CN214592559U

CN214592559U - Submerged cooling system

Info

Publication number: CN214592559U
Application number: CN202120395697.2U
Authority: CN
Inventors: 洪银树; 尹佐国; 李明聪
Original assignee: Sunonwealth Electric Machine Industry Co Ltd
Current assignee: Sunonwealth Electric Machine Industry Co Ltd
Priority date: 2021-02-17
Filing date: 2021-02-23
Publication date: 2021-11-02
Anticipated expiration: 2031-02-23
Also published as: TWI817091B; CN114945260A; TW202234980A

Abstract

The utility model provides an submergence formula cooling system for in solving current submergence formula cooling system, lead to problem with high costs because of using biphase working solution. The method comprises the following steps: a seal groove having a cavity; a circulating layer formed of a first working fluid filled in the chamber; the working layer is formed by a second working fluid filled in the chamber, the density of the second working fluid is lower than that of the first working fluid, and the boiling point of the second working fluid is higher than that of the first working fluid; and the circulating cooling module is provided with a circulating pipeline, the circulating pipeline is provided with a heat absorption section and a condensation section which are positioned between a first port and a second port, the first port and the second port are positioned in the cavity, the first port is communicated with the first working liquid, and the heat absorption section is positioned on the working layer.

Description

Submerged cooling system

Technical Field

The present invention relates to a cooling system, and more particularly to an immersion cooling system.

Background

Immersion cooling (Immersion cooling) is to immerse an electrical unit (such as a server, a motherboard, a central processing unit, a display adapter or a memory) in a non-conductive liquid, so that high-temperature heat energy generated during the operation of the electrical unit can be directly absorbed by the non-conductive liquid, and the electrical unit can maintain a proper operating temperature to achieve expected operating efficiency and service life.

The conventional immersion cooling system using a two-phase working fluid generally includes a cooling tank filled with the two-phase working fluid at a lower level in the cooling tank and a condenser disposed at an upper level in the cooling tank above the two-phase working fluid. The electric unit needing cooling is immersed in the liquid two-phase working fluid, and due to the low boiling point of the two-phase working fluid, part of the two-phase working fluid can be converted into a gas state after absorbing the working heat energy of the electric unit, so that bubbles are formed in the liquid two-phase working fluid and float upwards until the bubbles leave the surface layer of the liquid two-phase working fluid, and then the bubbles are condensed back to the liquid state again and drop downwards when contacting the condenser.

Although the two-phase working fluid can provide better heat exchange performance due to the low temperature boiling effect, the two-phase working fluid is expensive, and it costs a considerable amount to fill the cooling tank with the two-phase working fluid, which causes an economic burden to users.

In view of the above, there is a need for an improved immersion cooling system.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present invention provides an immersion cooling system, which can reduce the usage amount of the two-phase working fluid.

The utility model discloses a next purpose provides an submergence formula cooling system, can promote the radiating efficiency.

It is yet another object of the present invention to provide an immersion cooling system that can be reduced in overall size.

The present invention relates to a directional device, and more particularly to a directional device, such as a directional device, a method, a device, a method, a device and a device, a method, a device and a device.

The components and members described throughout the present invention use the wording "one" or "one" only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.

The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.

The utility model discloses an submergence formula cooling system, include: a seal groove having a cavity; a circulating layer formed of a first working fluid filled in the chamber; a working layer formed by a second working fluid filled in the chamber, the boiling point of the second working fluid is higher than that of the first working fluid, the density of the second working fluid is lower than that of the first working fluid, the first working fluid and the second working fluid are not mutually dissolved, and the circulating layer and the working layer are mutually adjacent; and the circulating cooling module is provided with a circulating pipeline, the circulating pipeline is provided with a heat absorption section and a condensation section which are positioned between a first port and a second port, the first port and the second port are positioned in the chamber, the first port is communicated with the first working fluid, the heat absorption section is positioned in the working layer, and the first working fluid circularly flows in the circulating pipeline.

