CN117580325A - Radiator and immersed liquid cooling device - Google Patents
Radiator and immersed liquid cooling device Download PDFInfo
- Publication number
- CN117580325A CN117580325A CN202311549877.1A CN202311549877A CN117580325A CN 117580325 A CN117580325 A CN 117580325A CN 202311549877 A CN202311549877 A CN 202311549877A CN 117580325 A CN117580325 A CN 117580325A
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- Prior art keywords
- liquid
- liquid inlet
- radiator
- electronic information
- radiating
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- 239000007788 liquid Substances 0.000 title claims abstract description 242
- 238000001816 cooling Methods 0.000 title claims abstract description 50
- 230000017525 heat dissipation Effects 0.000 claims abstract description 84
- 238000010438 heat treatment Methods 0.000 claims abstract description 67
- 239000003507 refrigerant Substances 0.000 claims abstract description 63
- 238000007654 immersion Methods 0.000 claims abstract description 21
- 238000005192 partition Methods 0.000 claims description 23
- 238000000926 separation method Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of heat dissipation of electronic information equipment, in particular to a radiator and an immersed liquid cooling device. The immersed liquid cooling device comprises a cabinet body, at least one radiator, a first liquid inlet pipe group and a second liquid inlet pipe group, wherein the cabinet body comprises an accommodating space, the accommodating space is used for accommodating electronic information equipment, the inside of the electronic information equipment is communicated with the accommodating space, and the inside of the electronic information equipment comprises at least one main heating element. At least one radiator is arranged in the electronic information equipment, the surface of each radiator is used for being attached to at least one main heating element, the first liquid inlet pipe group is used for being communicated with a liquid inlet of the radiator, and the second liquid inlet pipe group is used for being communicated with the accommodating space. The immersion liquid cooling device in the application can provide a refrigerant for the radiator through the first liquid inlet pipe group, and provide the refrigerant for the accommodating space through the second liquid inlet pipe group so as to improve the radiating effect on electronic information equipment in the accommodating space.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic information equipment, in particular to a radiator and an immersed liquid cooling device.
Background
With the progress of science and technology, the computing processing capacity of the electronic information equipment is continuously improved, and the heating value and the heat flux density of the electronic information equipment are greatly improved, so that heat generated by the electronic information equipment needs to be taken away in time, and stable operation of the electronic information equipment is ensured.
In the prior art, in order to dissipate heat of electronic information equipment, a single-phase immersion liquid cooling technology is generally adopted, and cooling liquid continuously flows through the electronic information equipment to continuously take away heat generated by the electronic information equipment so as to maintain that the electronic information equipment can work at a set temperature.
However, with the increasing of the arithmetic processing capability of electronic information devices, the number of high-power consumption components included in the electronic information devices is increasing, and shielding is generated between the components, so that the cooling liquid cannot exchange heat with the high-power consumption components sufficiently.
Disclosure of Invention
The invention provides a radiator and an immersed liquid cooling device, wherein the immersed liquid cooling device can provide a refrigerant for the radiator through a first liquid inlet pipe group and provide a refrigerant for a containing space through a second liquid inlet pipe group so as to improve the heat dissipation effect of electronic information equipment in the containing space.
In order to achieve the above purpose, the present invention provides the following technical solutions:
in a first aspect, the present application provides an immersion liquid cooling apparatus. The immersion liquid cooling device includes: the cabinet body comprises an accommodating space, the accommodating space is used for accommodating electronic information equipment, the inside of the electronic information equipment is communicated with the accommodating space, and the inside of the electronic information equipment comprises at least one main heating element. At least one radiator is arranged in the electronic information equipment, the surface of each radiator is used for being attached to at least one main heating element, the first liquid inlet pipe group is used for being communicated with a liquid inlet of the radiator, and the second liquid inlet pipe group is used for being communicated with the accommodating space.
