CN114190063A - Integrated directional immersion cooling type server module and data center - Google Patents
Integrated directional immersion cooling type server module and data center Download PDFInfo
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- CN114190063A CN114190063A CN202111607904.7A CN202111607904A CN114190063A CN 114190063 A CN114190063 A CN 114190063A CN 202111607904 A CN202111607904 A CN 202111607904A CN 114190063 A CN114190063 A CN 114190063A
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- 238000001816 cooling Methods 0.000 title claims abstract description 66
- 238000007654 immersion Methods 0.000 title claims abstract description 14
- 239000007788 liquid Substances 0.000 claims abstract description 114
- 238000005192 partition Methods 0.000 claims abstract description 14
- 238000009434 installation Methods 0.000 claims description 16
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 206010011469 Crying Diseases 0.000 abstract description 2
- 239000002826 coolant Substances 0.000 description 20
- 239000000110 cooling liquid Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses an integrated directional immersion cooling type server module and a data center applying the same, and relates to the technical field of server hardware equipment. The server module comprises a main box body, wherein a server, a plate heat exchanger, a first air-cooled radiator and a first circulating pump are arranged in the main box body, a first circulating loop is formed through a pipeline, and the plate heat exchanger and the first air-cooled radiator are connected on the first circulating loop in parallel. A first partition plate is arranged in the main box body and divides the inner space of the main box body into an upper layer space and a lower layer space. The server is arranged in the upper layer space, and the plate heat exchanger, the first air-cooled radiator and the first circulating pump are arranged in the lower layer space. The main box body is provided with an air inlet communicated with the lower layer space. The problem that the weeping risk of traditional indirect contact liquid cooling and the granularity that direct contact liquid cooling exists are big, not convenient for maintain has been solved to this scheme.
Description
Technical Field
The invention relates to the technical field of server hardware equipment, in particular to an integrated directional immersion cooling type server module and a data center.
Background
In the field of server cooling, liquid cooling is a new server refrigeration method and is divided into a direct contact type liquid cooling mode and an indirect contact type liquid cooling mode.
Indirect contact type liquid cooling is to use a liquid cooling plate to contact with heat generating components such as a CPU, and the cooling plate is internally provided with a flow channel or a connecting pipeline so that cooling liquid flows to replace the traditional fan for heat exchange. By adopting the heat exchange mode, the heat exchange device has the advantages that the traditional heat convection between air and a CPU is changed into the heat convection and heat conduction of cooling liquid, a cold plate and the CPU, the heat convection coefficient is greatly increased, and the heat exchange device has obvious advantages of cooling the CPU. However, the traditional water cooling plate is in contact with the CPU, so that the risk of water entering the server exists, once leakage occurs at the interface, the server is greatly damaged, and the safety of the liquid cooling technology by using water is reduced.
Direct contact liquid cooling means that cooling liquid directly contacts with a server heating component, and the liquid flows through the server and takes away heat generated by the server heating component. Generally, the liquid is selected from insulating, nontoxic, non-corrosive, low-viscosity and other characteristic liquids. The cooling method is divided into single-phase immersion cooling and two-phase immersion cooling according to whether the liquid has phase change when cooling the server. The two modes have the common characteristic that the liquid covers the whole server completely, the heat exchange is uniform, the fan function of the server is completely omitted, and the energy is saved. However, in general, when designing such a cooling form, a cooling cabinet with a large size is designed, and a plurality of groups of servers are all placed in the cooling cabinet to perform centralized cooling. Therefore, there are the following problems:
first, traditional direct contact liquid cooling is with all servers placed in this box, carries out centralized cooling, and the system granularity is great, like this, when maintaining the liquid cooling system, need close all servers, can cause the influence to all servers.
Secondly, because the box size is great, the server liquid flows through the server velocity of flow is slower, and the convection heat transfer coefficient is little, and to high power density region such as chip, heat transfer capacity is limited, still easily produces local hot spot, and simultaneously, too big box can bear too much coolant liquid, causes the coolant liquid when the excessive use, also can cause the coolant liquid easily to volatilize and waste.
