TW202137864A - Liquid cooling head device - Google Patents

Abstract

A liquid cooling head device includes a base, an upper cover, an inlet, an outlet, and a pump. The base includes a guide channel, a first cavity and an opening. The first cavity is connected to the guide channel and the opening, and provide with a heat dissipation fin module therein. The upper cover covers the base to form a second cavity with the base. The inlet is located on the base to connect to the first cavity through the guide channel. The outlet is formed on the upper cover. The pump includes a casing and a fan blade. The casing covers one surface of the upper cover, so that a third cavity is defined between the pump and the upper cover. The third cavity is respectively connected with the second cavity and the outlet. The fan blade is located in the third cavity, and the guide channel is located between the fan blade and the first cavity.

Description

Liquid cold head device

The invention relates to a heat dissipation module, in particular to a liquid cooling head device.

With the advancement and popularization of technology, various electronic devices or computer equipment have long become indispensable roles in people's daily lives, such as notebook computers, desktop computers, and network servers. Generally speaking, the internal electronic components of these products will increase the temperature during operation, and high temperature can easily cause damage to the components. Therefore, the heat dissipation mechanism is a very important and necessary design for these electronic products. In addition to general heat dissipation design using fans to provide airflow for convection cooling, or attaching heat dissipation units of special materials to conduct conduction cooling, water-cooling mechanisms are also an effective and common heat dissipation design.

To put it simply, the principle of water-cooled heat dissipation is generally to use liquid (such as water or coolant) as the heat dissipation medium, and a continuously operating water pump or pump is used to form a continuous circulation in the applied system. Liquid flows in closed pipelines, and these pipelines are distributed on the surface of various electronic components (such as central processing units) in the system. When the relatively low temperature liquid flows through these relatively high temperature electronic components, it will absorb its heat to slow down its temperature rise. Then, as the pipeline exchanges heat with the outside or other heat dissipation mechanisms to release heat to reduce the temperature of the liquid, the liquid is returned to the system for circulation and heat dissipation.

However, due to the limited internal space of general computer equipment, host or server equipment, it can only be used in the space of the environment where it is installed, and water-cooled heat dissipation must have the design of the inflow and outflow of pipelines, making the installation of pipelines It will be relatively complicated. Therefore, how to design a water-cooled heat dissipation structure with good heat dissipation efficiency, while taking into account the overall pipeline configuration, reducing the occupied space to facilitate installation in a small environment, and effectively completing the connection with other pipelines and avoiding water leakage. The main purpose of the development of this case.

One purpose of the present invention is to provide a liquid-cooled head device to solve the above-mentioned difficulties mentioned in the prior art.

