CN213694613U - Immersion cooling device and electronic equipment with same - Google Patents
Immersion cooling device and electronic equipment with same Download PDFInfo
- Publication number
- CN213694613U CN213694613U CN202021461550.0U CN202021461550U CN213694613U CN 213694613 U CN213694613 U CN 213694613U CN 202021461550 U CN202021461550 U CN 202021461550U CN 213694613 U CN213694613 U CN 213694613U
- Authority
- CN
- China
- Prior art keywords
- liquid
- conductive liquid
- slot
- side walls
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 52
- 238000007654 immersion Methods 0.000 title claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 211
- 238000007789 sealing Methods 0.000 claims abstract description 36
- 239000012530 fluid Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 21
- 230000001681 protective effect Effects 0.000 claims description 14
- 238000009835 boiling Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 description 21
- 239000010410 layer Substances 0.000 description 21
- 230000000694 effects Effects 0.000 description 17
- 230000001965 increasing effect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015654 memory Effects 0.000 description 3
- 229920001410 Microfiber Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003658 microfiber Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an submergence formula cooling device and have this submergence formula cooling device's electronic equipment for solve the non-conducting liquid quantity among the current submergence formula cooling device and form this high problem more. The immersion cooling apparatus includes: the sealing groove is internally provided with a cavity which is filled with a non-conductive liquid; and an electric positioning seat which is arranged in the cavity and is provided with a plurality of fixing frames which are arranged on a base, a slot is formed between two adjacent fixing frames, a heat source is arranged in the slot, and the non-conductive liquid soaks the heat source.
Description
Technical Field
The present invention relates to a cooling device for an electrical unit, and more particularly, to an immersion cooling device for immersing an electrical unit in a non-conductive liquid to maintain a proper working temperature and an electronic device having the same.
Background
Immersion cooling (Immersion cooling) is to immerse the electrical units (such as servers, motherboards, cpus, display cards or memories) in the non-conductive liquid, so that the high-temperature heat energy generated during the operation of the electrical units can be directly absorbed by the non-conductive liquid, and the electrical units can maintain proper operating temperature to achieve the expected operating efficiency and service life.
A conventional immersion cooling apparatus generally includes a cooling tank and a condenser, wherein a lower layer of the cooling tank is filled with a liquid non-conductive liquid, and the condenser is disposed above the liquid non-conductive liquid in an upper layer of the cooling tank. The electric unit needing cooling is immersed in the liquid non-conductive liquid, and due to the low boiling point of the non-conductive liquid, after the working heat energy of the electric unit is absorbed, part of the non-conductive liquid can be converted into a gas state, so that bubbles are formed in the liquid non-conductive liquid and float upwards until the bubbles leave the surface layer of the liquid non-conductive liquid, and then the bubbles are condensed back to the liquid state again and drop downwards when contacting the condenser.
Most of the existing immersion cooling devices place a partition frame in the cooling tank for the electrical units to be inserted and positioned one by one. But the separation frame is made of thin sheets, and the volume of the separation frame is not large; that is, the liquid level in the cooling tank does not rise much due to the placement of the spacer. Therefore, in order to make the non-conductive liquid fully infiltrate each electric unit, the using amount of the non-conductive liquid in the cooling tank is generally required to be large, and the price of the non-conductive liquid is high, so that the using cost of the whole immersion type cooling device is difficult to reduce.
In view of the above, there is a need for an improved immersion cooling apparatus.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the present invention provides an immersion cooling device and an electronic apparatus having the same, wherein the electrical positioning seat can be used for stably erecting an electrical unit, and also can enable the liquid level of the non-conductive liquid to rise obviously, so that the electrical unit can be fully infiltrated by using a smaller amount of non-conductive liquid.
The utility model discloses a next time the purpose provides an submergence formula cooling device and have this submergence formula cooling device's electronic equipment, can guide the liquid or gaseous non-conducting liquid smooth and easy flow, makes the heat exchange efficiency of non-conducting liquid and electric unit promote, helps promoting the heat dispersion to electric unit.
It is still another object of the present invention to provide an immersion cooling apparatus and an electronic device having the same, which can generate turbulent flow effect to fluid and increase the overall heat dissipation area to improve the heat dissipation efficiency of the electrical unit.
Another object of the present invention is to provide an immersion cooling apparatus and an electronic device having the same, which can reduce the loss of the nonconducting liquid.
The present invention relates to a directional device, and more particularly to a directional device, such as a directional device, a directional device.
The elements and components described throughout the present invention are referred to by the term "a" or "an" merely for convenience and to provide a general meaning of the scope of the invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.
The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be easily manufactured and manufactured by using the same method.
The utility model discloses an submergence formula cooling device can be used to cool off an at least heat source, include: the sealing groove is internally provided with a cavity which is filled with a non-conductive liquid; and the electric positioning seat is positioned in the cavity, is provided with a plurality of fixing frames positioned on a base, forms a slot between two adjacent fixing frames, and the heat source is positioned in the slot and is soaked by the non-conductive liquid.
Therefore, the utility model discloses an submergence formula cooling device, its electrical positioning seat can supply the firm frame of electric unit to erect outward, can also make the liquid level of non-conducting liquid obviously rise to use less non-conducting liquid just can fully soak this electric unit, so can save the quantity of non-conducting liquid, have the efficiency such as use cost that reduces non-conducting liquid.
