JP2002094276A - Cooling device of electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the cooling device of electronic equipment that prevents air from remaining in a liquid channel, has excellent thermal conductivity, can improve heat radiation properties, and at the same time can prevent cooling liquid from leaking. SOLUTION: This cooling device of the electronic equipment comprises a liquid-cooling mechanism for cooling an electrical heating element mounted in the electronic equipment, and a forced air-cooled mechanism. The liquid- cooling mechanism has a heat reception surface in contact with the heat generation site of the electrical heating element for absorbing generation heat, and at the same time forms a liquid channel for circulating the cooling liquid in a body. The liquid channel comprises a heat-absorber cover for closing in a laminar shape via a gasket, and a water pump section for circulating the cooling liquid into the liquid channel by an impeller. The forced air-cooled mechanism comprises a fan driven by a motor, and a radiation fin formed in a body and a body housing. In the forced air-cooled mechanism, the water pump section of the liquid-cooled mechanism and the liquid channel are set to a one-price structure body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling apparatus for electronic equipment, and more particularly to a cooling apparatus for electronic equipment suitable for cooling a heating element such as a CPU mounted on a notebook personal computer or the like.

[0002]

2. Description of the Related Art Since electronic devices, especially notebook personal computers in recent years, are provided with a heating element such as a CPU which generates high heat, an external device is provided so that heat from the heating element does not adversely affect other electronic components. To dissipate the heat. However, a cooling device of the type that attaches heat radiation fins directly to the heating element and naturally cools it is suitable as a cooling device for thin electronic devices such as notebook computers, whose height is limited in the housing. is not. For this reason, in thin electronic devices such as notebook personal computers, heat from a heating element is transferred to a housing or the like to radiate heat, or a heat pipe type cooling device is used.

However, in the case of a structure in which heat from a heating element is transferred to a housing or the like, heat stays in the housing or remains in the housing itself, and the amount of heat generated increases with an increase in speed. It is not suitable as a cooling device for a CPU or the like. In addition, the heat pipe type cooling device can meet the demand for thinner notebook PCs, but has a limited cooling capacity for CPUs and other devices that generate more heat as the speed increases. The structure is such that piping is provided inside the housing in the space that has been allocated, making the housing design difficult.

[0004] In order to solve these problems, there is a cooling apparatus for electronic equipment disclosed in PCT / JP99 / 00940 of an international patent application based on the Patent Cooperation Treaty by the present applicant.

As shown in FIGS. 6 to 8, a cooling device 1 ′ for an electronic apparatus is formed of a high heat conductive material such as aluminum in a flat shape, and a heating element A is formed on one surface thereof.
That has a heat-receiving surface 101 in contact with the inside and a heat-absorbing section 100 in which a liquid flow path 104 is provided therein, and a pump that accommodates a pump in which an impeller 116 is rotatably provided in a housing 109 formed of a synthetic resin material. The storage section 102 and a mounting plate 123 to which the pump storage section 102 is mounted.
And the liquid passage 104 of the pump housing section 102 and the heat absorbing section 100
And a forced cooling mechanism CC configured to cool the radiated pipes 120 and 121 and the housing 109 by a fan 125. The liquid cooling mechanism BB and the forced cooling mechanism CC are provided. The structure is such that it is isolated and attached by an insulating member.

The cooling device 1 'for an electronic device having such a structure operates as follows to cool the heating element A such as a CPU.

[0007] A heating element A such as a CPU is provided inside the electronic apparatus, and the upper surface of the heating element A is placed on the heat absorbing portion 10 of the liquid cooling mechanism BB.
0 heat receiving surface 101. Then, the heat generated from the heating element A is transmitted to the heat absorber 100. When a current is applied to the coil 135 of the motor board 133 shown in FIGS. 7 and 8, a magnetic force is generated in the fan rotating magnet 129 attached to the fan 125, and the fan 125 rotates. With the rotation of the fan 125, the impeller 116 of the pump housing section 102 shown in FIG.

As shown in FIG. 8, a liquid passage 104 through which a coolant circulates is formed in the heat absorbing portion 100 in a crank shape. Both ends of the liquid passage 104 are inclined from the end of the heat receiving surface 101. Hole 107 penetrating connecting arm 106 projecting from
And the return hole 108. And the supply hole 10
The supply-side radiating pipe 120 and the returning-side radiating pipe 121 shown in FIG. 9 are connected to the return hole 108 and the return hole 108, respectively. Therefore, the circulating coolant is circulated by the rotation of the impeller 116 of the pump housing 102. Become. The cooling liquid is cooled in the middle of passing through the supply-side radiating pipe 120, and receives heat by passing through the heat absorbing section 100 to cool the heat absorbing section 100 whose temperature is rising.