In this embodiment, the inlet intercommunication of first feed liquor nest of tubes and radiator, the refrigerant inflow radiator in the first feed liquor nest of tubes dispels the heat to the main heating element who laminates on the radiator to the heat that makes main heating element produce can be quick the efflux, guarantees that main heating element can stable operation. In addition, the refrigerant in the second liquid inlet pipe group directly enters the accommodating space of the cabinet body, flows into the electronic information equipment through the accommodating space, submerges the main heating element in the electronic information equipment, so as to radiate the main heating element in the electronic information equipment, and the radiating efficiency of the main heating element can be further improved. In the mode, the main heating element is provided with the first liquid inlet pipe group which independently provides the refrigerant, so that the heat generated by the main heating element can be rapidly dissipated. The electronic information equipment is also internally provided with a second liquid inlet pipe group for independently providing the cooling medium. When one of the first liquid inlet pipe group and the second liquid inlet pipe group is damaged, the other one of the first liquid inlet pipe group and the second liquid inlet pipe group can also radiate heat for the electronic information equipment, so that the working stability of the electronic information equipment can be improved.
In one embodiment, the first liquid inlet pipe group comprises a first liquid inlet pipe, a first liquid collector and at least one first liquid separating pipe;
the first liquid inlet pipe is communicated with the liquid inlet of the first liquid collector, one end of the first liquid dividing pipe is communicated with the water outlet pipe of the first liquid collector, and the other end of the first liquid dividing pipe is communicated with the liquid inlet of the heat exchanger.
In one embodiment, the first liquid inlet pipe is provided with a first control valve.
In one embodiment, the first liquid collector is disposed on a side of the side plate of the cabinet, which is close to the top plate of the cabinet.
In one embodiment, the second liquid inlet pipe set includes a second liquid collector and a second liquid inlet pipe, the second liquid inlet pipe is communicated with a liquid inlet of the second liquid collector, the second liquid collector includes a plurality of liquid outlets, and the plurality of liquid outlets are used for providing refrigerants for the inside of the electronic information equipment.
In one embodiment, a second control valve is disposed on the second liquid inlet pipe.
In one embodiment, the radiator comprises a radiating shell and a first radiating fin group, wherein the radiating shell is attached to the main heating element, the radiating shell comprises a radiating cavity with one end open, and the open end of the radiating cavity is distributed with a liquid inlet of the radiator at intervals along a first direction; the first radiating fin group is arranged in the radiating cavity, the radiating cavity is communicated with the first liquid inlet pipe group through a liquid inlet of the radiator, and the radiating cavity is communicated with the internal space of the electronic information equipment through an opening; the first direction is the arrangement direction of the bottom plate and the top plate of the cabinet body.
In one embodiment, the heat sink includes a second heat dissipation fin set, and the second heat dissipation fin set is arranged on two sides of the heat dissipation shell opposite to the main heating element.
In one embodiment, the first heat dissipation fin group includes a plurality of first heat dissipation fins arranged at intervals, and a first runner is formed between every two adjacent first heat dissipation fins, and the first runner extends along the first direction; the second radiating fin group comprises a plurality of second radiating fins which are arranged at intervals, a second flow passage is formed between two adjacent second radiating fins, and the second flow passage extends along the first direction.
In an embodiment, the immersion liquid cooling device comprises a supporting structure, the supporting structure comprises a partition plate and a supporting plate, one end of the partition plate is connected to the bottom plate of the cabinet body, the other end of the partition plate extends to one side of the top plate of the cabinet body, the supporting plate is connected to the side plate of the cabinet body, the extending direction of the supporting plate is perpendicular to the extending direction of the partition plate, and the electronic information equipment is connected with one end, facing the top plate, of the partition plate and one side, facing the top plate, of the supporting plate.
In one embodiment, the partition plate is used for dividing the accommodating space into a first chamber and a second chamber, the second chamber comprises a liquid outlet, the electronic information device is located in the first accommodating chamber, and the interior of the electronic information device is communicated with the first chamber and the second chamber.
In one embodiment, the electronic information device includes at least one secondary heating element inside, and both the secondary heating element and the primary heating element are immersed by a refrigerant inside the electronic information device.
In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides an immersion liquid cooling system, which includes a cooling device and an immersion liquid cooling device according to any of the first aspect, where the cooling device is respectively communicated with the first liquid inlet pipe group, the second liquid inlet pipe group, and the accommodating space.
