CN112437590A - Novel heat dissipation device - Google Patents
Novel heat dissipation device Download PDFInfo
- Publication number
- CN112437590A CN112437590A CN202011299816.0A CN202011299816A CN112437590A CN 112437590 A CN112437590 A CN 112437590A CN 202011299816 A CN202011299816 A CN 202011299816A CN 112437590 A CN112437590 A CN 112437590A
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- China
- Prior art keywords
- heat dissipation
- radiator
- fan
- heat
- novel
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 56
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 230000005855 radiation Effects 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a novel heat dissipation device, which comprises a mainboard and a heat dissipation fan, wherein the novel heat dissipation device comprises: the radiator is arranged on the mainboard and is tightly attached to one end of the exhaust port of the heat radiation fan; the heat sink includes: the groove body is used for accommodating a heating element arranged on the main board; the radiating fins are distributed in the radiator and are positioned on two sides of the groove body; and an exhaust heat dissipation channel is formed between the inside of the radiator and an exhaust port of the heat dissipation fan. The technical scheme has the advantages that other heating elements are placed in the radiator, the space in the radiator is fully utilized, and the fan is utilized to simultaneously radiate the radiator and the middle heating elements, so that the utilization rate of the fan is increased, the radiating efficiency is improved, and the space is effectively utilized.
Description
Technical Field
The invention relates to the technical field of equipment device heat dissipation, in particular to a novel heat dissipation device.
Background
With the development of society, people have higher and higher requirements on electronic products, and the trend is that the size is small and the price is low. Generally, electronic products have heating elements therein, and the smaller the volume of the product, the higher the requirement for heat dissipation of internal elements. The existing heat dissipation mode is mainly characterized in that a heat dissipation fan is arranged on a circuit main board, air heat exchange is formed through the work of the heat dissipation fan, and then the high temperature inside equipment is cooled, but the effect of the cooling mode is not obvious, especially for heating elements placed in a concentrated mode, an effective heat dissipation mode is provided for the heating elements, and the improvement of the utilization efficiency of the heat dissipation fan is a problem which needs to be solved urgently at present
Disclosure of Invention
Aiming at the problems of heat dissipation of heating elements on a main board of equipment in the prior art, the novel heat dissipation device for improving the utilization efficiency of the fan and integrally improving the heat dissipation efficiency is provided.
The specific technical scheme is as follows:
the utility model provides a novel heat abstractor, includes, mainboard and cooling blower, wherein, include:
the radiator is arranged on the mainboard and is tightly attached to one end of the exhaust port of the heat radiation fan;
the heat sink includes:
the groove body is used for accommodating a heating element arranged on the main board;
the radiating fins are distributed in the radiator and are positioned on two sides of the groove body;
and an exhaust heat dissipation channel is formed between the inside of the radiator and an exhaust port of the heat dissipation fan.
Preferably, the radiator mainly comprises radiating units which are symmetrical left and right.
Preferably, a pair of the heat dissipation units are fixedly connected in a matching manner through a connecting part.
Preferably, the radiator is provided with a fixing position corresponding to the position where the heat dissipation fan is arranged, and the heat dissipation fan is arranged at the fixing position through a fastening structure.
Preferably, a sliding groove is formed in the top of the radiator along the horizontal direction, a sliding block matched with the sliding groove is arranged on the connecting part, and the sliding block and the sliding groove are fixed in a sliding mode.
Preferably, the heat dissipation unit is provided with a groove oppositely, and the inner side of the tail end of the groove is provided with a hook-shaped structure;
the pair of grooves form the sliding groove structure;
the slider structure includes the fixed strip that sets up along vertical direction and the fixed plate that the horizontal direction set up, the end of fixed plate is provided with the reverse complex screens structure of slot.
Preferably, the heat dissipation fins are regularly arranged from top to bottom.
Preferably, four corners of the radiator are respectively provided with a first fixing hole, four corners of the cooling fan are provided with a second fixing hole corresponding to the first fixing hole, and the first fixing hole and the second fixing hole are fixed through threads.
Preferably, the outer side wall of the radiator is closely attached to a row of heating devices arranged on the mainboard.
Preferably, the cross-sectional area of the air inlet and the air outlet of the heat dissipation fan is smaller than or equal to the cross-sectional area of one end of the heat radiator.
The technical scheme has the following advantages or beneficial effects: other heating elements are placed in the radiator, the space in the radiator is fully utilized, and the fan is utilized to simultaneously radiate the radiator and the middle heating element, so that the utilization rate of the fan is increased, the radiating efficiency is improved, and the space is effectively utilized.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.
