned drawbacks of the prior art.
Disclosure of Invention
One objective of the present invention is to provide a liquid cooling heat dissipation device for dissipating heat from multiple heat sources, which can be used for different heat sources simultaneously, and which has a compact structure and occupies less space.
In order to achieve the above-mentioned objective, the present invention provides a liquid cooling heat dissipating device for dissipating heat from multiple heat sources, comprising a first water tank, a second water tank, a plurality of water cooling units, a plurality of heat absorbing units and a plurality of water pumps, wherein the first water tank is provided with a plurality of first water storage tanks, and each first water storage tank is adjacent to each other but not communicated with each other; the second water tank is arranged at intervals with the first water tank, and is provided with a plurality of second water storage tanks, and each second water storage tank is adjacent to each other but not communicated with each other; each water-cooling row component is arranged between the first water tank and the second water tank in parallel, and each water-cooling row component is communicated with one first water storage tank and one second water storage tank; each heat absorbing component is communicated with a second water storage tank; the water pumps are respectively arranged in the first water storage tanks and the second water storage tanks.
The technical scheme provided by the invention is as follows:
a liquid cooling heat sink for heat dissipation from multiple heat sources, comprising: a first water tank provided with a plurality of first water storage tanks, wherein each first water storage tank is adjacent to each other but not communicated with each other; the second water tank is arranged at intervals with the first water tank, and is provided with a plurality of second water storage tanks, and each second water storage tank is adjacent to each other but is not communicated with each other; the water cooling row assemblies are arranged between the first water tank and the second water tank in parallel, and each water cooling row assembly is communicated with one first water storage tank and one second water storage tank; a plurality of heat absorbing components, each of which is communicated with a second water storage tank; and a plurality of water pumps respectively installed in the first water storage tanks and the second water storage tanks.
Further preferably, the second water tank includes a second tank body, each second water storage tank is formed inside the second tank body, a cross-shaped partition board is arranged in each second water storage tank, and a water pump accommodating groove for fixedly installing the water pump is arranged in each partition board.
Further preferably, the second water tank further comprises a cover plate, the cover plate corresponds to the second tank body and covers, and an opening for the water pump to pass through is arranged at the position of the cover plate corresponding to the water pump.
Further preferably, a baffle is disposed in each second water storage tank, the baffle is L-shaped, one end of the baffle is embedded in the cover plate, and the other end of the baffle is clamped by the water pump and the baffle.
Further preferably, a plurality of pipe connecting grooves communicated with the second water storage grooves are formed in the bottom surface of the second box body, each water cooling row assembly comprises a plurality of connecting pipes and a plurality of cooling fins sleeved on the connecting pipes, and one ends of the connecting pipes are respectively communicated with the pipe connecting grooves.
Further preferably, a water inlet and a water outlet are respectively formed at positions of the cover plate corresponding to the second water storage tanks, each heat absorbing component comprises a first water cooling head, a second water cooling head and a water delivery pipe group, each water delivery pipe group comprises a first water delivery pipe, a second water delivery pipe and a third water delivery pipe, two ends of the first water delivery pipe are respectively communicated with the water outlet and the first water cooling head, two ends of the second water delivery pipe are respectively communicated with the first water cooling head and the second water cooling head, and two ends of the third water delivery pipe are respectively communicated with the second water cooling head and the water inlet.
Further preferably, a water supplementing hole is respectively arranged at the position of the cover plate corresponding to each second water storage tank.
Further preferably, the first water tank includes a first tank body, each first water storage tank is disposed in the first tank body, a cross-shaped partition board is disposed in each first water storage tank, and a water pump accommodating groove is disposed in the partition board, and the water pump accommodating groove is used for fixedly mounting the water pump.
Further preferably, the first water tank further includes a cover plate, the cover plate covers the first tank body, and an opening for the water pump to pass through is provided at a position of the cover plate corresponding to the water pump.
Still preferably, the bottom surface of the first tank body is provided with a plurality of first pipe connecting grooves communicated with the first water storage grooves, the second water tank comprises a second tank body, the bottom surface of the second tank body is provided with a plurality of second pipe connecting grooves communicated with the second water storage grooves, each water cooling row assembly comprises a plurality of connecting pipes and a plurality of cooling fins sleeved on each connecting pipe, and two ends of each connecting pipe are respectively communicated with each first pipe connecting groove and each second pipe connecting groove.