The electric positioning seat can be provided with at least one liquid inlet channel, and the liquid inlet channel can be positioned below the plurality of slots and can be communicated with the plurality of slots. Therefore, the method has the effects of improving the flowing smoothness of the non-conductive liquid and the like.
Wherein, each mount can have a plurality of bubble guide slots that are longitudinal extension, and each bubble guide slot can communicate the top and this inlet channel of this mount. Therefore, the non-conductive liquid which is heated and converted into the gas state can form bubbles and smoothly flow upwards along the guidance of the plurality of bubble guide grooves, and the heat dissipation performance is improved.
Wherein, the width of the bubble guide groove can be gradually increased from bottom to top. Therefore, the air bubble flow control device has the effects of improving the flow smoothness of air bubbles and the like.
The electric positioning seat can be provided with a clamping frame used for combining and fixing the electric unit, and the clamping frame can be clamped and combined with the corresponding fixing frame. Therefore, the electric unit can be fixed by a simple structure, and the electric unit has the effects of reducing the manufacturing cost, improving the assembly convenience and the like.
The electric positioning seat can be provided with two opposite side walls, the two side walls can be positioned on the base, the plurality of fixing frames can be positioned between the two side walls, and a slot for inserting and positioning the electric unit can be formed between each side wall and the nearest fixing frame. Therefore, the total number of the electric units which can be inserted into the electric positioning seat can be increased in a limited space, and the electric positioning seat has the effects of increasing the space utilization rate and the like.
The sealing groove can be provided with a ring wall and a sealing base plate, a convex ring part of the sealing base plate can be combined with the ring wall in a liquid-tight mode and can be located in the cavity, the base can be arranged in a space enclosed by the convex ring part, the two side walls can be connected with the base through local parts, the local parts can be located above the convex ring part, and the parts, back to the plurality of fixing frames, of the side walls can conform to the shape of the inner wall of the ring wall. Therefore, the base and the two side walls can occupy the space in the cavity, which is not easy to erect the electrical unit, so that the using amount of the non-conductive liquid is saved, and the effects of reducing the using cost of the non-conductive liquid and the like are achieved.
The base can be provided with at least one through groove which can be communicated with the plurality of slots, and a fluid driving piece can drive the non-conductive liquid to flow into the plurality of slots through the through groove. Therefore, the fluid driving piece can drive the non-conductive liquid to circularly flow, and has the effects of improving the heat dissipation performance of the electrical unit and the like.
The electric positioning seat can be provided with two opposite side walls, the two side walls can be positioned on the base, the plurality of fixing frames can be positioned between the two side walls, each side wall can be provided with at least one liquid guide channel which extends longitudinally, the liquid guide channels can be communicated with the top ends of the side walls and the through grooves, and the fluid driving piece can drive the non-conductive liquid to flow into the plurality of inserting grooves through the liquid guide channels and the through grooves. Therefore, the non-conducting liquid which is input into and flows out of the slot can be shunted, the mutual temperature interference is avoided, and the heat dissipation efficiency of the electric unit is improved.
Wherein, the fluid driving member can be positioned in the through groove or can be positioned in the liquid guide channel. Therefore, the efficiency of space utilization and the like is improved.
Wherein, this cavity can fill in addition and be equipped with a protection liquid, and the density of this protection liquid can be less than the density of this non-conducting liquid, and the boiling point of this protection liquid can be higher than the boiling point of this non-conducting liquid. Therefore, the liquid non-conductive liquid can be converted into a gas state after absorbing heat energy, bubbles are formed and rise into the liquid protection liquid, the gas non-conductive liquid can be condensed back to the liquid state in the liquid environment and then sink back to the lower part of the protection liquid, and the effects of reducing the loss of the gas non-conductive liquid and the like are achieved.
The utility model discloses an electronic equipment can include: the immersion cooling device; and at least one electric unit which is arranged in the slot in an inserting way and is provided with the heat source. Therefore, the electronic equipment can be stably erected by the electrical positioning seat and can also obviously raise the liquid level of the non-conductive liquid, so that the heat source of the electrical unit can be fully infiltrated by a small amount of the non-conductive liquid, and the electronic equipment has the effects of reducing the use cost of the non-conductive liquid and the like.
The electronic device may further include at least one auxiliary heat sink having a heat conductive substrate attached to the heat source of the electrical unit, a porous layer structure contacting the heat conductive substrate and the non-conductive liquid. Therefore, the porous layer structure can increase the heat dissipation area, can more quickly transfer the heat energy generated by the heat source to the non-conductive liquid, and has the effects of improving the heat dissipation efficiency of the electric unit and the like.
Wherein, the outer surface of the porous layer structure can be provided with a plurality of burbling parts in a convex or concave shape. Therefore, the fluid can generate vortex when passing through the position, further disturbs the surrounding fluid, increases the whole heat dissipation area, and has the effects of improving the heat dissipation efficiency of the electric unit and the like.
Wherein, the cross section of this vortex portion can be triangle-shaped. Therefore, the heat dissipation efficiency of the electric unit is further improved.
The auxiliary heat sink may have a frame, the frame may have a hollow, the frame may be connected to the heat conductive substrate, and the porous layer structure may be located within a range of the hollow. Therefore, the frame can protect the porous layer structure from being damaged easily, strengthen the structure of the integral auxiliary radiator, and has the effects of reducing the damage rate of the auxiliary radiator, improving the assembly convenience and the like.
