CN210534699U - Heat dissipation module structure for server - Google Patents
Heat dissipation module structure for server Download PDFInfo
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- CN210534699U CN210534699U CN201921396472.8U CN201921396472U CN210534699U CN 210534699 U CN210534699 U CN 210534699U CN 201921396472 U CN201921396472 U CN 201921396472U CN 210534699 U CN210534699 U CN 210534699U
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- Prior art keywords
- base plate
- server
- fin group
- heat dissipation
- module structure
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- 230000017525 heat dissipation Effects 0.000 title claims description 25
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000003507 refrigerant Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat radiation module structure for server, which comprises a base plate and a fin group arranged on the base plate, wherein the surface of one side of the base plate is provided with a mounting groove, the fin group is connected in the mounting groove, one side of the base plate, which is opposite to the fin group, is connected with a heat source body, and one sides of the base plate, the fin group and the heat source body are provided with fans; the fin group comprises a plurality of L-shaped fins, a gap is formed between every two adjacent fins, bent parts of the fins are inserted into the mounting grooves to be fixed, the fins comprise two metal plates, four sides of each metal plate are attached, a cavity is formed in the middle of each metal plate, and a refrigerant is filled in the cavity. The utility model discloses can promote radiator fin surface temperature's homogeneity, make and utilize the fan to drive the air flow and dispel the heat, improve the radiating efficiency.
Description
Technical Field
The utility model relates to a server is with heat dissipation module structure belongs to heat dissipation part field.
Background
With the rapid development of electronic technology, the demand for higher performance, higher density and higher intelligence of chips, the integration level, packaging density and operating frequency of chips are continuously improved, the required power consumption of a single chip is increased, high heat flux density thermal control or cooling processing mode of a large server has been widely concerned, and the design requirement of a compact structure of equipment makes heat dissipation more difficult, so that in order to enable the chips to operate normally more efficiently and more stably, the size and weight of the heat sink are larger and heavier in order to maintain the efficient heat dissipation function of the heat sink, however, various electronic components, structural members, chips and the like in a server system occupy a certain space, the space provided for the heat sink is very limited, and the stamped fin heat sink for the server in the prior art utilizes a fan to drive air to flow so as to exchange heat with heat collecting fins, so as to take away the heat of the fins to achieve the purpose of cooling. However, the thickness of the fins is small, so that the temperature difference between the low end with high temperature and the top end with low temperature of the fins is large, and the efficiency of the radiator is low. Therefore, how to effectively improve the efficiency of the heat sink on the premise of not increasing the volume of the heat sink as much as possible becomes the direction of efforts of numerous engineers.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a server is with heat dissipation module structure, this server is with heat dissipation module structure can promote radiator fin surface temperature's homogeneity, makes to utilize the fan to drive the air flow and dispels the heat, has improved the radiating efficiency.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a heat radiation module structure for a server comprises a substrate and a fin group arranged on the substrate, wherein a mounting groove is formed in the surface of one side of the substrate, the fin group is connected in the mounting groove, a heat source body is connected to the side, opposite to the fin group, of the substrate, and fans are arranged on the sides of the substrate, the fin group and the heat source body;
the fin group comprises a plurality of L-shaped fins, a gap is formed between every two adjacent fins, bent parts of the fins are inserted into the mounting grooves to be fixed, the fins comprise two metal plates, four sides of each metal plate are attached, a cavity is formed in the middle of each metal plate, and a refrigerant is filled in the cavity.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the heat source body is connected to the substrate through the heat conducting glue.
2. In the above scheme, the edge of base plate is equipped with a plurality of screws, and every screw in-connection has a swivel nut, there is the plastic packing ring between the head of swivel nut and the base plate, keep away from head one side on the swivel nut and be equipped with the lantern ring.
3. In the above scheme, the metal plate of the fin is provided with a plurality of connecting points to divide the cavity into a plurality of flow channels.
