TW202202034A - Immersion cooling system and electronic device including the same - Google Patents

Abstract

An immersion cooling system and electronic device including the same are provided to solve the problem where the conventional immersion cooling system is easily outflow with non-conductive fluid. The system includes a sealing groove having a chamber; a working layer formed by at least one non-conductive fluid filled in the chamber; a protective layer formed by at least one protective fluid filled in the chamber, a density of the protective fluid is lower than the non-conductive fluid, a boiling point of the protective fluid is higher than the non-conductive fluid.

Description

Immersion cooling system and electronic device having the same

The present invention relates to a cooling system for an electronic device, especially an immersion cooling system for immersing a heat source of the electronic device in a non-conductive liquid to maintain a proper working temperature, and an electronic device having the immersion cooling system.

Immersion cooling is to immerse electrical units (such as servers, motherboards, central processing units, graphics cards or memory, etc.) It is directly absorbed by the non-conductive liquid, so that the electrical unit can maintain a proper working temperature to achieve the expected working efficiency and service life.

A common conventional immersion cooling system generally includes a cooling tank and a condenser, the lower layer in the cooling tank is filled with liquid non-conductive liquid, and the condenser is installed in the upper layer in the cooling tank and is located in the liquid state. Above the non-conductive liquid. The electrical unit that needs to be cooled is immersed in a liquid non-conductive liquid. Due to the low boiling point of the non-conductive liquid, part of the non-conductive liquid can be transformed into a gaseous state after absorbing the working heat energy of the electrical unit, so that the liquid non-conductive liquid can be converted into a gaseous state. Bubbles are formed in the conductive liquid and float upward until it leaves the surface layer of the liquid non-conductive liquid, and then condenses back to the liquid state and drips downward when it contacts the condenser.

However, before the gaseous non-conductive liquid condenses back to the liquid state, it is easy to leak from the gap in the cooling tank or other places to the outside world, resulting in a gradual decrease in the amount of the non-conductive liquid in the cooling tank, which needs to be replenished at regular intervals, not only The labor cost of maintenance and the high price of the non-conductive liquid also cause the economic burden of the user.

In view of this, the conventional immersion cooling system does still need to be improved.

In order to solve the above problems, the purpose of the present invention is to provide an immersion cooling system and an electronic device having the immersion cooling system, so that the gaseous non-conductive liquid can be condensed back to a liquid state in a liquid environment, so as to reduce the loss of the gaseous non-conductive liquid quantity.

Another object of the present invention is to provide an immersion cooling system and an electronic device having the immersion cooling system, which can improve the efficiency of condensing a gaseous non-conductive liquid back into a liquid state.

Another object of the present invention is to provide an immersion cooling system and an electronic device having the immersion cooling system, which can reduce equipment and operating costs.

The directional or similar terms used throughout this disclosure, such as "front", "back", "left", "right", "top (top)", "bottom (bottom)", "inside", "outside" , "side surface", etc., mainly refer to the directions of the attached drawings, each directionality or its similar terms are only used to assist the description and understanding of the various embodiments of the present invention, and are not intended to limit the present invention.

The use of the quantifier "a" or "an" for the elements and components described throughout the present invention is only for convenience and provides a general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and a single The concept of also includes the plural case unless it is obvious that it means otherwise.

Similar terms such as "combined", "combined" or "assembled" mentioned in the whole text of the present invention mainly include the components that can be separated without destroying the components after the connection, or the components can not be separated after being connected, which are common knowledge in the field. It can be selected according to the material of the components to be connected or the assembly requirements.

The immersion cooling system of the present invention comprises: a sealing tank with a cavity inside; a working layer formed by at least one non-conductive liquid filled in the cavity; and a protective layer filled in the cavity At least one protective liquid in the chamber is formed, the density of the protective liquid is lower than the density of the non-conductive liquid, and the boiling point of the protective liquid is higher than the boiling point of the non-conductive liquid.