Therefore, the utility model discloses an submergence formula cooling system uses this first working solution and this second working solution to carry out cooling work simultaneously, and the price is higher, this first working solution of heat exchange performance preferred carries out the heat exchange in only being arranged in this circulating line, consequently, the user can reduce the use amount of this first working solution by a wide margin, and then saves considerable cost.

Wherein the boiling point of the first working fluid may be lower than water. Therefore, the heat exchange performance is improved.

Wherein the first working fluid may have a density higher than water and the second working fluid may have a density lower than water. Therefore, the first working fluid and the second working fluid can be naturally layered.

Wherein, the first working fluid and the second working fluid are non-conductive fluids. Thus, the cooling device has the function of cooling the electric device.

Wherein the circulation line may not be a closed loop. Therefore, the first cooling working fluid can be circulated and alternately enter the circulating pipeline.

Wherein the condensing section may not be located in the circulation layer or the working layer. Therefore, the condensation section can use more abundant heat dissipation space, and has the effect of improving the heat dissipation efficiency.

Wherein the condensing section may be located in the chamber. Therefore, the overall volume of the immersion cooling system is reduced.

The circulating cooling module can be additionally provided with a plurality of cooling fins, and the cooling fins are combined with the condensation section. Therefore, the heat dissipation structure has the effect of increasing the heat dissipation area.

Wherein the recirculating cooling module can additionally have at least one fan which is coupled to the condensation section. Thus, the air circulation accelerating device has the effect of accelerating air circulation.

Wherein the second port may be located in the active layer. Therefore, the circulating pipeline can have a shorter length and has the effect of saving materials.

Wherein, this circulative cooling module has a check valve to be located between this condensation section and this second port, and this second port of export intercommunication of this check valve. Therefore, the second working fluid is prevented from entering the circulating pipeline.

Wherein the second port may be located in the circulation layer. Therefore, the first working fluid flowing back from the circulating pipeline can directly flow into the circulating layer, and the effect of increasing the supplementing speed of the first working fluid is achieved.

Wherein, the circulation pipeline is provided with a return section adjacent to the second port, and the return section can be provided with a plurality of through holes. Therefore, the air-removing device has the effect of removing air in the pipeline.

Wherein, the circulative cooling module can have at least one water-cooling head, and this water-cooling head combines in this heat absorption section, and this water-cooling head has one and holds the groove, and the fluid and this appearance groove intercommunication on this circulation layer, the surface of this water-cooling head have a heat-absorbing surface. Therefore, the heat dissipation device has the effect of improving the heat dissipation efficiency.

Wherein the water cooling head may have at least one locking portion. Therefore, the water cooling head can be locked and fixed on the electric unit, and the heat absorption surface can be in close contact with a heat source.

Wherein, the first port can be communicated with a liquid outlet of a pump, and a liquid inlet of the pump is positioned on the circulating layer. Therefore, the circulation speed of the first working fluid can be increased, and the heat dissipation efficiency is improved.

Wherein the pump may be located in the chamber. Therefore, the immersed cooling system has the effect of reducing the occupied area.

The circulating cooling module can be provided with a check valve positioned between the heat absorption section and the first port, and an inlet of the check valve is communicated with the first port. Therefore, the check valve can prevent the first working fluid in the circulating pipeline from entering the cavity through the first port, and has the effect of fixing the circulating direction of the first working fluid.

The circulating cooling module can be additionally provided with a plurality of cooling fins, the cooling fins are combined on the outer surface of the circulating pipeline, and the cooling fins can be positioned in the working layer. Therefore, the heat dissipation area of the circulation pipeline is increased.

The submerged cooling system may further include an air layer formed in the chamber by the air in the chamber, and the circulating cooling module may further have a plurality of fins coupled to an outer surface of the circulating pipe, the plurality of fins being located in the air layer. Thus, once the second working fluid in the gas state exists in the air layer, the heat sink has the effect of enabling the second working fluid in the gas state to be condensed into the liquid state again.

The immersion cooling system may additionally include at least one electrical unit having at least one heat source located in the working layer. Therefore, the electric unit can maintain proper working temperature.