Wherein the porous layer structure may be formed by sintering copper powder. Therefore, the porous layer structure has fine pores and good uniformity, and has the effects of improving the heat dissipation effect and the like.
The utility model has the advantages that:
the utility model discloses an submergence formula cooling device, its electrical positioning seat can also make the liquid level of non-conducting liquid obviously rise except that can supply the firm frame of electrical unit to use less non-conducting liquid just can fully soak this electrical unit, so can save the quantity of non-conducting liquid, have efficiency such as use cost that reduces non-conducting liquid. Furthermore, the utility model discloses still borrow the bubble guide slot by this electric positioning seat, the guide bubble upwards flows more smoothly to promote the heat dispersion to electric unit. And the fluid driving piece of the electric positioning seat can drive the non-conductive liquid to circularly flow, and is helpful to improve the heat dissipation performance of the electric unit.
Drawings
FIG. 1: the utility model discloses an exploded perspective view of a first embodiment;
FIG. 2: a side cross-sectional view of the first embodiment of the present invention;
FIG. 3: the utility model discloses a partial section decomposition perspective view of the first embodiment of the electric positioning seat;
FIG. 4: the utility model discloses the overlook section view of the first embodiment electric positioning seat;
FIG. 5: the utility model discloses the use state diagram of the first embodiment;
FIG. 6: the utility model discloses a perspective view of the second embodiment of the electric positioning seat;
FIG. 7: the utility model discloses the use state diagram of the second embodiment;
FIG. 8: the utility model discloses a perspective view of the third embodiment of the electric positioning seat;
FIG. 9: the utility model discloses the use state diagram of the third embodiment;
FIG. 10: a side cross-sectional view of a fourth embodiment of the present invention;
FIG. 11: the utility model discloses a partial sectional schematic view of an electronic device;
FIG. 12: an exploded perspective view of an auxiliary heat sink according to another embodiment of the present invention;
FIG. 13: the utility model discloses the combination perspective view of auxiliary heat radiator of another embodiment.
Description of the reference numerals
1 sealing groove
11: ring wall
111 opening
112, covering the opening
12, bottom sealing plate
12a disk body
12b convex ring part
121: a joint part
13: groove cover
2: electric positioning seat
21: base
211 penetrating groove
22 fixing rack
221 bubble guide groove
23, a slot
24: clamping frame
25 liquid inlet channel
26 side wall
261 liquid guiding channel
27 fluid driving member
3: auxiliary radiator
31 heat conductive substrate
31a first side
31b second side
32 porous layer Structure
321 outer surface
322 turbulent flow part
33: frame
331, hollowed-out opening
4: casing
C, a chamber
D, immersion type cooling device
E electric unit
F inner wall
H is heat source
K is cushion block
L1 non-conducting liquid
L2 protective liquid
R is rubber ring
S locking and fixing piece
T is the top end
W is the width.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the invention more comprehensible, preferred embodiments accompanied with figures are described in detail as follows:
referring to fig. 1, a first embodiment of an immersion cooling device D of the present invention includes a sealing groove 1 and an electrical positioning seat 2, wherein the electrical positioning seat 2 is located in the sealing groove 1.
Referring to fig. 1 and 2, the sealing groove 1 has a chamber C therein, the chamber C is filled with a non-conductive liquid L1, and the non-conductive liquid L1 may be, for example, a liquid with good fluidity but no conductivity, such as an electronic engineering liquid. The cavity C can also accommodate the electrical positioning socket 2 and at least one electrical unit E to be cooled, so that the non-conductive liquid L1 can absorb the heat energy generated by the operation of the electrical unit E.
The present invention is not limited to the type of the sealing groove 1, for example, the sealing groove 1 of the present embodiment may have a ring wall 11, a sealing base 12 and a groove cover 13. The annular wall 11 may have an opening 111 and a cover opening 112, and the cover opening 112 may be opposite to the opening 111; in the use state, the opening 111 can face downward, and the cover opening 112 can face upward. The bottom sealing plate 12 can be coupled to the annular wall 11 in a liquid-tight manner and covers the opening 111, and the cover 13 can be coupled to the annular wall 11 in a gas-tight manner and covers the cover opening 112, so as to enclose the chamber C by the annular wall 11, the bottom sealing plate 12 and the cover 13, and ensure that the liquid in the chamber C does not leak from the bottom end of the sealing groove 1 to the outside, and prevent the fluid in the chamber C from leaking from between the cover 13 and the annular wall 11 to the outside. In other embodiments, the annular wall 11 and the back cover 12 can be integrally formed (as shown in fig. 7), but the invention is not limited thereto.
More specifically, the sealing base plate 12 of the present embodiment may have a plate 12a, and the plate 12a may have a plurality of joints 121 for joining and fixing the plate 12a to a predetermined position of the ring wall 11; each of the coupling portions 121 may be a lock hole, for example, and the tray body 12a may be locked and coupled to the bottom end surface of the ring wall 11 by a locking member S. The back cover 12 of the present embodiment may further have a protruding ring portion 12b, the protruding ring portion 12b may be connected to the top surface of the tray 12a and located at the bottom end of the cavity C, the outer periphery of the protruding ring portion 12b may be sleeved with at least one rubber ring R, and the rubber ring R abuts against the inner wall F of the ring wall 11, so that a liquid-tight state may be formed between the back cover 12 and the ring wall 11. The slot cover 13 may also have a similar structure, which will not be described in detail herein.
