CN217279502U

CN217279502U - Intelligence cooling computer mainboard

Info

Publication number: CN217279502U
Application number: CN202221071844.1U
Authority: CN
Inventors: 王利东
Original assignee: Shenzhen Zhiao Technology Co ltd
Current assignee: Shenzhen Zhiao Technology Co ltd
Priority date: 2022-05-07
Filing date: 2022-05-07
Publication date: 2022-08-23
Anticipated expiration: 2032-05-07

Abstract

The utility model discloses an intelligence cooling computer mainboard, including the computer mainboard body, the equal fixedly connected with heat-conducting plate in both sides of computer mainboard body, the top of heat-conducting plate transversely is provided with the heat pipe, the top fixed mounting of computer mainboard body has heat radiation fins. The utility model discloses a set up the computer mainboard body, the heat-conducting plate, the heat pipe, heat radiation fins, the heat dissipation box, heat conduction frame one, heat conduction frame two, communicating pipe one, communicating pipe two, the semiconductor refrigeration piece, the fan, cooling tube one, cooling tube two, micro water pump, intelligent temperature controller, the cooperation of controller and singlechip is used, it generally carries out the forced air cooling heat conduction cooling through fan and fin to have solved current computer mainboard, can not effectively be quick intelligent with the temperature reduction to normal temperature, need just can reduce normal temperature through the longer time, be unfavorable for the user to carry out the problem of cooling to the computer mainboard fast.

Description

Intelligence cooling computer mainboard

Technical Field

The utility model relates to a computer motherboard technical field specifically is an intelligence cooling computer motherboard.

Background

The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes BIOS chips, I/O control chips, keyboard and panel control switch interfaces, indicator light connectors, expansion slots, and dc power supply connectors for the main board and the plug-in cards.

SUMMERY OF THE UTILITY MODEL

For solving the problem that provides in the above-mentioned background art, the utility model aims to provide an intelligence cooling computer mainboard has possessed intelligence rapid cooling's advantage, has solved current computer mainboard and generally has carried out the forced air cooling heat conduction cooling through fan and fin, can not be effectively rapid intelligent with the temperature reduction to normal temperature, need just can reduce to normal temperature through the longer time, be unfavorable for the user to carry out the problem of cooling to computer mainboard fast.

In order to achieve the above object, the utility model provides a following technical scheme: an intelligent cooling computer mainboard comprises a computer mainboard body;

the computer mainboard comprises a computer mainboard body, wherein heat conducting plates are fixedly connected to two sides of the computer mainboard body, a heat conducting pipe is transversely arranged at the top of the heat conducting plate, heat radiating fins are fixedly arranged at the top of the computer mainboard body, a heat radiating box is inlaid at the top of the heat radiating fins, a first heat conducting frame is fixedly connected to the left sides of the heat radiating fins, a second heat conducting frame is fixedly connected to the right sides of the heat radiating fins, a first communicating pipe is communicated with the front of the heat conducting pipe at the front of the first heat conducting frame, a second communicating pipe is communicated with the back of the second heat conducting frame, the bottom of the second communicating pipe is communicated with the back of the heat conducting pipe, a semiconductor refrigerating sheet is fixedly connected to the bottom of the heat radiating box, a fan is fixedly arranged at the top of the heat radiating fins, a first heat radiating pipe is communicated with the left side of the heat radiating box, and the left end of the first heat radiating pipe is communicated with the right side of the first heat conducting frame, the top of the heat dissipation box is communicated with a micro water pump, the output end of the micro water pump is communicated with a second heat dissipation pipe, and the right end of the second heat dissipation pipe is communicated with the left side of the second heat conduction frame; the left side of the top of the heat dissipation box and the top of the heat conduction pipe are both in threaded connection with an intelligent temperature controller;

the input end electricity of fan is connected with the controller, the input of miniature pump and semiconductor refrigeration piece all is connected with the output electricity of controller, the input electricity of controller is connected with the singlechip, the input of singlechip is connected with the output electricity of intelligent temperature controller.

As the utility model discloses preferred, the top of fan is inlayed and is had the protection network, the protection network is made by the metal.

As the utility model discloses it is preferred, the quantity of communicating pipe one and communicating pipe two is a plurality of, and a plurality of communicating pipe one and communicating pipe two all are the equidistance and distribute.

As the utility model discloses preferred, the bottom of heat pipe and the top fixed connection of heat-conducting plate.