Further preferably, each heat absorbing component comprises a first water cooling head, a second water cooling head and a water delivery pipe group, wherein the water delivery pipe group comprises a first water delivery pipe, a second water delivery pipe, a third water delivery pipe and a fourth water delivery pipe, two ends of the first water delivery pipe and the second water delivery pipe are respectively communicated with the second water tank and the first water cooling head, and two ends of the third water delivery pipe and the fourth water delivery pipe are respectively communicated with the first water tank and the second water cooling head.
Further preferably, each heat absorbing component comprises a first water cooling head, a second water cooling head and a water delivery pipe group, the water delivery pipe group comprises a first water delivery pipe, a second water delivery pipe and a third water delivery pipe, two ends of the first water delivery pipe are respectively communicated with the second water tank and the first water cooling head, two ends of the second water delivery pipe are respectively communicated with the first water cooling head and the second water cooling head, and two ends of the third water delivery pipe are respectively communicated with the second water cooling head and the first water tank.
The invention has the advantages that the independent water cooling row components and the independent heat absorbing components are not communicated to form the independent internal circulation system, so that heat accumulation can be reduced, and uniform heat dissipation can be realized, thereby being beneficial to the consistency of the temperature points of the heat sources and ensuring that the temperature points are within an allowable range. Structurally, the water storage tanks forming the independent internal circulation systems are connected into a whole, so that the number of joints and sealing ports can be reduced, and the risk of leakage can be reduced. The technical scheme has compact structure, space saving and easy assembly, thereby reducing the use cost of manpower.
Drawings
The above features, technical features, advantages and implementation manners of a liquid cooling heat dissipation device for multi-heat source heat dissipation will be further described below in a clear and understandable manner with reference to the accompanying drawings.
FIG. 1 is a schematic view showing the assembly of a servo device according to the present invention.
FIG. 2 is a schematic diagram showing the assembly of the liquid cooling heat sink according to the present invention.
FIG. 3 is an exploded perspective view of the first water tank and each water pump of the present invention.
FIG. 4 is a perspective view of the first tank and pumps of the present invention.
FIG. 5 is an exploded perspective view of the second water tank and each water pump of the present invention.
FIG. 6 is a perspective view of a second tank and pumps of the present invention.
FIG. 7 is another view of the liquid cooling heat sink of the present invention.
Fig. 8 is a bottom view of the liquid cooling heat sink of the present invention.
FIG. 9 is a top view of a liquid-cooled heat sink according to the present invention.
FIG. 10 is a sectional view of a liquid-cooled heat sink assembly according to the present invention.
FIG. 11 is a sectional view of a first tank and water pumps of the present invention.
FIG. 12 is a sectional view of a second tank and water pumps of the present invention.
FIG. 13 is a schematic diagram showing a combination of the liquid-cooled heat sink according to another embodiment of the present invention.
FIG. 14 is a combined external view of a liquid-cooled heat sink according to another embodiment of the present invention.
FIG. 15 is a combined external view of a liquid-cooled heat sink according to another embodiment of the present invention.
Reference numerals illustrate: 10. the water pump comprises a first water tank, 11, a first tank, 111, a first water storage tank, 112, a partition plate, 113, a water pump containing tank, 12, a cover plate, 121, an opening, 114, a first pipe joint tank, 20, a second water tank, 21, a second tank, 211, a second water storage tank, 212, a partition plate, 213, a water pump containing tank, 214, a second pipe joint tank, 215, a water supplementing hole, 22, a cover plate, 221, an opening, 222, a water inlet hole, 223, a water outlet hole, 224, a water supplementing hole, 23, a baffle plate, 30, a water cooling row assembly, 31, a connecting pipe, 32, a cooling fin, 40, a heat absorbing assembly, 41, a first water cooling head, 42, a second water cooling head, 43A, 43B, 43C, a water delivery pipe group, 431, a first water delivery pipe, 432, a second water delivery pipe, 433, a third water delivery pipe 434, a fourth water delivery pipe, 50, a water pump, 60, a heat dissipating fan, 8, a servo device, 81, a casing, 82 and a host plate.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system configurations, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
It should be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
For the sake of simplicity of the drawing, the parts relevant to the present invention are shown only schematically in the figures, which do not represent the actual structure thereof as a product. Additionally, in order to simplify the drawing for ease of understanding, components having the same structure or function in some of the drawings are shown schematically with only one of them, or only one of them is labeled. Herein, "a" means not only "only this one" but also "more than one" case.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
The detailed description and technical content of the present invention are described below with reference to the drawings, which are, however, provided for reference and illustration only and are not intended to limit the present invention.
