CN212341825U - Immersion cooling system and electronic device with same - Google Patents
Immersion cooling system and electronic device with same Download PDFInfo
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- CN212341825U CN212341825U CN202021316681.XU CN202021316681U CN212341825U CN 212341825 U CN212341825 U CN 212341825U CN 202021316681 U CN202021316681 U CN 202021316681U CN 212341825 U CN212341825 U CN 212341825U
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- 238000001816 cooling Methods 0.000 title claims abstract description 63
- 238000007654 immersion Methods 0.000 title claims description 30
- 239000007788 liquid Substances 0.000 claims abstract description 178
- 239000010410 layer Substances 0.000 claims abstract description 53
- 230000001681 protective effect Effects 0.000 claims abstract description 38
- 239000011241 protective layer Substances 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 238000009835 boiling Methods 0.000 claims abstract description 13
- 239000012530 fluid Substances 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims 2
- 230000003134 recirculating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an submergence formula cooling system and have this submergence formula cooling system's electron device for solve the problem that the non-conducting liquid in the current submergence formula cooling system runs off easily. The method comprises the following steps: a sealing groove having a chamber therein; a working layer formed by at least one non-conductive liquid filled in the chamber; and a protective layer formed by at least one protective liquid filled in the cavity, wherein the density of the protective liquid is lower than that of the non-conductive liquid, and the boiling point of the protective liquid is higher than that of the non-conductive liquid.
Description
Technical Field
The present invention relates to a cooling system of an electronic device, and more particularly to an immersion cooling system for immersing a heat source of an electronic device in a non-conductive liquid to maintain a proper working temperature and an electronic device having the same.
Background
Immersion cooling (Immersion cooling) is to immerse an electrical unit (such as a server, a motherboard, a cpu, a display card or a memory) in a non-conductive liquid, so that high-temperature heat energy generated during the operation of the electrical unit can be directly absorbed by the non-conductive liquid, and the electrical unit can maintain a proper operating temperature to achieve a desired operating performance and a desired service life.
A conventional immersion cooling system generally includes a cooling tank filled with a liquid non-conductive liquid at a lower layer and a condenser disposed at an upper layer above the liquid non-conductive liquid in the cooling tank. The electric unit needing cooling is immersed in the liquid non-conductive liquid, and due to the low boiling point of the non-conductive liquid, after the working heat energy of the electric unit is absorbed, part of the non-conductive liquid can be converted into a gas state, so that bubbles are formed in the liquid non-conductive liquid and float upwards until the bubbles leave the surface layer of the liquid non-conductive liquid, and then the bubbles are condensed back to the liquid state again and drop downwards when contacting the condenser.
However, since the gaseous non-conductive liquid is easy to leak from the gap of the cooling tank or other places to the outside before condensing back to a liquid state, the amount of the non-conductive liquid in the cooling tank is gradually reduced, and the non-conductive liquid needs to be replenished at intervals, which not only requires manpower cost for maintenance, but also causes economic burden of users due to the high price of the non-conductive liquid.
In view of the above, there is a need for an improved immersion cooling system.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the present invention provides an immersion cooling system and an electronic device having the same, which can condense gaseous non-conductive liquid back to liquid state in liquid state environment to reduce the loss of gaseous non-conductive liquid.
The utility model discloses a next purpose provides an submergence formula cooling system and have this submergence formula cooling system's electron device, can promote the efficiency of condensing gaseous state non-conducting liquid back to liquid state.
Another object of the present invention is to provide an immersion cooling system and an electronic device having the same, which can reduce the cost of the apparatus and the operation cost.
In the present invention, the directions or the similar terms thereof, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., refer to the directions of the drawings, and the directions or the similar terms thereof are only used to assist the explanation and understanding of the embodiments of the present invention, but not to limit the present invention.
The elements and components described throughout the present invention are referred to by the term "a" or "an" merely for convenience and to provide a general meaning of the scope of the invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.
The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.