As the utility model discloses it is preferred, the thermovent has been seted up in the front of heat-conducting plate, the quantity of thermovent is a plurality of.

As the utility model discloses preferred, heat pipe, heat conduction frame one and heat conduction frame two are made by red copper.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the computer mainboard body, the heat-conducting plate, the heat pipe, heat radiation fins, the heat dissipation box, heat conduction frame one, heat conduction frame two, communicating pipe one, communicating pipe two, the semiconductor refrigeration piece, the fan, cooling tube one, cooling tube two, micro water pump, intelligent temperature controller, the cooperation of controller and singlechip is used, it generally carries out the forced air cooling heat conduction cooling through fan and fin to have solved current computer mainboard, can not effectively quick intelligent with the temperature reduction to normal temperature, need just can reduce normal temperature through the longer time, be unfavorable for the user to carry out the problem of cooling to the computer mainboard fast, the advantage of intelligent rapid cooling has been possessed, the speed that the user carries out the cooling to the computer mainboard has been improved.

2. The utility model discloses a set up the protection network, can protect the top of fan, the top of having avoided external object to get into the fan causes the influence to the fan, has improved the security of fan.

3. The utility model discloses a quantity with communicating pipe one and communicating pipe two all sets up to a plurality of, can make a plurality of communicating pipe one and communicating pipe two carry the inside into heat conduction frame one and heat conduction frame two with the coolant liquid fast.

4. The utility model discloses a set up the bottom of heat pipe and the top of heat-conducting plate into fixed connection, can make the stable top at the heat-conducting plate of heat pipe use.

5. The utility model discloses a set up the thermovent, can make the outside air circulate in the inside of heat-conducting plate fast, make the effectual increase of radiating effect of heat-conducting plate.

6. The utility model discloses a set up heat pipe, heat conduction frame one and heat conduction frame two all to be made by red copper, can make the heat conduction effect increase of heat pipe, heat conduction frame one and heat conduction frame two, make the coolant liquid dispel the heat fast.

Drawings

FIG. 1 is a schematic front view of the structure of the present invention;

FIG. 2 is a schematic sectional view of the heat dissipation box of the present invention;

FIG. 3 is a schematic diagram of a micro water pump of the present invention;

fig. 4 is a schematic perspective view of the heat pipe of the present invention.

In the figure: 1. a computer motherboard body; 2. a heat conducting plate; 3. a heat conducting pipe; 4. a heat dissipating fin; 5. a heat dissipation box; 6. a first heat conduction frame; 7. a second heat conduction frame; 8. a first communicating pipe; 9. a second communicating pipe; 10. a semiconductor refrigeration sheet; 11. a fan; 12. a first radiating pipe; 13. a second radiating pipe; 14. a micro water pump; 15. an intelligent temperature controller; 16. a controller; 17. a single chip microcomputer; 18. a protective net; 19. and a heat dissipation port.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 to 4, the utility model provides an intelligent cooling computer motherboard, which comprises a computer motherboard body 1;

the computer mainboard comprises a computer mainboard body 1, heat conducting plates 2 are fixedly connected to two sides of the computer mainboard body 1, a heat conducting pipe 3 is transversely arranged at the top of the heat conducting plate 2, heat radiating fins 4 are fixedly installed at the top of the computer mainboard body 1, heat radiating boxes 5 are inlaid at the tops of the heat radiating fins 4, a first heat conducting frame 6 is fixedly connected to the left sides of the heat radiating fins 4, a second heat conducting frame 7 is fixedly connected to the right sides of the heat radiating fins 4, a first communicating pipe 8 is communicated with the front of the first communicating pipe 6, the bottom end of the first communicating pipe 8 is communicated with the front of the heat conducting pipe 3, a second communicating pipe 9 is communicated with the back of the second heat conducting pipe 7, the bottom end of the second communicating pipe 9 is communicated with the back of the heat conducting pipe 3, a refrigerating semiconductor sheet 10 is fixedly connected to the bottom of the heat radiating boxes 5, fans 11 are fixedly installed at the tops of the heat radiating fins 4, a first radiating pipe 12 is communicated with the left ends of the first heat conducting pipes 12, the top of the heat dissipation box 5 is communicated with a micro water pump 14, the output end of the micro water pump 14 is communicated with a second heat dissipation pipe 13, and the right end of the second heat dissipation pipe 13 is communicated with the left side of the second heat conduction frame 7; the left side of the top of the heat dissipation box 5 and the top of the heat conduction pipe 3 are both in threaded connection with an intelligent temperature controller 15;

the input end of the fan 11 is electrically connected with a controller 16, the input ends of the micro water pump 14 and the semiconductor refrigeration sheet 10 are electrically connected with the output end of the controller 16, the input end of the controller 16 is electrically connected with a single chip microcomputer 17, and the input end of the single chip microcomputer 17 is electrically connected with the output end of the intelligent temperature controller 15.