Drawings

FIG. 1 is a combined cross-sectional view of a first embodiment of the present invention;

FIG. 2 is a combined cross-sectional view of a second embodiment of the present invention;

FIG. 3 is a combined cross-sectional view of a third embodiment of the present invention;

figure 4 is a combined cross-sectional view of a fourth embodiment of the present invention.

Description of the reference numerals

[ utility model ] to solve the problems

1 sealing groove

11: cylinder body

111 opening

12 cover body

2 circulating layer

3 working layer

4 circulating cooling module

41 circulating pipeline

41a heat absorption section

41b condensation section

41c reflux section

411 first port

412 second port

413 passing through the hole

42 heat sink

43 fan

44 water cooling head

441, containing groove

442 heat absorbing surface

443 locking part

45 pump

451 liquid outlet

452 liquid inlet

46 check valve

461 inlet

462, outlet port

47 the heat sink

5 air layer

E electric unit

F1, F2 outer surface

H is heat source

L1 first working fluid

L2 second working fluid

S, a chamber.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail as follows:

referring to fig. 1, a first embodiment of the submerged cooling system of the present invention includes a sealing groove 1, a circulation layer 2, a working layer 3 and a circulation cooling module 4. The sealing groove 1 is internally provided with a cavity S, the circulating layer 2 and the working layer 3 are accommodated in the cavity S, and the circulating cooling module 4 is communicated with the cavity S.

The form of the sealing groove 1 is not limited by the present invention, in this embodiment, the sealing groove 1 may have a cylinder 11 and a cover 12, and the cavity S is located inside the cylinder 11. The barrel 11 can be made of a transparent material so that a user can observe the condition of the chamber S through the barrel 11, the barrel 11 has an opening 111 communicated with the chamber S, and the opening 111 can be used for inputting liquid into the chamber S or taking and putting objects to be cooled; the cover 12 can cover the opening 111, and the periphery of the cover 12 can be airtight with the barrel 11, for example, by a rubber ring, so as to ensure that the gas or liquid in the chamber S does not leak from the periphery of the cover 12 to the outside.

The circulating layer 2 is formed of a first working liquid L1 filled in the chamber S, the first working liquid L1 may be a more expensive two-phase working liquid. The working layer 3 is formed by a second working fluid L2 filled in the chamber S, the boiling point of the second working fluid L2 is higher than that of the first working fluid L1, the second working fluid L2 can be a single-phase or two-phase working fluid with lower price, and preferably, the boiling point of the first working fluid L1 can be lower than that of water, so as to improve the heat exchange performance of the immersion cooling system. The density of the second working fluid L2 is lower than that of the first working fluid L1, preferably, the density of the first working fluid L1 may be higher than that of water, and the density of the second working fluid L2 may be lower than that of water, so that the first working fluid L1 and the second working fluid L2 can be naturally layered in the chamber S, and the first working fluid L1 and the second working fluid L2 do not dissolve in each other, so that the working layer 3 is adjacent to and above the circulating layer 2. The first working fluid L1 and the second working fluid L2 are preferably non-conductive fluids, thereby cooling the electrical devices.

The immersion cooling system may further include at least one electrical unit E, which is an object to be cooled and has at least one heat source H, and the electrical unit E may be a main board, a communication interface board, a display adapter, a data storage board, or the like. The electrical unit E may be positioned at a default position in the chamber S so that the electrical unit E can be immersed in contact with the second operating liquid L2. For example, the whole electrical unit E may be immersed in the working layer 3, or at least the heat source H of the electrical unit E may be immersed in the working layer 3, which is not limited by the present invention.

The circulating cooling module 4 has a circulating pipeline 41 for the first working fluid L1 to flow circularly, the circulating pipeline 41 may be made of heat conductive materials such as copper, aluminum, titanium or stainless steel, the circulating pipeline 41 has a first port 411, the first port 411 is connected to a heat absorbing section 41a, the heat absorbing section 41a is connected to a condensing section 41b, the condensing section 41b is connected to the second port 412, the first port 411 and the second port 412 are located in the chamber S, and the first port 411 is connected to the first working fluid L1, in this embodiment, the first port 411 is located in the circulating layer 2, so that the first working fluid L1 can enter the circulating pipeline 41.