The utility model discloses an submergence formula cooling system, include: a sealing groove having a chamber therein; a working layer formed by at least one non-conductive liquid filled in the chamber; and a protective layer formed by at least one protective liquid filled in the cavity, wherein the density of the protective liquid is lower than that of the non-conductive liquid, and the boiling point of the protective liquid is higher than that of the non-conductive liquid.
Therefore, the utility model discloses an submergence formula cooling system, the liquid nonconducting liquid in its working layer can convert the gaseous state to after absorbing heat energy to form the bubble and rise and get into the protective layer, make the nonconducting liquid of gaseous state can condense back to liquid in liquid state environment, sink back to again in this working layer, thereby can effectively reduce the loss of the nonconducting liquid of gaseous state, make the nonconducting liquid volume in this seal groove difficult to reduce, have the expense that reduces the replenishment nonconducting liquid by a wide margin and efficiency such as human cost.
Wherein, this seal groove can have a barrel groove and a capping, and this cavity is located this barrel inslot portion, and this barrel groove can have a lid and close this cavity of mouth intercommunication, and this capping can cover this lid and close the mouth. Therefore, the cavity can be conveniently used for inputting liquid, taking and placing objects or pulling out wires, and the device has the effects of improving the convenience of assembly and use and the like.
The protective layer may be formed of two or more protective liquids having different densities, and the protective liquid on the upper layer has a lower density and a higher boiling point. Therefore, the method has the effects of further reducing the loss of the non-conductive liquid and the like.
The immersion cooling system may further comprise an agitator, which may be located at the protective layer, the agitator agitating the protective liquid by an impeller. Therefore, the temperature of each part of the whole protective layer is relatively even, and the efficiency of condensing the gaseous non-conducting liquid back to the liquid state is improved.
The immersion cooling system may further include a circulating cooling module, which may have a pipe assembly, a part of the pipe assembly may pass through the protective layer and form a heat absorbing part, and the protective liquid may exchange heat with the heat absorbing part. Therefore, the protective solution can maintain low temperature and has the effects of improving cooling efficiency and the like.
The circulating cooling module can be provided with a driving source communicated with the pipe assembly, the driving source can drive fluid in the pipe assembly to flow, and the pipe assembly can be connected with a heat dissipation unit to reduce the temperature of the fluid in the pipe assembly. Therefore, the cooling efficiency is improved.
The immersion cooling system may additionally include at least one electrical unit, which may be positioned in the chamber and which may be immersed in the non-conductive liquid. Thus, the electric unit can be cooled down reliably, and the electric unit can operate stably.
Wherein the heat source of the electrical unit may be located in the working layer and a part of the electrical unit may be located in the protective layer. Therefore, on the premise of cooling the heat source, the consumption of the non-conductive liquid is reduced, and the heat source has the effects of reducing the cost and the like.
The immersion cooling system may further include a mounting bracket for positioning at least one electrical unit, the mounting bracket may be located at the bottom end of the chamber, the mounting bracket may have a plurality of spaced-apart fixing brackets, a slot may be formed between any two adjacent fixing brackets, the electrical unit may be inserted and positioned in one of the slots, and the non-conductive liquid may infiltrate the heat source of the electrical unit through the slot. Therefore, the electric units can be stably arranged, the number of the electric units which can be cooled at the same time is increased, and the cooling effect is improved, the occupied space is reduced, and the like.
The utility model provides an electron device in addition, include: a plurality of electrical units, at least one of which has a heat source; and the heat source is positioned in the working layer. Therefore, the protective layer can also condense the gaseous non-conductive liquid back to the liquid state in the liquid state environment, thereby reducing the loss of the non-conductive liquid and greatly reducing the expense for supplementing the non-conductive liquid and the labor cost and the like of the electronic device.
Wherein a part of the electrical unit having the heat source may be located in the protective layer. Therefore, the electric units can be stably arranged, the number of the electric units which can be cooled at the same time is increased, and the cooling effect is improved, the occupied space is reduced, and the like. Therefore, on the premise of cooling the heat source, the consumption of the non-conductive liquid is reduced, and the heat source has the effects of reducing the cost and the like.