In an embodiment, cooling device includes casing, heat exchange assembly, returns liquid pipeline and feed liquor pipeline, heat exchange assembly set up in the casing, return the one end of liquid pipeline with heat exchange assembly intercommunication, return the other end and the accommodation space intercommunication of liquid pipeline, the one end of feed liquor pipeline with heat exchange assembly intercommunication, the other end of feed liquor pipeline respectively with first feed liquor nest of tubes and second feed liquor nest of tubes intercommunication.
In one embodiment, a circulation pump is arranged on the liquid supply pipeline or the liquid return pipeline.
In a third aspect, the present application further provides a radiator, the radiator includes heat dissipation shell and first radiating fin group, the heat dissipation shell is used for laminating main heating element, the heat dissipation shell includes inlet and one end open-ended heat dissipation chamber, the inlet with the heat dissipation chamber intercommunication, the heat dissipation chamber is used for holding first radiating fin group, the inlet is used for accessing the refrigerant, the opening in heat dissipation chamber is used for flowing out the refrigerant.
In one embodiment, the first heat dissipation fin group includes first heat dissipation fins arranged at intervals, a first flow channel is formed between every two adjacent first heat dissipation fins, and the liquid inlet and the opening of the heat dissipation cavity are located at two ends of the first flow channel.
In one embodiment, the heat sink includes a second fin group, where the second fin group includes a plurality of second fins arranged at intervals, and a second flow channel is formed between every two adjacent second fins, and an extension direction of the second flow channel is the same as an extension direction of the first flow channel.
Drawings
FIG. 1 is a schematic diagram of an immersion liquid cooling system according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a radiator in an immersion liquid cooling apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a radiator in an immersion liquid cooling apparatus according to an embodiment of the present invention;
FIG. 4 is a rear view of FIG. 2;
fig. 5 is a schematic structural diagram of a radiator in an immersion liquid cooling apparatus according to an embodiment of the present invention;
FIG. 6 is a top view of FIG. 2;
fig. 7 is a front view of fig. 2.
Icon: 10-a cabinet body; 11-top plate; 12-a bottom plate; 13-side plates; 101-a first chamber; 102-a second chamber; 1020-liquid outlet; 20-a first liquid inlet pipe group; 21-a first liquid inlet pipe; 210-a first control valve; 22-a first liquid trap; 23-a first liquid separating pipe; 230-a first liquid separation main pipe; 231-a liquid separation head; 232-a liquid separation branch pipe; 30-a second liquid inlet pipe group; 31-a second liquid trap; 32-a second liquid inlet pipe; 320-a second control valve; 40-supporting structure; 41-supporting plates; 42-a separator; 50-an electronic information device; 51-time heating element; 60-a heat sink; 61-a heat dissipation shell; 62-a first set of heat dissipating fins; 620-first heat radiating fins; 621-a first flow channel; 63-a heat dissipation chamber; 64-liquid inlet; 65-a second fin group; 650-second heat radiating fins; 651-second flow channel; 70-a housing; 80-a heat exchange assembly; 90-liquid return pipeline; 100-liquid supply pipelines; 110-a circulation pump.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, an embodiment of the present application provides an immersion liquid cooling system. The immersed liquid cooling system comprises an immersed liquid cooling device and a cooling device, wherein the cooling device is used for providing a refrigerant for the immersed liquid cooling device and cooling the refrigerant after absorbing heat again so as to continuously provide the refrigerant for the immersed liquid cooling device.
The immersion liquid cooling apparatus and the cooling apparatus are described below. The cooling device comprises a shell 70, a heat exchange assembly 80, a liquid return pipeline 90 and a liquid supply pipeline 100, wherein the heat exchange assembly 80 is arranged in the shell 70, one end of the liquid return pipeline 90 is communicated with the heat exchange assembly 80, and the other end of the liquid return pipeline 90 is communicated with an accommodating space in the immersed liquid cooling device. One end of the liquid supply pipeline 100 is communicated with the heat exchange assembly 80, and the other end of the liquid supply pipeline 100 is respectively communicated with the first liquid inlet pipe group 20 and the second liquid inlet pipe group 30 in the immersed liquid cooling device. The refrigerant in the heat exchange assembly provides the refrigerant for the first liquid inlet pipe group 20 and the second liquid inlet pipe group 30 through the liquid supply pipeline 100, and after the refrigerant exchanges heat with the main heating element in the accommodating space, the refrigerant flows back into the heat exchange assembly 80 through the liquid return pipeline 90. The first liquid inlet tube set 20 and the second liquid inlet tube set 30 are mutually independent and provide refrigerant for the accommodating space, so that the heat dissipation efficiency of the main heating element in the accommodating space is improved.
In order to ensure that the refrigerant can be circulated to provide the accommodating space, a circulating pump 110 is arranged on the liquid supply pipeline 100 and/or the liquid return pipeline 90, and the circulating pump 110 provides power for the circulation of the refrigerant.
Wherein the refrigerant is non-conductive heat dissipation medium such as synthetic oil and mineral oil.
The submerged liquid cooling apparatus comprises a cabinet 10, at least one radiator 60, a first liquid inlet pipe set 20 and a second liquid inlet pipe set 30. The cabinet 10 includes a top plate 11, a bottom plate 12, and side plates for connecting the top plate 11 and the bottom plate 12. The top plate 11, the bottom plate 12 and the side plate 13 enclose an accommodating space for accommodating the electronic information device 50, wherein the top plate 11 is rotatable relative to the side plate 13 so as to mount the electronic information device 50 in the accommodating space. The interior of the electronic information device 50 communicates with the receiving space, and the electronic information device 50 includes at least one main heat generating element, the at least one main heat generating element being located inside the electronic information device 50. At least one heat sink 60 is disposed inside the electronic information device 50, and each heat sink 60 is configured to fit at least one main heating element. One end of the first liquid inlet pipe group 20 is used for being communicated with a cooling device, the other end of the first liquid inlet pipe group 20 is used for being communicated with a liquid inlet of the radiator 60, a refrigerant enters the radiator 60 through the first liquid inlet pipe group 20, and the radiator 60 radiates heat to at least one main heating element arranged on the radiator 60. One end of the second liquid inlet pipe group 60 is used for being communicated with the cooling device, the other end of the second liquid inlet pipe group 30 is communicated with the accommodating space, the refrigerant enters the accommodating space through the second liquid inlet pipe group 30, the refrigerant in the accommodating space is continuously increased, the liquid level of the refrigerant in the accommodating space is increased, the refrigerant enters the electronic information equipment 50, and the main heating element in the electronic information equipment 50 is immersed to dissipate heat of the main heating element in the electronic information equipment 50. In this way, the radiator 60 has the first liquid inlet tube set 20 that independently provides the refrigerant, so as to ensure the rapid dissipation of the heat generated by the main heating element. The electronic information device 50 also has a second liquid inlet pipe group 30 for providing refrigerant independently, so as to improve the heat dissipation speed of the main heating element. When one of the first intake stack 20 and the second intake stack 30 is damaged, the other of the first intake stack 20 and the second intake stack 0 can also radiate heat for the main heat generating element in the electronic information device 50, and the stability of the operation of the electronic information device 50 can be improved.
It should be noted that the main heating element is the core heat generating component. In some embodiments, the main heating element is attached to the surface of the heat sink 60, so that the heat sink 60 can intensively dissipate heat of the main heating element, so as to ensure that the main heating element can work stably. The main heating element can be a chip, a CPU or a GPU and other high-power consumption elements. The electronic information device 50 further includes a secondary heating element 51, and the primary heating element and the secondary heating element 51 are immersed in the refrigerant inside the electronic information device 50, and the refrigerant inside the electronic information device 50 can dissipate heat from the primary heating element and the secondary heating element 51. The secondary heating element can be a PCIE card, a RAID card, a hard disk, a power module, a memory bank, etc., and in contrast, the heat generated by the primary heating element is higher than that of the secondary heating element. In addition, the cabinet 10 may have a rectangular, cylindrical, or other shape.
In one embodiment, the immersion liquid cooling apparatus includes a support structure 40, the support structure 40 being configured to be used to secure an electronic information device 50. Specifically, the support structure 40 includes a partition plate 42 and a support plate 41, one end of the partition plate 42 is connected to a side of the bottom plate 12 facing the top plate 11, and the other end of the partition plate 42 faces the top plate 11. More specifically, the extending direction of the partition plate 42 is the arrangement direction of the bottom plate 12 and the top plate 11, and the partition plate 42 is perpendicular to the bottom plate 12 and the top plate 11, wherein the arrangement direction of the top plate 11 and the bottom plate 12 is the first direction. One end of the support plate 41 is connected to the side plate 13, and the other end of the support plate 41 extends toward the partition plate 42, and the extending direction of the support plate 41 is perpendicular to the extending direction of the partition plate 42. The other end of the partition plate 42 and the support plate 41 are spaced apart from the top plate 11 or the bottom plate 12 by the same distance to ensure the stability of the electronic information device 50 mounted in the accommodating space through the partition plate 42 and the support plate 41.
With continued reference to fig. 1, the partition 42 is configured to divide the accommodating space into a first chamber 101 and a second chamber 102, the second chamber 102 including a drain 1020, the electronic information device 50 being located in the first accommodating chamber 101, the interior of the electronic information device 50 being in communication with the second chamber 102. The refrigerant in the electronic information device 50 flows into the second chamber 102 through the gap between the electronic information device 50 and the top plate 11, and flows into the cooling device through the liquid outlet 1020 of the second chamber 102. The liquid outlet 1020 is located at the connection between the bottom plate 12 or the side plate 13 and the bottom plate 12, so as to ensure that the refrigerant is rapidly discharged from the second chamber 102.
In one embodiment, the first inlet tube set 20 comprises a first inlet tube 21, a first liquid trap 22 and at least one first liquid separation tube 23. The first liquid inlet pipe 21 is communicated with a liquid inlet of the first liquid collector 22, one end of the first liquid dividing pipe is communicated with a liquid outlet of the first liquid collector 22, and the other end of the first liquid dividing pipe 23 is communicated with a liquid inlet of the radiator 60. The refrigerant enters the first liquid collector 22 through the first liquid inlet pipe 21, and the refrigerant in the first liquid collector 22 flows into the radiator 60 through the at least one first liquid distribution pipe 23 so as to radiate heat of a main heating element arranged on the surface of the radiator 60. The number of the first liquid-dividing pipes 23 may be the same as that of the heat sinks 60, so as to ensure that the heat sinks 60 can be filled with the refrigerant. Alternatively, the first liquid-dividing pipe 23 includes a first liquid-dividing main pipe 230, a liquid-dividing head 231 and a plurality of liquid-dividing branch pipes 232, one end of the first liquid-dividing main pipe 230 is communicated with the liquid outlet of the first liquid collector 22, the other end of the first liquid-dividing main pipe 230 is connected with the liquid-dividing head 231, the liquid-dividing head 231 is connected with the plurality of first liquid-dividing branch pipes 232, the first liquid-dividing branch pipe 232 is communicated with the liquid inlet of the radiator 60, or the liquid-dividing head 232 is communicated with the liquid inlet of one radiator 60, and the first liquid-dividing branch pipe 232 is communicated with the liquid inlet of the radiator 60.
It should be noted that the first liquid distribution pipe 23 is a flexible pipeline, so as to ensure that the first liquid distribution pipe 23 can avoid other components in the electronic information device 50 to provide the cooling medium for the radiator 60.
In addition, to facilitate the installation of the first liquid trap 22, the first liquid trap 22 is fixed inside the side plate 13, and the first liquid trap 22 is located near the side of the support plate 41 toward the bottom plate 12. The first liquid inlet pipe 21 extends from the bottom plate 12 to the position where the first liquid collector 22 is located and is communicated with a liquid inlet of the first liquid collector 22, a liquid outlet of the first liquid inlet 22 is communicated with the first liquid separating pipe 23, and the first liquid separating pipe 23 extends towards the direction of the bottom plate 12 and is communicated with the radiator 60 inside the electronic information equipment 50. In this mode, the refrigerant flows from the bottom plate 12 to the first liquid receiver 22 through the first liquid inlet pipe 21, is stored in the first liquid receiver 22, flows to the bottom plate 12 side through the first liquid separation pipe 23, and finally flows to the top plate side and enters the radiator 60.
In one embodiment, the first inlet pipe 21 is provided with a first control valve 210, and the first control valve 210 can control the opening and closing of the first inlet pipe 21 so as to facilitate maintenance of the first inlet pipe group 20 and the radiator 60. In addition, the first control valve 210 can also control the flow rate of the refrigerant flowing into the first liquid inlet pipe 21.
In an embodiment, the second liquid inlet tube set 30 includes a second liquid collector 31 and a second liquid inlet tube 32, the second liquid inlet tube 32 is communicated with a liquid inlet of the second liquid collector 31, the second liquid inlet tube 32 provides a refrigerant for the second liquid collector 31, the refrigerant in the second liquid collector 31 can flow out through a plurality of liquid outlets on the second liquid collector 31, and the refrigerant flowing out through the plurality of liquid outlets of the second liquid collector 31 can enter the electronic information device 50 to dissipate heat of a main heating element and a secondary heating element 51 included in the electronic information device 50. The refrigerant in the second liquid trap 31 can also communicate with the inside of the electronic information device 50 through a pipe, and dissipate heat from the main heating element and the sub heating element 51.
In order to control the refrigerant entering the second liquid collector 31, a second control valve 320 is disposed on the second liquid inlet pipe 32, and the second control valve 320 can control the opening and closing of the second liquid inlet pipe 32, so as to control the flow rate of the refrigerant entering the second liquid collector 31.
The second liquid collector 31 is fixed to the base plate 12, and specifically, the second liquid collector 21 may be integrally formed with the base plate 12, so as to improve the stability of the second liquid collector 31 mounted on the base plate 12. In addition, the second liquid trap 31 is provided on the bottom plate 12, and the refrigerant discharged through the second liquid trap 31 has less impact on the bottom plate 12, so that the service life of the bottom plate 12 can be improved.
The refrigerant flowing out through the plurality of liquid outlets of the second liquid collector 31 is accumulated on the bottom plate 12 of the cabinet body 10, the refrigerant in the cabinet body 10 is gradually increased, the liquid level in the cabinet body 10 is continuously increased, the refrigerant can be understood as flowing from the bottom plate 12 of the cabinet body 10 to the top plate 11, and enters the electronic information equipment 50 in the process of flowing into the top plate 11, the main heating element and the secondary heating element 51 in the electronic information equipment 50 are immersed and exchange heat with the main heating element and the secondary heating element 51, and the refrigerant after heat exchange flows out of the cabinet body 10 through the second chamber 102.
In the above-described embodiment, referring to fig. 2 to 7, the heat sink 60 includes the heat dissipation case 61 and the first heat dissipation fin group 62, and the heat dissipation case 61 is used for bonding with the main heating element. Specifically, the heat dissipation case 61 is used for attaching the main heating element. The heat dissipation shell 61 is used for accommodating the first heat dissipation fin group 62, the refrigerant enters the heat dissipation shell 61, and heat dissipation is performed on the main heating element attached to the surface of the heat dissipation shell 61 through the heat dissipation shell 61 and the first heat dissipation fin group. In some embodiments, the heat dissipation shell 61 includes a liquid inlet 64 and a heat dissipation cavity 63, the heat dissipation cavity 63 is used for accommodating the first heat dissipation fin group 62, the liquid inlet 64 is communicated with the heat dissipation cavity 63, the liquid inlet 64 is used for being communicated with one first liquid separation tube 23, the refrigerant enters the heat dissipation cavity 63 through the liquid inlet 64, the refrigerant exchanges heat with the main heating element through the first heat dissipation fin group 62 and the heat dissipation shell 61, and the heat dissipation efficiency of the refrigerant to the main heating element can be improved by the first heat dissipation fin group 62. It can be understood that the refrigerant can directly flow into the electronic information device 50 after flowing through the first heat dissipating fin set 62, and exchange heat with the secondary heating element 51.
In an embodiment, when the heat dissipation cavity 63 is communicated with the inside of the electronic information device 50, one end of the heat dissipation cavity 63 is opened, and the opening end of the heat dissipation cavity 63 and the liquid inlet 64 can be disposed opposite to each other along the first direction, so as to ensure that the refrigerant in the heat dissipation shell 61 can flow out of the heat dissipation cavity 63 conveniently. In addition, the first heat dissipation fin group 62 includes a plurality of first heat dissipation fins 620 arranged at intervals, a first flow passage 621 is formed between two adjacent first heat dissipation fins 620, and the first flow passage 621 extends in the first direction. The first direction is a direction from the bottom plate 12 to the top plate 11 to ensure that the refrigerant flows in the heat dissipation chamber along the extending direction of the first flow channel 621.
In one embodiment, the heat sink 60 includes a second heat dissipation fin set 65, and the second heat dissipation fin set 65 is disposed opposite to the main heating element on two sides of the heat dissipation shell 61. It is understood that the second fin group 65 and the main heating element are provided on opposite surfaces of the heat dissipation case 61, respectively. The second heat dissipation fin group 65 can increase the heat exchange speed between the radiator 60 and the refrigerant entering the electronic information device 50 through the second liquid inlet pipe 32, and when the radiator 60 does not work, the heat dissipation efficiency of the main heating element can be ensured by the second heat dissipation fin group 65, so that the working stability of the electronic information device 50 is improved.
The second heat dissipation fin group 65 includes a plurality of second heat dissipation fins 650, the plurality of second heat dissipation fins 650 are arranged at intervals, a second flow channel 651 is formed between two adjacent heat dissipation fins 650, the extending direction of the second flow channel 651 is the same as the extending direction of the first flow channel 651, and the refrigerant entering the electronic information device 50 through the second liquid inlet tube group 30 can further dissipate heat of a main heat dissipation element arranged on the heat radiator through the second flow channel 651.
In the above-described embodiment, the heat sink 60 includes the heat dissipation case 61, the first heat dissipation fin group 62, and the second heat dissipation fin group 65. The heat dissipation shell 61 includes a heat dissipation cavity 63 with an opening at one end and a liquid inlet 64, the first heat dissipation fin group 62 includes a plurality of first heat dissipation fins 620 arranged at intervals, the plurality of first heat dissipation fins 620 are disposed in the heat dissipation cavity 63, a first flow channel 621 is formed between two adjacent first heat dissipation fins 620, and the opening of the heat dissipation cavity 63 and the liquid inlet 64 are located at two ends of the first flow channel 621. The second heat dissipation fin group 65 is disposed on the surface of the heat dissipation shell 61, the second heat dissipation fin group 65 includes a plurality of second heat dissipation fins 650 arranged at intervals, a second flow channel 651 is formed between two adjacent second heat dissipation fins 650, and an extending direction of the second flow channel 651 is the same as an extending direction of the first flow channel 651.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (15)
1. An immersion liquid cooling apparatus, comprising:
the cabinet body comprises an accommodating space, wherein the accommodating space is used for accommodating electronic information equipment, the interior of the electronic information equipment is communicated with the accommodating space, and the interior of the electronic information equipment comprises at least one main heating element;
at least one radiator arranged in the electronic information equipment, wherein each radiator is used for being attached to at least one main heating element;
the first liquid inlet pipe group is used for being communicated with a liquid inlet of the radiator to provide a refrigerant for the radiator;
the second liquid inlet pipe group is used for being communicated with the accommodating space and providing a refrigerant for the accommodating space.
2. The immersion liquid cooling apparatus according to claim 1, wherein the first liquid inlet tube group includes a first liquid inlet tube, a first liquid trap, and at least one first liquid separation tube;
the first liquid inlet pipe is communicated with the liquid inlet of the first liquid collector, one end of the first liquid dividing pipe is communicated with the liquid outlet of the first liquid collector, and the other end of the first liquid dividing pipe is communicated with the liquid inlet of the radiator.
3. The immersion liquid cooling apparatus according to claim 2, wherein a first control valve is provided on the first liquid inlet pipe.
4. An immersion liquid cooling apparatus according to claim 3 wherein the first liquid trap is disposed on a side of the side plate of the cabinet adjacent to the top plate of the cabinet.