Referring to fig. 2 and 3, the electrical positioning base 2 may be made of plastic or metal, and the present invention is not limited thereto. The electrical positioning seat 2 can be stably arranged at the bottom end of the cavity C and used for erecting and positioning the electrical unit E to be cooled in the cavity C. For example, but not limited to, the electrical positioning socket 2 of the present embodiment may have a base 21, and the base 21 may be placed in a space surrounded by the convex ring portion 12b of the bottom sealing plate 12. The electrical positioning seat 2 may further have a plurality of fixing frames 22 located above the base 21 to form a slot 23 between two adjacent fixing frames 22, when the electrical unit E is a sheet structure such as a motherboard, a communication interface panel, a display panel or a data storage panel, the electrical unit E may be inserted and set in the slot 23, and the non-conductive liquid L1 may infiltrate the heat source H of the electrical unit E through the slot 23. For example, in the present embodiment, a clamping frame 24 is selectively combined and fixed on the upper end of the electrical unit E, and the electrical unit E can be maintained and positioned at the predetermined position in the slot 23 by clamping and combining the clamping frame 24 with the corresponding fixing frame 22.
More specifically, the electrical positioning socket 2 may have at least one liquid inlet channel 25, and the liquid inlet channel 25 may be located below the plurality of slots 23 and communicate with the plurality of slots 23, so that the non-conductive liquid L1 may flow into the liquid inlet channel 25 and then flow into the plurality of slots 23 from below. In this embodiment, the upper surface of the base 21 may be connected with a plurality of strip-shaped cushion blocks K, and the cushion blocks K are spaced apart from each other and preferably arranged in parallel; the fixing frame 22 is connected above each cushion block K to form the liquid inlet channel 25 between any two adjacent cushion blocks K, and each liquid inlet channel 25 is communicated with one slot 23. Wherein, these a plurality of cushion K can be connected or built-up connection with this base 21 integrated into one piece, or every cushion K is connected etc. with corresponding mount 22 integrated into one piece respectively, the utility model discloses all do not restrict. In other embodiments, the same liquid inlet channel 25 may communicate with a plurality of slots 23, as long as the non-conductive liquid L1 can be smoothly guided to flow into the plurality of slots 23.
Referring to fig. 2 to 4, each fixing frame 22 may have a plurality of air bubble guiding grooves 221 extending longitudinally, each air bubble guiding groove 221 communicates with the top end T of the fixing frame 22 and the liquid inlet channel 25, and the electrical unit E in the slot 23 faces the surface of the fixing frame 22 having the plurality of air bubble guiding grooves 221 with the heat source H thereof, so that the nonconducting liquid L1 heated by the heat source H and converted into a gaseous state may form air bubbles and smoothly flow upward along the guidance of the plurality of air bubble guiding grooves 221, thereby enhancing the heat dissipation performance. Additionally, the width W of each of the bubble guiding grooves 221 may be increased from bottom to top, so that bubbles having a larger volume can smoothly pass the bubbles as going up.
Referring to fig. 1 and 4, the electrical positioning seat 2 may further have two opposite side walls 26, the two side walls 26 are located on the base 21, the plurality of fixing frames 22 are located between the two side walls 26, and a slot 23 is also formed between each side wall 26 and the nearest fixing frame 22 for the electrical unit E to be inserted and positioned, so as to increase the total number of the electrical units E that can be inserted in the electrical positioning seat 2 in a limited space. Referring to fig. 2, in the present embodiment, the height of the base 21 is approximately such that the fixing frame 22, the slot 23, the liquid inlet channel 25 and other parts are all higher than the convex ring part 12b of the bottom sealing plate 12, so that the flow and circulation of the non-conductive liquid L1 can be smoother. The two walls 26 may be partially connected to the base 21, and partially protrude from the base 21 and are located above the protruding ring portion 12b of the back cover 12, and the portion of each side wall 26 facing away from the plurality of fixing frames 22 may conform to the shape of the inner wall F of the ring wall 11 and be as close as possible to the inner wall F of the ring wall 11. Thus, the base 21 and the two side walls 26 can occupy the space in the chamber C that is not easily used for erecting the electrical unit E, i.e., the space is filled with the non-conductive liquid L1, which has no heat dissipation effect, and the base 21 and the two side walls 26 occupy, but can also save the amount of the non-conductive liquid L1.
Referring to fig. 5, in the immersion cooling device D of the present embodiment, the electrical unit E can be stably erected by the electrical positioning seat 2, and the base 21, the fixing frame 22, the two side walls 26 and other parts occupy a space in the chamber C that is not easy to erect the electrical unit E, so that a small amount of the non-conductive liquid L1 can reach a sufficient liquid level height to fully soak the heat source H of the electrical unit E. Therefore, when the electrical unit E operates to generate heat energy, the non-conductive liquid L1 around the electrical unit E absorbs the heat energy to convert into gas, form bubbles and flow upward, naturally drive the liquid non-conductive liquid L1 to be supplemented into the slot 23, and continuously exchange heat with the electrical unit E, so that the electrical unit E can be maintained at a proper working temperature, and the required amount of the non-conductive liquid L1 can be reduced, thereby effectively reducing the use cost of the whole immersion cooling device D.
Referring to fig. 6 and 7, which are second embodiments of the immersion cooling device D of the present invention, the electrical positioning socket 2 of the present embodiment further has a function of driving the non-conductive liquid L1 to flow circularly.