Accordingly, in the immersion cooling system of the present invention, the liquid non-conductive liquid in the working layer can be converted into a gaseous state after absorbing thermal energy, and form bubbles and rise into the protective layer, so that the gaseous non-conductive liquid can condense in a liquid environment Return to the liquid state, and then sink back into the working layer, which can effectively reduce the loss of gaseous non-conductive liquid, make it difficult to reduce the amount of non-conductive liquid in the sealing groove, and greatly reduce the cost and labor cost of replenishing the non-conductive liquid and other effects.

Wherein, the sealing groove may have a cylindrical groove and a groove cover, the cavity is located inside the cylindrical groove, the cylindrical groove may have a cover opening communicating with the chamber, and the groove cover may cover the cover opening. In this way, it is convenient to input liquid, pick and place objects, or pull out wires to the chamber, which has the effect of improving the convenience of assembly and use.

Wherein, the protective layer can be formed of two or more protective liquids with different densities, and the protective liquid of the upper layer has a lower density and a higher boiling point. In this way, it has the effect of further reducing the loss of non-conductive liquid.

The immersion cooling system may further comprise a perturbator, which may be located in the protective layer, the perturbator stirring the protective liquid by an impeller. In this way, the temperature of all parts of the entire protective layer can be made more uniform, which has the effect of improving the efficiency of condensing the gaseous non-conductive liquid back into the liquid state.

The immersion cooling system may further include a circulating cooling module, and the circulating cooling module may have a pipe assembly, a part of the pipe assembly can pass through the protective layer and form a heat absorbing part, and the protective liquid can heat with the heat absorbing part exchange. In this way, the protective liquid can maintain a low temperature, and has functions such as improving cooling efficiency.

Wherein, the circulating cooling module may have a driving source connected to the tube assembly, the driving source may drive the fluid flow in the tube assembly, and the tube assembly may be connected with a heat dissipation unit to reduce the temperature of the fluid in the tube assembly. In this way, it has the effect of improving the cooling efficiency and the like.

Wherein, the color of the non-conductive liquid may be different from the color of the protective liquid. In this way, it has the functions of enhancing the color visual effect and the like.

Wherein, the color of the non-conductive liquid or/and the color of the protective liquid can be blended with a fat-soluble dye. In this way, there are effects such as reducing the manufacturing cost.

The immersion cooling system may further comprise at least one electrical unit, the electrical unit may be positioned in the chamber, and the electrical unit may be immersed in the non-conductive liquid. In this way, the electrical unit can be surely cooled down, and the electrical unit can operate stably.

Wherein, the heat source of the electrical unit may be located in the working layer, and a part of the electrical unit may be located in the protective layer. In this way, on the premise that the heat source can be cooled, the amount of the non-conductive liquid can be reduced, and the cost can be reduced.

The immersion cooling system may further comprise a mount for positioning at least one electrical unit, the mount may be located at the bottom end of the chamber, the mount may have a plurality of spaced fixing mounts, any two adjacent mounts A slot can be formed therebetween, the electrical unit can be inserted into one of the slots, and the non-conductive liquid can pass through the slot to infiltrate the heat source of the electrical unit. In this way, the electrical unit can be stably arranged, and the number of electrical units that can be cooled at the same time is increased, thereby improving the cooling effect and reducing the occupied space.

The present invention further provides an electronic device, comprising: a plurality of electrical units, at least one of which has a heat source; and the above-mentioned immersion cooling system, the heat source is located in the working layer. In this way, the gaseous non-conductive liquid can also be condensed back to a liquid state by the protective layer, thereby reducing the loss of the non-conductive liquid, so that the electronic device can greatly reduce the cost and labor cost of replenishing the non-conductive liquid.