4. In the above scheme, the fin group is connected to the base plate in an adhesive manner
5. In the above scheme, the substrate is a copper plate.
6. In the above scheme, the heat source body is a chip module or a circuit board.
Because of the application of the technical scheme, compared with the prior art, the utility model have following advantage and effect:
1. the utility model discloses a server is with heat dissipation module structure, including base plate and the fin group of installing on the base plate, the fin on the fin group is the L type, inserts the bending portion of L type fin in the mounting groove, can increase the area of contact with the heat source, improves heat transfer rate, reduces the radiating time, realizes the even distribution of fin from bottom to top temperature, because be equipped with the clearance between the fin, can form the wind channel, when the fan blows towards the wind channel, can further increase heat dissipation rate; when the base plate is under the condition that the size is the same, the short edge of the fin can be bent into a smaller size, so that the fin distance is reduced, the number of fins is increased, the contact area with a heat source is ensured, and meanwhile, the heat dissipation effect of the radiator is improved.
2. The utility model discloses a server is with heat dissipation module structure, the edge of its base plate is equipped with a plurality of screws, connects with a swivel nut in each screw, there is the plastic packing ring between the base plate and the head of swivel nut, can prevent that swivel nut and bottom plate friction from producing the metal fillings when the lock solid, thereby fall into the product, produce bad consequence; meanwhile, the screw sleeve is provided with a plastic lantern ring, so that the falling of the screw in the transportation process can be avoided.
Drawings
Fig. 1 is a structural schematic diagram of a heat dissipation module for a server according to the present invention;
fig. 2 is a schematic diagram of a fin structure in a heat dissipation module structure for a server according to the present invention;
fig. 3 is a schematic diagram of a substrate structure in the heat dissipation module structure for the server of the present invention;
fig. 4 is a schematic diagram of a thread insert structure in the heat dissipation module structure for the server of the present invention;
fig. 5 is a schematic view of the connection structure of the heat source body of the heat dissipation module structure clock for the server of the present invention.
In the above drawings: 1. a substrate; 11. mounting grooves; 13. a screw hole; 15. a threaded sleeve; 16. a plastic gasket; 17. a plastic collar; 2. a fin set; 21. a metal plate; 22. a joining point; 3. a fan; 4. a heat source body; 41. and (4) heat-conducting glue.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a heat radiation module structure for a server comprises a base plate 1 and a fin group 2 arranged on the base plate 1, wherein a mounting groove 11 is formed in the surface of one side of the base plate 1, the fin group 2 is connected in the mounting groove 11, a heat source body 4 is connected to the side, opposite to the fin group 2, of the base plate 1, and a fan 3 is arranged on one side of the base plate 1, the fin group 2 and the heat source body 4;
the fin group 2 comprises a plurality of L-shaped fins, a gap is formed between every two adjacent fins, the bent parts of the fins are inserted into the mounting grooves 11 for fixation, each fin comprises two metal plates 21, four sides of each metal plate 21 are attached, a cavity is formed in the middle of each metal plate, and a refrigerant is filled in the cavity.
The heat source body 4 is connected to the substrate 1 by a heat conductive paste 41.
The edge of above-mentioned base plate 1 is equipped with a plurality of screw holes 13, connects with a swivel nut 15 in every screw hole 13, there is plastic washer 16 between the head of swivel nut 15 and the base plate 1, keep away from head one side on the swivel nut 15 and be equipped with lantern ring 17.
The heat source 4 is a chip module.
Example 2: a heat radiation module structure for a server comprises a base plate 1 and a fin group 2 arranged on the base plate 1, wherein a mounting groove 11 is formed in the surface of one side of the base plate 1, the fin group 2 is connected in the mounting groove 11, a heat source body 4 is connected to the side, opposite to the fin group 2, of the base plate 1, and a fan 3 is arranged on one side of the base plate 1, the fin group 2 and the heat source body 4;
the fin group 2 comprises a plurality of L-shaped fins, a gap is formed between every two adjacent fins, the bent parts of the fins are inserted into the mounting grooves 11 for fixation, each fin comprises two metal plates 21, four sides of each metal plate 21 are attached, a cavity is formed in the middle of each metal plate, and a refrigerant is filled in the cavity.