In detail, the base 21 of the electrical positioning socket 2 may have at least one through slot 211, and the through slot 211 connects the plurality of slots 23 located above the base 21 with the outer periphery or the bottom end of the base 21, so that the non-conductive liquid L1 located at the outer periphery or the bottom end of the base 21 can be input into the plurality of slots 23 from below through the through slot 211. At least one fluid driving member 27 is disposed to drive the relatively low temperature electrically-nonconductive liquid L1 in the chamber C to flow into the slots 23 through the through slot 211 for heat exchange. The fluid driving member 27 may be, for example, a pump or an impeller.
In addition, in order to reduce the influence of the relatively high temperature of the nonconducting liquid L1 passing through the electrical unit E on the nonconducting liquid L1 before being input into the slot 23, the relatively low temperature of the nonconducting liquid L1 can be kept as low as possible to be input into the slot 23, and the nonconducting liquid L1 input into and output from the slot 23 can be preferably branched. Therefore, in this embodiment, at least one liquid guiding channel 261 extending longitudinally is optionally disposed on the side wall 26 of the electrical positioning seat 2, the liquid guiding channel 261 is communicated with the top end T of the side wall 26 and the through groove 211, so that the relatively low temperature non-conductive liquid L1 can flow into the through groove 211 through the liquid guiding channel 261, the relatively low temperature non-conductive liquid L1 is formed to flow downward from the outside, and the relatively high temperature non-conductive liquid L1 and the air bubbles flow upward from the middle through the electrical unit E, so as to reduce interference between the two.
The fluid driving member 27 may be located in the through groove 211 or in the liquid guiding channel 261, which is not limited by the present invention. In this embodiment, the base 21 may have two through slots 211, the two through slots 211 are not connected, and part of the slots 23 are connected to one of the through slots 211, and the other slots 23 are connected to the other through slot 211, and the two through slots 211 are respectively provided with one of the fluid driving members 27; in addition, the number of the liquid guiding channels 261 on the same side wall 26 is set to be plural, so that the relatively low temperature non-conductive liquid L1 driven by each fluid driving member 27 can synchronously pass through the plural liquid guiding channels 261, and converge through grooves 211 commonly communicated through the plural liquid guiding channels 261, and then respectively input into the plural slots 23 corresponding to the two through grooves 211, thereby improving the smoothness of the flow of the non-conductive liquid L1.
Therefore, the electrical positioning seat 2 of the present embodiment can drive the relatively low temperature nonconducting liquid L1 to be inputted into the plurality of slots 23 from below by the operation of the fluid driving member 27, and help the relatively high temperature nonconducting liquid L1 and the bubbles to flow upward and leave the plurality of slots 23 through the electrical unit E, so as to form a circulation, which not only guides the liquid or gaseous nonconducting liquid L1 to flow smoothly, but also improves the heat exchange efficiency between the nonconducting liquid L1 and the electrical unit E, thereby facilitating the improvement of the heat dissipation performance of the electrical unit E.
In addition, the ring wall 11 and the sealing bottom plate 12 of the sealing slot 1 of the present embodiment can be integrally formed and connected to each other, so as to further simplify the structure of the sealing slot 1 and ensure that the fluid in the chamber C cannot leak from the bottom end of the sealing slot 1 to the outside. However, the electrical positioning socket 2 having the function of driving the non-conductive liquid L1 to circulate is not limited to the use in combination with the sealing groove 1 shown in fig. 7, and may be applied to the sealing groove 1 shown in fig. 5 or other forms of sealing grooves 1, as will be understood by those skilled in the art, and the drawings should not be construed as limiting the embodiments.
Referring to fig. 8 and 9, which are third embodiments of the immersion cooling device D of the present invention, in this embodiment, the fluid driving member 27 is selectively disposed in the liquid guiding channel 261 of the side wall 26.
In detail, the side wall 26 may only have a single liquid guiding channel 261, and the liquid guiding channel 261 may guide the non-conductive liquid L1 to be input from the liquid inlet end of the fluid driving member 27, and after the non-conductive liquid L1 is output from the liquid outlet end of the fluid driving member 27, the non-conductive liquid L1 may flow to the through slot 211 communicated with the liquid guiding channel 261 and then input into the slots 23 corresponding to the through slot 211, which may also improve the smoothness of the flow of the non-conductive liquid L1, and improve the heat exchange efficiency between the non-conductive liquid L1 and the electrical unit E, thereby facilitating to improve the heat dissipation performance of the electrical unit E. For example, when the fluid driving member 27 is selected to be a centrifugal pump or an impeller with a shaft entering and exiting from the side, the liquid guiding channel 261 can guide the non-conductive liquid L1 to enter the liquid inlet end from the axial direction of the fluid driving member 27, and then to flow to the through groove 211 communicated with the liquid guiding channel 261 after being laterally output from the liquid outlet end. In other embodiments, the fluid driving member 27 may also be a shaft-in shaft-out type or a side-in side-out type of fluid guiding direction, and the shape of the fluid guiding channel 261 can be adjusted correspondingly according to the fluid guiding direction of the fluid driving member 27, which is understood by those skilled in the art, and therefore, the invention is not limited to the shape disclosed in the drawings.
