CN201418227Y - Novel radiator - Google Patents
Novel radiator Download PDFInfo
- Publication number
- CN201418227Y CN201418227Y CN2009201325541U CN200920132554U CN201418227Y CN 201418227 Y CN201418227 Y CN 201418227Y CN 2009201325541 U CN2009201325541 U CN 2009201325541U CN 200920132554 U CN200920132554 U CN 200920132554U CN 201418227 Y CN201418227 Y CN 201418227Y
- Authority
- CN
- China
- Prior art keywords
- radiator
- mainboard
- heater members
- heating device
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract 8
- 238000010586 diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Landscapes
- Central Heating Systems (AREA)
Abstract
The utility model is suitable for the technical field of heat dissipation, and discloses a novel radiator. The novel radiator is a heat conductor; a plurality of radiating fins are arranged in parallel on the outer surface of the radiator; the radiator is provided with a hollow cavity for accommodating a heating part and a mainboard; the heating device is fixed on the mainboard fixed with the radiator; and the heating device and the radiator are in connection contact. In an embodiment of the novel radiator, the hollow cavity accommodating the heating part and the mainboard is arranged, the heating device is fixed on the mainboard fixed with the radiator, and the heating device and the radiator are in connection contact. Because the heating device is in direct contact with the radiator, theradiator can perform heat dissipation to the heating part and be used as a housing at the same time, and the radiator with a larger area has high heat dissipation efficiency; and at the same time, noradiating devices are required to be added, so that the volume of a product using the radiator can be reduced, and the cost is further reduced.
Description
Technical field
The utility model relates to the heat dissipation technology field, particularly a kind of new radiator that is used for electronic product.
Background technology
Development of electronic technology, electronic product is miniaturization more and more, makes things convenient for the user to carry and use becomes a kind of development trend.
Existing electronic product all can produce more heat when working, and must heat in time be left by heat abstractor, makes product be operated in a suitable temperature environment, could guarantee the stability and the reliability of product.Because the electronic product inner space is limited, when heat abstractor is set, just must increase described electronic product volume, just have enough spaces and be used to place described heat abstractor, thereby described miniaturization of electronic products is restricted, is difficult to reduce the volume of electronic product.Simultaneously because the construction for heat radiating device more complicated needs to adopt the device of forced heat radiation just can reach better radiating effect.
The utility model content
The technical problem that the utility model mainly solves provides a kind of new radiator, and this heat spreader structures is simple, the radiating efficiency height, and the while can reduce to use the volume of this radiator product.
In order to address the above problem, the utility model provides a kind of new radiator, this radiator is a heat conductor, be provided with a plurality of fin in that its outer surface is parallel, described radiator is provided with the cavity of accommodating heater members and mainboard, described heater members is fixed on the described mainboard of fixing with described radiator, and this heater members is connected contact with described radiator.
Preferably, described radiator two ends are respectively equipped with a cover plate, and this cover plate cooperates fixing with described radiator, in the hole that is provided with the input/output interface coupling that is provided with on a plurality of and described mainboard on the described cover plate.
Preferably, described radiator is in the form of slot.
Preferably, described radiator also comprises fixed head, and this fixed head is provided with two guiding ribs, and this guiding rib is provided with T-slot with the end face of the dual-side of described groove and cooperates fixing.
Preferably, described radiator is an aluminium alloy.
The utility model radiator, by accommodating the cavity of heater members and mainboard, described heater members is fixed on the described mainboard of fixing with described radiator, and this heater members is connected contact with described radiator.Compared with prior art, because described heater members directly contacts with described radiator, be provided with a plurality of parallel fin at the outer surface of this radiator, this radiator also uses as shell when described heater members is dispelled the heat, the area of this radiator is bigger, the radiating efficiency height; Simultaneously do not need to increase radiating element, therefore can reduce to use the volume of the product of this radiator, further reduce cost.
Description of drawings
Fig. 1 is the utility model radiator example structure schematic diagram;
Fig. 2 is that the utility model radiator embodiment is along A-A ' directional profile schematic diagram;
Fig. 3 is the utility model radiator Embodiment B part-structure enlarged diagram;
Fig. 4 is the utility model radiator Embodiment C part-structure enlarged diagram.
Below in conjunction with embodiment, and with reference to accompanying drawing, realization, functional characteristics and the advantage of the utility model purpose is described further.
