CN114190063B - Integrated directional immersion cooling type server module and data center - Google Patents
Integrated directional immersion cooling type server module and data center Download PDFInfo
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- CN114190063B CN114190063B CN202111607904.7A CN202111607904A CN114190063B CN 114190063 B CN114190063 B CN 114190063B CN 202111607904 A CN202111607904 A CN 202111607904A CN 114190063 B CN114190063 B CN 114190063B
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- 238000001816 cooling Methods 0.000 title claims abstract description 80
- 238000007654 immersion Methods 0.000 title claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 113
- 238000005192 partition Methods 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 238000009434 installation Methods 0.000 claims description 16
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 abstract description 4
- 206010011469 Crying Diseases 0.000 abstract 1
- 239000000110 cooling liquid Substances 0.000 description 21
- 239000002826 coolant Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008676 import Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an integrated directional immersion cooling type server module and a data center applying the same, and relates to the technical field of server hardware equipment. The server module comprises a main box body, wherein a server, a plate heat exchanger, a first air-cooled radiator and a first circulating pump are arranged in the main box body, a first circulating loop is formed through a pipeline, and the plate heat exchanger and the first air-cooled radiator are connected in parallel on the first circulating loop. A first partition plate is arranged in the main box body to divide the inner space of the main box body into an upper space and a lower space. The server is arranged in the upper space, and the plate heat exchanger, the first air cooling radiator and the first circulating pump are arranged in the lower space. The main box body is provided with an air inlet communicated with the lower space. The problem that traditional indirect contact liquid cooling's weeping risk and direct contact liquid cooling exist is big with the granularity, inconvenient maintenance has been solved to this scheme.
Description
Technical Field
The invention relates to the technical field of server hardware equipment, in particular to an integrated directional immersion cooling type server module and a data center.
Background
In the field of server cooling, liquid cooling is an emerging server cooling method, and is divided into a direct contact type liquid cooling mode and an indirect contact type liquid cooling mode.
The indirect contact liquid cooling is to use a liquid cooling cold plate to contact heating components such as a CPU and the like, and the cooling liquid flows in the cold plate through a connecting pipeline or a flow channel to replace the traditional fan for heat exchange. By adopting the heat exchange mode, the heat exchange device has the advantages that the traditional convection heat exchange between air and the CPU is changed into the convection heat exchange and heat conduction of the cooling liquid-cold plate-CPU, the convection heat exchange coefficient is greatly increased, and the heat exchange device has obvious advantages for cooling the CPU. However, the traditional water cooling plate is in contact with the CPU, so that the risk of 'water entering the server' exists, and once the interface is leaked, the server is greatly damaged, so that the safety of a liquid cooling technology by using water is reduced.
The direct contact liquid cooling means that the cooling liquid directly contacts with the heating component of the server, and the liquid flows through the server and takes away the heat generated by the heating component of the server. Typically, such liquids are selected to be insulating, non-toxic, non-corrosive, low viscosity, and the like. The cooling mode is divided into single-phase immersion cooling and two-phase immersion cooling according to whether the liquid changes phase when cooling the server. The two modes share that the liquid fully covers the whole server, the heat exchange is uniform, the effect of a server fan is completely omitted, and the energy is saved. However, in general, when designing such a cooling form, a large-sized cooling box is designed, and a plurality of sets of servers are all placed in the box for centralized cooling. Therefore, there are the following problems:
first, the traditional direct contact liquid cooling is to place all servers in the box for centralized cooling, so that the granularity of the system is large, and when the liquid cooling system is maintained, all servers need to be closed, and the influence on all servers can be caused.
Secondly, because the box size is great, the flow rate of server liquid flow through the server is slower, and convection heat transfer coefficient is little, and to high power density region such as chip, heat transfer capacity is limited, still easily produces local hot spot, simultaneously, too big box can bear too much coolant liquid, causes the coolant liquid to use excessively, also can cause the coolant liquid to volatilize easily and extravagant.
Disclosure of Invention
Aiming at the problems, the invention provides an integrated directional immersion cooling type server module and a data center using the same, which not only solve the problem that the traditional indirect contact type liquid cooling exists that the cooling of a water cooling plate has the risk of liquid leakage, but also solve the problems that the traditional direct contact type liquid cooling exists that the granularity is large, the maintenance operation is inconvenient, the consumption of the cooling liquid is large, and the volatilization is easy.
