CN220140057U - Radiating assembly and electronic equipment - Google Patents
Radiating assembly and electronic equipment Download PDFInfo
- Publication number
- CN220140057U CN220140057U CN202321939637.8U CN202321939637U CN220140057U CN 220140057 U CN220140057 U CN 220140057U CN 202321939637 U CN202321939637 U CN 202321939637U CN 220140057 U CN220140057 U CN 220140057U
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- Prior art keywords
- water chamber
- integrated
- module
- liquid
- water
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 126
- 239000007788 liquid Substances 0.000 claims abstract description 82
- 238000001816 cooling Methods 0.000 claims abstract description 55
- 239000000110 cooling liquid Substances 0.000 claims abstract description 20
- 238000001514 detection method Methods 0.000 claims description 25
- 239000002826 coolant Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 238000004512 die casting Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 33
- 238000012545 processing Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000001502 supplementing effect Effects 0.000 description 8
- 238000003754 machining Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003020 moisturizing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation assembly and electronic equipment. The heat dissipation assembly comprises an integrated water chamber module and a liquid cooling plate, wherein the integrated water chamber module is fixedly connected with the liquid cooling plate or integrally formed, and cooling liquid flows into a cavity of the liquid cooling plate from the integrated water chamber module, absorbs heat of power devices arranged on two sides of the liquid cooling plate and flows back to the integrated water chamber module. The electronic device comprises a heat dissipation assembly and a plurality of power devices, wherein the power devices are at least partially arranged on the heat dissipation assembly. Through the arrangement, the heat dissipation assembly is simpler in structure, lower in complexity of assembly and processing technology, higher in power density of electronic equipment and higher in heat dissipation efficiency.
Description
Technical Field
The present disclosure relates to heat dissipation assemblies, and particularly to a heat dissipation assembly for a heat dissipation device.
Background
With the development of the electronic industry, the power density of semiconductor power modules, such as IGBTs, in power electronic equipment, such as frequency converters, current transformers, etc., is higher and higher, which puts higher demands on the heat dissipation structure. At present, the liquid cooling device is widely applied to various devices due to better heat dissipation effect, and the heat dissipation is realized in a mode that the liquid cooling plate takes away the heat of the cooling liquid.
However, the existing liquid cooling assembly often adopts a mode that each module is independently arranged, so that the problems of low integration level, complex process and high production cost exist.
Disclosure of Invention
The utility model aims to provide a heat dissipation assembly and electronic equipment with simple structure and low cost.
Based on the above object, the present utility model provides a heat dissipating assembly, which comprises an integrated water chamber module and a liquid cooling plate, wherein the integrated water chamber module is fixedly connected with the liquid cooling plate or integrally formed, and a cooling liquid flows into a cavity of the liquid cooling plate from the integrated water chamber module, absorbs heat of power devices arranged on two sides of the liquid cooling plate, and flows back to the integrated water chamber module.
Further, the liquid cooling plate is integrally formed through a die casting process.
Further, the liquid cooling plate comprises a front shell and a rear shell which are assembled by welding, and the front shell and the rear shell are integrally formed through a die casting process respectively.
Further, a flow channel for cooling liquid to flow is arranged in the cavity of the liquid cooling plate, and radiating fins for improving radiating efficiency are arranged in the flow channel.
Further, the integrated water chamber module is provided with an independent water chamber, a water inlet and a water outlet, cooling liquid enters the integrated water chamber module from the water inlet, enters the liquid cooling plate from the integrated water chamber module, absorbs heat of the power device, and flows to the independent water chamber after absorbing heat and is discharged from the water outlet.
Further, the integrated water chamber module further comprises a liquid supplementing port and a water supplementing valve, wherein the liquid supplementing port is used for supplementing cooling liquid, the liquid supplementing port is arranged at the upper end of the integrated water chamber module, and the water supplementing valve is arranged at the liquid supplementing port.
Further, the integrated water chamber module further comprises a liquid level detection module, and when the liquid level detection module detects that the liquid level of the cooling liquid of the independent water chamber is lower than a liquid level threshold value, the cooling liquid is supplemented to the integrated water chamber module from the liquid supplementing port.
Further, the integrated water chamber module further comprises a liquid outlet for discharging cooling liquid during maintenance and a drain valve, wherein the liquid outlet is arranged at the lower end of the integrated water chamber module, and the drain valve is arranged at the liquid outlet.