Therein, parts of the electrical unit with the heat source can be located in the protective layer. In this way, the electrical unit can be stably arranged, and the number of electrical units that can be cooled at the same time is increased, thereby improving the cooling effect and reducing the occupied space. In this way, on the premise that the heat source can be cooled, the amount of the non-conductive liquid can be reduced, and the cost can be reduced.

Wherein, the immersion cooling system may further comprise a frame, the seat frame may be located at the bottom end of the chamber, the seat frame may have several fixed frames spaced apart, and a socket may be formed between any two adjacent fixed frames The electric unit with the heat source can be inserted into one of the slots, and the non-conductive liquid can penetrate the slot to infiltrate the heat source. In this way, the electrical unit can be stably arranged, and the number of electrical units that can be cooled at the same time is increased, thereby improving the cooling effect and reducing the occupied space.

In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings:

Please refer to Figures 1 and 2, which are the first embodiment of the immersion cooling system of the present invention, which includes a sealing groove 1 , a working layer 2 and a protective layer 3 . Inside the sealing groove 1 is a cavity C for accommodating the working layer 2 , the protective layer 3 and at least one electrical unit E to be cooled.

The present invention does not limit the shape of the sealing groove 1, and the principle is that the working layer 2, the protective layer 3 and the electrical unit E can be accommodated, so that the working layer 2 can absorb the thermal energy generated by the electrical unit E during operation. . Wherein, the sealing groove 1 can have a cylinder groove 11 and a groove cover 12, the chamber C is located inside the cylinder groove 11, and the cylinder groove 11 has a cover opening 111 to communicate with the chamber C, so that the cover opening 111 Input liquid into the chamber C, or pick and place objects such as the electrical unit E, or pull out wires such as wires or signal wires connected to the electrical unit E; the slot cover 12 can cover the lid closing 111 to make the chamber Chamber C forms a seal.

In this embodiment, the tank 11 can have a ring wall 11a and a bottom plate 11b, so that different parts of the tank 11 can be made of different materials; for example, the ring wall 11a can be made of a see-through material The sealing plate 11b can be made of a material with sturdy, wear-resistant or anti-slip properties as required. One end of the ring wall 11a may form the aforementioned cover opening 111, and the other end of the ring wall 11a may form an opening 112, the opening 112 may be opposite to the cover opening 111; in the use state, the cover opening 111 may face upwards , the opening 112 faces downward. In addition, for the barrel tank 11 having both the cover opening 111 and the opening 112 , the opening 112 can be selected to take objects, connect wires or input liquid. In addition, the sealing plate 11b can be combined with the annular wall 11a and cover the opening 112 , and the sealing plate 11b can be liquid-tight with the annular wall 11a to ensure that the liquid in the chamber C will not leak from the bottom of the tank 11 . leakage to the outside.

The groove cover 12 can be combined with the ring wall 11a and cover the cover opening 111, and the periphery of the groove cover 12 can be airtight with the ring wall 11a by, for example, a rubber ring to ensure that the gas or liquid in the chamber C does not It leaks to the outside from the periphery of the groove cover 12 . In the use state, the slot cover 12 can be located above the cylinder slot 11. In this embodiment, several holes 121 can be opened in the slot cover 12, so that the slot cover 12 can maintain the state of covering the cover opening 111. Through the plurality of holes 121 , liquid is input into the chamber C, or wires such as wires or signal wires connected to the electrical unit E are pulled out. Wherein, each of the holes 121 preferably has a sealing structure to reduce the chance of the gas or liquid in the chamber C leaking to the outside.