The technical scheme adopted for solving the technical problems is as follows:
an integrated directional immersion cooling type server module comprises a main box body, wherein a server, a plate heat exchanger, a first air cooling radiator and a first circulating pump are arranged in the main box body, and a liquid inlet main pipe and a liquid outlet main pipe are arranged on a shell of the server;
the server, the plate heat exchanger, the first air-cooled radiator and the first circulating pump are connected through pipelines to form a first circulating loop, and the plate heat exchanger and the first air-cooled radiator are connected in parallel on the first circulating loop;
a first partition plate is arranged in the main box body, and divides the inner space of the main box body into an upper space and a lower space;
the server is arranged in the upper space, and the plate heat exchanger, the first air cooling radiator and the first circulating pump are arranged in the lower space;
the main box body is provided with an air inlet communicated with the lower space.
Further, a chip radiator is arranged on the high-power consumption element of the server, the chip radiator comprises a shell with an opening at the front end, a plurality of second partition boards are arranged in the shell, the second partition boards divide the inner space of the shell into a plurality of flow channels, and a liquid inlet branch pipe is arranged on the rear side wall of the shell and connected with the liquid inlet main pipe.
Further, the rear side wall of the server shell is connected with the liquid outlet main pipe through a liquid outlet branch pipe.
Further, a second liquid return pipe and a first liquid return pipe are respectively arranged in an upper layer space and a lower layer space of the main box body, a connecting pipe used for communicating the first liquid return pipe and the second liquid return pipe is arranged between the first liquid return pipe and the second liquid return pipe, the liquid outlet main pipe is connected with the second liquid return pipe through a pipeline, and the first liquid return pipe is respectively connected with the plate heat exchanger and the first air-cooled radiator through pipelines.
Further, a filter is arranged on the first circulation loop and positioned on the upstream side of the plate heat exchanger and the first air-cooled radiator.
Further, the first circulation loop is provided with a pressure sensor, a temperature sensor and a flow sensor on the upstream side and the downstream side of the server.
Further, a second circulating pump is arranged in the lower space of the main box body, and the first circulating pump and the second circulating pump are connected in parallel on the first circulating loop.
The utility model provides an use integrative directional submergence cooling type server module's data center, includes the body frame, the front side of body frame is provided with cooling fan, the body frame in be located cooling fan's rear side is provided with the server module, just the air intake of server module is towards the front side.
The utility model provides an use integrative directional submergence cooling type server module's data center, includes the body frame, the body frame in be provided with the server module, the rear side of body frame is provided with the installation box, the installation box in be provided with inlet tube and outlet pipe, the secondary side import of the plate heat exchanger of server module and secondary side export link to each other through the pipeline respectively with inlet tube and outlet pipe, inlet tube and outlet pipe link to each other through the export and the import of pipeline with the second forced air cooling radiator respectively.
Further, the second air-cooled radiator is arranged on the rear side face of the installation box, a plurality of the second air-cooled radiators are connected in series, and a cold air inlet is formed in the installation box body.
The beneficial effects of the invention are as follows:
1. the scheme solves the problem that the traditional indirect contact type liquid cooling exists in the case of liquid leakage risk due to cooling of the water cooling plate, and solves the problems that the traditional direct contact type liquid cooling exists in the case of large granularity, inconvenient maintenance operation, large consumption of cooling liquid and easy volatilization.
2. According to the scheme, the server module is designed into a complete immersed liquid cooling data center module, namely, the server is packaged in the main box body and is immersed and cooled independently, so that more flexible arrangement and operation of immersed liquid cooling can be realized, the arrangement form of the whole immersed liquid cooling cabinet is the same as that of a traditional cabinet, the granularity of a system is effectively reduced, operation and maintenance are facilitated, and space is saved.
2. The main box body for containing the server is effectively reduced in size, so that the flow rate of cooling liquid flowing through the server is improved, the heat exchange effect is optimized, and local hot spots are not easy to generate; meanwhile, the consumption of the cooling liquid is reduced, and the problems of volatilization and waste of the cooling liquid are solved.
3. Through increasing directional cooling's chip radiator to the server, when the coolant liquid flows into the server region, under the pipeline constraint, the coolant liquid flows into special structure's cold plate radiator earlier, carries out the heat transfer to the core chip that generates heat, after accomplishing the heat transfer, the coolant liquid flows by the radiator, and flows through other low-power consumption heating parts and cool off, has optimized server part cooling sequence, improves whole heat transfer effect.