Referring to fig. 1 to 12, the present invention provides a liquid cooling heat dissipating device for dissipating heat from multiple heat sources, which mainly includes a first water tank 10, a second water tank 20, a plurality of water cooling units 30, a plurality of heat absorbing units 40 and a plurality of water pumps 50.
Referring to fig. 1 and 2, the liquid cooling heat dissipation device for multi-heat source heat dissipation of the present invention can be applied to a server device 8, the server device 8 has a chassis 81 and a motherboard 82 disposed in the chassis 81, a plurality of heat sources (not shown) are disposed on the motherboard 82, and each heat absorption component 40 of the present invention is in thermal contact with each heat source, and conducts heat and dissipates heat.
Referring to fig. 3 and 4, the first water tank 10 is a rectangular body, but not limited to this shape, and mainly includes a first tank 11 and a cover plate 12, wherein a plurality of first water storage tanks 111 are disposed in the first tank 11, and the first water storage tanks 111 are adjacent to each other but not communicated with each other. In addition, a cross-shaped partition plate 112 is disposed in the first water storage tank 111, and a water pump container 113 is disposed in the partition plate 112. A plurality of first pipe joint grooves 114 communicating with the first water storage groove 111 are provided on the bottom surface of the first casing 11. Wherein each water pump vessel 113 is provided for a water pump 50.
The cover plate 12 is covered corresponding to the first box 11, and is provided with an opening 121 through which the water supply pump 50 passes at a position corresponding to the water pump 50.
Referring to fig. 5 and 6, the second water tank 20 is also substantially rectangular, but not limited to this shape, and mainly includes a second tank 21 and a cover 22, wherein a plurality of second water storage tanks 211 are disposed inside the second tank 21, and each second water storage tank 211 is adjacent to each other but not communicated with each other. In addition, a cross-shaped partition plate 212 is disposed in the second water storage tank 211, and a water pump container 213 is disposed in the partition plate 212. A plurality of second pipe joint grooves 214 communicating with the second water storage groove 211 are provided on the bottom surface of the second casing 21. Wherein each water pump vessel 213 is configured with a water pump 50. Preferably, the first water tank 10 and the second water tank 20 are disposed in parallel and at a parallel interval from each other.
The cover 22 is covered corresponding to the second case 21, and has an opening 221 corresponding to the water pump 50, through which the water pump 50 is inserted. In addition, a water inlet 222 and a water outlet 223 are respectively formed at the positions of the cover plate 22 corresponding to the second water storage tanks 211. A water supply hole 224 is provided at a lower side of the cover plate 22 corresponding to each second water storage tank 211.
Further, a baffle plate 23 is disposed in each second water storage tank 211, and the baffle plate 23 is generally L-shaped, one end of the baffle plate 23 is embedded on the cover plate 22, and the other end is clamped by the water pump 50 and the partition plate 212 (as shown in fig. 10), so as to limit the flow direction of the internal fluid, and preferably, the water inlet hole 222 and the water outlet hole 223 can be formed at intervals defined by the cover plate 22.
Referring to fig. 7 to 12, each water-cooled row assembly 30 is disposed between the first water tank 10 and the second water tank 20 in parallel, each water-cooled row assembly 30 mainly includes a plurality of connecting pipes 31 and a plurality of cooling fins 32 (see fig. 10), two ends of each connecting pipe 31 are respectively connected to each of the first pipe connecting grooves 114 of the first water storage tank 111 and each of the second pipe connecting grooves 214 of the second water storage tank 211, and each of the cooling fins 32 is sequentially sleeved on each of the connecting pipes 31.
Each heat absorbing component 40 is respectively connected to each second water storage tank 211, each heat absorbing component 40 mainly comprises a first water cooling head 41, a second water cooling head 42 and a water delivery pipe group 43, the water delivery pipe group 43 mainly comprises a first water delivery pipe 431, a second water delivery pipe 432 and a third water delivery pipe 433, wherein two ends of the first water delivery pipe 431 are respectively connected to the water outlet 223 and the first water cooling head 41, two ends of the second water delivery pipe 432 are respectively connected to the first water cooling head 41 and the second water cooling head 42, and two ends of the third water delivery pipe 433 are respectively connected to the second water cooling head 42 and the water inlet 222.