The working layer 2 is formed by at least one non-conductive liquid L1 filled in the chamber C, and the protective layer 3 is formed by at least one protective liquid L2 filled in the chamber C. This embodiment The working layer 2 is formed from a single non-conductive liquid L1, and the protective layer 3 is formed from a single protective liquid L2, but not limited thereto. The density of the protective liquid L2 is lower than the density of the non-conductive liquid L1, so that the non-conductive liquid L1 and the protective liquid L2 can be naturally layered in the chamber C, and the protective layer 3 is adjacent to the working layer 2 above. In addition, the boiling point of the protective liquid L2 is higher than the boiling point of the non-conductive liquid L1. And, the color of the non-conductive liquid L1 can be different from the color of the protective liquid L2; for example, one of the non-conductive liquid L1 and the protective liquid L2 can be a transparent color (that is, see through, including transparent colored and transparent colorless ), the other can be non-transparent (i.e. not see-through, e.g. saturated red, yellow, blue, green...). Wherein, the color of the non-conductive liquid L1 or/and the color of the protective liquid L2 is preferably prepared by blending a fat-soluble dye.

The electrical unit E is an object to be cooled, and the electrical unit E can be positioned at a preset position in the chamber C, so that the electrical unit E can be immersed in contact with the non-conductive liquid L1. For example, the entire electrical unit E can be immersed in the working layer 2, or at least the heat source H of the electrical unit E can be immersed in the working layer 2, which is not limited by the present invention. Among them, the heat source H of the electrical unit E can be selected to be located in the working layer 2, and a part of the electrical unit E is located in the protective layer 3, that is, on the premise that the heat source H can be cooled, the non-conductive liquid can be reduced. The amount of L1 is used to reduce the cost; in addition, when the electrical unit E is erected, the heat source H of the electrical unit E can be selected to be as close to the bottom end B of the chamber C as possible, thereby further saving the non-conductive liquid Dosage of L1.

More specifically, in this embodiment, the electrical unit E can be selectively positioned on a frame 4 , and the seat frame 4 can be stably disposed on the bottom end B of the chamber C. As shown in FIG. For example but not limitation, the base frame 4 may have several fixing frames 41 spaced apart to form a slot 42 between any two adjacent fixing frames 41. When the electrical unit E is a motherboard, a communication interface In the case of a sheet-like structure such as a panel, a display panel or a data storage panel, the electrical unit E can be inserted into one of the slots 42, and the non-conductive liquid L1 can still pass through the slot 42 to infiltrate the heat source of the electrical unit E H. Alternatively, in other embodiments, a hanger can also be provided on the slot cover 12 to position the electrical unit E, so that the electrical unit E can be immersed in the working layer 2, so the present invention does not limit the positioning of the electrical unit E. Way.

The immersion cooling system may further include a disturber 5 , which is located in the protective layer 3 for stirring the protective liquid L2 so that the temperature of the entire protective layer 3 can be relatively uniform. In this embodiment, the disturber 5 may have a casing 51 , and the casing 51 may be assembled to the groove cover 12 by a connecting frame 52 , and keep the casing 51 soaked in the protective liquid L2 . The casing 51 has an inflow inlet 511 and a discharge outlet 512 , and an impeller 53 is arranged inside the casing 51 to drive the protective liquid L2 to flow into the casing 51 from the inflow inlet 511 , and then flow out from the discharge outlet 512 , wherein The diameter of the discharge port 512 may be smaller than the diameter of the inflow port 511 , so as to increase the flow velocity of the liquid flowing out of the discharge port 512 , thereby reducing the energy consumption of the perturbator 5 .