Embodiment
The utility model radiator embodiment, by accommodating the cavity of heater members and mainboard, described heater members is fixed on the described mainboard of fixing with described radiator, and this heater members is connected contact with described radiator.Because described heater members directly contacts with described radiator, this radiator also uses as shell when described heater members is dispelled the heat, and the area of this radiator is bigger, the radiating efficiency height; Simultaneously do not need to increase radiating element, realize reducing using the volume of the product of this radiator, the purpose that further reduces cost.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the utility model radiator proposes an embodiment.
Described radiator 1 is a heat conductor, the outer surface of this radiator 1 is parallel to be provided with a plurality of fin 11, described radiator 1 is provided with the cavity 5 of accommodating heater members 4 and mainboard 3, described heater members 4 is fixed on the described mainboard of fixing with described radiator 13, and this heater members 4 is connected contact with the inwall of described radiator 1.
Because described heater members 4 directly contacts with described radiator 1, this radiator 1 also uses as shell when described heater members 4 is dispelled the heat, and the area of dissipation of this radiator 1 is bigger, so the radiating efficiency height; Under other radiating element situations of increasing, can realize better radiating effect, thereby can realize reducing to use the small product size of this radiator 1, the purpose that further reduces cost.
Specifically, described radiator 1 is in the form of slot.Described heater members 4 is connected with circuit on the described mainboard 3, and this mainboard 3 is arranged in the cavity 5 that the radiator 1 of groove shape forms, and fixing with described radiator 1 by screw, and described heater members 4 contacts with the inwall of described radiator 1 to be fixed.
When 4 work of described heater members, the heat energy that produces, the radiator 1 by contact with it carries out heat loss through conduction, and by described fin 11 is faster heat is shed.Described radiator 1 can be used as the shell of the mainboard 3 that is provided with multiple electronic device circuit again when heater members 4 is dispelled the heat.Therefore can realize high efficiency heat radiation, under other radiating element situations of increasing, reduce to use the small product size of this radiator 1 simultaneously, further reduce cost.
In the above-described embodiments, described radiator 1 is a heat conductor, as metal or metal alloy, is preferably aluminium alloy.Described fin 11 can be made as heat radiation gear piece or other as required and have the plates of heat sinking function, the many more heat radiations of the quantity of this fin 11 good more.Described heater members 4 can produce the device of a large amount of heats for being arranged on processing apparatus on the mainboard 1, high-power MOS tube etc. in the time of also can being other work.The two ends of described radiator 1 can be respectively equipped with a cover plate 6, and this cover plate 6 cooperates fixing with described radiator 1, in the hole 61 that is provided with the input/output interface coupling that is provided with on a plurality of and described mainboard 3 on the described cover plate 6.Described radiator 1 also comprises fixed head 2, and 2 are provided with two guiding ribs 21 on this fixed head, and this guiding rib 21 is provided with T-slot 12 with the end face of the dual-side of groove shape radiator 1 and cooperates fixing.Be provided with the fixing hole 22 that is used for fixing described radiator 1 on this fixed head 2, the quantity of this fixing hole 22 can be provided with according to need.
The above only is a preferred embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (5)
1. new radiator, this radiator is a heat conductor, is provided with a plurality of fin in that its outer surface is parallel, it is characterized in that:
Described radiator is provided with the cavity of accommodating heater members and mainboard, and described heater members is fixed on the described mainboard of fixing with described radiator, and this heater members is connected contact with described radiator.
2. according to the described new radiator of claim 1, it is characterized in that:
Described radiator two ends are respectively equipped with a cover plate, and this cover plate cooperates fixing with described radiator, in the hole that is provided with the input/output interface coupling that is provided with on a plurality of and described mainboard on the described cover plate.
3. according to claim 1 or 2 described new radiators, it is characterized in that:
Described radiator is in the form of slot.
4. according to the described new radiator of claim 3, it is characterized in that:
Described radiator also comprises fixed head, and this fixed head is provided with two guiding ribs, and this guiding rib is provided with T-slot with the end face of the dual-side of described groove and cooperates fixing.