Fig. 1 is an exploded view of an embodiment of a novel heat dissipation device of the present invention;
FIG. 2 is an exploded view of an embodiment of a novel heat dissipation device of the present invention;
fig. 3 is an exploded view of an embodiment of a novel heat dissipation device of the present invention.
The above reference numerals denote:
1. a main board; 2. a heat sink; 3. a heating element; 4. a heat radiation fan; 21. a trough body; 22. a fin; heat dissipation units (23, 24); 25. a sliding groove; 26. fixing the position; 27. and a connecting member.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
The invention comprises a novel heat dissipation device.
As shown in fig. 1 to fig. 3, a novel heat dissipation device includes a main board 1 and a heat dissipation fan 4, wherein, includes:
the radiator 2 is arranged on the mainboard 1 and is tightly attached to one end of an exhaust port of the heat radiation fan 4;
the heat sink 2 includes:
a tank 21 for accommodating the heating element 3 provided on the main board 1;
the radiating fins 22 are distributed in the radiator 2 and positioned on two sides of the groove body 21;
an exhaust heat dissipation channel is formed between the interior of the radiator 2 and the exhaust port of the heat dissipation fan 4.
Among the above-mentioned technical scheme, through placing other heating element 3 in the radiator 2, make full use of the space between two radiators 2 utilizes the fan to dispel the heat simultaneously to radiator 2 and middle heating element 3. When the fan-type air cooler works, the fan rotates, air on one side forms negative pressure, and cold air enters from the end face hole of the radiator 2 under the action of the fan and is discharged from the other side of the radiator 2 through the heating element 3 arranged in the middle of the radiator 2 under the action of the fan, so that the heat of the heating element 3 arranged in the middle of the radiator 2 is taken away while the heat on the radiator 2 is taken away, the heat dissipation efficiency is improved, and the space is effectively utilized.
In a preferred embodiment, the heat sink 2 is mainly composed of bilaterally symmetrical heat dissipating units (23, 24).
In a preferred embodiment, a pair of heat dissipating units (23, 24) are fixedly coupled by a coupling member 27.
In a preferred embodiment, the heat sink 2 is provided with a fixing position 26 corresponding to the installation position of the heat dissipation fan 4, and the heat dissipation fan 4 is arranged at the fixing position 26 by a fastening structure.
In a preferred embodiment, the top of the heat sink 2 is provided with a sliding groove 25 along the horizontal direction, the connecting member 27 is provided with a slider matching with the sliding groove 25, and the slider and the sliding groove 25 are fixed in a sliding manner.
In a preferred embodiment, the heat dissipation units (23, 24) are oppositely provided with grooves, and the inner sides of the tail ends of the grooves are provided with hook-shaped structures;
the pair of grooves form a sliding groove 25 structure;
the sliding block structure (not shown in the figure) comprises a fixing strip arranged in the vertical direction and a fixing plate arranged in the horizontal direction, and the tail end of the fixing plate is provided with a clamping structure with a groove in reverse fit.
In the above technical solution, the heat dissipating units (23, 24) may be made of metal material, such as aluminum material, alloy material, etc., and the bottoms of the heat dissipating units (23, 24) and the main board 1 are correspondingly fixed and matched, such as screw thread fixed and matched, which is not limited herein.
In a preferred embodiment, the heat dissipating fins 22 are arranged regularly from top to bottom.
In a preferred embodiment, the four corners of the heat sink 2 are respectively provided with a first fixing hole, the four corners of the heat dissipation fan 4 are provided with a second fixing hole corresponding to the first fixing hole, and the first fixing hole and the second fixing hole are fixed through threads.
In a preferred embodiment, the outer side wall of the heat sink 2 is closely attached to a row of heat generating devices disposed on the motherboard 1.
In a preferred embodiment, the cross-sectional area of the air inlet and outlet of the heat dissipation fan 4 is equal to or less than the cross-sectional area of one end of the heat sink 2.
Among the above-mentioned technical scheme, place other heating element 3 between two mutually combined radiating unit (23, 24), make full use of the space between two radiating unit (23, 24), utilize the fan to dispel the heat to radiator 2 and middle heating element 3 simultaneously to the utilization ratio of fan has been increaseed, has improved the radiating efficiency, has effectively utilized the space.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a novel heat abstractor, includes, mainboard and cooling blower, a serial communication port, include:
the radiator is arranged on the mainboard and is tightly attached to one end of the exhaust port of the heat radiation fan;
the heat sink includes:
the groove body is used for accommodating a heating element arranged on the main board;
the radiating fins are distributed in the radiator and are positioned on two sides of the groove body;
and an exhaust heat dissipation channel is formed between the inside of the radiator and an exhaust port of the heat dissipation fan.