The immersion cooling system may further include a seat frame, the seat frame may be located at the bottom end of the chamber, the seat frame may have a plurality of spaced fixing frames, an insertion slot may be formed between any two adjacent fixing frames, the electrical unit having the heat source may be inserted and located in one of the insertion slots, and the non-conductive liquid may infiltrate the heat source through the insertion slot. Therefore, the electric units can be stably arranged, the number of the electric units which can be cooled at the same time is increased, and the cooling effect is improved, the occupied space is reduced, and the like.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
FIG. 1: the utility model discloses an exploded perspective view of a first embodiment;
FIG. 2: the utility model discloses the combined sectional view of the first embodiment;
FIG. 3: the utility model discloses the combined sectional view of the second embodiment;
FIG. 4: a plan view of a third embodiment of the present invention;
FIG. 5: a plan view of another aspect of the third embodiment of the present invention;
FIG. 6: the utility model discloses electron device's local cut-out plane view.
Description of the reference numerals
1 sealing groove
11: cylinder groove
11a ring wall
11b bottom sealing plate
111, cover and close the mouth
112 opening of
12: groove cover
121 holes
2 working layer
3 protective layer
4: seat frame
41 fixing frame
42, a slot
5. perturbator
51 casing
511 inlet of the reactor
512 discharge port
52 connecting frame
53 impeller
6: circulating cooling module
61 pipe fitting group
611 heat absorption part
62 driving source
63 heat dissipation unit
7 electronic device
71 casing
B, bottom end
C, a chamber
E electric unit
H is heat source
L1 non-conducting liquid
L2 protective liquid
L21 first protective solution
L22 second protective solution.
Detailed Description
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail as follows:
referring to fig. 1 and 2, a first embodiment of the immersion cooling system of the present invention includes a sealing groove 1, a working layer 2 and a protection layer 3. The sealing groove 1 has a cavity C therein for accommodating the working layer 2, the protection layer 3 and at least one electrical unit E to be cooled.
The utility model discloses do not restrict the pattern of this seal groove 1 to can hold this working layer 2, this protective layer 3 and this electrical unit E, produced heat energy is the principle when making this working layer 2 can absorb this electrical unit E function. The sealing groove 1 may have a cylinder groove 11 and a groove cover 12, the chamber C is located inside the cylinder groove 11, the cylinder groove 11 has a cover opening 111 communicated with the chamber C, so as to input liquid into the chamber C from the cover opening 111, or pick and place objects such as the electrical unit E, or pull out wires such as wires or signal wires connected with the electrical unit E; the cover 12 can cover the cover opening 111 to make the chamber C sealed.
In this embodiment, the barrel tank 11 may have a ring wall 11a and a sealing base plate 11b, so that different parts of the barrel tank 11 may be made of different materials; for example, the annular wall 11a can be made of a transparent material, and the bottom sealing plate 11b can be made of a material with the characteristics of firmness, wear resistance, skid resistance and the like according to requirements. One end of the annular wall 11a may form the aforementioned lid opening 111, and the other end of the annular wall 11a may form an opening 112, where the opening 112 may be opposite to the lid opening 111; in the use state, the cover opening 111 faces upward, and the opening 112 faces downward. In addition, for the barrel tank 11 having both the cover opening 111 and the opening 112, it is also possible to select to take and put objects, wiring or input liquid from the opening 112. In addition, the bottom sealing plate 11b can be combined with the annular wall 11a and cover the opening 112, and the bottom sealing plate 11b can form a liquid-tight seal with the annular wall 11a, so as to ensure that the liquid in the chamber C cannot leak from the bottom end of the tank 11 to the outside.