5. according to the described new radiator of claim 4, it is characterized in that:
Described radiator is an aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201325541U CN201418227Y (en) | 2009-06-05 | 2009-06-05 | Novel radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201325541U CN201418227Y (en) | 2009-06-05 | 2009-06-05 | Novel radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201418227Y true CN201418227Y (en) | 2010-03-03 |
Family
ID=41794654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201325541U Expired - Fee Related CN201418227Y (en) | 2009-06-05 | 2009-06-05 | Novel radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201418227Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686088A (en) * | 2012-06-11 | 2012-09-19 | 厦门蓝溪科技有限公司 | Multi-temperature zone radiating structure and method for electrical equipment |
| CN103425215A (en) * | 2013-07-31 | 2013-12-04 | 昆山维金五金制品有限公司 | CUP radiator |
| CN104202944A (en) * | 2014-08-08 | 2014-12-10 | 华为技术有限公司 | Single-plate cooling device and communication equipment |
| CN104486933A (en) * | 2014-12-16 | 2015-04-01 | 中冶南方（武汉）自动化有限公司 | Shell structure of motor controller |
| WO2018032578A1 (en) * | 2016-08-19 | 2018-02-22 | 益德电子科技（杭州）有限公司 | Computer chassis |
| CN112437590A (en) * | 2020-11-18 | 2021-03-02 | 纽福克斯光电科技（上海）有限公司 | Novel heat dissipation device |
| WO2022105306A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技（上海）有限公司 | Novel cooling apparatus |
-
2009
- 2009-06-05 CN CN2009201325541U patent/CN201418227Y/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102686088A (en) * | 2012-06-11 | 2012-09-19 | 厦门蓝溪科技有限公司 | Multi-temperature zone radiating structure and method for electrical equipment |
| CN103425215A (en) * | 2013-07-31 | 2013-12-04 | 昆山维金五金制品有限公司 | CUP radiator |
| CN104202944A (en) * | 2014-08-08 | 2014-12-10 | 华为技术有限公司 | Single-plate cooling device and communication equipment |
| CN104202944B (en) * | 2014-08-08 | 2017-04-12 | 华为技术有限公司 | Single-plate cooling device and communication equipment |
| CN104486933A (en) * | 2014-12-16 | 2015-04-01 | 中冶南方（武汉）自动化有限公司 | Shell structure of motor controller |
| WO2018032578A1 (en) * | 2016-08-19 | 2018-02-22 | 益德电子科技（杭州）有限公司 | Computer chassis |
| CN112437590A (en) * | 2020-11-18 | 2021-03-02 | 纽福克斯光电科技（上海）有限公司 | Novel heat dissipation device |
| WO2022105306A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技（上海）有限公司 | Novel cooling apparatus |
| CN112437590B (en) * | 2020-11-18 | 2025-02-25 | 纽福克斯光电科技（上海）有限公司 | A new type of heat dissipation device |
| US12302528B2 (en) | 2020-11-18 | 2025-05-13 | New Focus Lighting & Power Technology (Shanghai) Co., Ltd. | Cooling apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201418227Y (en) | Novel radiator | |
| CN106535565B (en) | A kind of mobile terminal radiator structure and mobile terminal | |
| CN215647984U (en) | Electronic device with liquid cooling mechanism | |
| CN215421387U (en) | Heat radiation module | |
| CN203133734U (en) | Completely-sealed chassis with radiating system | |
| CN110726318A (en) | A miniature MIMO antenna heat pipe radiator | |
| CN201726609U (en) | Novel heat radiation casing | |
| CN201418228Y (en) | Heat sink | |
| CN201184991Y (en) | Efficient radiator | |
| CN202546853U (en) | Quick-heat-dissipation electromagnetic oven | |
| CN213988458U (en) | High-power chip resistor | |
| CN203687710U (en) | Novel heat radiator | |
| CN210806305U (en) | Heat radiation structure of laser | |
| CN203934257U (en) | Radiator | |
| CN208462264U (en) | A kind of double-sided substrate corrugated teeth module heat radiator | |
| CN102413663B (en) | Manufacturing method of heat radiation device | |
| CN201438803U (en) | Waved electric power electronic sunflower radiator | |
| CN206331356U (en) | The radiating subassembly of notebook computer | |
| CN201639905U (en) | Heat radiation module with flat plate type heat pipe | |
| CN206481541U (en) | Heat radiation module | |
| CN218848707U (en) | Radiator with heat energy conversion function | |
| CN212034606U (en) | 3D type temperature-uniforming plate | |
| CN218888913U (en) | Small-size fragment of brick power module structure | |
| CN214206213U (en) | Printing ink formula shaping heat conduction post | |
| CN214474860U (en) | Notebook radiator convenient to adjust |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Benpo Intelligent Technology Co., Ltd. Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Benpo Intelligent Technology Co., Ltd. Document name: Notification of Termination of Patent Right |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100303 Termination date: 20130605 |