Further, the integrated water chamber module further comprises a water pressure detection module for detecting the water pressure of the cooling liquid, and the water pressure detection module is at least partially arranged on the drain valve.
Further, the integrated water chamber module further comprises a liquid temperature detection module, and the liquid temperature detection module is arranged close to the water inlet and the water outlet.
Further, the integrated water chamber module further comprises a water-air balance valve for controlling water inflow and air inflow balance, and the water-air balance valve is at least partially arranged on the independent water chamber.
An electronic device, comprising: the heat dissipation assembly and the power devices; the plurality of power devices is at least partially disposed on the heat sink assembly.
The utility model provides a heat radiation assembly and electronic equipment, which are characterized in that a liquid cooling plate and an integrated water chamber module are integrally designed, so that the heat radiation assembly is simpler in structure and lower in complexity of assembly and processing technology. Meanwhile, the power devices are arranged on the two sides of the liquid cooling plate, so that the power density of the electronic equipment and the heat dissipation efficiency of the liquid cooling plate are improved.
Drawings
Fig. 1 is a schematic structural view of a heat dissipating assembly provided according to the present utility model;
FIG. 2 is a split view of a heat dissipating assembly provided in accordance with the present utility model;
FIG. 3 is a top view of a liquid cooling plate provided in accordance with the present utility model;
fig. 4 is a schematic structural view of an integrated water chamber module provided according to the present utility model;
fig. 5 is a schematic structural diagram of an electronic device provided according to the present utility model.
Detailed Description
The present utility model will be described in detail below with reference to the specific embodiments shown in the drawings, but these embodiments are not limited to the present utility model, and structural, method, or functional modifications made by those skilled in the art based on these embodiments are included in the scope of the present utility model.
Fig. 1 and 2 illustrate a heat sink assembly 100, the heat sink assembly 100 comprising an integrated water chamber module 11 and a liquid cooling plate 12. For clarity of explanation of the technical solution of the present utility model, the front, rear, left, right, up, and down directions of the heat dissipating assembly 100 in this embodiment are taken as the front, rear, left, right, up, and down directions in fig. 1.
Wherein, integrated hydroecium module 11 and liquid cooling board 12 fixed connection or integrated into one piece, integrated hydroecium module 11 at least partly set up in the both ends of liquid cooling board 12, and the coolant liquid flows into in the cavity 121 of liquid cooling board 12 from integrated hydroecium module 11, absorbs the heat of the power device (not shown) of arranging on the two sides of liquid cooling board 12 to flow back to integrated hydroecium module 11.
Through the arrangement, the structure of the heat dissipation assembly 100 is simpler, the complexity of assembly and processing technology is reduced, and the production efficiency of the heat dissipation assembly 100 is improved. Meanwhile, the integrated water chamber module 11 and the liquid cooling plate 12 are integrally arranged, and power devices can be arranged on two sides of the liquid cooling plate 12, so that the power density of the power devices and the heat dissipation efficiency of the heat dissipation assembly 100 are improved.
As a possible implementation, the liquid cooling plate 12 is integrally formed by a die casting process. Through the arrangement, the structure of the liquid cooling plate 12 is simpler, the integration degree is higher, the processing efficiency of the liquid cooling plate 12 is improved, and the processing cost of the liquid cooling plate 12 is reduced.
As another possible implementation, as shown in fig. 2, the liquid cooling plate 12 includes a front case 122 and a rear case 123 assembled by welding, and the front case 122 and the rear case 123 are integrally formed by a die casting process, respectively. Through the arrangement, the design structure of the liquid cooling plate 12 is more flexible and the reliability is higher.
As shown in fig. 3, a flow passage 124 and a heat radiation fin 125 are provided in the cavity 121 of the liquid cooling plate 12. Wherein the flow channel 124 can flow the cooling liquid. The flow channel 124 can be formed by machining in a deep hole drilling mode, so that machining of the flow channel 124 is simpler, and machining efficiency of the liquid cooling plate 12 is improved. The heat dissipation fins 125 are at least partially disposed in the flow channels 124, the heat dissipation fins 125 are at least partially disposed on the front housing 122 and/or the rear housing 123, and the heat dissipation fins 125 are used to improve the heat dissipation efficiency of the liquid cooling plate 12.