Disclosure of Invention
Aiming at the problems, the invention provides an integrated directional immersion cooling type server module and a data center applying the server module, and the scheme not only solves the problem that the traditional indirect contact type liquid cooling has the risk of liquid leakage caused by cooling a water cooling plate, but also solves the problems that the traditional direct contact type liquid cooling has large granularity, is inconvenient to maintain and operate, has large coolant consumption and is volatile.
The technical scheme adopted by the invention for solving the technical problems is as follows:
an integrated directional immersion cooling type server module comprises a main box body, wherein a server, a plate heat exchanger, a first air-cooled radiator and a first circulating pump are arranged in the main box body, and a liquid inlet main pipe and a liquid outlet main pipe are arranged on a shell of the server;
the server, the plate heat exchanger, the first air-cooled radiator and the first circulating pump are connected through pipelines and form a first circulating loop, and the plate heat exchanger and the first air-cooled radiator are connected in parallel on the first circulating loop;
a first partition plate is arranged in the main box body, and the first partition plate divides the inner space of the main box body into an upper layer space and a lower layer space;
the server is arranged in the upper layer space, and the plate heat exchanger, the first air-cooled radiator and the first circulating pump are arranged in the lower layer space;
the main box body is provided with an air inlet communicated with the lower layer space.
Further, be provided with the chip radiator on the high-power consumption component of server, the chip radiator include a front end open-ended shell, the shell in be provided with a plurality of second baffles, just the second baffle will the inner space of shell is cut apart into a plurality of runners, there is the feed liquor branch pipe on the back lateral wall of shell, the feed liquor branch pipe with the feed liquor be responsible for and be connected.
Furthermore, the rear side wall of the server shell is connected with the main liquid outlet pipe through a liquid outlet branch pipe.
Further, a second liquid return pipe and a first liquid return pipe are respectively arranged in the upper layer space and the lower layer space of the main box body, a connecting pipe used for communicating the first liquid return pipe and the second liquid return pipe is arranged between the first liquid return pipe and the second liquid return pipe, the liquid outlet main pipe is connected with the second liquid return pipe through a pipeline, and the first liquid return pipe is connected with the plate type heat exchanger and the first air-cooled radiator through a pipeline.
Further, a filter is arranged on the first circulation loop and located on the upstream side of the plate heat exchanger and the first air-cooled radiator.
Further, a pressure sensor, a temperature sensor and a flow sensor are arranged on the first circulation loop on the upstream side and the downstream side of the server.
Furthermore, a second circulating pump is arranged in the lower-layer space of the main tank body, and the first circulating pump and the second circulating pump are connected in parallel on the first circulating loop.
A data center applying an integrated directional immersion cooling type server module comprises a main frame body, wherein a cooling fan is arranged on the front side of the main frame body, a server module is arranged on the rear side, located in the main frame body, of the cooling fan, and an air inlet of the server module faces the front side.
The utility model provides an use data center of directional submergence cooling server module of an organic whole, includes the body frame body, the body frame in be provided with the server module, the rear side of the body frame body is provided with the installation box, the installation box in be provided with inlet tube and outlet pipe, the secondary side import and the secondary side export of the plate heat exchanger of server module respectively through the pipeline with inlet tube and outlet pipe link to each other, inlet tube and outlet pipe respectively through pipeline and the export and the import of second air-cooled radiator link to each other.
Furthermore, the second air-cooled radiators are arranged on the rear side face of the installation box and are connected in series, and a cold air inlet is formed in the installation box body.
The invention has the beneficial effects that:
1. this scheme has not only solved the problem that the water-cooling plate cooling that traditional indirect contact formula liquid cooling exists has the weeping risk, and it is big still to have solved the granularity that traditional direct contact formula liquid cooling exists, and maintenance operation and coolant liquid quantity are big not convenient for, volatile problem.
2. This scheme designs into a complete submergence formula liquid cooling data center module with the server module, will be about to the server encapsulation in the main tank body, carries out the submergence cooling alone, consequently can realize the more nimble arrangement and the operation of submergence formula liquid cooling, whole submergence formula liquid cooling rack is the same with traditional rack arrangement form like this, has effectively reduced the granularity of system, is convenient for fortune dimension and operation, saves space more.