Referring to FIG. 2, the immersion cooling system of this embodiment can absorb heat energy by the non-conductive liquid L1 around the electrical unit E when the electrical unit E operates to generate thermal energy, so that the electrical unit E can be maintained at the proper operating temperature. Wherein, the liquid non-conductive liquid L1 in the working layer 2 can be converted into a gaseous state after absorbing thermal energy, and form bubbles and rise into the protective layer 3; at this time, the gaseous non-conductive liquid L1 entering the protective layer 3 can be The thermal energy is transferred to the liquid protective liquid L2, thereby condensing back to the liquid state in the protective layer 3, and then by the density difference between the non-conductive liquid L1 and the protective liquid L2, the non-conductive liquid L1 condensed back to the liquid state can naturally descend. Sink back into this working layer 2. In addition, due to the high boiling point of the protective liquid L2, when the gaseous non-conductive liquid L1 transfers thermal energy to the liquid protective liquid L2, the protective liquid L2 can still maintain the liquid state, and the gaseous non-conductive liquid L1 can remain in the liquid state as long as it does not reach the Before the top of the protective layer 3 is condensed back to the liquid state, almost no loss occurs, so the loss of the non-conductive liquid L1 can be greatly reduced. In addition, since the color of the non-conductive liquid L1 can be different from the color of the protective liquid L2, in addition to making the two easy to identify, when the liquid non-conductive liquid L1 in the working layer 2 is converted into a gaseous state to form bubbles and rise into the During the process of the protective layer 3, which condenses back to a liquid state and then naturally sinks back to the working layer 2, the color visual effect can also be viewed from around the sealing groove 1, which can not only bring benefits to the industry (for example, the e-sports industry) To bring more business opportunities, it can be both practical and aesthetic.

Please refer to FIG. 3, which is the second embodiment of the immersion cooling system of the present invention. The protective layer 3 in this embodiment can be formed by more than two kinds of protective liquids L2 with different densities, so as to further improve the aforementioned reduction Effect of non-conductive liquid L1 loss. For example, the protective layer 3 in this embodiment can be formed by two kinds of protective liquids L2 with different densities, which are referred to as the first protective liquid L21 and the second protective liquid L22 respectively for the sake of illustration.

The density of the first protection liquid L21 is lower than the density of the non-conductive liquid L1, the density of the second protection liquid L22 is again lower than the density of the first protection liquid L21, and the boiling point of the first protection liquid L21 is higher than The boiling point of the non-conductive liquid L1 and the boiling point of the second protection liquid L22 are again higher than the boiling point of the first protection liquid L21. In this way, the protective layer 3 of the present embodiment can be formed in the form of two layers, and the second protective liquid L22 is adjacent to the top of the first protective liquid L21. In case the gaseous non-conductive liquid L1 does not have time to reach the first protective liquid L21 Condensed back to the liquid state before the top, the bubbles can continue to enter the second protective liquid L22, and condensed back to the liquid state in the liquid second protective liquid L22, and naturally sink, through the first protective liquid L21 to return to the working layer 2 Therefore, the second protective liquid L22 can further reduce the loss of the non-conductive liquid L1. In other embodiments, protective liquids of different densities can also be added to make the protective layer 3 form more layers, as long as the upper layer of the protective liquid has a lower density and a higher boiling point.

Please refer to FIG. 4 , which is the third embodiment of the immersion cooling system of the present invention. This embodiment may further include a circulating cooling module 6 , and the circulating cooling module 6 may pass through the protective layer by a pipe assembly 61 . 3, to exchange heat with the protective liquid L2 forming the protective layer 3 by the liquid or gaseous fluid circulating in the pipe assembly 61, absorb the thermal energy of the protective liquid L2, so that the protective liquid L2 can be maintained at a low temperature, so as to improve the Efficiency of condensation of gaseous non-conductive liquid L1 back into liquid state.

Specifically, the circulating cooling module 6 can also have a driving source 62 and a heat dissipation unit 63, and the pipe element set 61 is communicated with the driving source 62, so that the driving source 62 drives the fluid flow in the pipe element group 61; the The tube assembly 61 is connected to the heat dissipation unit 63 , and the position of the tube assembly 61 in the chamber C forms a heat absorption portion 611 . Accordingly, the fluid in the pipe assembly 61 can absorb the thermal energy of the protective liquid L2 when flowing through the heat absorbing portion 611 , cool down when flowing through the heat dissipation unit 63 , and be directed to the heat absorbing portion again after cooling down. 611, so that the protection liquid L2 can maintain a low temperature.