[0009] The temperature of the coolant rises by the amount of heat absorbed, and the pump housing 1
02 is continuously returned. The coolant whose temperature has increased in this way is cooled by the forced cooling mechanism CC and is kept at a predetermined temperature or lower.

[0010] The forced cooling mechanism CC includes a heat radiation pipe 1 on the supply side.
09, a return-side radiating pipe 110 and a fan 125. By the operation of the fan 125, air inside the housing of the electronic device is discharged to the outside of the housing through an outlet (not shown) or the like. At this time, the air comes in strong contact with the supply-side heat radiating pipe 120 and the return-side heat radiating pipe 121 to cool the cooling liquid in these pipes. Further, they are also in contact with the outer surface and the like of the pump housing section 102 to cool them.

[0011]

However, such a cooling device for electronic equipment also has the following technical problems. When the coolant is injected into the liquid flow path 104 of the heat absorbing unit 100, the supply-side heat radiating pipe 120, and the return-side heat radiating pipe 121, the motor part including the motor board 133 is integrated with the heat radiating part and the heat absorbing part. Due to the configuration, air may remain in the liquid flow path, and the remaining air may cause a so-called air biting phenomenon in which the impeller 116 idles. When this air biting phenomenon occurs, the cooling capacity decreases and the CP
Since the heating elements A such as U cannot be cooled efficiently, they may be damaged.

The heat from the heating element A such as a CPU that has absorbed heat by the heat absorbing section 100 is radiated by the supply-side radiating pipe 120 and the return-side radiating pipe 121. Could not obtain the heat radiation ability.

Further, the connecting arm 106, which is a connecting portion of the heat absorbing section 100, is connected to the supply-side radiating pipe 120 and the return-side radiating pipe 121 by a process such as brazing, but the coolant raises its water temperature by absorbing heat. When this is done, the internal pressure in the pipe rises, and water leaks from these joints may occur.

The present invention has been made with the object of solving the technical problems as described above, and it is possible to improve the heat conduction efficiency and improve the heat dissipation without air biting. An object of the present invention is to provide a cooling device for an electronic device, which is capable of preventing water leakage of a cooling liquid.

[0015]

Means for Solving the Problems To achieve the above object, the cooling device for electronic equipment of the present invention has the following means.

The first means is a cooling device for electronic equipment comprising a liquid cooling mechanism for cooling a heating element mounted on the electronic equipment and a forced air cooling mechanism, wherein the liquid cooling mechanism has a heating element in a main body. A heat sink that has a heat receiving surface that contacts the heat generating portion of the heat sink and absorbs generated heat and that forms a liquid flow path that circulates a cooling liquid, and the liquid flow path has a heat absorber cover that is hermetically sealed via a gasket. And a water pump section that circulates a cooling liquid into the liquid flow path by an impeller.The forced air cooling mechanism includes a fan driven by a motor and radiation fins formed in the main body and the main body housing. The structure is such that the water pump section of the liquid cooling mechanism and the liquid flow path are formed as an integrated structure.

With this configuration, the liquid cooling mechanism and the forced air cooling mechanism are integrated, so that it is possible to provide a cooling device for an electronic device that can prevent water leakage of the cooling liquid. It is possible to provide a cooling device for an electronic device having a cooling capacity better than that of a conventional cooling device.

In addition, by adopting such a structure, it is possible to inject water into the liquid flow path of the cooling liquid so that the motor portion including the motor substrate has a separate structure from the heat radiating portion and the heat absorbing portion when assembling the device. Since it can be immersed, the air in the liquid flow path can be completely removed, so that it is possible to provide a cooling device for electronic equipment capable of preventing the air biting phenomenon.

Further, the heat radiation fins are formed at the cover of the water pump and the cover of the heat absorber. By forming the radiation fins on the outer peripheral surface of the liquid flow path and the outer peripheral surface of the liquid cooling mechanism, the heat radiation area of the cooling device itself can be increased, and the heat radiation of the device itself can be improved.

Further, a gasket member having a diaphragm function is sandwiched between the heat absorber cover for closing the liquid flow path of the heat absorbing section and the liquid flow path in a laminated manner. With such a configuration, the diaphragm function absorbs an increase in the internal pressure in the liquid flow path due to a rise in the temperature of the cooling water, and the pressure in the liquid flow path can be adjusted. Prevention can be achieved.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a cooling device for electronic equipment according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a plan view of a cooling device for an electronic device according to the present invention, FIG. 2 is a bottom view of the cooling device for an electronic device according to the present invention, and FIG. 3 is a discharge device shown in FIGS. FIG. 4 is a front view of the outlet, FIG. 4 is a cross-sectional view taken along line ZZ of FIG. 2, and FIG. 5 is an enlarged view of a main part of FIG.