2. The scheme effectively reduces the size of the main box body for containing the server, thereby improving the flow rate of the cooling liquid flowing through the server, optimizing the heat exchange effect and being difficult to generate local hot spots; meanwhile, the consumption of the cooling liquid is reduced, and the problems of volatilization and waste of the cooling liquid are solved.
3. Through increasing directional refrigerated chip radiator to the server, when the coolant liquid flows into the server region, under the pipeline restraint, the coolant liquid flows into special construction's cold plate radiator earlier, generates heat the chip to the core and carries out the heat transfer, and after accomplishing the heat transfer, the coolant liquid flows out by the radiator, and the other low-power consumption parts that generate heat of cocurrent flow have optimized server part cooling order, improve whole heat transfer effect.
4. In the scheme, the server is completely packaged, no contact with cooling water is possible, and the system safety is higher.
5. The data center using the server module can increase or decrease the number of server nodes according to the overall size and the calculation requirement, and has no influence on the whole computer system.
6. The data center using the server module finally exchanges heat to support an air cooling mode and a liquid cooling mode, and application scenes and environments of the equipment are greatly expanded.
7. Compared with the existing immersed liquid cooling product, the data center has the advantages that the cost, the equipment safety, the power consumption of the support chip and the like are improved, and the liquid cooling development of the data center can be effectively promoted.
Drawings
Fig. 1 is a schematic perspective view (exploded view) of the server module;
FIG. 2 is a schematic diagram of the internal structure of the server module;
FIG. 3 is a schematic view showing an internal structure of a lower space of the main casing;
FIG. 4 is a schematic view showing an internal structure of an upper space of the main casing;
FIG. 5 is a schematic diagram of the connection between the server housing and the chip heat sink;
FIG. 6 is a schematic perspective view of a chip heat spreader;
FIG. 7 is a schematic diagram of the internal structure of a chip heat spreader;
FIG. 8 is a schematic view of the connection between the first liquid return pipe and the second liquid return pipe;
FIG. 9 is a schematic structural diagram of a system cabinet;
FIG. 10 is a schematic view of airflow within a server module in a system cabinet;
FIG. 11 is a schematic structural diagram of a system cabinet according to a second embodiment;
fig. 12 is a schematic structural diagram of a system cabinet in the third embodiment.
In the figure: 1-a server module for storing and transmitting the data,
111-main box, 112-first baffle, 113-air inlet,
12-server, 121-shell, 122-CPU, 124-chip radiator, 1241-shell, 1242-second clapboard, 1243-liquid inlet branch pipe, 1244-liquid inlet main pipe, 125-liquid outlet main pipe, 126-liquid outlet branch pipe,
131-a first liquid return pipe, 132-a second liquid return pipe, 133-a connecting pipe,
141-a first circulation pump, 142-a second circulation pump,
15-a plate-type heat exchanger, and,
16-a first air-cooled heat sink,
171-first line, 172-second line, 173-third line, 174-fourth line, 175-fifth line, 176-sixth line, 177-seventh line, 178-eighth line, 179-ninth line,
181-first control valve, 182-second control valve, 183-third control valve, 184-fourth control valve, 185-fifth control valve,
191-filter, 192-pressure sensor, 193-temperature sensor, 194-flow sensor,
2-main frame body, 21-installation box body, 211-cold air inlet,
3-a cooling fan, wherein the cooling fan is arranged on the frame,
4-a second air-cooled heat sink,
51-a water inlet pipe, 52-a water outlet pipe,
61-a first pipe, 62-a second pipe, 63-a third pipe, 64-a fourth pipe,
7-third circulation pump.
Detailed Description
Example one
For convenience of description, a coordinate system is defined as shown in fig. 1, and the left-right direction is taken as a transverse direction, the front-back direction is taken as a longitudinal direction, and the up-down direction is taken as a vertical direction.
As shown in fig. 1 and 2, an integrated directional immersion cooling type server module includes a main box 111, a first partition plate 112 is disposed in the main box 111, and the first partition plate 112 divides an internal space of the main box 111 into an upper space and a lower space which are not communicated with each other, respectively. The upper space is fixedly provided with a server 12, that is, the server 12 is encapsulated in the upper space of the main box 111. An air inlet 113 is formed in the front side wall of the lower-layer space, and an air outlet is formed in the right side wall of the lower-layer space.