Referring to fig. 2, the top of the fan 11 is inlaid with a protection net 18, and the protection net 18 is made of metal.

As a technical optimization scheme of the utility model, through setting up the protection network 18, can protect fan 11's top, the top of having avoided external object to get into fan 11 causes the influence to fan 11, has improved fan 11's security.

Referring to fig. 1, the number of the first communication pipes 8 and the number of the second communication pipes 9 are a plurality, and the plurality of first communication pipes 8 and the plurality of second communication pipes 9 are distributed equidistantly.

As the utility model discloses a technical optimization scheme all sets up to a plurality of through the quantity with communicating pipe one 8 and communicating pipe two 9, can make a plurality of communicate pipe one 8 and communicating pipe two 9 carry the inside into heat conduction frame one 6 and heat conduction frame two 7 with the coolant liquid fast.

Referring to fig. 1, the bottom of the heat conductive pipe 3 is fixedly connected with the top of the heat conductive plate 2.

As a technical optimization scheme of the utility model, set up to fixed connection through the bottom with heat pipe 3 and heat-conducting plate 2's top, can make heat pipe 3 stable use at heat-conducting plate 2's top.

Referring to fig. 1, the heat-conducting plate 2 has heat-dissipating ports 19 formed on the front surface thereof, and the number of the heat-dissipating ports 19 is several.

As a technical optimization scheme of the utility model, through setting up thermovent 19, can make the outside air circulate in the inside of heat-conducting plate 2 fast, make the effectual increase of radiating effect of heat-conducting plate 2.

Referring to fig. 1, the heat conductive pipe 3, the first heat conductive frame 6, and the second heat conductive frame 7 are made of red copper.

As a technical optimization scheme of the utility model, through all setting up heat pipe 3, heat conduction frame 6 and heat conduction frame two 7 to be made by red copper, can make the heat conduction effect increase of heat pipe 3, heat conduction frame 6 and heat conduction frame two 7, make the coolant liquid dispel the heat fast.

The utility model discloses a theory of operation and use flow: when the computer mainboard cooling device is used, after heat of the computer mainboard body 1 is conducted to the inside of cooling liquid in the heat dissipation box 5 through the heat dissipation box 5 by the heat dissipation fins 4, the heat of the cooling liquid in the heat dissipation box 5 and the heat of the cooling liquid in the heat conduction pipe 3 are detected by the intelligent temperature controller 15, when the temperature is too high, the intelligent temperature controller 15 transmits signals to the single chip microcomputer 17, the single chip microcomputer 17 controls the controller 16 to sequentially start the semiconductor refrigerating sheet 10, the micro water pump 14 and the fan 11, the cooling liquid in the heat dissipation box 5 is cooled after the semiconductor refrigerating sheet 10 is started, the micro water pump 14 transmits the cooling liquid in the heat dissipation box 5 after being cooled by the semiconductor refrigerating sheet 10 into the heat conduction frame II 7 through the heat dissipation pipe II 13, then under the transmission of the communication pipe II 9, the cooling liquid enters the heat conduction pipe 3 to replace the cooling liquid in the heat conduction pipe 3, so that the temperature from the heat conduction plate 1 to the heat conduction plate 2 and the heat conduction pipe 3 is reduced, then the cooling liquid in the heat conduction pipe 3 is conveyed into the heat conduction frame I6 through the communication pipe II 9, and then flows back to the inside of the heat dissipation box 5 through the heat dissipation pipe I12 to be cooled again, the cooling liquid circulating from the inside of the heat conduction frame I6, the heat conduction frame II 7, the heat dissipation pipe I12 and the heat dissipation pipe II 13 can simultaneously reduce the temperature of the heat conduction frame I6, the heat conduction frame II 7, the heat dissipation pipe I12 and the heat dissipation pipe II 13, and then can continuously absorb the temperature in the heat dissipation fins 4, so that the heat of the heat dissipation fins 4 is continuously reduced, after the fan 11 is started, the heat of the heat conduction frame I6, the heat conduction frame II 7, the heat dissipation pipe I12, the heat dissipation pipe II 13, the heat dissipation box 5 and the heat dissipation fins 4 is discharged, so that the heat of the computer main board body 1 is further quickly dissipated, when the internal temperature of the heat dissipation box 5 and the heat conduction pipe 3 is reduced to a set temperature threshold value, the micro water pump 14, the fan 11 and the semiconductor refrigerating sheet 10 are closed, so that the intelligent and quick cooling effect is achieved.