The driving source 62 can be, for example, an impeller or a pump, and the driving source 62 can be arranged in the chamber C as shown in FIG. 4 , or outside the sealing groove 1 as shown in FIG. 5 . The heat dissipation unit 63 may be an air-cooled or liquid-cooled radiator, which is not limited in the present invention.

Referring to FIG. 6 , the electronic device 7 of this embodiment may have a casing 71 and a plurality of electrical units E, and the plurality of electrical units E and the immersion cooling system of the foregoing embodiments may be located in the casing 71 middle.

Specifically, the electronic device 7 can be, for example, an Industrial Personal Computer (IPC), and the electrical units E can be, for example, a power supply, a hard disk, a fan, a motherboard, a central processing unit, a memory, and Display cards, etc., in which electrical units E that generate high temperature during operation, such as motherboards, central processing units, memory and display cards, etc., at least one of the electrical units E can have a heat source H, and the heat source H can be It is arranged in the chamber C of the sealing groove 1 and immersed in the working layer 2 ; and other electrical units E that are unlikely to generate high temperature during operation can be arranged outside the sealing groove 1 . Wherein, the working layer 2 is formed by at least one non-conductive liquid L1, the protective layer 3 is formed by at least one protective liquid L2, the density of the protective liquid L2 is lower than the density of the non-conductive liquid L1, and the protective liquid L2 The boiling point of is higher than the boiling point of the non-conductive liquid L1. Accordingly, the liquid non-conductive liquid L1 in the working layer 2 can absorb the heat energy generated by the heat source H and convert it into a gaseous state, form bubbles and rise into the protective layer 3, condense back to a liquid state in the protective layer 3, and then descend sink back into the working layer 2 to achieve the effect of reducing the loss of the non-conductive liquid L1.

It is worth mentioning that the protective layer 3 of this embodiment can also be formed of two or more protective liquids L2 with different densities as in the second embodiment, so as to further enhance the aforementioned effect of reducing the loss of the non-conductive liquid L1; Alternatively, a perturbator 5 (marked in FIG. 2 ) can also be provided on the protective layer 3 as in the aforementioned first embodiment, or a circulating cooling module 6 (marked in FIG. 4 ) as in the aforementioned third embodiment, In order to improve the efficiency of condensing the gaseous non-conductive liquid L1 back to the liquid state. In addition, in other embodiments, the sealing groove 1 can be optionally disposed outside the casing 71 of the electronic device 7 , and the electrical unit E that needs to be disposed in the chamber C is naturally located outside the casing 71 . It can be understood by those skilled in the art, so the electronic device 7 of the present invention is not limited to the arrangement relationship shown in FIG. 6 .

To sum up, in the immersion cooling system of the present invention and the electronic device having the immersion cooling system, the liquid non-conductive liquid in the working layer can be converted into a gaseous state after absorbing heat energy, and form bubbles and rise into the protective layer, The gaseous non-conductive liquid can be condensed back to the liquid state in the liquid environment, and then sink back into the working layer, so that the loss of the gaseous non-conductive liquid can be effectively reduced, so that the amount of the non-conductive liquid in the sealing groove is not easy to reduce. It has the effect of greatly reducing the cost and labor cost of replenishing non-conductive liquid.

Although the present invention has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the patent application attached hereto.

1: sealing groove 11: Cylinder groove 11a: Ring Wall 11b: Seal the chassis 111: Cover the mouth 112: Opening 12: Slot cover 121: Hole 2: Working layer 3: protective layer 4: seat frame 41: Fixing frame 42: Slot 5: Scrambler 51: Shell 511: Inflow 512: discharge port 52: connecting frame 53: Impeller 6: Circulating cooling module 61: Pipe fitting group 611: heat sink 62: drive source 63: Cooling unit 7: Electronic device 71: Chassis B: Bottom C: Chamber E: electrical unit H: heat source L1: Non-conductive liquid L2: Protective fluid L21: The first protective liquid L22: The second protective liquid

[FIG. 1] An exploded perspective view of the first embodiment of the present invention. [Fig. 2] A combined cross-sectional view of the first embodiment of the present invention. [FIG. 3] A combined cross-sectional view of the second embodiment of the present invention. [FIG. 4] A plan view of a third embodiment of the present invention. [FIG. 5] A plan view of another aspect of the third embodiment of the present invention. [FIG. 6] A partial cross-sectional plan view of the electronic device of the present invention.