The water pumps 50 are respectively installed in the first water storage tank 111 and the second water storage tank 211.
Referring to fig. 13 to 15, another embodiment of a liquid cooling device for multi-heat source heat dissipation according to the present invention is shown, wherein fig. 13 is a schematic diagram showing a water supplementing hole 215 formed at a side of a second tank 21 of a second water tank 20 corresponding to each second water storage tank 211. Each heat absorbing assembly 40 mainly comprises a first water cooling head 41, a second water cooling head 42 and a water delivery pipe set 43A, wherein the water delivery pipe set 43A mainly comprises a first water delivery pipe 431, a second water delivery pipe 432, a third water delivery pipe 433 and a fourth water delivery pipe 434, two ends of the first water delivery pipe 431 are respectively communicated with the second water tank 20 and the first water cooling head 41, and two ends of the second water delivery pipe 432 are respectively communicated with the first water cooling head 41 and the second water tank 20. Two ends of the third water pipe 433 are respectively communicated with the first water tank 10 and the second water cooling head 42, and two ends of the fourth water pipe 434 are respectively communicated with the second water cooling head 42 and the first water tank 10.
Each heat absorbing assembly 40 in fig. 14 mainly includes a first water cooling head 41, a second water cooling head 42, and a water delivery tube set 43B, where the water delivery tube set 43B mainly includes a first water delivery tube 431, a second water delivery tube 432, and a third water delivery tube 433, two ends of the first water delivery tube 431 are respectively connected to the second water tank 20 and the first water cooling head 41, two ends of the second water delivery tube 432 are respectively connected to the first water cooling head 41 and the second water cooling head 42, and two ends of the third water delivery tube 433 are respectively connected to the second water cooling head 42 and the first water tank 10.
In fig. 15, the first water tank 10, the second water tank 20, the water-cooling-row assembly 30, the water pump 50 and the cooling fan 60 are combined into a main structure, and then are arranged in an upright manner, each heat-absorbing assembly 40 mainly comprises a first water-cooling head 41, a second water-cooling head 42 and a water-conveying-pipe set 43C, wherein the water-conveying-pipe set 43C mainly comprises a first water conveying pipe 431, a second water conveying pipe 432 and a third water conveying pipe 433, two ends of the first water conveying pipe 431 are respectively communicated with the second water tank 20 and the first water-cooling head 41, two ends of the second water conveying pipe 432 are respectively communicated with the first water-cooling head 41 and the second water-cooling head 42, and two ends of the third water conveying pipe 433 are respectively communicated with the second water-cooling head 42 and the second water tank 20. Similarly, one ends of the first water pipe 431 and the third water pipe 433 may also be connected to the first water tank 10.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
In summary, the liquid cooling heat dissipation device for multi-heat source heat dissipation of the present invention can achieve the expected purpose, and solve the existing problems.
Claims (10)
1. A liquid cooling heat sink for heat dissipation from multiple heat sources, comprising:
a first water tank provided with a plurality of first water storage tanks, wherein each first water storage tank is adjacent to each other but not communicated with each other;
the second water tank is arranged at intervals with the first water tank, and is provided with a plurality of second water storage tanks, and each second water storage tank is adjacent to each other but is not communicated with each other;
the water cooling row assemblies are arranged between the first water tank and the second water tank in parallel, and each water cooling row assembly is communicated with one first water storage tank and one second water storage tank;
a plurality of heat absorbing components, each of which is communicated with a second water storage tank; and
a plurality of water pumps respectively installed in the first water storage tanks and the second water storage tanks;
the second water tank comprises a second tank body, each second water storage tank is formed in the second tank body, a cross-shaped partition plate is arranged in each second water storage tank, and a water pump accommodating groove for fixedly installing the water pump is formed in each partition plate; the second water tank further comprises a cover plate, the cover plate corresponds to the second tank body in a covering way, a baffle plate is arranged in each second water storage tank and is L-shaped, one end of the baffle plate is embedded in the cover plate, and the other end of the baffle plate is clamped by the water pump and the baffle plate;
the cover plate is provided with a water inlet and a water outlet at positions corresponding to the second water storage tanks respectively, the baffle is used for limiting the flowing direction of internal fluid, and the water inlet and the water outlet are arranged at two sides of the baffle.