4. In the scheme, the server is completely packaged, and the server is not in contact with cooling water, so that the system safety is higher.
5. The data center applying the server module can increase or decrease server nodes according to the whole size and calculation requirement, and has no influence on the whole system.
6. By applying the data center of the server module, the final heat exchange supports an air cooling mode and a liquid cooling mode, so that the application scene and the environment of the equipment are greatly expanded.
7. Compared with the existing immersed liquid cooling products, the data center is improved in the aspects of cost, equipment safety, chip power consumption support and the like, and the development of liquid cooling of the data center can be effectively promoted.
Drawings
Fig. 1 is a schematic perspective view (exploded view) of the present server module;
FIG. 2 is a schematic diagram of the internal structure of the present server module;
FIG. 3 is a schematic view showing the internal structure of the lower space of the main casing;
FIG. 4 is a schematic view showing the internal structure of the upper space of the main casing;
FIG. 5 is a schematic diagram of a connection relationship between a server housing and a chip heat sink;
FIG. 6 is a schematic perspective view of a chip heat spreader;
FIG. 7 is a schematic diagram of the internal structure of a chip heat spreader;
FIG. 8 is a schematic diagram showing the connection relationship between the first liquid return pipe and the second liquid return pipe;
FIG. 9 is a schematic diagram of a system cabinet;
FIG. 10 is a schematic diagram of airflow within a server module in a system enclosure;
FIG. 11 is a schematic diagram of a system cabinet in a second embodiment;
fig. 12 is a schematic structural diagram of a system cabinet in the third embodiment.
In the figure: a 1-a server module, which is configured to,
111-a main box body, 112-a first partition board, 113-an air inlet,
12-server, 121-shell, 122-CPU, 124-chip radiator, 1241-shell, 1242-second baffle, 1243-liquid inlet branch pipe, 1244-liquid inlet main pipe, 125-liquid outlet main pipe, 126-liquid outlet branch pipe,
131-a first liquid return pipe, 132-a second liquid return pipe, 133-a connecting pipe,
141-a first circulation pump, 142-a second circulation pump,
a 15-plate heat exchanger, wherein the heat exchanger comprises a heat exchanger body,
16-a first air-cooled heat sink,
171-first line, 172-second line, 173-third line, 174-fourth line, 175-fifth line, 176-sixth line, 177-seventh line, 178-eighth line, 179-ninth line,
181-first control valve, 182-second control valve, 183-third control valve, 184-fourth control valve, 185-fifth control valve,
191-filters, 192-pressure sensors, 193-temperature sensors, 194-flow sensors,
2-main frame body, 21-installation box body, 211-cold air inlet,
a 3-cooling fan for cooling the air,
4-a second air-cooled radiator,
51-a water inlet pipe, 52-a water outlet pipe,
61-first conduit, 62-second conduit, 63-third conduit, 64-fourth conduit,
7-a third circulating pump.
Detailed Description
Example 1
For convenience of description, the coordinate system is defined as shown in fig. 1, and the left-right direction is a transverse direction, the front-back direction is a longitudinal direction, and the up-down direction is a vertical direction.
As shown in fig. 1 and 2, an integrated directional immersion cooling type server module includes a main casing 111, a first partition board 112 is disposed in the main casing 111, and the first partition board 112 divides an inner space of the main casing 111 into an upper space and a lower space which are not communicated with each other, and are respectively an upper space and a lower space. The upper space is fixedly provided with a server 12, that is, the server 12 is encapsulated in the upper space of the main box 111. An air inlet 113 is formed in the front side wall of the lower space, and an air outlet is formed in the right side wall of the lower space.
As shown in fig. 3, a first liquid return pipe 131, a first circulating pump 141, a plate heat exchanger 15, and a first air-cooled radiator 16 disposed at an air outlet are disposed in a lower space of the main casing 111. The outlet of the first liquid return pipe 131 is connected to the inlet of the first air-cooled radiator 16 and the primary inlet of the plate heat exchanger 15 through a first pipe group, and the first pipe group includes a first pipe 171 and a second pipe 172, that is, the outlet of the first liquid return pipe 131 is connected to the inlet of the first air-cooled radiator 16 and the primary inlet of the plate heat exchanger 15 through the first pipe 171 and the second pipe 172, respectively. The outlet of the first air-cooled radiator 16 is connected to the inlet of the first circulation pump 141 through a third pipe 173, and the primary side outlet of the plate heat exchanger 15 is connected to the inlet of the first circulation pump 141 through a fourth pipe 174. Namely, the first air-cooled radiator 16 and the plate heat exchanger 15 are connected in parallel between the first liquid return pipe 131 and the circulating pump.