The cooling device for electronic equipment of the present invention is shown in FIG.
As shown in FIG. 5, a liquid cooling mechanism B that absorbs heat generated by a heating element A in an electronic device is forcibly cooled by a forced air cooling mechanism C. The liquid cooling mechanism B and the forced air cooling mechanism C are configured to be integrated after assembly.

The structure of the cooling device 1 for electronic equipment will be specifically described. The liquid cooling mechanism B contacts the main body 11 of the cooling device 1 of the electronic device shown in FIGS.
A liquid flow path 4 having a heat receiving surface 1a for absorbing generated heat and circulating a cooling liquid is formed, and the liquid flow path 4 includes a heat absorber 5 including a heat absorber cover 1c hermetically sealed via a gasket 1b. And a water pump section 20 that circulates the cooling liquid into the liquid flow path 4 by the impeller 25.

On the other hand, the forced air cooling mechanism C includes a fan 31 driven by the motor 3 and a main body 11 of the cooling device 1 for the electronic equipment.
The water pump unit 20 of the liquid cooling mechanism B and the fan 31 of the forced air cooling mechanism C are disposed on the main body housing 10 in a vertical relationship. And the axis of the rotation axis 25a of the impeller 25 of the liquid cooling mechanism B and the axis of rotation of the rotation axis 31a of the fan 31 of the forced air cooling mechanism C are arranged in the same straight line.

As shown in FIG. 4, the heat absorber 5 of the liquid cooling mechanism B is formed by processing a highly heat conductive material such as aluminum into a flat shape, and one surface of one side is in contact with the upper surface of the heating element A of the electronic device. As a result, a heat receiving surface 1a for absorbing the heat of the heat generating element A is formed, and a crank-shaped groove is formed as a coolant flow path 4 by bending a plurality of times on the other surface. The liquid passage 4 is provided with a discharge hole 2 through which a cooling liquid of a water pump unit 20 described later is discharged.
1, and is integrally connected to a suction hole 22 into which the cooling liquid flows, and forms a circulation path of the cooling liquid. Further, a gasket 1b is sandwiched between the liquid flow path 4 and the heat absorber cover 1c, and is closed by screws or the like by the heat absorber cover 1c. This gasket 1b
Is a liquid flow path 4 rising by a so-called diaphragm action.
By absorbing the internal pressure in the inside, water leakage of the heat absorber 5 is prevented.

Here, the gasket 1b will be described. The material of the gasket 1b is preferably a material such as synthetic rubber having little heat-resistant deformation. However, the material may be used as it is. A frame with a so-called frame may be manufactured by fitting a material to the inside of the frame. Further, if a water leakage prevention groove is formed on the surface of the gasket 1b which is in contact with the liquid flow path 4 so as to engage with the crank-shaped groove of the liquid flow path 4, the liquid flow path 4 is further improved.
Is increased, and it is ensured that water leakage is prevented.

The back surface of the heat sink cover 1c is shown in FIG.
As shown in FIG. 5, a perforated groove 1d facing the liquid flow path 4 is formed, and acts as a relief groove for pressure when the gasket 1b expands by acting as a diaphragm.

Next, the water pump section 2 of the liquid cooling mechanism B
0 will be described. As shown in FIGS. 4 and 5, the water pump section 20 includes an impeller 25 that is disposed in the main body housing 10 and rotates with the rotation of a fan 31 of a forced air cooling mechanism C described later.

The impeller 25 has a plurality of blades 25a extending in the normal direction on the surface of a circular thin plate.
As shown in FIG. 5, a rotary shaft 27 protruding from the water pump cover 26 is rotatably mounted on a shaft 27 via a bearing 27a. Since the impeller 25 is formed of a magnetic material, it receives the magnetic force of the fan rotating magnet 29 provided on the upper surface of the fan 31 directly. The magnetic force acts to rotate the impeller 25 as well.

The water pump section 20 includes
As shown in FIG. 3, a discharge hole 21 through which the cooling liquid is discharged and a suction hole 22 through which the cooling liquid flows are provided.
And is integrally connected to the liquid flow path 4 to form a circulation path for the cooling liquid.

A concave groove (not shown) is formed on the inner wall surface of the water pump section 20 from the vicinity of the suction hole 22 toward the center of the impeller 25. The concave groove flows from the suction hole 22. The cooling liquid is formed such that the cooling liquid easily reaches the central portion of the impeller 25.