1: sealing groove

11: Cylinder groove

11a: Ring Wall

11b: Seal the chassis

111: Cover the mouth

112: Opening

12: Slot cover

121: Hole

2: Working layer

3: protective layer

4: seat frame

41: Fixing frame

42: Slot

5: Scrambler

51: Shell

511: Inflow

512: discharge port

52: connecting frame

53: Impeller

B: Bottom

C: Chamber

E: electrical unit

H: heat source

L1: Non-conductive liquid

L2: Protective fluid

Claims (14)

An immersion cooling system comprising: a sealing groove with a chamber inside; a working layer formed by at least one non-conductive liquid filled in the chamber; and A protective layer is formed by at least one protective liquid filled in the chamber, the density of the protective liquid is lower than that of the non-conductive liquid, and the boiling point of the protective liquid is higher than that of the non-conductive liquid. The immersion cooling system of claim 1, wherein the sealing tank has a barrel tank and a tank cover, the chamber is located inside the barrel tank, the barrel tank has a cover that is connected to the chamber, and the tank cover covers the tank Cover the mouth. The immersion cooling system of claim 1, wherein the protective layer is formed of two or more protective liquids with different densities, and the protective liquid of the upper layer has a lower density and a higher boiling point. The immersion cooling system according to claim 1, further comprising a perturbator, the perturbator is located in the protective layer, and the perturbator stirs the protective liquid by an impeller. The immersion cooling system of claim 1 further comprises a circulating cooling module, the circulating cooling module has a pipe assembly, a part of the pipe assembly passes through the protective layer and forms a heat absorbing part, the protective liquid and the heat absorbing part heat exchange. The immersion cooling system of claim 5, wherein the circulating cooling module has a driving source connected to the tube set, the drive source drives the fluid flow in the tube set, and the tube set is connected to a heat dissipation unit to lower the tube set fluid temperature in . The immersion cooling system of claim 1, wherein the color of the non-conductive liquid is different from the color of the protective liquid. The immersion cooling system as claimed in claim 7, wherein the color of the non-conductive liquid or/and the color of the protective liquid is blended with a fat-soluble dye. The immersion cooling system of any one of claims 1 to 8, further comprising at least one electrical unit positioned in the chamber and immersed in the non-conductive liquid. The immersion cooling system of claim 9, wherein the heat source of the electrical unit is located in the working layer, and a portion of the electrical unit is located in the protective layer. The immersion cooling system of any one of claims 1 to 8, further comprising a stand for positioning at least one electrical unit, the stand is located at the bottom end of the chamber, and the stand has a plurality of spaced fixing stands , a slot is formed between any two adjacent fixing frames, the electrical unit is inserted and set in one of the slots, and the non-conductive liquid penetrates the heat source of the electrical unit through the slot. An electronic device comprising: a plurality of electrical units, at least one of which has a heat source; and As in the immersion cooling system of any one of claims 1 to 8, the heat source is located in the working layer. The electronic device of claim 12, wherein a portion of the electrical unit having the heat source is located in the protective layer. The electronic device of claim 12, wherein the immersion cooling system further comprises a frame, the seat frame is located at the bottom end of the chamber, the seat frame has a plurality of spaced-apart fixing frames, and any two adjacent fixing frames are between the fixing frames. A slot is formed between the two slots, the electrical unit with the heat source is inserted and set in one of the slots, and the non-conductive liquid passes through the slot to infiltrate the heat source.

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