2. The novel heat sink of claim 1, wherein the heat sink consists essentially of bilaterally symmetric heat dissipating units.
3. The novel heat dissipation device as claimed in claim 2, wherein a pair of the heat dissipation units are fixedly connected by a connection member.
4. The novel heat dissipation device as claimed in claim 1, wherein the heat sink is provided with a fixing location corresponding to a position where the heat dissipation fan is disposed, and the heat dissipation fan is disposed at the fixing location through a fastening structure.
5. The novel heat dissipation device as claimed in claim 3, wherein a sliding groove is formed in the top of the heat sink along the horizontal direction, the connecting member is provided with a sliding block matched with the sliding groove, and the sliding block and the sliding groove are slidably fixed.
6. The novel heat dissipation device as claimed in claim 5, wherein the heat dissipation unit is provided with grooves, and a hook-shaped structure is arranged inside the tail end of each groove;
the pair of grooves form the sliding groove structure;
the slider structure includes the fixed strip that sets up along vertical direction and the fixed plate that the horizontal direction set up, the end of fixed plate is provided with the reverse complex screens structure of slot.
7. The novel heat sink as claimed in claim 1, wherein the fins are arranged regularly from top to bottom.
8. The novel heat dissipation device as claimed in claim 4, wherein first fixing holes are respectively formed at four corners of the heat sink, second fixing holes corresponding to the first fixing holes are formed at four corners of the heat dissipation fan, and the first fixing holes and the second fixing holes are fixed through threads.
9. The novel heat dissipation device as claimed in claim 1, wherein the outer side wall of the heat sink is closely attached to a row of heat generating devices disposed on the motherboard.
10. The novel heat dissipation device as claimed in claim 1, wherein the cross-sectional area of the air inlet and outlet of the heat dissipation fan is smaller than or equal to the cross-sectional area of one end of the heat sink.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011299816.0A CN112437590A (en) | 2020-11-18 | 2020-11-18 | Novel heat dissipation device |
| PCT/CN2021/110160 WO2022105306A1 (en) | 2020-11-18 | 2021-08-02 | Novel cooling apparatus |
| US18/253,538 US20230422429A1 (en) | 2020-11-18 | 2021-08-02 | Novel cooling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011299816.0A CN112437590A (en) | 2020-11-18 | 2020-11-18 | Novel heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112437590A true CN112437590A (en) | 2021-03-02 |
Family
ID=74694252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011299816.0A Pending CN112437590A (en) | 2020-11-18 | 2020-11-18 | Novel heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112437590A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105306A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技（上海）有限公司 | Novel cooling apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090237882A1 (en) * | 2008-03-20 | 2009-09-24 | Kuo-Len Lin | Heat sink and heat dissipation device having the same |
| CN201418227Y (en) * | 2009-06-05 | 2010-03-03 | 深圳市宾利达智能科技有限公司 | Novel radiator |
| CN204560113U (en) * | 2015-04-30 | 2015-08-12 | 苏州汇川技术有限公司 | Electric machine controller radiator structure |
| CN107577305A (en) * | 2017-06-14 | 2018-01-12 | 威海职业学院 | A kind of computer housing ventilation heat abstractor |
| CN214206200U (en) * | 2020-11-18 | 2021-09-14 | 纽福克斯光电科技（上海）有限公司 | Novel heat dissipation device |
-
2020
- 2020-11-18 CN CN202011299816.0A patent/CN112437590A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090237882A1 (en) * | 2008-03-20 | 2009-09-24 | Kuo-Len Lin | Heat sink and heat dissipation device having the same |
| CN201418227Y (en) * | 2009-06-05 | 2010-03-03 | 深圳市宾利达智能科技有限公司 | Novel radiator |
| CN204560113U (en) * | 2015-04-30 | 2015-08-12 | 苏州汇川技术有限公司 | Electric machine controller radiator structure |
| CN107577305A (en) * | 2017-06-14 | 2018-01-12 | 威海职业学院 | A kind of computer housing ventilation heat abstractor |
| CN214206200U (en) * | 2020-11-18 | 2021-09-14 | 纽福克斯光电科技（上海）有限公司 | Novel heat dissipation device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105306A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技（上海）有限公司 | Novel cooling apparatus |
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