The cover 12 can be combined with the annular wall 11a and cover the cover opening 111, and the periphery of the cover 12 can be airtight with the annular wall 11a, for example, by a rubber ring, so as to ensure that the gas or liquid in the chamber C cannot leak from the periphery of the cover 12 to the outside. In the using state, the slot cover 12 may be located above the barrel slot 11, and in this embodiment, a plurality of holes 121 may be selectively formed in the slot cover 12, so that the slot cover 12 can input liquid into the chamber C or pull out wires such as wires or signal wires connected to the electrical unit E through the plurality of holes 121 while covering the cover opening 111. In addition, each hole 121 preferably has a sealing structure to reduce the chance of gas or liquid in the chamber C leaking to the outside.
The working layer 2 is formed by at least one non-conductive liquid L1 filled in the chamber C, the protection layer 3 is formed by at least one protection liquid L2 filled in the chamber C, and the working layer 2 is formed by a single non-conductive liquid L1 and the protection layer 3 is formed by a single protection liquid L2, but not limited thereto. The density of the protective liquid L2 is lower than that of the non-conductive liquid L1, so that the non-conductive liquid L1 and the protective liquid L2 can be naturally layered in the chamber C, and the protective layer 3 is adjacent to the upper side of the working layer 2. The boiling point of the protective liquid L2 is higher than the boiling point of the non-conductive liquid L1.
The electric unit E is an object to be cooled, and the electric unit E may be positioned at a predetermined position in the chamber C so that the electric unit E can be immersed in contact with the non-conductive liquid L1. For example, the whole electrical unit E may be immersed in the working layer 2, or at least the heat source H of the electrical unit E may be immersed in the working layer 2, which is not limited by the present invention. The heat source H of the electrical unit E can be selectively located in the working layer 2, and a part of the electrical unit E is located in the protective layer 3, so that the amount of the non-conductive liquid L1 can be reduced to reduce the cost on the premise of cooling the heat source H; in addition, when the electrical unit E is erected, the heat source H of the electrical unit E is selected to be as close as possible to the bottom end B of the chamber C, so as to further save the usage of the non-conductive liquid L1.
More specifically, the present embodiment optionally positions the electrical unit E on a mounting 4, which mounting 4 can be stably disposed at the bottom end B of the chamber C. For example, but not limited to, the seat frame 4 may have a plurality of spaced fixing frames 41 to form a slot 42 between any two adjacent fixing frames 41, when the electrical unit E is a sheet structure such as a motherboard, a communication interface panel, a display panel or a data storage panel, the electrical unit E may be inserted and positioned in one slot 42, and the non-conductive liquid L1 may still infiltrate the heat source H of the electrical unit E through the slot 42. Alternatively, in other embodiments, a hanging bracket may be disposed on the slot cover 12 to position the electrical unit E, so that the electrical unit E can be immersed in the working layer 2, and the present invention does not limit the manner of positioning the electrical unit E.
The immersion cooling system may further comprise an agitator 5, wherein the agitator 5 is disposed on the protection layer 3 for agitating the protection liquid L2, so as to make the temperature of the protection layer 3 more uniform. In this embodiment, the perturbator 5 may have a housing 51, and the housing 51 may be assembled to the cover 12 by a connecting frame 52 and maintain the housing 51 to be soaked in the protection liquid L2. The casing 51 has an inlet 511 and an outlet 512, and the casing 51 has an impeller 53 therein for driving the protection liquid L2 to flow into the casing 51 from the inlet 511 and then flow out from the outlet 512, wherein the aperture of the outlet 512 can be smaller than the aperture of the inlet 511 to increase the flow rate of the liquid flowing out from the outlet 512, thereby reducing the energy consumption of the perturber 5.