An embodiment of the present invention provides a liquid-cooled head device. The liquid cooling head device includes a base, a heat dissipation fin module, an upper cover, an inlet, an outlet, and a pump. The base includes a diversion channel, a first cavity and at least one opening, and the first cavity is respectively connected with the diversion channel and the opening. The heat dissipation fin module is located in the first cavity. The upper cover covers a surface of the base and forms a second chamber with the base. The second chamber is connected to the first chamber through the opening. The entrance part is located on the base and is connected to the first chamber through the diversion channel. The outlet part is formed on the upper cover. The suction pump includes a casing and a fan blade. The shell covers a side of the upper cover facing away from the base, so that a third cavity is defined between the shell and the upper cover. The third chamber is respectively connected with the second chamber and the outlet part. The fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber. In this way, when a working fluid is sent from the inlet part to the first chamber and flows through the second chamber, the fan blade sends the working fluid in the second chamber out of the outlet part through the third chamber.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, the base includes a thermally conductive substrate, a lower cover, and an elastic deflector. The heat dissipation fin module is located on one surface of the heat-conducting substrate. The lower cover is assembled on the thermally conductive substrate. The elastic diversion cover is sandwiched between the heat-conducting substrate and the lower cover. The elastic deflector includes a first through hole and at least one second through hole. The first through opening is connected to the diversion channel and the first chamber, and the second through opening is connected to the opening and the first chamber.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, there are two openings and second through-holes, and these openings are respectively aligned and connected to the second through-holes, and the first through-holes are located in these first through-holes. Between the two openings, and located in the center of one of the lower cover.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, the housing has an electromechanical cavity and a lower groove. The lower groove is located on one side of the shell, and the electromechanical cavity is located inside the shell. The upper cover has an upper groove, and the upper groove and the lower groove jointly form a third cavity, and the third cavity is airtightly isolated from the electromechanical cavity.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, the pumping pump further includes a stator, a rotor, a shaft, and a circuit board. The stator is located in the electromechanical cavity. The rotor is located in the third cavity and fixedly connected to the fan blades. The shaft rod passes through the rotor and the fan blades, and is connected to the upper cover to drive the rotor to rotate to drive the fan blades to rotate.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, the rotor is a magnet, and the stator is one of a silicon steel sheet, a magnet, and an electromagnet.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, the heat dissipation fin module includes a plurality of fin parts, and there is a gap between any two adjacent fin parts. The elastic deflector includes a flexible cushion body and a plurality of positioning blocks. The positioning blocks are arranged at intervals on the surface of the flexible cushion body facing the heat-conducting substrate. Each positioning block extends into one of the gaps to guide the elastic The flow cover is fixed on the thermally conductive substrate.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, the lower cover has a recessed portion facing away from one of the elastic diversion covers, the opening is formed in the recessed portion, and the surface of the lower cover facing the thermally conductive substrate has at least one An annular recess, which surrounds the opening.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, the elastic deflector further includes at least one ring-shaped protrusion, and the ring-shaped protrusion is protruded on a surface of the flexible cushion body facing away from the thermally conductive substrate , And inserted into the annular recess.

According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head device, the elastic deflector includes a flexible material.

In this way, through the structures described in the above embodiments, the present invention can not only achieve good heat dissipation efficiency, but is also beneficial to be applied to related computer equipment, host or server equipment.

The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

Hereinafter, a plurality of embodiments of the present invention will be disclosed in the form of drawings. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in the embodiment of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements are shown in the drawings in a simple and schematic manner.

Please refer to Figure 1A, Figure 1B, and Figure 2. Figure 1A shows a perspective view of a liquid-cooled head device 6 provided by an embodiment of the present invention, Figure 1B is an exploded view of Figure 1A, and Figure 2 is Figure 1A is a cross-sectional view taken along the line 2-2.

In this embodiment, the liquid-cooled head device 6 mainly includes a pump 61, an upper cover 62, and a base 630, and the pump 61, the upper cover 62 and the base 630 are assembled from top to bottom to form the liquid-cooled head device. 6. The base 630 includes a diversion channel 634, a first chamber 66C and two openings 632 and 633. The first chamber 66C is respectively connected with the diversion channel 634 and the two openings 632 and 633. A heat dissipation fin module 651 is provided in the first cavity 66C. The upper cover 62 includes a first side 62A and a second side 62B opposite to each other. The second side 62B of the upper cover 62 covers the top surface of the base 630 and forms a second cavity 66B with the base 630. The second chamber 66B is connected to the first chamber 66C through the openings 632 and 633. An entrance 631 is provided on the base 630. The inlet portion 631 connects to the first chamber 66C through the diversion channel 634. An outlet portion 624 is provided on the first side 62A of the upper cover 62. The pump 61 covers the upper cover 62 to define a third chamber 66A therebetween.

More specifically, the base 630 includes a lower cover 63, an elastic deflector 64 and a thermally conductive substrate 65. The thermally conductive substrate 65 includes a first side 65A and a second side 65B opposite to each other. The heat dissipation fin module 651 is located on the first side 65A of the thermally conductive substrate 65. The lower cover 63 includes a first side 63A and a second side 63B opposite to each other, and the second side 63B of the lower cover 63 is assembled on the thermally conductive substrate 65. The inlet portion 631 and the openings 632 and 633 penetrate the first side 63A and the second side 63B of the lower cover 63, respectively. The elastic baffle 64 is sandwiched between the first side 63A of the thermally conductive substrate 65 and the second side 63B of the lower cover 63.