The first pipe group is provided with a control valve group for controlling the flow direction of the cooling liquid, as a specific implementation manner, the first pipeline 171 and the second pipeline 172 in this embodiment have a common part, the control valve group includes a first control valve 181 disposed on the common part of the first pipeline 171 and the second pipeline 172, the first pipeline 171 is provided with a second control valve 182 capable of controlling the on-off of the first pipeline 171 only, the second pipeline 172 is provided with a third control valve 183 capable of controlling the on-off of the second pipeline 172 only, that is, the second control valve 182 and the third control valve 183 are disposed on independent parts of the first pipeline 171 and the second pipeline 172 respectively. The third pipeline 173 is provided with a fourth control valve 184 for controlling the on-off of the third pipeline 173, and the fourth pipeline 174 is provided with a fifth control valve 185 for controlling the on-off of the fourth pipeline 174.
Further, as shown in fig. 3, a filter 191, a pressure sensor 192, a temperature sensor 193, and a flow sensor 194 are sequentially disposed on a common portion of the first pipe 171 and the second pipe 172 in the flow direction of the cooling liquid.
As shown in fig. 5, the high power consumption components of the server 12 are provided with a chip heat sink 124. The high power consumption element can be set by the user according to the requirement, such as a CPU or a GPU. As a specific implementation manner, the high-power consumption element in this embodiment is a CPU122, and two CPUs 122 are disposed in the server. The high power consumption elements (CPU) are each provided with a chip heat sink 124.
As shown in fig. 6 and 7, the chip heat sink 124 includes a rectangular parallelepiped housing 1241 with an opening facing the front side, a plurality of second partitions 1242 are vertically disposed between the upper and lower sidewalls of the housing 1241 in the left-right direction, and the second partitions 1242 divide the inner space of the housing 1241 into a plurality of flow paths extending in the front-rear direction. The rear end of the second partition 1242 is spaced from the rear side wall of the housing 1241 by a certain distance, and the rear side wall of the housing 1241 is provided with a liquid inlet branch pipe 1243 which is communicated with the inner space of the housing 1241. A liquid inlet main pipe 1244 extending in the left-right direction is disposed in the housing 121 of the server 12 at the rear side of the chip radiator 124, the liquid inlet branch pipe 1243 is connected with the liquid inlet main pipe 1244, and the liquid inlet main pipe 1244 is communicated with the inner space of the housing 1241 of the chip radiator 124 through the liquid inlet branch pipe 1243. The left end of the main liquid inlet pipe 1244 is a blind end, the right end of the main liquid inlet pipe 1244 is open, and the open end of the main liquid inlet pipe 1244 extends to the outside of the housing 121 of the server 12 through the housing 121 of the server 12.
As shown in fig. 5, a main liquid outlet pipe 125 extending in the left-right direction is disposed at the rear side of the server 12, a plurality of branch liquid outlet pipes 126 are disposed between the main liquid outlet pipe 125 and the housing 121 of the server 12, and the main liquid outlet pipe 125 is communicated with the inner space of the housing 121 of the server 12 through the branch liquid outlet pipes 126.
As shown in fig. 3 and 4, the outlet of the first circulating pump 141 is connected to the inlet of the main liquid inlet pipe 1244 through a fifth pipe 175, and the first partition 112 is provided with a through hole for accommodating the fifth pipe 175. The second liquid return pipe 132 is disposed on the front side of the server 12 in the upper space, the right end of the main liquid outlet pipe 125 is a blind end, the left end of the main liquid outlet pipe 125 is an open end, and the open end of the main liquid outlet pipe 125 is connected to the inlet of the second liquid return pipe 132 through a sixth pipeline 176. As shown in fig. 8, a connection pipe 133 for connecting the first liquid return pipe 131 and the second liquid return pipe 132 is disposed between the first liquid return pipe 131 and the second liquid return pipe 132, and a through hole for accommodating the connection pipe 133 is disposed on the first partition 112. Preferably, the first liquid return pipe 131 and the second liquid return pipe 132 are arranged in parallel, the second liquid return pipe 132 is located right above the first liquid return pipe 131, a plurality of connecting pipes 133 are arranged between the first liquid return pipe 131 and the second liquid return pipe 132, and the plurality of connecting pipes 133 are uniformly arranged along the axial directions of the first liquid return pipe 131 and the second liquid return pipe 132.