Referring to fig. 2, in the immersion cooling system of the present embodiment, when the electrical unit E operates to generate heat energy, the non-conductive liquid L1 around the electrical unit E absorbs the heat energy, so that the electrical unit E can be maintained at a proper working temperature. The liquid-state non-conductive liquid L1 in the working layer 2 can be converted into a gas state after absorbing heat energy, and form bubbles to rise into the protective layer 3; at this time, the gaseous nonconducting liquid L1 entering the protection layer 3 can transfer heat energy to the liquid protection liquid L2, so as to condense back to a liquid state in the protection layer 3, and then the nonconducting liquid L1 condensed back to the liquid state can naturally sink back to the working layer 2 through the density difference between the nonconducting liquid L1 and the protection liquid L2. In addition, because the boiling point of the protective liquid L2 is high, when the gaseous non-conductive liquid L1 transfers heat energy to the liquid protective liquid L2, the protective liquid L2 can still maintain the liquid state, and the gaseous non-conductive liquid L1 hardly flows away as long as it is condensed back to the liquid state before reaching the top end of the protective layer 3, so that the flow loss of the non-conductive liquid L1 can be greatly reduced.
Referring to fig. 3, which is a second embodiment of the immersion cooling system of the present invention, the protection layer 3 of the present embodiment may be formed by more than two protection liquids L2 with different densities, so as to further improve the effect of reducing the loss of the nonconducting liquid L1. For example, the protection layer 3 of the present embodiment may be formed by two protection liquids L2 with different densities, and hereinafter referred to as a first protection liquid L21 and a second protection liquid L22, respectively, for the sake of illustration.
The density of the first protective liquid L21 is lower than that of the non-conducting liquid L1, the density of the second protective liquid L22 is lower than that of the first protective liquid L21, the boiling point of the first protective liquid L21 is higher than that of the non-conducting liquid L1, and the boiling point of the second protective liquid L22 is higher than that of the first protective liquid L21. Thus, the protection layer 3 of the present embodiment can be formed in a two-layer form, and the second protection liquid L22 is adjacent to the top of the first protection liquid L21, in case the gaseous non-conductive liquid L1 does not reach the top of the first protection liquid L21 and condenses back to a liquid state, the bubbles can enter the second protection liquid L22 and condenses back to a liquid state in the liquid second protection liquid L22, and naturally sink, and pass through the first protection liquid L21 to return to the working layer 2; therefore, the second protective liquid L22 can further reduce the loss of the non-conductive liquid L1. In another embodiment, the protective layer 3 may be formed in a multilayer form by further adding protective solutions having different densities, and the principle that the density of the protective solution is lower and the boiling point is higher as the upper layer is higher may be grasped.
Referring to fig. 4, which shows a third embodiment of the immersion cooling system of the present invention, the present embodiment may further include a circulating cooling module 6, the circulating cooling module 6 may pass through the protection layer 3 through a pipe assembly 61, so that the liquid or gaseous fluid circulating in the pipe assembly 61 exchanges heat with the protection liquid L2 forming the protection layer 3 to absorb the heat energy of the protection liquid L2, so that the protection liquid L2 can be maintained at a low temperature, thereby improving the efficiency of condensing the gaseous nonconducting liquid L1 back to the liquid state.
In detail, the circulation cooling module 6 may further have a driving source 62 and a heat dissipating unit 63, the pipe assembly 61 is connected to the driving source 62, so that the driving source 62 drives the fluid in the pipe assembly 61 to flow; the tube assembly 61 is connected to the heat dissipating unit 63, a heat absorbing portion 611 is formed at a portion of the tube assembly 61 located in the cavity C, and a connection portion of the heat dissipating unit 63 and the tube assembly 61 is preferably far away from the heat absorbing portion 611. Accordingly, the fluid in the tube assembly 61 can absorb the heat energy of the protection liquid L2 when flowing through the heat absorbing part 611, and cool down when flowing through the heat dissipating unit 63, and is guided to the heat absorbing part 611 again after cooling down, so as to circulate continuously, so that the protection liquid L2 can maintain a low temperature.
The driving source 62 may be an impeller or a pump, for example, and the driving source 62 may be disposed in the chamber C as shown in fig. 4 or disposed outside the sealing groove 1 as shown in fig. 5. The heat dissipation unit 63 may be an air-cooled or liquid-cooled heat sink, which is not limited in the present invention.