The elastic deflector 64 includes a flexible cushion body 640, a first through opening 641 and two second through openings 642 and 643. The flexible cushion body 640 includes a first side 64A and a second side 64B opposite to each other. The first through opening 641 and the second through openings 642 and 643 both penetrate the first side 64A and the second side 64B of the flexible cushion body 640. The first through opening 641 connects the diversion channel 634 and the first chamber 66C, the second through openings 642 and 643 are respectively aligned and connected to the openings 632 and 633, and the second through openings 642 and 643 are also connected to the first Chamber 66C. In this embodiment, but not limited to this, the first through opening 641 is located between the second through openings 642 and 643 and approximately at the center of the lower cover 63. In addition, the elastic deflector 64 further includes a plurality of positioning blocks 645 and two annular protrusions 646. The positioning blocks 645 are arranged at intervals on the second side 64B of the flexible cushion body 640. Each ring-shaped protrusion 646 is protruded on a surface of the flexible pad body 640 facing away from the thermally conductive substrate 65 (that is, the second side 64B of the flexible pad body 640), and surrounds the second through hole 642 or 643.

The pump 61 includes a housing 611, a stator 612, a circuit board (not shown in the figure), a rotor 613, a shaft 614, and a fan blade 615. The housing 611 covers a side of the upper cover 62 facing away from the base 630, so that the aforementioned third cavity 66A is defined between the housing 611 and the upper cover 62. The third chamber 66A is connected to the second chamber 66B and the outlet portion 624 respectively. The housing 611 forms an electromechanical cavity 6111. The electromechanical cavity 6111 is a space that can be isolated from the working fluid, and contains the circuit board and the stator 612 inside. The stator 612 is a magnetic element, such as a silicon steel sheet, a magnet, or an electromagnet, and is electrically connected to the circuit board. The rotor 613 is combined with the fan blade 615, and is located (outside the electromechanical cavity 6111) in the working space through which the working fluid flows. The rotor 613 uses a magnetic element, such as a magnet. The fan blade 615 is located in the groove 623 on the upper cover 62, and the diversion channel 634 is located between the fan blade 615 and the first cavity 66C. Under the combined action of the circuit board, the stator 612 and the rotor 613, the fan blade 615 can be driven to rotate, thereby guiding the movement of the working fluid. In addition, the shaft rod 614 passes through the rotor 613 and the fan blade 615, and is installed on a shaft rod holder 621 of the upper cover 62 to prevent the rotor 613 and the fan blade 615 from swinging or deviating from the rotation axis when rotating.

The upper cover 62 is assembled with the housing 611 of the pump 61 to define the aforementioned third chamber 66A. The second side 62B of the upper cover 62 faces the lower cover 63 and is connected to the first side 63A of the lower cover 63 Assemble together. In this embodiment, the assembling means adopts a screwing method, and the two different components are assembled together by corresponding screw holes and screws. More specifically, one surface of the housing 611 has a lower groove 6112. The upper cover 62 has an upper groove 623, and the lower groove 6112 and the upper groove 623 jointly form the third cavity 66A.

In addition, the upper cover 62 forms a shaft fixing frame 621 on the first side 62A, and at least one opening 622 is formed under the bottom of the shaft fixing frame 621. Furthermore, the upper cover 62 is tied around the shaft holder 621, forming an upper groove 623 and an outlet portion 624 (such as a drainage pipe). The upper groove 623 is a part of the third chamber 66A and is connected to the fan The bottoms of the blades 615 correspond to each other in size, so that the bottoms of the fan blades 615 can be accommodated therein. The outlet portion 624 communicates with the upper groove 623 for discharging the working fluid from the upper groove 623 to the outside of the liquid cooling head device 6.

Among them, the first side 63A of the lower cover 63 corresponds to the second side 62B of the upper cover 62. The two are assembled together to define a second chamber 66B. The second chamber 66B and the third chamber 66A are different from each other. The spaces are communicated with each other through the opening 622. The second side 63B of the lower cover 63 faces the elastic deflector 64 and the thermally conductive substrate 65, and the second side 63B of the lower cover 63 is assembled with the first side 65A of the thermally conductive substrate 65, and the elastic deflector 64 is It is sandwiched between the lower cover 63 and the thermally conductive substrate 65. In addition, the elastic baffle 64 and the thermally conductive substrate 65 jointly define a first cavity 66C. The function of the elastic deflector 64 can not only guide the flow of the working fluid, but also can be made of flexible and deformable rubber material, so it also has a waterproof gasket and an O-ring (O-ring). The function can not only fill the gap between the lower cover 63 and the thermally conductive substrate 65, but also prevent the leakage of liquid.