Further, as shown in fig. 3, a second circulation pump 142 is disposed in the lower space of the main tank 111, the outlet of the first air-cooled radiator 16 is connected to the inlet of the second circulation pump 142 through a seventh pipeline 177, and the primary side outlet of the plate heat exchanger 15 is connected to the inlet of the second circulation pump 142 through an eighth pipeline 178. The first circulating pump 141 and the second circulating pump 142 are connected in parallel. The fourth control valve 184 is disposed on a common portion of the third pipeline 173 and the seventh pipeline 177, and the fifth control valve 185 is disposed on a common portion of the fourth pipeline 174 and the eighth pipeline 178. The outlet of the second circulation pump 142 is connected to the inlet of the main liquid inlet pipe 1244 via a ninth pipeline 179, and the first partition 112 is provided with a through hole for accommodating the ninth pipeline 179.
The reason for this design is that an effect of backup can be produced, when one of the circulation pumps fails, the other circulation pump can be started, and the reliability of operation is ensured.
Further, as shown in fig. 4, the fifth pipe 175 and the ninth pipe 179 have a common portion, and a pressure sensor 192, a temperature sensor 193, and a flow sensor 194 are sequentially disposed on the common portion of the fifth pipe 175 and the ninth pipe 179 along the flow direction of the coolant. Preferably, a pressure sensor 192, a temperature sensor 193 and a flow sensor 194, which are located on a common portion of the fifth pipe 175 and the ninth pipe 179, are located in the upper space of the main tank 111.
In operation, by providing the chip radiator 124, the coolant just entering the server 12 (at which time the coolant temperature is the lowest) can be restrained and directed so that the coolant flows through the area where heat generation is the most serious. The cooling liquid is then ejected through the opening at the front end of the chip radiator 124 and moves forward. When the coolant flows to the front end of the server 12, the coolant is blocked and flows backward, and finally flows out through the rear side outlet branch pipe 126 and enters the outlet main pipe 125. The coolant flowing out of the main liquid outlet pipe 125 passes through the sixth pipe 176, the second return pipe 132, and the first return pipe 131 in this order, and enters the filter 191. Then, when the cooling liquid is cooled by air cooling, the first control valve 181, the second control valve 182 and the fourth control valve 184 are opened, the third control valve 183 and the fifth control valve 185 are closed, and the cooling liquid flows through the first air-cooled radiator 16 and then re-enters the server 12. When the cooling liquid is cooled by water cooling, the first control valve 181, the third control valve 183 and the fifth control valve 185 are opened, and the second control valve 182 and the fourth control valve 184 are closed, so that the cooling liquid flows through the plate heat exchanger 15 and then reenters the server 12.
As shown in fig. 9 and 10, a data center using an integrated directional immersion cooling type server module includes a main frame 2, a cooling fan 3 is disposed on a front side of the main frame 2, a plurality of server modules 1 arranged in an up-down direction are disposed on a rear side of the cooling fan 3 in the main frame 2, and an air inlet 113 of the server modules 1 faces to a front side.
As a specific implementation manner, the main frame 2 in this embodiment includes a cuboid frame, a plurality of layers of support frames are disposed in the cuboid frame, and the server module 1 is fixedly disposed on the support frames. The front side of the main frame body 2 is provided with an opening towards the rear side of the installation box body 21, the rear end of the installation box body 21 is fixedly connected with the main frame body 2, the front side surface of the installation box body 21 is uniformly distributed with installation holes, and each installation hole is internally provided with a cooling fan 3.
In operation, air flow enters the lower space of the main casing 111 of the server module 1 through the cooling fan 3 and exits the server module 1 through the first air-cooled radiator 16. At this time, the first control valve 181, the second control valve 182 and the fourth control valve 184 in the server module 1 are opened, the third control valve 183 and the fifth control valve 185 are closed, the cooling liquid flows through the first air-cooled radiator 16, the cooling air exchanges heat with the cooling liquid flowing through the air-cooled radiator, thereby cooling the cooling liquid, and the cooled cooling liquid is again introduced into the server 12 in the upper space of the main casing 111, and the heating element in the server 12 is cooled.