Referring to fig. 10, which shows a fourth embodiment of the immersion cooling device D of the present invention, a protection liquid L2 may be additionally filled in the chamber C of the present embodiment, the density of the protection liquid L2 is lower than that of the non-conductive liquid L1, and the boiling point of the protection liquid L2 is higher than that of the non-conductive liquid L1. Thus, the non-conductive liquid L1 and the protective liquid L2 can be naturally layered in the chamber C, and the protective liquid L2 is adjacent to and above the non-conductive liquid L1. The liquid non-conductive liquid L1 can be converted into a gas state after absorbing heat energy, and form bubbles to rise into the liquid protective liquid L2, that is, the heat energy can be transferred to the liquid protective liquid L2, so that the gas non-conductive liquid L1 is condensed back to a liquid state in the protective liquid L2, and the condensed liquid non-conductive liquid L1 can naturally sink back to the lower side of the protective liquid L2 by the density difference between the non-conductive liquid L1 and the protective liquid L2. In addition, because the boiling point of the protective liquid L2 is high, when the gaseous non-conductive liquid L1 transfers heat energy to the liquid protective liquid L2, the protective liquid L2 can still maintain the liquid state, and the gaseous non-conductive liquid L1 hardly flows away as long as it is condensed back to the liquid state before penetrating through the entire protective liquid L2, so that the loss amount of the non-conductive liquid L1 can be effectively reduced. It should be noted that although the drawings of the present embodiment illustrate the electric positioning socket 2 in the first embodiment, the present embodiment has the concept of the protective liquid L2, and can be applied to the immersion type cooling device D having the electric positioning socket 2 of the foregoing embodiments, so the form disclosed in the drawings is not limited.
Additionally, in the embodiment, a rubber ring R can be selectively placed between the ring wall 11 and the bottom sealing plate 12, or between the ring wall 11 and the groove cover 13, the size of a whole ring of the rubber ring R approximately matches with the top end surface or the bottom end surface of the ring wall 11, and the rubber ring R can be not penetrated by the locking member S, or can be penetrated by the locking member S to prevent displacement. Additionally, the rubber ring R shape can also be used in other embodiments of the present invention, which can be understood by those skilled in the art, and the drawings should not be used to limit the embodiments.
Referring to fig. 3 and 11, the electronic device of the present invention may include the immersion cooling device D, a plurality of electrical units E and at least one auxiliary heat sink 3 according to any of the embodiments, wherein at least one of the electrical units E may have a heat source H, and the heat source H may be disposed in the cavity C of the sealing groove 1 and immersed in the non-conductive liquid L1; the auxiliary heat sink 3 can be attached to the heat source H of the electrical unit E to further improve the heat exchange efficiency between the heat source H and the non-conductive liquid L1.
In detail, the electronic device can be, for example, an Industrial Computer (IPC), a server or a network communication device, and the plurality of electrical units E can be, for example, a power supply, a hard disk, a fan, a motherboard, a cpu, a memory and a display card. Most of the electric units E, such as a main board, a cpu, a memory, a display card, etc., which generate high temperature during operation to form the heat source H, may be installed in the chamber C of the sealing chamber 1 such that the heat source H is immersed in the non-conductive liquid L1; other electrical units E, which are less likely to generate high temperature during operation, may be disposed outside the sealing groove 1.
The auxiliary heat sink 3 may have a heat conducting substrate 31 and a porous layer structure 32, the heat conducting substrate 31 may be attached to the heat source H of the electrical unit E, and the porous layer structure 32 may contact the heat conducting substrate 31 and the non-conductive liquid L1. For example, the heat conductive substrate 31 may be a copper substrate, and the porous layer structure 32 may be located on the surface of the heat conductive substrate 31 to form a microfiber Powder Boiler (Micro Fiber power Boiler) together with the heat conductive substrate 31; the porous structure 32 may be, for example, a capillary sheet formed by sintering copper powder, or a copper mesh that is spread on the second surface 31b (shown in fig. 12) of the heat conducting substrate 31 with solder paste and then welded by reflow, etc., which is not limited by the present invention as long as the porous structure can be formed. In addition, the heat conducting substrate 31 may also be a part of a temperature equalizing plate (VC), so that the porous layer structure 32 may be formed on the outer surface of the temperature equalizing plate.
Thus, in the electronic apparatus of the embodiment, when the electrical unit E having the heat source H operates, the heat energy generated by the heat source H can be absorbed by the heat conducting substrate 31 and transferred to the porous layer structure 32, so that the heat dissipation area can be increased by the porous layer structure 32, and the heat energy can be more rapidly transferred to the non-conductive liquid L1, so as to improve the heat exchange efficiency between the heat source H and the non-conductive liquid L1, i.e., the heat dissipation efficiency of the heat source H is improved.
Referring to fig. 11 to 13, in other embodiments, the heat conducting substrate 31 may have a first surface 31a and a second surface 31b opposite to each other, and the heat conducting substrate 31 may be attached to the heat source H of the electrical unit E through the first surface 31 a. The porous layer structure 32 is located on the second face 31b, and the outer surface 321 of the porous layer structure 32 contacting the non-conductive liquid L1 may have a plurality of protruding or recessed turbulence portions 322, so that a vortex may be generated by the fluid passing through the turbulence portions, and further the surrounding gaseous and liquid non-conductive liquid L1 may be disturbed, thereby increasing the overall heat dissipation area and enhancing the heat dissipation effect; preferably, the cross section of the spoiler 322 may be triangular to further enhance the aforementioned effects. In addition, the auxiliary heat sink 3 may further include a frame 33, the frame 33 may have a hollow 331, the frame 33 may be connected to the second surface 31b of the heat conducting substrate 31, and the porous layer structure 32 is located within the hollow 331, so that the frame 33 does not shield the porous layer structure 32, the frame 33 protects the porous layer structure 32 from being damaged, and the structure of the whole auxiliary heat sink 3 is strengthened, so as to combine the auxiliary heat sink 3 to the electrical unit E, and the heat conducting substrate 31 is attached to the heat source H of the electrical unit E.