As mentioned above, the heat absorbing section 41a is a part of the circulation pipeline 41 passing through the working layer 3, and more specifically, the heat absorbing section 41a is located on the working layer 3 and may be adjacent to the heat source H, so that the heat absorbing section 41a absorbs heat of the heat source H. The condensing section 41b is used to cool the first working fluid L1, and the condensing section 41b is preferably not located in the circulation layer 2 or the working layer 3, and in this embodiment, the condensing section 41b is located outside the sealing groove 1, so that the condensing section 41b can use a relatively abundant heat dissipation space, and has the effect of increasing the heat dissipation efficiency.

In addition, in order to further improve the heat dissipation efficiency, the circulation cooling module 4 may further include a plurality of heat sinks 42, and the heat sinks 42 may be combined with the condensation section 41b, thereby increasing the heat dissipation area. Preferably, the circulation cooling module 4 may further have at least one fan 43, and the fan 43 may also be combined with the condensation section 41b, thereby having the function of accelerating the circulation of air.

The second port 412 is used for returning the cooled first working fluid L1 to the chamber S. The position of the second port 412 in the chamber S is not limited by the present invention, and in this embodiment, the second port 412 may be located in the working layer 3, so that the circulation pipeline 41 may have a shorter length and have a material saving effect.

The immersion cooling system of this embodiment can absorb heat energy from the second working fluid L2 around the electrical unit E and the first working fluid L1 in the circulation pipeline 41 when the electrical unit E operates to generate heat energy, so that the electrical unit E can be maintained at a proper working temperature, the second working fluid L2 is used to cool the electrical unit E and exchange heat with the circulation pipeline 41 to maintain the ambient temperature of the working layer 3, and the first working fluid L1 is used to accelerate the removal of heat from the heat source H.

In detail, in the embodiment, the circulation pipeline 41 is not a closed loop, so that the cooled first working fluid L1 can be circulated and alternately introduced into the circulation pipeline 41, and since the first working fluid L1 is only used for heat exchange in the circulation pipeline 41, the usage amount of the first working fluid L1 can be much lower than that of the second working fluid L2, and thus, a user can save considerable cost. Since the second working fluid L2 is used in a higher amount than the first working fluid L1, the first working fluid L1 can be pressurized by the weight of the second working fluid L2, and then enter the heat absorption section 41a of the circulation line 41 through the first port 411. The first working fluid L1 in the heat absorbing section 41a can absorb heat of the heat source H, vaporize into a gaseous state and flow into the condensing section 41b to carry heat away from the heat source H. The gaseous first working fluid L1 enters the condensing section 41b, is cooled and condensed back to liquid state, and flows to the second port 412. The cooled first working fluid L1 can flow back to the working layer 3 through the second port 412, and the density difference between the first working fluid L1 and the second working fluid L2 enables the liquid first working fluid L1 to naturally sink back to the circulating layer 2, and then to enter the first port 411 to flow to the heat absorbing section 41a, so as to continuously absorb the heat of the heat source H.

Referring to fig. 2, which is a second embodiment of the submerged cooling system of the present invention, in this embodiment, the circulation cooling module 4 may have at least one water cooling head 44, the water cooling head 44 is combined with the heat absorbing section 41a, the water cooling head 44 has a containing groove 441, the fluid of the circulation layer 2 is communicated with the containing groove 441, and an outer surface F1 of the water cooling head 44 has a heat absorbing surface 442. The heat absorbing surface 442 is configured to contact the heat source H, and the receiving groove 441 is configured to allow the first working fluid L1 to flow, so that heat energy of the heat source H can be directly transferred from the heat absorbing surface 442 to the receiving groove 441, and then the heat energy of the heat source H is taken away by a circulation flow caused by a phase change of the first working fluid L1, thereby improving a heat dissipation efficiency. Preferably, the water cooling head 44 may have at least one locking portion 443 for locking the water cooling head 44 to the electric unit E, whereby the locking portion 443 has the function of making the heat absorbing surface 442 contact the heat source H more closely.