As shown in fig. 2 and 4, the integrated water chamber module 11 is provided with an independent water chamber 111, a water inlet 112 and a water outlet 113. Specifically, the independent water chamber 111 is at least partially disposed at one end of the liquid cooling plate 12, and the independent water chamber 111 is fixedly connected or integrally formed with the liquid cooling plate 12. The cavity inside the independent water chamber 111 is communicated with the cavity 121 inside the liquid cooling plate 12. More specifically, the positions of the water inlet 112 and the water outlet 113 are not limited, i.e., the water inlet 112 and/or the water outlet 113 may be disposed in any one of the front, rear, left, right, upper, and lower directions of the independent water chamber 111. In the present utility model, the water inlet 112 is provided at the lower end of the independent water chamber 111, and the water outlet 113 is provided at the front end of the independent water chamber 111.
Through the arrangement, the cooling liquid can enter the integrated water chamber module 11 from the water inlet 112, enter the liquid cooling plate 12 from the integrated water chamber module 11, absorb the heat of the power device, flow to the independent water chamber 111 after absorbing the heat, and are discharged from the water outlet 113.
As one possible implementation, the integrated water chamber module 11 further includes a make-up port 114 and a make-up valve 1141 for replenishing the coolant. Specifically, the fluid refill port 114 is disposed at the upper end of the integrated water chamber module 11, and the water refill valve 1141 is disposed at the fluid refill port 114.
Further, the integrated water chamber module 11 further includes a liquid level detection module 115, where the liquid level detection module 115 is at least partially disposed at the upper end of the independent water chamber 111, and when the liquid level detection module 115 detects that the liquid level of the cooling liquid in the independent water chamber 111 is lower than a liquid level threshold, the cooling liquid can be replenished to the integrated water chamber module 11 from the liquid replenishing port 114.
Through the arrangement, the hydraulic pressure in the integrated water chamber module 11 can be kept above the set hydraulic pressure threshold value, so that the cooling liquid can stably circulate between the integrated water chamber module 11 and the liquid cooling plate 12, and the heat dissipation stability and reliability of the heat dissipation assembly 100 are improved.
As shown in fig. 2, as a possible implementation manner, the integrated water chamber module 11 further includes a drain port 116 for discharging the coolant during maintenance and a drain valve 1161, the drain port 116 is provided at a lower end of the integrated water chamber module 11, and the drain valve 1161 is provided at the drain port 116.
Further, the integrated water chamber module 11 further includes a water pressure detection module (not shown) for detecting the water pressure of the coolant, and the water pressure detection module is at least partially disposed on the drain valve 1161.
Through the above arrangement, when the water pressure of the cooling liquid in the liquid cooling plate 12 is detected to be greater than the preset water pressure threshold value, or the liquid cooling plate 12 needs to be maintained, the drain valve 1161 can be opened to drain the cooling liquid in the liquid cooling plate 12, so that the safety of the liquid cooling plate 12 in heat dissipation is higher.
As shown in fig. 4, as a possible implementation, the integrated water chamber module 11 further includes a liquid temperature detection module 117, and the liquid temperature detection module 117 is disposed near the water inlet 112 and the water outlet 113. By arranging the water temperature detection modules at the water inlet 112 and the water outlet 113, the temperature of the cooling liquid in the integrated water chamber module 11 can be detected in real time, so that the temperature of the cooling liquid is ensured to be lower than a preset temperature threshold value, and the heat dissipation stability and reliability of the heat dissipation assembly 100 are improved.
As a possible implementation, the integrated water chamber module 11 further comprises a water vapor balance valve 118 for controlling the intake and intake balance, the water vapor balance valve 118 being at least partially disposed on the separate water chamber 111. Further, an air pressure detection module (not shown) is further disposed in the integrated water chamber module 11, and the air pressure detection module is used for detecting air pressure in the independent water chamber 111 module. When the ratio of the air pressure and the hydraulic pressure in the integrated water chamber module 11 is greater than the preset water-air ratio threshold, the water-air balance valve 118 can be opened to allow part of the air to be discharged out of the integrated water chamber module 11, so as to improve the safety and reliability of the integrated water chamber module 11.