As shown in fig. 3, a first liquid return pipe 131, a first circulation pump 141, a plate heat exchanger 15, and a first air-cooled radiator 16 disposed at an air outlet are disposed in the lower space of the main box 111. The outlet of the first liquid return pipe 131 is connected to the inlet of the first air-cooled radiator 16 and the primary inlet of the plate heat exchanger 15 through a first pipe group, where the first pipe group includes a first pipe 171 and a second pipe 172, that is, the outlet of the first liquid return pipe 131 is connected to the inlet of the first air-cooled radiator 16 and the primary inlet of the plate heat exchanger 15 through the first pipe 171 and the second pipe 172, respectively. The outlet of the first air-cooled radiator 16 is connected to the inlet of the first circulation pump 141 through a third pipe 173, and the outlet of the primary side of the plate heat exchanger 15 is connected to the inlet of the first circulation pump 141 through a fourth pipe 174. Namely, the first air-cooled radiator 16 and the plate heat exchanger 15 are connected in parallel between the first liquid return pipe 131 and the circulating pump.
As a specific implementation manner, in this embodiment, the first pipeline 171 and the second pipeline 172 have a common portion, the control valve group includes a first control valve 181 disposed on the common portion of the first pipeline 171 and the second pipeline 172, the first pipeline 171 is provided with a second control valve 182 capable of controlling the on-off of the first pipeline 171 only, the second pipeline 172 is provided with a third control valve 183 capable of controlling the on-off of the second pipeline 172 only, that is, the second control valve 182 and the third control valve 183 are disposed on the independent portions of the first pipeline 171 and the second pipeline 172 respectively. A fourth control valve 184 is arranged on the third pipeline 173 for controlling the on-off of the third pipeline 173, and a fifth control valve 185 is arranged on the fourth pipeline 174 for controlling the on-off of the fourth pipeline 174.
Further, as shown in fig. 3, a filter 191, a pressure sensor 192, a temperature sensor 193, and a flow sensor 194 are sequentially disposed on a common portion of the first and second pipes 171 and 172 in a flow direction of the cooling liquid.
As shown in fig. 5, a chip heat sink 124 is disposed on the high power consumption component of the server 12. Here, the high power consumption element may be configured according to the requirement, such as a CPU or a GPU. As a specific implementation manner, the high power consumption component in this embodiment is a CPU122, and two CPUs 122 are disposed in the server. The high power consumption Components (CPU) are all provided with a chip heat sink 124.
As shown in fig. 6 and 7, the chip heat sink 124 includes a rectangular parallelepiped housing 1241 having an opening facing the front side, a plurality of second partitions 1242 vertically arranged are provided between the upper and lower sidewalls of the housing 1241 in the left-right direction, and the second partitions 1242 divide the internal space of the housing 1241 into a plurality of flow channels extending in the front-rear direction. A certain distance is provided between the rear end of the second partition 1242 and the rear side wall of the housing 1241, and a liquid inlet branch pipe 1243 communicated with the inner space of the housing 1241 is disposed on the rear side wall of the housing 1241. The casing 121 of the server 12 is provided with a liquid inlet main pipe 1244 extending along the left-right direction at the rear side of the chip radiator 124, the liquid inlet branch pipe 1243 is connected with the liquid inlet main pipe 1244, and the liquid inlet main pipe 1244 is communicated with the inner space of the casing 1241 of the chip radiator 124 through the liquid inlet branch pipe 1243. The left end of the liquid inlet main pipe 1244 is a blind end, the right end of the liquid inlet main pipe 1244 is open, and the open end of the liquid inlet main pipe 1244 passes through the casing 121 of the server 12 and extends to the outside of the casing 121 of the server 12.
As shown in fig. 5, a main liquid outlet pipe 125 extending in the left-right direction is disposed at the rear side of the server 12, a plurality of branch liquid outlet pipes 126 are disposed between the main liquid outlet pipe 125 and the casing 121 of the server 12, and the main liquid outlet pipe 125 is communicated with the inner space of the casing 121 of the server 12 through the branch liquid outlet pipes 126.