To sum up, the utility model discloses an submergence formula cooling device, its electric positioning seat can supply the electric unit to stabilize and erect outward, can also make the liquid level of nonconducting liquid obviously rise to use less non-conducting liquid just can fully soak this electric unit, so can save the quantity of nonconducting liquid, have the efficiency such as use cost that reduces nonconducting liquid. Furthermore, the utility model discloses still borrow the bubble guide slot by this electric positioning seat, the guide bubble upwards flows more smoothly to promote the heat dispersion to electric unit. And the fluid driving piece of the electric positioning seat can drive the non-conductive liquid to circularly flow, and is helpful to improve the heat dissipation performance of the electric unit.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention.
Claims (15)
1. An immersion cooling apparatus for cooling at least one heat source, comprising:
the sealing groove is internally provided with a cavity which is filled with a non-conductive liquid; and
the electric positioning seat is positioned in the cavity and provided with a plurality of fixing frames positioned on a base, an inserting groove is formed between two adjacent fixing frames, the heat source is positioned in the inserting groove, the non-conductive liquid soaks the heat source, the base is provided with at least one through groove, the through groove is communicated with the inserting grooves, and a fluid driving piece drives the non-conductive liquid to flow into the inserting grooves through the through groove.
2. The immersion cooling apparatus as claimed in claim 1, wherein the electrical positioning socket has at least one inlet channel, the inlet channel is located below and communicates with the plurality of slots.
3. The submerged cooling device of claim 2, wherein each holder has a plurality of bubble guide channels extending longitudinally, each bubble guide channel communicating with the top end of the holder and the liquid inlet passage.
4. The submerged cooling apparatus of claim 3, wherein the width of the bubble guide increases from bottom to top.
5. The immersion cooling apparatus as claimed in claim 1, wherein the electrical positioning socket has a clamping frame for engaging and fixing the electrical unit, the clamping frame engaging and fixing the corresponding fixing frame.
6. The immersion cooling apparatus as claimed in claim 1, wherein the electrical positioning socket has two opposite side walls, the two side walls are located on the base, a plurality of fixing brackets are located between the two side walls, and a slot for inserting and positioning the electrical unit is formed between each side wall and the nearest fixing bracket.
7. The submerged cooling device of claim 6, wherein the sealing groove has a ring wall and a bottom sealing plate, a protruding ring of the bottom sealing plate is joined to the ring wall in a liquid-tight manner and is located in the chamber, the bottom sealing plate is located in a space surrounded by the protruding ring, two side walls are partially connected to the bottom sealing plate and are partially located above the protruding ring, and a portion of each side wall facing away from the plurality of fixing brackets conforms to the shape of the inner wall of the ring wall.
8. The immersion cooling apparatus as claimed in claim 1, wherein the electrical positioning socket has two opposite side walls, the two side walls are disposed on the base, a plurality of fixing frames are disposed between the two side walls, each side wall has at least one liquid guiding channel extending in a longitudinal direction, the liquid guiding channel is connected to the top ends of the side walls and the through slot, and the fluid driving member drives the non-conductive liquid to flow into the plurality of slots through the liquid guiding channel and the through slot.
9. An immersion cooling apparatus as claimed in claim 8, wherein the fluid drive is located in the through-slot or in the liquid conducting channel.
10. An immersion cooling apparatus as claimed in any one of claims 1 to 9, wherein the chamber is additionally filled with a protective liquid having a density lower than the non-conducting liquid and a boiling point higher than the non-conducting liquid.
11. An electronic device, comprising:
an immersion cooling apparatus as claimed in any one of claims 1 to 10; and
at least one electric unit is inserted and positioned in the slot, and the electric unit is provided with the heat source.
12. The electronic device of claim 11, further comprising at least one auxiliary heat sink having a thermally conductive substrate attached to the heat source of the electrical unit, a porous layer structure contacting the thermally conductive substrate and the electrically non-conductive liquid.
13. The electronic device of claim 12, wherein the outer surface of the porous layer structure has a plurality of turbulators that are convex or concave.