In summary, the following steps: this intelligence cooling computer mainboard, through setting up computer mainboard body 1, the heat-conducting plate 2, heat pipe 3, heat radiation fins 4, heat dissipation box 5, heat conduction frame one 6, heat conduction frame two 7, communicating pipe one 8, communicating pipe two 9, semiconductor refrigeration piece 10, fan 11, cooling tube one 12, cooling tube two 13, micro-water pump 14, intelligent temperature controller 15, controller 16 and singlechip 17's cooperation is used, it generally carries out the forced air cooling heat conduction cooling through fan and fin to have solved current computer mainboard, can not be effectively quick intelligent with the temperature reduction to normal temperature, need just can reduce normal temperature through the longer time, be unfavorable for the user to carry out the problem of cooling to the computer mainboard fast.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An intelligent cooling computer mainboard comprises a computer mainboard body (1);

the method is characterized in that: the heat-conducting plate is characterized in that the heat-conducting plates (2) are fixedly connected to the two sides of the computer mainboard body (1), the heat-conducting pipes (3) are transversely arranged at the top of the heat-conducting plates (2), the heat-radiating fins (4) are fixedly mounted at the top of the computer mainboard body (1), the heat-radiating boxes (5) are embedded at the tops of the heat-radiating fins (4), the heat-conducting frame I (6) is fixedly connected to the left sides of the heat-radiating fins (4), the heat-conducting frame II (7) is fixedly connected to the right sides of the heat-radiating fins (4), the communicating pipe I (8) is communicated with the front side of the heat-conducting pipe (3) at the front side of the heat-conducting frame I (8), the communicating pipe II (9) is communicated with the back side of the heat-conducting pipe II (7), the bottom end of the communicating pipe II (9) is communicated with the back side of the heat-conducting pipes (3), and the semiconductor refrigerating sheets (10) are fixedly connected to the bottom of the heat-radiating boxes (5), the heat dissipation device is characterized in that a fan (11) is fixedly mounted at the top of each heat dissipation fin (4), the left side of the heat dissipation box (5) is communicated with a first heat dissipation tube (12), the left end of the first heat dissipation tube (12) is communicated with the right side of a first heat conduction frame (6), the top of the heat dissipation box (5) is communicated with a miniature water pump (14), the output end of the miniature water pump (14) is communicated with a second heat dissipation tube (13), the right end of the second heat dissipation tube (13) is communicated with the left side of a second heat conduction frame (7), and the left side of the top of the heat dissipation box (5) and the top of the heat conduction tube (3) are both in threaded connection with an intelligent temperature controller (15);

the input electricity of fan (11) is connected with controller (16), the input of miniature pump (14) and semiconductor refrigeration piece (10) all is connected with the output electricity of controller (16), the input electricity of controller (16) is connected with singlechip (17), the input of singlechip (17) is connected with the output electricity of intelligent temperature controller (15).

2. The intelligent cooling computer mainboard of claim 1, wherein: a protective net (18) is embedded at the top of the fan (11).

3. The intelligent cooling computer mainboard of claim 1, wherein: the number of the first communicating pipes (8) and the number of the second communicating pipes (9) are a plurality.

4. The intelligent cooling computer mainboard of claim 1, wherein: the bottom of the heat conduction pipe (3) is fixedly connected with the top of the heat conduction plate (2).

5. The intelligent cooling computer mainboard of claim 1, wherein: the front surface of the heat conducting plate (2) is provided with a heat dissipation port (19).

6. The intelligent cooling computer mainboard of claim 1, wherein: the heat conduction pipe (3), the first heat conduction frame (6) and the second heat conduction frame (7) are all made of red copper.