Referring to fig. 6, the electronic device 7 of the present embodiment may have a housing 71 and a plurality of electrical units E, and the plurality of electrical units E and the immersion cooling system of the foregoing embodiments may be located in the housing 71.
In detail, the electronic device 7 may be, for example, an Industrial Computer (IPC), the plurality of electrical units E may be, for example, a power supply, a hard disk, a fan, a motherboard, a cpu, a memory, a display card, etc., wherein the electrical units E generating high temperature during operation, such as the motherboard, the cpu, the memory, the display card, etc., at least one of the electrical units E may have a heat source H, and the heat source H may be disposed in the cavity C of the sealing groove 1 and immersed in the working layer 2; other electrical units E, which are less likely to generate high temperature during operation, may be disposed outside the sealing groove 1. The working layer 2 is formed by at least one non-conductive liquid L1, the protective layer 3 is formed by at least one protective liquid L2, the density of the protective liquid L2 is lower than that of the non-conductive liquid L1, and the boiling point of the protective liquid L2 is higher than that of the non-conductive liquid L1. Accordingly, the liquid non-conductive liquid L1 in the working layer 2 can absorb the heat energy generated by the heat source H and convert the heat energy into a gas state, form bubbles and rise into the protection layer 3, condense back to a liquid state in the protection layer 3, and then sink back into the working layer 2, thereby achieving the effect of reducing the loss of the non-conductive liquid L1.
It should be noted that the protection layer 3 of the present embodiment may also be formed by more than two protection liquids L2 with different densities as in the second embodiment, so as to further enhance the effect of reducing the loss of the non-conductive liquid L1; alternatively, a perturber 5 (shown in fig. 2) may be disposed on the passivation layer 3 as in the first embodiment, or a circulating cooling module 6 (shown in fig. 4) may be disposed in the third embodiment to improve the efficiency of condensing the gaseous nonconducting liquid L1 back to the liquid state. In addition, in other embodiments, the sealing groove 1 can be selectively disposed outside the housing 71 of the electronic device 7, and the electrical unit E required to be disposed in the chamber C is naturally also disposed outside the housing 71, which can be understood by those skilled in the art, so the electronic device 7 of the present invention is not limited to the configuration shown in fig. 6.
To sum up, the utility model discloses an submergence formula cooling system and have this submergence formula cooling system's electron device, the liquid nonconducting liquid in its working layer can convert the gaseous state to after absorbing heat energy to form the bubble and rise and get into the protective layer, make the nonconducting liquid of gaseous state can condense back to the liquid state in liquid state environment, sink back to again in this working layer, thereby can effectively reduce the loss of gaseous nonconducting liquid, make the nonconducting liquid measure in this seal groove difficult the reduction, have the expense that reduces the replenishment nonconducting liquid by a wide margin and efficiency such as human cost.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention.
Claims (12)
1. An immersion cooling system, comprising:
a seal groove having a cavity therein;
a working layer formed by at least one non-conductive liquid filled in the chamber; and
and the protective layer is formed by at least one protective liquid filled in the chamber, the density of the protective liquid is lower than that of the non-conductive liquid, and the boiling point of the protective liquid is higher than that of the non-conductive liquid.
2. The immersion cooling system as claimed in claim 1, wherein the sealing groove has a tank and a cover, the chamber is located inside the tank, the tank has a cover opening communicating with the chamber, and the cover covers the cover opening.
3. An immersion cooling system as claimed in claim 1, wherein the protective layer is formed from two or more protective liquids of different densities, the upper layer having a lower density and a higher boiling point.
4. The submerged cooling system of claim 1, further comprising an agitator located in the protective layer, the agitator agitating the protective liquid with an impeller.
5. An immersion cooling system as claimed in claim 1, further comprising a recirculating cooling module having a bank of tubes, part of which passes through the protective layer and forms a heat sink, the protective liquid being in heat exchange with the heat sink.