Example two
As shown in fig. 11, a data center using an integrated directional immersion cooling type server module includes a main frame 2, as a specific implementation manner, the main frame 2 in this embodiment includes a cuboid frame, a plurality of support frames are disposed in the cuboid frame, a server module 1 is disposed on the support frames, and the server module 1 is fixedly connected with the support frames through screws.
The rear side of the main frame body 2 is provided with a mounting box body 21, and the rear side surface of the mounting box body 21 is provided with a second air-cooled radiator 4. The installation box 21 is internally provided with a water inlet pipe 51 and a water outlet pipe 52 which extend along the vertical direction, the secondary side inlet of the plate heat exchanger 15 of the server module 1 is connected with the water inlet pipe 51 through a first pipeline 61, and the secondary side outlet of the plate heat exchanger 15 of the server module 1 is connected with the water outlet pipe 52 through a second pipeline 62. The lower end (i.e., the open end) of the water inlet pipe 51 is connected to the outlet of the second air-cooled radiator 4 through a third pipe 63, and the lower end (i.e., the open end) of the water outlet is connected to the inlet of the second air-cooled radiator 4 through a fourth pipe 64.
Preferably, a plurality of second air-cooled radiators 4 are disposed on the rear side of the mounting box 21, and a plurality of the second air-cooled radiators 4 are connected in series.
The third pipe 63 or the fourth pipe 64 is provided with a third circulation pump 7, and as a specific embodiment, the third pipe 63 is provided with the third circulation pump 7.
The mounting box 21 is provided with a cold air inlet 211, and preferably, the cold air inlet 211 is arranged on the upper side surface of the mounting box.
The structure of the server module 1 is the same as that of the first embodiment, and will not be described herein.
Example III
As shown in fig. 12, the second air-cooled radiator 4 is disposed outside the installation box 21, and the other structures are the same as those of the second embodiment.
Example IV
A filter 191, a pressure sensor 192, a temperature sensor 193 and a flow sensor 194 are sequentially disposed on the independent portion of the first pipeline 171 along the flow direction of the cooling liquid. A filter 191, a pressure sensor 192, a temperature sensor 193 and a flow sensor 194 are sequentially disposed on the independent portion of the second pipe 172 along the flow direction of the cooling liquid.
The rest of the structure is the same as that of the first embodiment.
Example five
A pressure sensor 192, a temperature sensor 193 and a flow sensor 194 are sequentially disposed on the independent portion of the fifth pipe 175 along the flow direction of the cooling liquid. A pressure sensor 192, a temperature sensor 193 and a flow sensor 194 are sequentially disposed on the independent portion of the ninth pipe 179 in the flow direction of the coolant.
The rest of the structure is the same as that of the first embodiment.
Example six
The control valve group on the first pipe group is a three-way valve arranged on the first pipe group. The rest of the structure is the same as that of the first embodiment.
Example seven
The first liquid return pipe 131, the second liquid return pipe 132 and the connecting pipe 133 are removed, and the open end of the main liquid outlet pipe 125 is directly connected to the inlet of the filter 191 through a sixth pipeline 176. The first partition 112 is provided with a through hole for receiving the sixth pipe 176.
The rest of the structure is the same as that of the first embodiment.
Example eight
The filter 191, the pressure sensor 192, the temperature sensor 193, the flow sensor 194 and the control valve group on the first pipe group are all located in the upper space of the main tank 111, and the other structures are the same as the first embodiment.
Claims (10)
1. An integrated directional immersion cooling server module, characterized by: the device comprises a main box body, wherein a server, a plate heat exchanger, a first air-cooled radiator and a first circulating pump are arranged in the main box body, and a liquid inlet main pipe and a liquid outlet main pipe are arranged on a shell of the server;
the server, the plate heat exchanger, the first air-cooled radiator and the first circulating pump are connected through pipelines to form a first circulating loop, and the plate heat exchanger and the first air-cooled radiator are connected in parallel on the first circulating loop;
a first partition plate is arranged in the main box body, and divides the inner space of the main box body into an upper space and a lower space;
the server is arranged in the upper space, and the plate heat exchanger, the first air cooling radiator and the first circulating pump are arranged in the lower space;
the main box body is provided with an air inlet communicated with the lower space.