One of the openings 632 of the lower cover 63 in the vertical direction directly corresponds to one of the second through openings 642 or 643 of the elastic deflector 64, and the opening 633 of the lower cover 63 is directly aligned with the elastic deflector 64 in the vertical direction.的口643。 The opening 643. A surface of the lower cover 63 facing away from the elastic guide cover 64 (ie, the first side 63A) has a recess 635, and these openings 632 are formed in the recess 635. The lower cover 63 has two ring-shaped recesses 636 on one side (ie, the second side 63B) facing the thermally conductive substrate 65. Each annular recess 636 surrounds one of the openings 632. Each annular convex portion 646 is inserted into the annular concave portion 636. In addition, on the second side 63B of the lower cover 63, the above-mentioned diversion channel 634 is formed (please also refer to Figure 2B). The diversion channel 634 can be assembled on the lower cover 63, the elastic diversion cover 64 and the thermally conductive substrate 65 After completion, it is responsible for connecting the inlet portion 631 of the lower cover 63 with the first through hole 641 of the elastic deflector 64. Conversely, when the elastic deflector 64 is removed away from the lower cover 63, the ring-shaped protrusions 646 are drawn away from the corresponding ring-shaped recesses 636, respectively.

The heat dissipation fin module 651 is formed on the first side 65A of the thermally conductive substrate 65. The heat dissipation fin module 651 includes a plurality of fin parts 6511. Each fin portion 6511 includes a plurality of fins arranged side by side (omitted in the figure). There is a gap 6512 between any two adjacent fin portions 6511. When the elastic deflector 64 covers the first side 65A of the thermally conductive substrate 65, each positioning block 645 of the elastic deflector 64 extends into one of the gaps 6512 to fix the elastic deflector 64 on the thermally conductive substrate 65 , And guide the working fluid into these fin parts 6511, so that the fins take away the heat energy absorbed by the working fluid. On the contrary, when the elastic air deflector 64 is removed away from the thermally conductive substrate 65, the positioning blocks 645 are drawn away from the corresponding gap 6512, respectively. It should be understood that most of the third cavity 66A defined by the elastic baffle 64 and the thermally conductive substrate 65 is filled by the heat dissipation fin module 651 and the gap 6512.

The second side 65B of the thermally conductive substrate 65 can form an outwardly protruding boss structure 652. The boss structure 652 is used to make direct thermal contact with the heat source, or to make contact with the heat source by means of a thermal paste or a thermal pad. Indirect thermal contact. Next, the liquid-cooled head device of the present application will be described. The flow direction of the working fluid in the liquid-cooled head device will be described. At the same time, the corresponding structure of each component of the liquid-cooled head device is also shown correspondingly.

Figures 3A and 3B are partial perspective views of the liquid-cooled head device 6 (only the pump 61, the upper cover 62 and the lower cover 63), showing that the working fluid enters the diversion channel 634 of the lower cover 63 from the outside the process of. First, referring to FIG. 3A, the working fluid will enter the liquid-cooled head device 6 from the opening 625 of the upper cover 62 along the direction D1 and pass through the inlet 631 of the lower cover 63. Then, as shown in Figure 3B, the working fluid flows along the arc-shaped diversion channel 634 along the direction D2 to the central area of the second side 63B of the lower cover 63, which is located in the first area of the elastic diversion cover 64 Above the opening 641 (Figure 1B).