In summary, by integrally designing the liquid cooling plate 12 and the integrated water chamber module 11, the heat dissipation assembly 100 has simpler structure and lower complexity of assembly and processing technology. And through setting up liquid level detection module 115, water pressure detection module, atmospheric pressure detection module, liquid temperature detection module 117, aqueous vapor balance valve 118, moisturizing valve 1141 and drain valve 1161, conveniently realize the inner loop liquid cooling system of radiator unit 100 to detect the state of the coolant liquid in the radiator unit 100, furthest improved radiator unit 100's stability and reliability.
As shown in fig. 5, the present utility model further provides an electronic device 300, where the electronic device 300 includes the heat dissipation assembly 100 and a plurality of power devices 200. Specifically, a plurality of power devices 200 are at least partially disposed on the heat sink assembly 100. More specifically, the plurality of power devices 200 may be disposed at both sides of the heat dissipation assembly 100 in the front-rear direction of the electronic device 300 to increase the power density of the electronic device 300 and the heat dissipation efficiency of the electronic device 300 by the heat dissipation assembly 100.
Although the preferred embodiments of the present utility model have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the utility model as disclosed in the accompanying claims.
Claims (12)
1. The utility model provides a cooling module, its characterized in that, cooling module includes integrated hydroecium module and liquid cooling board, integrated hydroecium module with liquid cooling board fixed connection or integrated into one piece, the coolant liquid follow integrated hydroecium module flows in the cavity of liquid cooling board, absorbs the heat of arranging the power device on the two sides of liquid cooling board, and flow back to integrated hydroecium module.
2. The heat dissipating assembly of claim 1, wherein said liquid cooling plate is integrally formed by a die casting process.
3. The heat dissipating assembly of claim 1, wherein said liquid cooled panel comprises a front housing and a rear housing assembled by welding, said front housing and said rear housing being integrally formed by a die casting process, respectively.
4. The heat dissipating assembly of claim 1, wherein a flow channel through which the cooling liquid flows is provided in the cavity of the liquid cooling plate, and a heat dissipating fin for improving heat dissipating efficiency is provided in the flow channel.
5. The heat sink assembly of claim 1 wherein the integrated water chamber module is provided with an independent water chamber, a water inlet and a water outlet, the coolant enters the integrated water chamber module from the water inlet and enters the liquid cooling plate from the integrated water chamber module, absorbs heat of the power device, and the heat-absorbed coolant flows to the independent water chamber and is discharged from the water outlet.
6. The heat sink assembly of claim 5 wherein the integrated water chamber module further comprises a fluid refill port for replenishing coolant and a water refill valve, the fluid refill port being disposed at an upper end of the integrated water chamber module, the water refill valve being disposed at the fluid refill port.
7. The heat removal assembly of claim 6, wherein said integrated water chamber module further comprises a level detection module, said level detection module replenishing said integrated water chamber module with coolant from said fluid replenishment port when it detects that the level of coolant in said separate water chamber is below a level threshold.
8. The heat sink assembly of claim 5, wherein the integrated water chamber module further comprises a drain port for discharging the coolant during maintenance and a drain valve, the drain port being provided at a lower end of the integrated water chamber module, the drain valve being provided at the drain port.
9. The heat sink assembly of claim 8 wherein the integrated water chamber module further comprises a water pressure detection module for detecting a water pressure of the coolant, the water pressure detection module being at least partially disposed on the drain valve.
10. The heat sink assembly of claim 5 wherein the integrated water chamber module further comprises a liquid temperature detection module disposed proximate the water inlet and the water outlet.
11. The heat sink assembly of claim 5 wherein the integrated water chamber module further comprises a water vapor balance valve for controlling water intake and air intake balance, the water vapor balance valve being at least partially disposed on the separate water chamber.
12. An electronic device, comprising:
the heat dissipating assembly of any of claims 1 to 11;
a plurality of power devices, a plurality of the power devices being at least partially disposed on the heat sink assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321939637.8U CN220140057U (en) | 2023-07-21 | 2023-07-21 | Radiating assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321939637.8U CN220140057U (en) | 2023-07-21 | 2023-07-21 | Radiating assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220140057U true CN220140057U (en) | 2023-12-05 |
Family
ID=88958019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321939637.8U Active CN220140057U (en) | 2023-07-21 | 2023-07-21 | Radiating assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220140057U (en) |
-
2023
- 2023-07-21 CN CN202321939637.8U patent/CN220140057U/en active Active
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