6. An immersion cooling system as claimed in claim 5, wherein the hydronic module has a drive source in communication with the set of pipes, the drive source driving fluid flow in the set of pipes, the set of pipes being connected to a heat sink unit to reduce the temperature of the fluid in the set of pipes.
7. An immersion cooling system as claimed in any one of claims 1 to 6, further comprising at least one electrical unit, the electrical unit being located in the chamber and immersed in the non-conductive liquid.
8. The immersion cooling system as claimed in claim 7, wherein the heat source of the electrical unit is located in the working layer and a portion of the electrical unit is located in the protective layer.
9. An immersion cooling system as claimed in any one of claims 1 to 6, further comprising a mounting for locating at least one electrical unit, the mounting being located at the bottom end of the chamber, the mounting having a plurality of spaced apart mounts, a slot being formed between any two adjacent mounts, the electrical unit being inserted and located in one of the slots, the non-conductive liquid wetting the heat source of the electrical unit through the slot.
10. An electronic device, comprising:
a plurality of electrical units, at least one of which has a heat source; and
an immersion cooling system as claimed in any one of claims 1 to 6, the heat source being located in the working layer.
11. The electronic device of claim 10, wherein a portion of the electrical unit having the heat source is located in the protective layer.
12. The electronic device of claim 10, wherein the immersion cooling system further comprises a mount located at the bottom end of the chamber, the mount having a plurality of spaced apart mounts, a slot being formed between any two adjacent mounts, an electrical unit having the heat source being configured to be located in one of the slots, the non-conductive liquid wetting the heat source through the slot.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109121870 | 2020-06-29 | ||
| TW109121870 | 2020-06-29 |
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| CN212341825U true CN212341825U (en) | 2021-01-12 |
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| CN202010646647.7A Pending CN113934276A (en) | 2020-06-29 | 2020-07-07 | Immersion cooling system and electronic device with same |
| CN202021316681.XU Active CN212341825U (en) | 2020-06-29 | 2020-07-07 | Immersion cooling system and electronic device with same |
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| CN114945260A (en) * | 2021-02-17 | 2022-08-26 | 建准电机工业股份有限公司 | Submerged cooling system |
| EP4093170A1 (en) * | 2021-05-17 | 2022-11-23 | Cgg Services Sas | Methods and systems for fluid immersion cooling |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5907473A (en) * | 1997-04-04 | 1999-05-25 | Raytheon Company | Environmentally isolated enclosure for electronic components |
| JP2009520178A (en) * | 2005-12-19 | 2009-05-21 | ハネウェル・インターナショナル・インコーポレーテッド | Multi-fluid refrigerant system |
| US8619425B2 (en) * | 2011-10-26 | 2013-12-31 | International Business Machines Corporation | Multi-fluid, two-phase immersion-cooling of electronic component(s) |
| AU2015339685A1 (en) * | 2014-10-27 | 2017-06-15 | Ebullient, Llc | Computer hardware adapted for fluid cooling |
| US10130008B2 (en) * | 2016-04-04 | 2018-11-13 | Hamilton Sundstrand Corporation | Immersion cooling systems and methods |
| CN109757058B (en) * | 2017-11-02 | 2021-06-01 | 阿里巴巴集团控股有限公司 | Liquid cooling system and control method of liquid cooling system |
| US20220017803A1 (en) * | 2018-12-03 | 2022-01-20 | 3M Innovative Properties Company | Visually distinguishable working fluids |
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2020
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- 2020-07-07 CN CN202021316681.XU patent/CN212341825U/en active Active
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114945260A (en) * | 2021-02-17 | 2022-08-26 | 建准电机工业股份有限公司 | Submerged cooling system |
| EP4093170A1 (en) * | 2021-05-17 | 2022-11-23 | Cgg Services Sas | Methods and systems for fluid immersion cooling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113934276A (en) | 2022-01-14 |
| TWI830985B (en) | 2024-02-01 |
| TW202202034A (en) | 2022-01-01 |
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