Figures 4A and 4B are cross-sectional views and partial perspective views of the liquid-cooled head device 6 (only the pump 61, the upper cover 62, the lower cover 63 and the elastic diversion cover 64), corresponding to the working fluid from the lower cover 63 After flowing through the elastic deflector 64, it passes through the first chamber 66C and enters the process before entering the second chamber 66B. FIG. 4C is a perspective view of the thermally conductive substrate 65 of the liquid-cooled head device 6, in which the positioning block 645 in the gap 6512 is shown by a dotted line. As shown in Figures 4A to 4C, after the working fluid passes through the first through hole 641 of the elastic deflector 64, it enters the first chamber 66C downward along the direction D3, and then the working fluid flows along the direction D4. After passing through the gap 6512 between the fins 6511, the two second through openings 642 and 643 of the elastic deflector 64 are concentrated and upward to prepare to enter the second chamber 66B. (Figure 4A and Figure 4B)

Figures 5A and 5B are cross-sectional views and partial perspective views of the liquid-cooled head device 6 (only the pump 61 and the upper cover 62), correspondingly showing that the working fluid enters the second chamber 66B and then flows to the third chamber. The process of chamber 66A. After the working fluid passes through the two second through openings 642, 643 of the elastic deflector 64, it will pass through the openings 632, 633 of the lower cover 63 and then enter the second chamber 66B. At this time, the working fluid will be After the space is rearranged, it gathers at the opening 622 of the upper cover 62 along the direction D5, and prepares to enter the third chamber 66A.

Figures 6A and 6B are a cross-sectional view and a partial perspective view of the liquid-cooled head device 6 (only the upper cover 62 and part of the fan blade 615), correspondingly showing how the working fluid enters the third chamber 66A and is blocked by the fan blade 615 Guide, and finally discharge the liquid-cooled head device 6 process. After the working fluid enters the third chamber 66A from below the opening 622 of the upper cover 62, it will be sucked into the space between the blades of the fan blade 615 along the direction D6. When the fan blade 615 rotates to the vicinity of the outlet portion 624, the working fluid The fluid can pass through the outlet portion 624 and be thrown out of the liquid cooling head device 6 along the direction D7, and then be transferred to other cooling devices such as water cooling banks for cooling action.

In this way, through the structures described in the above embodiments, the present invention can not only achieve good heat dissipation efficiency, but is also beneficial to be applied to related computer equipment, host or server equipment.

Finally, the various embodiments disclosed above are not intended to limit the present invention. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the present invention, and they can all be protected in this invention. Inventing. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

2-2: Section line 6: Liquid cold head device 61: Pump 611: Shell 6111: Electromechanical cavity 6112: Lower groove 612: Stator 613: Rotor 614: Shaft 615: fan blade 62: upper cover 62A: First side 62B: second side 621: Axle rod holder 622: hole 623: upper groove 624: Export Department 625: open 63: lower cover 63A: First side 63B: second side 630: Base 631: entrance 632, 633: opening 634: Diversion Channel 635: depression 636: ring recess 64: Elastic shroud 64A: first side 64B: second side 640: Flexible cushion body 641: first pass 642, 643: second pass 645: positioning block 646: Ring Convex 65: Thermally conductive substrate 65A: first side 65B: second side 651: cooling fin module 6511: fin 6512: gap 652: Boss Structure 66A: third chamber 66B: second chamber 66C: first chamber D1~D7: Direction

In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: Figure 1A is a perspective view of the liquid-cooled head device; Figure 1B is an exploded view of the liquid-cooled head device; Figure 2 is a cross-sectional view of Figure 1A along the line 2-2; Figures 3A and 3B are partial perspective views of the liquid-cooled head device, showing the process of working fluid entering the diversion channel of the lower cover from the outside; Figures 4A and 4B are cross-sectional views and partial perspective views of the liquid-cooled head device, showing the process of working fluid after flowing from the lower cover through the elastic diversion cover, passing through the third chamber and entering the second chamber; Figure 4C is a three-dimensional view of the thermally conductive substrate of the liquid-cooled head device; Figures 5A and 5B are cross-sectional views and partial perspective views of the liquid-cooled head device, showing the process of the working fluid flowing into the first chamber after entering the second chamber; and Figures 6A and 6B are cross-sectional views and partial perspective views of the liquid-cooled head device, showing how the working fluid is guided by the fan blades after entering the first chamber, and finally discharged from the liquid-cooled head device.