In addition, the circulation pipeline 41 may further have a return section 41c, the return section 41c is adjacent to the second port 412, and the return section 41c may have a plurality of through holes 413. The return section 41c is used to guide the first working fluid L1 to the second port 412, so that the first working fluid L1 flows back into the chamber S, when the first working fluid L1 in the return section 41c is still in a partial gaseous state, or residual air is left in the circulation pipeline 41 due to the pipeline installation process, the gas can be exhausted through the through hole 413, and the function of exhausting pipeline air is achieved.

Please refer to fig. 3, which shows a third embodiment of the immersion cooling system of the present invention, the number of the electrical units E may be multiple, and each electrical unit E may also have multiple heat sources H, in this embodiment, the electrical unit E has two heat sources H, the heat absorbing section 41a may sequentially pass through each heat source H, and radiate the heat from the heat source H by two corresponding water cooling heads 44, and the structure of the circulation pipeline 41 may be adjusted according to the number of the electrical units E and the heat sources H, which can be understood by those skilled in the art.

In addition, the circulation cooling module 4 may have a pump 45, the liquid outlet 451 of the pump 45 is connected to the first port 411, the first port 411 may be located in the working layer 3, or preferably located in the circulation layer 2, but the present invention is not limited thereto, and the liquid inlet 452 of the pump 45 is located in the circulation layer 2. Therefore, the first working fluid L1 still enters the circulation pipeline 41, and the pump 45 can be driven to increase the circulation speed and the heat removal speed, thereby improving the heat dissipation efficiency. Preferably, the pump 45 may be located in the chamber S, having the effect of reducing the footprint of the immersion cooling system.

The hydronic module 4 may further have a check valve 46, the check valve 46 is located between the heat absorbing section 41a and the first port 411, and an inlet 461 of the check valve 46 is communicated with the first port 411. The check valve 46 can prevent the first working fluid L1 in the circulation line 41 from entering the chamber S through the first port 411, and thus the check valve 46 has the function of fixing the circulation direction of the first working fluid L1.

Also, the submerged cooling system may further include at least one air layer 5, the air layer 5 may be formed in the chamber S by air in the chamber S, the air layer 5 is adjacent to the upper side of the working layer 3, the air layer 5 may be used to provide a cooling space, so that the vaporized first working fluid L1 or/and the vaporized second working fluid L2 may be condensed into liquid state again, and then flow back to the circulating layer 2 or/and the working layer 3.

The circulation cooling module 4 preferably has a plurality of cooling fins 47, the cooling fins 47 are combined on the outer surface F2 of the circulation pipeline 41, the heat dissipation area of the circulation pipeline 41 can be increased, the positions of the cooling fins 47 can be located in the working layer 3 or in the air layer 5, the present invention is not limited thereto, in this embodiment, the cooling fins 47 can be located in the air layer 5, thereby, in addition to increasing the heat dissipation area of the circulation pipeline 41, once the gaseous second working fluid L2 exists in the air layer 5, the cooling fins 47 can also help to cool the gaseous second working fluid L2, and condense it into liquid again.

As mentioned above, the position of the second port 412 in the chamber S is not limited by the present invention, and in this embodiment, the second port 412 can be located in the circulation layer 2, so that the first working fluid L1 flowing back through the circulation pipeline 41 can directly flow into the circulation layer 2, thereby increasing the supplement speed of the first working fluid L1.

Referring to fig. 4, which is a fourth embodiment of the immersion cooling system of the present invention, in the embodiment, the condensation section 41b may be located in the chamber S, the heat sink 42 is combined with the condensation section 41b, and the heat sink 42 can radiate heat by penetrating the cover 12 to contact the external environment, so as to cool the first working fluid L1 in the condensation section 41 b. Thus, the whole volume of the immersion cooling system is reduced. In addition, the check valve 46 can also be located between the backflow section 41c and the second port 412, and the outlet 462 of the check valve 46 is communicated with the second port 412, so that the check valve 46 can prevent the second working fluid L2 from entering the circulation pipeline 41 through the second port 412.