2. The liquid cooling heat dissipating device as set forth in claim 1, wherein an opening is provided at a position of the cover plate corresponding to the water pump for the water pump to penetrate.
3. The liquid cooling heat dissipating device for dissipating heat from multiple heat sources as set forth in claim 1, wherein a plurality of pipe connecting grooves are disposed on the bottom surface of the second housing and are in communication with each of the second water storage grooves, each of the water cooling units comprises a plurality of connecting pipes and a plurality of heat dissipating fins sleeved on each of the connecting pipes, and one end of each of the connecting pipes is in communication with each of the pipe connecting grooves.
4. The liquid cooling heat sink for heat dissipation according to claim 1, wherein each heat absorbing component comprises a first water cooling head, a second water cooling head and a water delivery pipe group, the water delivery pipe group comprises a first water delivery pipe, a second water delivery pipe and a third water delivery pipe, wherein two ends of the first water delivery pipe are respectively communicated with the water outlet and the first water cooling head, two ends of the second water delivery pipe are respectively communicated with the first water cooling head and the second water cooling head, and two ends of the third water delivery pipe are respectively communicated with the second water cooling head and the water inlet.
5. The liquid cooling device as claimed in claim 4, wherein a water supplementing hole is provided at a position of the cover plate corresponding to each of the second water storage tanks.
6. The liquid cooling heat dissipating device as set forth in claim 1, wherein the first water tank comprises a first tank body, each of the first water tanks is disposed in the first tank body, a cross-shaped partition plate is disposed in each of the first water tanks, and a water pump receiving tank is disposed in the partition plate, wherein the water pump receiving tank is fixedly mounted with a water pump.
7. The liquid cooling heat dissipating device for multiple heat sources as recited in claim 6, wherein the first water tank further comprises a cover plate, the cover plate covers the first tank, and an opening is provided at a position of the cover plate corresponding to the water pump for the water pump to pass through.
8. The liquid cooling heat dissipating device for heat dissipation of multiple heat sources as recited in claim 6, wherein a plurality of first pipe connecting grooves are formed on the bottom surface of the first tank and are mutually communicated with the first water storage grooves, the second water tank comprises a second tank, a plurality of second pipe connecting grooves are formed on the bottom surface of the second tank and are mutually communicated with the second water storage grooves, each water cooling row assembly comprises a plurality of connecting pipes and a plurality of cooling fins sleeved on each connecting pipe, and two ends of each connecting pipe are respectively communicated with each first pipe connecting groove and each second pipe connecting groove.
9. The liquid cooling heat sink for heat dissipation according to claim 1, wherein each heat absorbing component comprises a first water cooling head, a second water cooling head and a water delivery pipe group, the water delivery pipe group comprises a first water delivery pipe, a second water delivery pipe, a third water delivery pipe and a fourth water delivery pipe, two ends of the first water delivery pipe and the second water delivery pipe are respectively communicated with the second water tank and the first water cooling head, and two ends of the third water delivery pipe and the fourth water delivery pipe are respectively communicated with the first water tank and the second water cooling head.
10. The liquid cooling heat sink for heat dissipation of multiple heat sources as recited in claim 1 wherein each of the heat absorbing components comprises a first water cooling head, a second water cooling head and a water delivery pipe group, the water delivery pipe group comprises a first water delivery pipe, a second water delivery pipe and a third water delivery pipe, two ends of the first water delivery pipe are respectively communicated with the second water tank and the first water cooling head, two ends of the second water delivery pipe are respectively communicated with the first water cooling head and the second water cooling head, and two ends of the third water delivery pipe are respectively communicated with the second water cooling head and the first water tank.
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| TWM324810U (en) * | 2007-06-05 | 2008-01-01 | Gigazone Int Co Ltd | Water-cooled circulating heat dissipation device of computer motherboard |
| CN107787157A (en) * | 2016-08-26 | 2018-03-09 | 双鸿科技股份有限公司 | Liquid cooling radiation module |
| CN110337227A (en) * | 2019-08-13 | 2019-10-15 | 深圳市研派科技有限公司 | Liquid-cooling heat radiator |
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