As shown in fig. 3 and 4, the outlet of the first circulation pump 141 is connected to the inlet of the liquid inlet main 1244 through a fifth pipeline 175, and the first partition 112 is provided with a through hole for accommodating the fifth pipeline 175. A second liquid return pipe 132 is arranged at the front side of the server 12 in the upper space, the right end of the liquid outlet main pipe 125 is a blind end, the left end of the liquid outlet main pipe 125 is an open end, and the open end of the liquid outlet main pipe 125 is connected with an inlet of the second liquid return pipe 132 through a sixth pipeline 176. As shown in fig. 8, a connection pipe 133 for connecting the first liquid return pipe 131 and the second liquid return pipe 132 is disposed between the first liquid return pipe 131 and the second liquid return pipe 132, and a through hole for accommodating the connection pipe 133 is disposed on the first partition 112. Preferably, the first liquid return pipe 131 and the second liquid return pipe 132 are arranged in parallel, the second liquid return pipe 132 is located right above the first liquid return pipe 131, a plurality of connecting pipes 133 are arranged between the first liquid return pipe 131 and the second liquid return pipe 132, and the plurality of connecting pipes 133 are uniformly arranged along the axial direction of the first liquid return pipe 131 and the second liquid return pipe 132.
Further, as shown in fig. 3, a second circulation pump 142 is disposed in the lower space of the main tank 111, an outlet of the first air-cooled radiator 16 is connected to an inlet of the second circulation pump 142 through a seventh pipe 177, and a primary outlet of the plate heat exchanger 15 is connected to an inlet of the second circulation pump 142 through an eighth pipe 178. The first circulation pump 141 and the second circulation pump 142 are connected in parallel. The fourth control valve 184 is disposed at a common portion of the third and seventh lines 173 and 177, and the fifth control valve 185 is disposed at a common portion of the fourth and eighth lines 174 and 178. The outlet of the second circulation pump 142 is communicated with the inlet of the liquid inlet main pipe 1244 through a ninth pipeline 179, and the first partition 112 is provided with a through hole for accommodating the ninth pipeline 179.
The reason for this design is that one spare effect can be produced, when one of them circulating pump breaks down, can start another circulating pump, guarantees the reliability of work.
Further, as shown in fig. 4, the fifth pipe 175 and the ninth pipe 179 have a common portion, and a pressure sensor 192, a temperature sensor 193, and a flow sensor 194 are sequentially disposed on the common portion of the fifth pipe 175 and the ninth pipe 179 in the flow direction of the cooling liquid. Preferably, a pressure sensor 192, a temperature sensor 193, and a flow sensor 194, which are located on a common portion of the fifth pipe 175 and the ninth pipe 179, are located in an upper space of the main tank 111.
In operation, by providing the chip heat sink 124, the coolant that has just entered the server 12 (and at this time the coolant has the lowest temperature) can be restricted and guided, so that the coolant first flows through the area where heat generation is the most severe. The coolant is then ejected through an opening at the front end of the chip heat spreader 124 and moves forward. When the cooling liquid flows to the front end of the server 12, the cooling liquid is blocked and flows backwards, and finally flows out through the liquid outlet branch pipe 126 at the rear side and enters the liquid outlet main pipe 125. The cooling liquid flowing out of the liquid outlet main pipe 125 sequentially passes through the sixth pipeline 176, the second liquid return pipe 132, and the first liquid return pipe 131, and enters the filter 191. Then, an appropriate path is selected as required, and when the cooling liquid is to be cooled by air cooling, the first control valve 181, the second control valve 182, and the fourth control valve 184 are opened, and the third control valve 183 and the fifth control valve 185 are closed, so that the cooling liquid flows through the first air-cooled radiator 16 and reenters the server 12. When the cooling liquid is to be cooled by water cooling, the first control valve 181, the third control valve 183, and the fifth control valve 185 are opened, and the second control valve 182 and the fourth control valve 184 are closed, so that the cooling liquid flows through the plate heat exchanger 15 and reenters the server 12.
As shown in fig. 9 and 10, a data center using an integrated directional immersion cooling server module includes a main frame 2, a cooling fan 3 is disposed on a front side of the main frame 2, a plurality of server modules 1 arranged in an up-down direction are disposed on a rear side of the cooling fan 3 in the main frame 2, and an air inlet 113 of each server module 1 faces the front side.