To sum up, the utility model discloses an submergence formula cooling system uses this first working solution and this second working solution to carry out cooling work simultaneously, and the price is higher, this first working solution of heat exchange performance preferred only is arranged in this circulating line to carry out the heat exchange, consequently, the user can reduce the use amount of this first working solution by a wide margin, and then saves considerable cost. In addition, the circulation pipeline can be combined with the cooling fin, the fan, the pump and other devices, so that the heat dissipation efficiency of the immersion cooling system can be further improved.

Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention.

Claims

1. An immersion cooling system, comprising:

a seal groove having a cavity;

a circulating layer formed of a first working fluid filled in the chamber;

a working layer formed by a second working fluid filled in the chamber, the boiling point of the second working fluid is higher than that of the first working fluid, the density of the second working fluid is lower than that of the first working fluid, the first working fluid and the second working fluid are not mutually dissolved, and the circulating layer and the working layer are mutually adjacent; and

and the circulating cooling module is provided with a circulating pipeline, the circulating pipeline is provided with a heat absorption section and a condensation section which are positioned between a first port and a second port, the first port and the second port are positioned in the chamber, the first port is communicated with the first working fluid, the heat absorption section is positioned in the working layer, and the first working fluid circularly flows in the circulating pipeline.

2. The submerged cooling system of claim 1, wherein the first working liquid has a boiling point lower than water.

3. The immersion cooling system as claimed in claim 1, wherein the first working fluid is of a higher density than water and the second working fluid is of a lower density than water.

4. The immersion cooling system as claimed in claim 1, wherein the first and second working fluids are non-conductive fluids.

5. The immersion cooling system as claimed in claim 1, wherein the circulation line is not a closed loop.

6. The submerged cooling system of claim 1, wherein the condenser section is not located in the circulation layer or the working layer.

7. An immersion cooling system as claimed in claim 6, wherein the condenser section is located in the chamber.

8. The submerged cooling system of claim 6, wherein the hydronic module further comprises a plurality of fins coupled to the condenser section.

9. The submerged cooling system of claim 6, characterised in that the circulating cooling module additionally has at least one fan, which is coupled to the condensation section.

10. The immersion cooling system as claimed in claim 1, wherein the second port is located in the working layer.

11. The submerged cooling system of claim 10, wherein the hydronic module has a check valve between the condenser section and the second port, and an outlet of the check valve communicates with the second port.

12. The submerged cooling system of claim 1, wherein the second port is located in the circulating layer.

13. The immersion cooling system of claim 1, wherein the circulation line has a return section adjacent the second port, the return section having a plurality of perforations.

14. An immersion cooling system as claimed in claim 1, wherein the circulating cooling module has at least one water-cooled head coupled to the heat absorbing section, the water-cooled head having a vessel with which the fluid of the circulating layer is in communication, the water-cooled head having an outer surface with a heat absorbing surface.

15. The submerged cooling system of claim 14, wherein the water-cooled head has at least one lock.

16. The immersion cooling system as claimed in claim 1, wherein the first port communicates with a liquid outlet of a pump, and a liquid inlet of the pump is located at the circulating layer.

17. The immersion cooling system as claimed in claim 16, wherein the pump is located in the chamber.

18. The immersion cooling system of claim 1, wherein the hydronic module has a check valve between the heat absorbing section and the first port, and an inlet of the check valve communicates with the first port.

19. The submerged cooling system of claim 1, wherein the recirculating cooling module further comprises a plurality of fins bonded to an outer surface of the recirculating conduit, the fins being located in the working layer.

20. The submerged cooling system of claim 1, further comprising an air layer formed in the chamber by the air in the chamber, the circulating cooling module further comprising a plurality of fins attached to an outer surface of the circulating pipe, the fins being located in the air layer.

21. An immersion cooling system as claimed in any one of claims 1 to 20, further comprising at least one electrical unit having at least one heat source located in the active layer.