14. The electronic device of claim 13, wherein the spoiler has a triangular cross-section.
15. The electronic device of claim 12, wherein the auxiliary heat sink has a frame, the frame has a hollow, the frame is connected to the heat conductive substrate, and the pair of porous layers is located within the hollow.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109123730A TWI750733B (en) | 2020-07-14 | 2020-07-14 | Immersion cooling device and electronic device including the same |
| TW109123730 | 2020-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213694613U true CN213694613U (en) | 2021-07-13 |
Family
ID=76742573
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021461550.0U Active CN213694613U (en) | 2020-07-14 | 2020-07-22 | Immersion cooling device and electronic equipment with same |
| CN202010711396.6A Pending CN113939142A (en) | 2020-07-14 | 2020-07-22 | Immersion cooling device and electronic equipment with same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010711396.6A Pending CN113939142A (en) | 2020-07-14 | 2020-07-22 | Immersion cooling device and electronic equipment with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN213694613U (en) |
| TW (1) | TWI750733B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939142A (en) * | 2020-07-14 | 2022-01-14 | 建准电机工业股份有限公司 | Immersion cooling device and electronic equipment with same |
| US20220369504A1 (en) * | 2021-05-17 | 2022-11-17 | Cgg Services Sas | Methods and systems for fluid immersion cooling |
| WO2023129225A1 (en) * | 2021-12-30 | 2023-07-06 | Microsoft Technology Licensing, Llc. | Enhanced fluid replacement structures for use in immersion cooling tanks |
| TWI824611B (en) * | 2022-07-08 | 2023-12-01 | 緯穎科技服務股份有限公司 | Immersion cooling system |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI816465B (en) * | 2022-07-08 | 2023-09-21 | 緯穎科技服務股份有限公司 | Immersion cooling system |
| CN117241566B (en) * | 2023-11-14 | 2024-01-30 | 东南大学 | Immersed multiphase coupling liquid cooling system |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI447340B (en) * | 2009-12-14 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | Water-cooled heat sink |
| US10297339B2 (en) * | 2014-02-19 | 2019-05-21 | Advantest Corporation | Integrated cooling system for electronics testing apparatus |
| EP3902372A3 (en) * | 2015-10-16 | 2022-02-23 | Breville USA, Inc. | Thermal immersion circulator |
| TWM530013U (en) * | 2016-05-20 | 2016-10-01 | Kuan Ding Ind Co Ltd | Liquid-cooling heat dissipation device |
| TWI836706B (en) * | 2017-09-06 | 2024-03-21 | 英商艾瑟歐托普集團有限公司 | Heat sink, heat sink arrangement and module for liquid immersion cooling |
| CN108966603A (en) * | 2018-08-15 | 2018-12-07 | 南京佳力图机房环境技术股份有限公司 | A kind of cooling immersion liquid cooling combination unit of server |
| CN209982997U (en) * | 2019-04-16 | 2020-01-21 | 龙岩思康新材料有限公司 | Closed server cooling device |
| CN110290677B (en) * | 2019-06-06 | 2024-04-26 | 深圳绿色云图科技有限公司 | Liquid immersion type cooling cabinet |
| CN110958819B (en) * | 2019-12-11 | 2021-06-01 | 深圳绿色云图科技有限公司 | Cooling device and single-phase immersed liquid cooling cabinet |
| TWI750733B (en) * | 2020-07-14 | 2021-12-21 | 建準電機工業股份有限公司 | Immersion cooling device and electronic device including the same |
-
2020
- 2020-07-14 TW TW109123730A patent/TWI750733B/en active
- 2020-07-22 CN CN202021461550.0U patent/CN213694613U/en active Active
- 2020-07-22 CN CN202010711396.6A patent/CN113939142A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939142A (en) * | 2020-07-14 | 2022-01-14 | 建准电机工业股份有限公司 | Immersion cooling device and electronic equipment with same |
| US20220369504A1 (en) * | 2021-05-17 | 2022-11-17 | Cgg Services Sas | Methods and systems for fluid immersion cooling |
| WO2023129225A1 (en) * | 2021-12-30 | 2023-07-06 | Microsoft Technology Licensing, Llc. | Enhanced fluid replacement structures for use in immersion cooling tanks |
| TWI824611B (en) * | 2022-07-08 | 2023-12-01 | 緯穎科技服務股份有限公司 | Immersion cooling system |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI750733B (en) | 2021-12-21 |
| TW202203736A (en) | 2022-01-16 |
| CN113939142A (en) | 2022-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213694613U (en) | Immersion cooling device and electronic equipment with same | |
| TWI836706B (en) | Heat sink, heat sink arrangement and module for liquid immersion cooling | |
| CN107484387B (en) | Immersed liquid cooling device, blade server and rack server | |
| EP3232753B1 (en) | Immersion cooling arrangements for electronic devices | |
| CN107113996B (en) | Shell for liquid-immersed cooling type electronic device | |
| KR100633492B1 (en) | Cooling module | |
| CN106445037A (en) | Partial immersion type liquid cooling server cooling system | |
| JP2018018857A (en) | Immersion cooler, immersion cooling system, and control method of immersion cooler | |
| KR20220136949A (en) | Cooling device | |
| JP2023501829A (en) | Cold plates and systems for cooling electronic devices | |
| US11252839B2 (en) | Computer liquid cooling system | |
| US10881019B2 (en) | Cooling apparatus | |
| WO2023116491A1 (en) | Immersion-type liquid-cooling device and immersion-type liquid-cooling system | |
| CN115023075B (en) | Computing equipment and cabinet | |
| JP2004246615A (en) | Electronic equipment, its enclosure and electronic module for the same | |
| CN216017518U (en) | Submerged cooling system | |
| CN212341825U (en) | Immersion cooling system and electronic device with same | |
| CN214592559U (en) | Submerged cooling system | |
| CN216905720U (en) | Cooling device and electronic equipment | |
| JPH1051169A (en) | Semiconductor device mounting heat generating element | |
| CN211878558U (en) | Be suitable for radiating electronic equipment of liquid cooling to bear device and virtual currency digger | |
| CN116156830A (en) | Cooling device and electronic equipment | |
| CN116483178A (en) | Computing equipment and cold plate thereof | |
| CN113966069A (en) | Substrate structure and terminal device | |
| CN111831084B (en) | Cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |