CN210137402U - Switch heat abstractor and switch - Google Patents
Switch heat abstractor and switch Download PDFInfo
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- CN210137402U CN210137402U CN201921759920.6U CN201921759920U CN210137402U CN 210137402 U CN210137402 U CN 210137402U CN 201921759920 U CN201921759920 U CN 201921759920U CN 210137402 U CN210137402 U CN 210137402U
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- heat exchanger
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Abstract
The utility model provides a heat dissipation device, include: a base plate; liquid cooling system, liquid cooling system includes: the liquid cooling plate is arranged on one side of the bottom plate; the heat exchanger water tank is arranged on the opposite side of the bottom plate; a conduit configured to communicate with the liquid cold plate and the heat exchanger water bath and to transfer a cooling liquid therebetween; and the fan is configured to face the edge of the bottom plate and enable fan airflow to point to the liquid cooling plate and the heat exchanger water tank which are positioned on two sides of the bottom plate, wherein a plurality of through holes are formed in the heat exchanger water tank, and the direction of each through hole is parallel to the direction of the fan airflow. The utility model discloses the radiating efficiency is high, has guaranteed at switch high load during operation, thereby CPU and exchange board can not produce the excess temperature and make the performance decline machine of dying even, have promoted the reliability of switch under high load work.
Description
Technical Field
The field relates to the field of computers, and more particularly to a heat sink for a switch and a switch.
Background
With the development of information technology, the integration level of electronic equipment is higher and higher, more and more components are used in the equipment, the performance of the equipment is higher and higher, but the power of corresponding components and equipment is higher and higher, and the current data center switch is also developed towards higher density and higher switching capacity.
Traditional switch often only sets up a plurality of fan module to carry out the heat exchange to components and parts with higher speed air flow's mode, reduce the temperature. Because under the existing situation, adopt the volume great or increase fan figure to improve radiating efficiency more, but can occupy more quick-witted case inner space like this, and radiating efficiency is not good, can produce more noise moreover, consequently need improve the heat dissipation technology and satisfy the heat dissipation demand of switch.
Disclosure of Invention
In view of this, the utility model aims at providing a switch heat abstractor, the utility model discloses the radiating efficiency is high, has guaranteed that at switch high load during operation, thereby CPU and exchange board can not produce the excess temperature and make the performance decline even machine of dying, have promoted the reliability of switch under high load operation. In addition, because more fans with high power and large volume are not needed for heat dissipation, the power consumption of the whole machine is reduced, the generated noise is also reduced, and the fan is more environment-friendly.
Based on the above object, an aspect of the utility model provides a switch heat abstractor, include:
a base plate;
liquid cooling system, liquid cooling system includes:
the liquid cooling plate is arranged on one side of the bottom plate;
the heat exchanger water tank is arranged on the opposite side of the bottom plate;
a conduit configured to communicate with the liquid cold plate and the heat exchanger water bath and to transfer a cooling liquid therebetween;
a fan configured to face an edge of the base plate and direct fan airflow toward both the liquid cold plate and the heat exchanger sink on both sides of the base plate,
wherein, a plurality of through holes are arranged on the heat exchanger water tank, and the direction of the through holes is parallel to the airflow direction of the fan.
According to an embodiment of the present invention, the bottom plate is a switchboard on the switch.
According to an embodiment of the present invention, the device further comprises a heat sink, the heat sink being arranged on the liquid cooling plate.
According to an embodiment of the present invention, the size and shape of the heat sink are the same as those of the liquid cooling plate.
According to an embodiment of the invention, a part of the conduit is arranged at the edge of the bottom plate.
According to the utility model discloses an embodiment, the device still includes the water pump, and the water pump setting is in the heat exchanger basin so that the coolant liquid in the pipe circulates to the heat exchanger basin via the liquid cooling board.
According to an embodiment of the present invention, the heat exchanger sink is further constructed as a multi-layer rectangular parallelepiped structure.
According to an embodiment of the invention, the heat exchanger sink is further constructed as a spiral structure.
According to the utility model discloses an embodiment, the heat exchanger basin is provided with water inlet and delivery port, and the water inlet setting is in the upper left end of heat exchanger basin, and the delivery port setting is at the right lower extreme of heat exchanger basin.
Another aspect of the invention provides a switch comprising the apparatus of any of the above.
The utility model discloses following beneficial technological effect has: the heat dissipation device provided by the embodiment of the utility model is provided with the bottom plate; liquid cooling system, liquid cooling system includes: the liquid cooling plate is arranged on one side of the bottom plate; the heat exchanger water tank is arranged on the other side of the bottom plate and is constructed into a cuboid; a conduit configured to connect the liquid-cooled plate and the heat exchanger water tank; the fan, the fan sets up at the edge of bottom plate and constructs when static for the fan, half impeller is just to liquid cooling board, half impeller is just to the heat exchanger basin, wherein be provided with a plurality of through-holes on the heat exchanger basin, the direction structure of through-hole is for the technical scheme parallel with fan airflow direction, the advantage that has the radiating efficiency height has guaranteed when the switch high load work, thereby CPU and exchange board can not produce the excess temperature and make the performance decline even shut down, the reliability of switch under the high load work has been promoted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other embodiments can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic front view of an apparatus according to an embodiment of the present invention;
fig. 2 is a schematic side view of a device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The steps illustrated in the flow charts of the figures may be performed in a computer system such as a set of computer-executable instructions. Also, while a logical order is shown in the flow diagrams, in some cases, the steps shown or described may be performed in an order different than here.
In view of the above, the present invention provides, in a first aspect, an embodiment of a heat dissipation device for a switch. Fig. 1 shows a schematic view of the device.
As shown in fig. 1, the apparatus 10 may include:
a base plate 11;
a liquid cooling plate 13, the liquid cooling plate 13 being disposed on one side of the base plate 11;
a heat exchanger water tank 14, the heat exchanger water tank 14 being arranged on the opposite side of the base plate 11, for example, may be configured as a rectangular parallelepiped, the heat exchanger being arranged in the heat exchanger water tank 14;
a conduit 15, the conduit 15 being configured to communicate the liquid cold plate 13 and the heat exchanger water tank 14 and to transfer the cooling liquid therebetween;
a fan 16, the fan 16 being configured to face the edge of the base plate 11 and direct fan airflow simultaneously toward both the liquid-cooled plate 13 and the heat exchanger sink 14 on both upper and lower sides of the base plate 11,
wherein the heat exchanger water tank 14 is provided with a plurality of through holes 17, and the direction of the through holes 17 is configured to be parallel to the air flow direction of the fan 16. The fan 16 arranged in the technical scheme can radiate the liquid cooling plate 13 on one side surface of the bottom plate 11 on one hand, and can radiate the heat of the heat exchanger water tank 14 on the other hand, and the contact area between the heat exchanger water tank 14 and wind can be increased by arranging the through hole 17 in the heat exchanger water tank 14, so that a better radiating effect can be generated.
The utility model discloses utilize liquid cooling and forced air cooling cooperation, through liquid cooling board and CPU, exchange board etc. directly carry out the heat exchange, the heat dissipation of help heat components and parts is fast, recycles the heat dissipation of traditional heating panel forced air cooling mode help liquid cooling board, reduces liquid cooling device system load, and the whole heat dissipation that is faster of help.
Through the technical scheme, the heat dissipation device has the advantage of high heat dissipation efficiency, the CPU and the switch board can not generate over temperature when the switch works under high load, so that the performance is reduced and even the switch is down, and the reliability of the switch under the high-load work is improved. And more fans with high power and large volume are not needed for heat dissipation, so that the power consumption of the whole machine is reduced, the generated noise is reduced, and the environment is protected.
In a preferred embodiment of the present invention, the bottom plate 11 is a switch board on the switch, and a plurality of liquid cooling plates 13 can be disposed on the switch board according to specific heat dissipation requirements, so as to achieve better heat dissipation for the switch. The liquid cooling plate 13 can be directly arranged on the CPU, and directly exchanges heat with the CPU, so that the CPU can be better cooled.
In a preferred embodiment of the present invention, the device further includes a heat sink, the heat sink is disposed on the liquid cooling plate 13, the heat on the liquid cooling plate 13 and the bottom plate 11 directly performs heat exchange, and then the heat sink disposed on the liquid cooling plate 13 performs partial heat dissipation for the liquid cooling plate 13, so as to increase the heat dissipation speed of the liquid cooling plate 13, and to have higher heat dissipation efficiency.
In a preferred embodiment of the present invention, the size and shape of the cooling fin are the same as those of the liquid cooling plate 13, and the cooling fin completely covers the liquid cooling plate 13, so as to increase the contact with the liquid cooling plate, and better dissipate heat from the liquid cooling plate 13.
In a preferred embodiment of the present invention, a part of the conduit 15 is disposed at the edge of the bottom plate 11, the conduit 15 connects the liquid cooling plate 13 and the heat exchanger water tank 14, the routing of the conduit 15 can be theoretically arbitrary, a part of the conduit 15 is disposed at the edge of the bottom plate 11, and the cooling air outside the bottom plate 11 can be used to increase the heat dissipation rate of the liquid in the conduit 15.
In a preferred embodiment of the invention, the device further comprises a water pump arranged in the heat exchanger water tank 14 to circulate the cooling liquid in the conduit 15 to the heat exchanger water tank 14 via the liquid cooling plate 13. After the cooling liquid of the liquid cooling plate 13 is fully contacted with heat sources such as a CPU (central processing unit) for heat exchange, on one hand, the cooling liquid flows to the heat exchanger water tank 14 positioned at the air channel of the fan 16 through the water pump control through the guide pipe 15, the fan 16 forces the heat exchanger water tank 14 and the outside air to form air convection, sufficient heat exchange is carried out, heat is discharged, the temperature of the cooling liquid is reduced, and then the cooling liquid flows back to the liquid cooling plate 13 again to dissipate the heat of the bottom plate 11 under the action of the water pump. On the other hand, the radiating fins are arranged on the liquid cooling plate 13, so that heat exchange of the liquid cooling system can be utilized, the radiating plate of the air cooling system can be utilized to directly radiate the liquid cooling plate 13, and the radiating efficiency of the liquid cooling plate 13 can be ensured to be high enough. The two modes are combined to fully reduce the heat of the main heating device in the switch, fully reduce the internal temperature of the switch and ensure that the switch cannot be degraded or crashed due to overhigh temperature during high-load work.
In a preferred embodiment of the present invention, the heat exchanger water tank 14 is further constructed as a multi-layer rectangular structure, the rectangular structure of each layer is connected through the conduit 15, and the contact area between the wind and the heat sink water tank 14 is increased to a greater extent by the multi-layer structure, so that the wind can take away more heat to achieve a better heat dissipation effect.
In a preferred embodiment of the present invention, the heat exchanger water tank 14 is further constructed as a spiral structure, which can expose a larger area of the heat sink water tank 14 to the wind generated by the fan 16, thereby better dissipating heat.
In a preferred embodiment of the present invention, the heat exchanger water tank 14 is provided with a water inlet and a water outlet, the water inlet is disposed at the upper left end of the heat exchanger water tank 14, and the water outlet is disposed at the lower right end of the heat exchanger water tank 14. The coolant flows in from the water inlet and flows out from the water outlet, and the water inlet and the water outlet are arranged at the opposite far ends of the radiator water tank 14, so that the liquid can be better radiated in the radiator water tank 14.
The device can also be provided with a plurality of baffles, and the baffles are arranged between the fan 16 and the radiator water tank 14 to form a channel for air circulation, so that all wind power generated by the fan 16 can be blown out only by the through holes 17 of the radiator water tank 14.
In addition, the fluorine chloride is used as cooling liquid, so that the heat exchange effect is higher, and meanwhile, leakage after the guide pipe 15 and the like are damaged does not cause circuit short circuit like water cooling, so that the safety is higher.
The utility model discloses the radiating efficiency is high, has guaranteed at switch high load during operation, thereby CPU and exchange board can not produce the excess temperature and make the performance decline machine of dying even, have promoted the reliability of switch under high load work.
In a second aspect, the present invention provides a switch, comprising the apparatus of any one of the above.
Accordingly, it is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and applications other than the examples provided will be apparent upon reading the above description. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled, and not by reference to the above description. It is expected that further developments will occur in the arts discussed herein, and that the disclosed systems and methods will be incorporated into such future embodiments. In sum, it should be understood that the invention is capable of modification and variation.
The above-described embodiments, particularly any "preferred" embodiments, are possible examples of implementations, and are presented merely for a clear understanding of the principles of the invention. Many variations and modifications may be made to the above-described embodiments without departing from the spirit and principles of the technology described herein. All such modifications are intended to be included within the scope of this disclosure and protected by the following claims.
While preferred embodiments of the present invention have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in practicing the invention. It is intended that the following claims define the scope of the invention and that methods and structures within the scope of these claims and their equivalents be covered thereby.
The present disclosure is intended to explain how to fashion and use various embodiments in accordance with the technology rather than to limit the true, intended, and equivalent scope and spirit thereof. The foregoing description is not intended to be exhaustive or to be limited to the precise forms disclosed. Modifications and variations are possible in light of the above teachings. The embodiments were chosen and described to provide the best illustration of the principles of the technology and its practical application, and to enable one of ordinary skill in the art to utilize the technology in various embodiments and with various modifications as are suited to the particular use contemplated. All such variations and modifications are within the scope of the embodiments as determined by the appended claims, as may be amended during the pendency of this application for patent, and all equivalents thereof, when interpreted in accordance with the breadth to which they are fairly, legally, and equitably entitled.
Claims (10)
1. A heat sink for a switch, comprising:
a base plate;
a liquid cooling system, the liquid cooling system comprising:
a liquid cooling plate disposed on one side of the base plate;
a heat exchanger water tank disposed on an opposite side of the base plate;
a conduit configured to communicate the liquid-cooled plate and the heat exchanger sink and to transfer a cooling liquid therebetween;
a fan configured to face an edge of the base plate and direct fan airflow toward both the liquid-cooled plate and the heat exchanger sink on both sides of the base plate,
wherein the heat exchanger water tank is provided with a plurality of through holes, and the direction of the through holes is parallel to the airflow direction of the fan.
2. The apparatus of claim 1, wherein the backplane is a switch board on the switch.
3. The apparatus of claim 1, further comprising a heat sink disposed on the liquid-cooled plate.
4. The apparatus of claim 3, wherein the heat sink is the same size and shape as the liquid-cooled plate.
5. The apparatus of claim 1, wherein a portion of the conduits are disposed at an edge of the floor.
6. The apparatus of claim 1, further comprising a water pump disposed in the heat exchanger water tank to circulate the coolant in the conduit to the heat exchanger water tank via the liquid-cooled plate.
7. The apparatus of claim 1, wherein the heat exchanger sink is further configured as a multi-layered rectangular parallelepiped structure.
8. The apparatus of claim 1, wherein the heat exchanger water tank is further configured as a spiral structure.
9. The apparatus of claim 1, wherein the heat exchanger water tank is provided with a water inlet disposed at an upper left end thereof and a water outlet disposed at a lower right end thereof.
10. A switch, characterized in that it comprises a device according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921759920.6U CN210137402U (en) | 2019-10-18 | 2019-10-18 | Switch heat abstractor and switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921759920.6U CN210137402U (en) | 2019-10-18 | 2019-10-18 | Switch heat abstractor and switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210137402U true CN210137402U (en) | 2020-03-10 |
Family
ID=69708374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921759920.6U Active CN210137402U (en) | 2019-10-18 | 2019-10-18 | Switch heat abstractor and switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210137402U (en) |
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2019
- 2019-10-18 CN CN201921759920.6U patent/CN210137402U/en active Active
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