2. An integrated directional immersion cooling server module as claimed in claim 1, wherein: the high-power consumption element of the server is provided with a chip radiator, the chip radiator comprises a shell with an opening at the front end, a plurality of second partition boards are arranged in the shell, the second partition boards divide the inner space of the shell into a plurality of flow channels, and the rear side wall of the shell is provided with a liquid inlet branch pipe which is connected with the liquid inlet main pipe.
3. An integrated directional immersion cooling server module as claimed in claim 2, wherein: the rear side wall of the server shell is connected with the liquid outlet main pipe through a liquid outlet branch pipe.
4. An integrated directional immersion cooling server module as claimed in claim 1, wherein: the upper space and the lower space of the main box body are respectively provided with a second liquid return pipe and a first liquid return pipe, a connecting pipe used for communicating the first liquid return pipe and the second liquid return pipe is arranged between the first liquid return pipe and the second liquid return pipe, the liquid outlet main pipe is connected with the second liquid return pipe through a pipeline, and the first liquid return pipe is respectively connected with the plate heat exchanger and the first air-cooled radiator through pipelines.
5. An integrated directional immersion cooling server module as claimed in claim 1, wherein: and a filter is arranged on the first circulation loop and positioned on the upstream side of the plate heat exchanger and the first air cooling radiator.
6. An integrated directional immersion cooling server module as claimed in claim 1, wherein: and the first circulation loop is provided with a pressure sensor, a temperature sensor and a flow sensor on the upstream side and the downstream side of the server.
7. An integrated directional immersion cooling server module as claimed in claim 1, wherein: a second circulating pump is arranged in the lower space of the main box body, and the first circulating pump and the second circulating pump are connected in parallel to the first circulating loop.
8. A data center employing the integrated directional immersion-cooled server module of any one of claims 1-7, characterized by: the cooling fan is arranged on the front side of the main frame body, a server module is arranged on the rear side of the cooling fan in the main frame body, and an air inlet of the server module faces to the front side.
9. A data center employing the integrated directional immersion-cooled server module of any one of claims 1-7, characterized by: the plate type heat exchanger comprises a main frame body, wherein a server module is arranged in the main frame body, an installation box body is arranged on the rear side of the main frame body, a water inlet pipe and a water outlet pipe are arranged in the installation box body, a secondary side inlet and a secondary side outlet of the plate type heat exchanger of the server module are respectively connected with the water inlet pipe and the water outlet pipe through pipelines, and the water inlet pipe and the water outlet pipe are respectively connected with an outlet and an inlet of a second air cooling radiator through pipelines.
10. A data center employing the integrated directional immersion-cooled server module of any one of claims 1-7 as claimed in claim 9, wherein: the second air-cooled radiator is arranged on the rear side face of the installation box, a plurality of second air-cooled radiators are connected in series, and a cold air inlet is formed in the installation box body.
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| CN114756110A (en) * | 2022-06-16 | 2022-07-15 | 天津提尔科技有限公司 | Low-voltage direct-current power supply immersion liquid cooling calculation server |
| CN116321934B (en) * | 2022-12-30 | 2023-12-22 | 比赫电气（太仓）有限公司 | 5U rack-type immersion liquid cooling system |
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| CN107889433A (en) * | 2017-12-11 | 2018-04-06 | 四川中庸药业有限公司 | A kind of moistureproof water cooling server |
| WO2019015321A1 (en) * | 2017-07-17 | 2019-01-24 | 华为技术有限公司 | Immersed type liquid cooling apparatus, blade type server and frame type server |
| KR20190137221A (en) * | 2018-06-01 | 2019-12-11 | 박흥열 | Water-cooled rack mount server chassis |
| CN111465274A (en) * | 2020-04-21 | 2020-07-28 | 广州智冷节能科技有限公司 | Single-cabinet modular server liquid cooling system and control method thereof |
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| CN104754924B (en) * | 2015-03-31 | 2016-02-03 | 广东申菱环境系统股份有限公司 | The server radiating system that liquid cooling apparatus and auxiliary radiating device combine |
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| WO2019015321A1 (en) * | 2017-07-17 | 2019-01-24 | 华为技术有限公司 | Immersed type liquid cooling apparatus, blade type server and frame type server |
| CN107889433A (en) * | 2017-12-11 | 2018-04-06 | 四川中庸药业有限公司 | A kind of moistureproof water cooling server |
| KR20190137221A (en) * | 2018-06-01 | 2019-12-11 | 박흥열 | Water-cooled rack mount server chassis |
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