5. A submerged liquid cooling apparatus according to claim 3, wherein the second liquid inlet pipe group comprises a second liquid collector and a second liquid inlet pipe, the second liquid inlet pipe being in communication with the liquid inlet of the second liquid collector, the second liquid collector comprising a plurality of liquid outlets for providing a cooling medium to the receiving space.
6. The immersion liquid cooling apparatus according to claim 5, wherein a second control valve is provided on the second liquid inlet pipe.
7. The submerged entry liquid cooling apparatus of any one of claims 1 to 6, wherein the radiator comprises a radiator shell and a first set of radiating fins, the radiator shell is attached to the main heating element, the radiator shell comprises a radiator cavity with an open end, and the open end of the radiator cavity is spaced apart from the liquid inlet of the radiator along a first direction;
the first radiating fin group is arranged in the radiating cavity, the radiating cavity is communicated with the first liquid inlet pipe group through a liquid inlet of the radiator, and the radiating cavity is communicated with the internal space of the electronic information equipment through an opening;
the first direction is the arrangement direction of the bottom plate and the top plate of the cabinet body.
8. The submerged cooling apparatus of claim 7, wherein the radiator comprises a second radiating fin group arranged on two sides of the radiating shell opposite to the main heating element.
9. The submerged cooling apparatus of claim 8, wherein the first radiating fin group comprises a plurality of first radiating fins arranged at intervals, a first flow channel is formed between every two adjacent first radiating fins, and the first flow channel extends along the first direction;
the second radiating fin group comprises a plurality of second radiating fins which are arranged at intervals, a second flow passage is formed between two adjacent second radiating fins, and the second flow passage extends along the first direction.
10. The apparatus according to any one of claims 1 to 6, wherein the apparatus comprises a support structure including a partition plate and a support plate, one end of the partition plate is connected to the bottom plate of the cabinet, the other end of the partition plate extends to the top plate side of the cabinet, the support plate is connected to the side plate of the cabinet, the extending direction of the support plate is perpendicular to the extending direction of the partition plate, and the electronic information device is connected to one end of the partition plate facing the top plate and one side of the support plate facing the top plate.
11. The immersion liquid cooling apparatus according to claim 10, wherein the partition is configured to partition the accommodating space into a first chamber and a second chamber, the second chamber including a liquid drain, the electronic information device being located in the first accommodating chamber, an interior of the electronic information device being in communication with the first chamber and the second chamber.
12. The immersion liquid cooling apparatus according to claim 1, wherein an interior of the electronic information device includes at least one secondary heating element, both the secondary heating element and the primary heating element being immersed by a refrigerant in the interior of the electronic information device.
13. The radiator is characterized by comprising a radiating shell and a first radiating fin group, wherein the radiating shell is used for being attached to a main heating element, the radiating shell comprises a liquid inlet and a radiating cavity with one end open, the liquid inlet is communicated with the radiating cavity, the radiating cavity is used for accommodating the first radiating fin group, the liquid inlet is used for being connected with a refrigerant, and an opening of the radiating cavity is used for flowing out the refrigerant.
14. The heat sink of claim 13 wherein the first fin group comprises a plurality of first fins arranged at intervals, a first flow channel is formed between each two adjacent first fins, and the liquid inlet and the opening of the heat dissipation cavity are positioned at two ends of the first flow channel.
15. The heat sink of claim 14, wherein the heat sink comprises a second fin group comprising a plurality of second fins arranged at intervals, and a second flow passage is formed between each two adjacent second fins, and the extending direction of the second flow passage is the same as the extending direction of the first flow passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311549877.1A CN117580325A (en) | 2023-11-16 | 2023-11-16 | Radiator and immersed liquid cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311549877.1A CN117580325A (en) | 2023-11-16 | 2023-11-16 | Radiator and immersed liquid cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117580325A true CN117580325A (en) | 2024-02-20 |
Family
ID=89885801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311549877.1A Pending CN117580325A (en) | 2023-11-16 | 2023-11-16 | Radiator and immersed liquid cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117580325A (en) |
-
2023
- 2023-11-16 CN CN202311549877.1A patent/CN117580325A/en active Pending
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