The heat source body 4 is connected to the substrate 1 by a heat conductive paste 41.
The metal plate 21 of the fin is provided with a plurality of connecting points 22 to divide the cavity into a plurality of flow channels.
The fin group 2 is connected to the base plate 1 by means of gluing
The substrate 1 is a copper plate.
The heat source body 4 is a circuit board.
The radiating module structure for the server comprises a base plate and a fin group arranged on the base plate, wherein the fins on the fin group are L-shaped, the bent parts of the L-shaped fins are inserted into the mounting grooves, the contact area between the L-shaped fins and a heat source can be increased, the heat transfer rate is improved, the radiating time is reduced, the uniform distribution of the temperature of the fins from the bottom to the top is realized, an air channel can be formed due to the gaps among the fins, and the radiating rate can be further increased when the fan blows air towards the air channel; when the base plate is under the condition that the size is the same, the short edge of the fin can be bent into a smaller size, so that the fin distance is reduced, the number of fins is increased, the contact area with a heat source is ensured, and meanwhile, the heat dissipation effect of the radiator is improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (7)
1. A heat dissipation module structure for server, its characterized in that: the heat source device comprises a base plate (1) and a fin group (2) arranged on the base plate (1), wherein a mounting groove (11) is formed in the surface of one side of the base plate (1), the fin group (2) is connected in the mounting groove (11), a heat source body (4) is connected to the side, opposite to the fin group (2), of the base plate (1), and a fan (3) is arranged on one side of the base plate (1), the fin group (2) and the heat source body (4);
the fin group (2) comprises a plurality of L-shaped fins, a gap is formed between every two adjacent fins, bent portions of the fins are inserted into the mounting grooves (11) to be fixed, the fins comprise two metal plates (21), four sides of the metal plates (21) are attached, a cavity is formed in the middle of the metal plates, and refrigerants are filled in the cavity.
2. The heat dissipation module structure for server as claimed in claim 1, wherein: the heat source body (4) is connected to the substrate (1) through heat conducting glue (41).
3. The heat dissipation module structure for server as claimed in claim 1, wherein: the edge of base plate (1) is equipped with a plurality of screw (13), and every screw (13) in-connection has a swivel nut (15), there is plastic washer (16) between the head of swivel nut (15) and base plate (1), keep away from head one side on swivel nut (15) and be equipped with lantern ring (17).
4. The heat dissipation module structure for server as claimed in claim 1, wherein: a plurality of connecting points (22) are arranged on a metal plate (21) of the fin to divide the cavity into a plurality of flow channels.
5. The heat dissipation module structure for server as claimed in claim 1, wherein: the fin group (2) is connected to the base plate (1) in an adhesive mode.
6. The heat dissipation module structure for server as claimed in claim 1, wherein: the substrate (1) is a copper plate.
7. The heat dissipation module structure for server as claimed in claim 1, wherein: the heat source body (4) is a chip module or a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921396472.8U CN210534699U (en) | 2019-08-27 | 2019-08-27 | Heat dissipation module structure for server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921396472.8U CN210534699U (en) | 2019-08-27 | 2019-08-27 | Heat dissipation module structure for server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210534699U true CN210534699U (en) | 2020-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921396472.8U Active CN210534699U (en) | 2019-08-27 | 2019-08-27 | Heat dissipation module structure for server |
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| Country | Link |
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| CN (1) | CN210534699U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111902020A (en) * | 2020-07-16 | 2020-11-06 | 深圳市飞荣达科技股份有限公司 | Heat dissipation assembly and installation method thereof |
| CN112714600A (en) * | 2020-12-30 | 2021-04-27 | 苏州浪潮智能科技有限公司 | Edge server and control cabinet |
-
2019
- 2019-08-27 CN CN201921396472.8U patent/CN210534699U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111902020A (en) * | 2020-07-16 | 2020-11-06 | 深圳市飞荣达科技股份有限公司 | Heat dissipation assembly and installation method thereof |
| CN112714600A (en) * | 2020-12-30 | 2021-04-27 | 苏州浪潮智能科技有限公司 | Edge server and control cabinet |
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