As a specific implementation manner, the main frame 2 in this embodiment includes a rectangular parallelepiped frame, a plurality of layers of bearing bracket bodies are disposed in the rectangular parallelepiped frame, and the server module 1 is fixedly disposed on the bearing bracket bodies. The front side of the main frame body 2 is provided with an opening towards the rear side installation box body 21, just the rear end of the installation box body 21 with the main frame body 2 fixed connection, evenly be covered with the mounting hole on the leading flank of installation box body 21, every the mounting hole in all be provided with cooling fan 3.
In operation, air flows through the cooling fan 3 into the lower space of the main housing 111 of the server module 1 and exits the server module 1 through the first air-cooled heat sink 16. At this time, the first control valve 181, the second control valve 182, and the fourth control valve 184 in the server module 1 are opened, the third control valve 183, and the fifth control valve 185 are closed, the coolant flows through the first air-cooled radiator 16, and the cold air exchanges heat with the coolant flowing through the air-cooled radiator to cool the coolant, so that the cooled coolant enters the servers 12 in the upper space of the main casing 111 again to cool the heat generating elements in the servers 12.
Example two
As shown in fig. 11, a data center using an integrated directional immersion cooling type server module includes a main frame 2, as a specific implementation manner, in this embodiment, the main frame 2 includes a rectangular parallelepiped frame, a plurality of support frames are disposed in the rectangular parallelepiped frame, a server module 1 is disposed on each support frame, and the server module 1 is fixedly connected to the support frames through screws.
The rear side of the main frame body 2 is provided with an installation box body 21, and the rear side surface of the installation box body 21 is provided with a second air-cooled radiator 4. The installation box body 21 is internally provided with a water inlet pipe 51 and a water outlet pipe 52 which extend along the vertical direction, a secondary side inlet of the plate type heat exchanger 15 of the server module 1 is connected with the water inlet pipe 51 through a first pipeline 61, and a secondary side outlet of the plate type heat exchanger 15 of the server module 1 is connected with the water outlet pipe 52 through a second pipeline 62. The lower end (i.e. the open end) of the water inlet pipe 51 is connected with the outlet of the second air-cooled radiator 4 through a third pipeline 63, and the lower end (i.e. the open end) of the water outlet is connected with the inlet of the second air-cooled radiator 4 through a fourth pipeline 64.
Preferably, a plurality of second air-cooled radiators 4 are arranged on the rear side surface of the mounting box 21, and the plurality of second air-cooled radiators 4 are connected in series.
The third pipe 63 or the fourth pipe 64 is provided with a third circulation pump 7, and as a specific implementation manner, the third pipe 63 is provided with the third circulation pump 7 in this embodiment.
The installation box body 21 is provided with a cold air inlet 211, and preferably, the cold air inlet 211 is arranged on the upper side surface of the installation box.
The structure of the server module 1 is the same as that of the first embodiment, and is not described herein again.
EXAMPLE III
As shown in fig. 12, the second air-cooled radiator 4 is externally disposed outside the mounting case 21, and the rest of the structure is the same as that of the second embodiment.
Example four
A filter 191, a pressure sensor 192, a temperature sensor 193, and a flow sensor 194 are provided in this order in the flow direction of the coolant in the separate portion of the first pipe 171. A filter 191, a pressure sensor 192, a temperature sensor 193, and a flow sensor 194 are sequentially provided on an independent portion of the second pipe 172 in the flow direction of the coolant.
The rest of the structure is the same as the first embodiment.
EXAMPLE five
A pressure sensor 192, a temperature sensor 193, and a flow sensor 194 are provided in this order on separate portions of the fifth pipe 175 in the flow direction of the coolant. A pressure sensor 192, a temperature sensor 193, and a flow sensor 194 are provided in this order in the flow direction of the coolant in a separate portion of the ninth pipe 179.
The rest of the structure is the same as the first embodiment.
EXAMPLE six
The control valve group on the first pipe group is a three-way valve arranged on the first pipe group. The rest of the structure is the same as the first embodiment.
EXAMPLE seven
The first liquid return pipe 131, the second liquid return pipe 132 and the connecting pipe 133 are removed, and the open end of the liquid outlet main pipe 125 is directly connected with the inlet of the filter 191 through the sixth pipeline 176. The first partition 112 is provided with a through hole for accommodating the sixth pipeline 176.
The rest of the structure is the same as the first embodiment.
Example eight
The filter 191, the pressure sensor 192, the temperature sensor 193, the flow sensor 194 and the control valve set on the first tube set are all positioned in the upper space of the main box body 111, and the rest of the structure is the same as that of the first embodiment.
Claims (10)
1. An integrated directional immersion-cooled server module, characterized by: the system comprises a main box body, wherein a server, a plate heat exchanger, a first air-cooled radiator and a first circulating pump are arranged in the main box body, and a liquid inlet main pipe and a liquid outlet main pipe are arranged on a shell of the server;
the server, the plate heat exchanger, the first air-cooled radiator and the first circulating pump are connected through pipelines and form a first circulating loop, and the plate heat exchanger and the first air-cooled radiator are connected in parallel on the first circulating loop;
a first partition plate is arranged in the main box body, and the first partition plate divides the inner space of the main box body into an upper layer space and a lower layer space;
the server is arranged in the upper layer space, and the plate heat exchanger, the first air-cooled radiator and the first circulating pump are arranged in the lower layer space;
the main box body is provided with an air inlet communicated with the lower layer space.
2. An integrated directional immersion-cooled server module as claimed in claim 1, wherein: be provided with the chip radiator on the high-power consumption component of server, the chip radiator include a front end open-ended shell, the shell in be provided with a plurality of second baffles, just the second baffle will the inner space of shell is cut apart into a plurality of runners, there is the feed liquor branch pipe on the back lateral wall of shell, the feed liquor branch pipe with the feed liquor be responsible for and be connected.
3. An integrated directional immersion cooled server module as claimed in claim 2, wherein: the rear side wall of the server shell is connected with the liquid outlet main pipe through the liquid outlet branch pipe.
4. An integrated directional immersion-cooled server module as claimed in claim 1, wherein: the upper space and the lower space of the main box body are respectively provided with a second liquid return pipe and a first liquid return pipe, a connecting pipe used for communicating the first liquid return pipe and the second liquid return pipe is arranged between the first liquid return pipe and the second liquid return pipe, the liquid outlet main pipe is connected with the second liquid return pipe through a pipeline, and the first liquid return pipe is connected with the plate heat exchanger and the first air-cooled radiator through a pipeline.
5. An integrated directional immersion-cooled server module as claimed in claim 1, wherein: and a filter is arranged on the first circulation loop at the upstream side of the plate heat exchanger and the first air-cooled radiator.
6. An integrated directional immersion-cooled server module as claimed in claim 1, wherein: and a pressure sensor, a temperature sensor and a flow sensor are arranged on the upstream side and the downstream side of the server on the first circulation loop.
7. An integrated directional immersion-cooled server module as claimed in claim 1, wherein: and a second circulating pump is arranged in the lower-layer space of the main box body, and the first circulating pump and the second circulating pump are connected in parallel on the first circulating loop.
8. A data center employing an integrated directional immersion-cooled server module, comprising: the cooling device comprises a main frame body, wherein a cooling fan is arranged on the front side of the main frame body, a server module is arranged on the rear side of the cooling fan in the main frame body, and an air inlet of the server module faces the front side.
9. A data center employing an integrated directional immersion-cooled server module, comprising: the main frame body is internally provided with a server module, the rear side of the main frame body is provided with an installation box body, the installation box body is internally provided with an inlet pipe and an outlet pipe, the secondary side inlet and the secondary side outlet of the plate heat exchanger of the server module are respectively connected with the inlet pipe and the outlet pipe through pipelines, and the inlet pipe and the outlet pipe are respectively connected with the outlet and the inlet of the second air-cooled radiator through pipelines.
10. The data center using the integrated directional immersion cooling server module as claimed in claim 9, wherein: the second air-cooled radiator set up in on the trailing flank of install bin, and a plurality of the second air-cooled radiator establish ties, the installation box on be provided with cold air inlet.
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| CN202111607904.7A CN114190063B (en) | 2021-12-22 | 2021-12-22 | Integrated directional immersion cooling type server module and data center |
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| CN114190063B CN114190063B (en) | 2024-01-16 |
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| CN114190063B (en) | 2024-01-16 |
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