Domestic deposit information (please note in the order of deposit institution, date and number) without Foreign hosting information (please note in the order of hosting country, institution, date, and number) without

6: Liquid cold head device

61: Pump

611: Shell

6112: Lower groove

62: upper cover

62A: First side

62B: second side

621: Axle rod holder

623: upper groove

624: Export Department

625: open

63: lower cover

63A: First side

63B: second side

630: Base

631: entrance

632, 633: opening

635: depression

64: Elastic shroud

64A: first side

64B: second side

640: Flexible cushion body

641: first pass

642, 643: second pass

646: Ring Convex

65: Thermally conductive substrate

65A: first side

65B: second side

651: cooling fin module

6511: fin

6512: gap

Claims (10)

A liquid-cooled head device, including: A base, including a diversion channel, a first chamber and at least one opening, the first chamber is respectively connected with the diversion channel and the opening; A heat dissipation fin module located in the first cavity; An upper cover covering a surface of the base and forming a second chamber with the base, the second chamber being connected to the first chamber through the opening; An entrance part located on the base and connected to the first chamber through the diversion channel; An outlet portion formed on the upper cover; and A pumping pump, containing: A shell covering a surface of the upper cover back to the base, so that a third chamber is defined between the shell and the upper cover, and the third chamber is respectively connected to the second chamber and the outlet portion; and A fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber, Wherein, when a working fluid is sent from the inlet part to the first chamber and flows through the second chamber, the fan blade sends the working fluid in the second chamber out of the outlet part through the third chamber . The liquid-cooled head device according to claim 1, wherein the base includes: A heat-conducting substrate, wherein the heat dissipation fin module is located on a surface of the heat-conducting substrate; Lower the cover and combine it on the thermally conductive substrate; and An elastic diversion cover sandwiched between the thermally conductive substrate and the lower cover, The elastic guide cover includes a first through hole and at least one second through hole. The first through hole connects the guide channel and the first chamber, and the second through hole connects the opening and the first cavity. The first chamber. The liquid-cooled head device according to claim 2, wherein the at least one opening and the at least one second through-hole are both two, and the openings are respectively aligned and connected to the second through-holes, and the first through-hole The opening is located between the second through openings and is located at a central position of the lower cover. The liquid-cooled head device according to claim 1, wherein the housing has an electromechanical cavity and a lower groove, the lower groove is located on a surface of the housing, and the electromechanical cavity is located inside the housing; and The upper cover has an upper groove, and the upper groove and the lower groove jointly form the third cavity, and the third cavity is airtightly isolated from the electromechanical cavity. The liquid-cooled head device according to claim 4, wherein the pumping pump further comprises: The stator is located in the electromechanical cavity; A rotor located in the third cavity and fixedly connected to the fan blade; A shaft rod that passes through the rotor and the fan blades, and is connected to the upper cover; and A circuit board is used to drive the rotor to rotate to drive the fan blade to rotate. The liquid-cooled head device according to claim 5, wherein the rotor is a magnet, and the stator is one of a silicon steel sheet, a magnet, and an electromagnet. The liquid-cooled head device according to claim 2, wherein the heat dissipation fin module includes a plurality of fin parts, and there is a gap between any two adjacent fin parts; and The elastic shroud includes a flexible cushion body and a plurality of positioning blocks, the positioning blocks are arranged at intervals on a surface of the flexible cushion body facing the thermally conductive substrate, and each of the positioning blocks extends into the gaps One of them is used to fix the elastic shroud on the thermally conductive substrate. The liquid-cooled head device according to claim 7, wherein the lower cover has a recessed portion on the back of the elastic deflector, the opening is formed in the recessed portion, and a surface of the lower cover facing the thermally conductive substrate has at least one An annular recess that surrounds the opening. The liquid-cooled head device according to claim 8, wherein the elastic deflector further comprises at least one annular convex portion, and the annular convex portion is protrudingly provided on a surface of the flexible cushion body that is opposite to the thermally conductive substrate, and Insert into the annular recess. The liquid-cooled head device according to claim 1, wherein the elastic deflector comprises a flexible material.

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