When the impeller 25 starts rotating, the cooling liquid in the water pump section 20 flows out of the discharge hole 21 into the liquid cooling mechanism B liquid flow path 4 and circulates in the crank-shaped liquid flow path 4. It functions as a so-called centrifugal pump that flows into the center portion of the impeller 25 through the suction hole 22.
In such a structure, not only is the structure itself simple, but also the impeller 25 can be formed thin, so that the main body housing 10 can be formed in a thin and small flat shape.

A gasket 11a abutting on the peripheral edge of the opening and a housing cover 13 closing the opening are attached to the lower surface of the main body housing 10. A screw 1 passing through the housing cover 13 and the gasket 11a is attached.
4 is screwed into a screw hole provided on the lower surface of the main body housing 10, thereby sealing the water pump section 20.

Next, the forced air cooling mechanism C will be described. The forced air cooling mechanism C is, as shown in FIGS. 4 and 5, a fan 31 driven by the motor 3 and a radiation fin formed on the main body 11 and the main body housing 10 of the cooling device 1 of the electronic device and shown in FIGS. 12 and
The structure is such that the water pump section 20 of the liquid cooling mechanism B and the fan 31 of the forced air cooling mechanism C are arranged in a vertical positional relationship within the main body housing 10.

The motor 3 which is a driving source of the fan 31 and the impeller 25 will be described. The motor 3 has a plurality of coils 35 fixed to the lower surface of the main body housing 10 and a lead wire (not shown) Is connected. As shown in FIGS. 4 and 5, a bearing 36 for guiding the rotation of the fan 31 is provided on the lower surface of the main body housing 10, and a rotating shaft 32 of the fan 31 is supported on the inner surface of the bearing 36. Bearing 33 is mounted, and the mounting position of the bearing 33 is a stop ring 34.
It is fixed by.

The fan 31 is formed by processing a thin plate having a circular contour, has a rotary shaft 32 in the center, and a plurality of slits in the outer peripheral portion, and twists a tongue piece formed between the slits. Exhaust vanes 31a having corners are formed. Further, a fan rotating magnet 29 for transmitting a rotating force to the fan 31 is fixed to an upper surface of the fan 31. The fan rotating magnet 29 is formed in an annular shape, and is disposed between the rotating shaft 32 and the exhaust blade 31a.

When a current is supplied to the above-mentioned lead wire (not shown) and the magnetic field of the coil 35 changes, the fan 31 is driven to rotate by the fan rotating magnet 29 and the main body housing 1 is rotated.
The air in the housing is taken in the space 0. The air is taken in and discharged to the outside of the housing of the electronic device from the air outlet 40 shown in FIG.

A cooling fin 12 is formed in the main body housing 10. The cooling fin 12 efficiently blows the air of the fan 31 to the outside of the housing and circulates the cooling liquid circulated by the above-described liquid cooling mechanism B. It also acts to cool the body housing that has absorbed the heat of the body.

In the above embodiment, the radiator fins and the like are cooled by exhausting the air in the housing of the electronic device. It is good also as composition which takes in air and cools a radiation fin etc.

Since the present invention is configured as described above, it is smaller, thinner and more compact than a conventional cooling device.
It is possible to obtain a cooling device for an electronic device that can efficiently and sufficiently obtain a cooling effect and that can prevent water leakage.

[Brief description of the drawings]

FIG. 1 is a plan view of a cooling device for an electronic device according to an embodiment of the present invention.

FIG. 2 is a bottom view of the cooling device of the electronic device.

FIG. 3 is a front view of a discharge port shown in FIGS. 1 and 2;

FIG. 4 is a sectional view taken along the line ZZ in FIG. 2;

FIG. 5 is an enlarged view of a main part of FIG.

FIG. 6 is a plan view showing a conventional example of a cooling device for an electronic device.

FIG. 7 is a sectional view of FIG. 6;

FIG. 8 is an exploded perspective view of a motor section and a heat absorbing section of a conventional example.

FIG. 9 is an exploded perspective view of a conventional liquid cooling mechanism.

[Explanation of symbols]

 Reference Signs List A Electronic device B Liquid cooling mechanism C Forced cooling mechanism 1 Heat absorbing portion 1a Heat receiving surface 1b Gasket 1c Heat sink cover 3 Motor 4 Liquid flow path 10 Main body housing 11 Main body 11a Gasket 13 Housing cover 20 Water pump storage section 25 Impeller 26 Water pump cover 29 Fan rotation magnet 31 Fan

Claims (3)

[Claims] 1. A cooling device for an electronic device, comprising: a liquid cooling mechanism for cooling a heating element mounted on the electronic apparatus; and a forced air cooling mechanism, wherein the liquid cooling mechanism contacts a heating portion of the heating element with a main body. A heat absorber having a heat receiving surface for absorbing generated heat and forming a liquid flow path for circulating a cooling liquid, the liquid flow path comprising a heat absorber cover hermetically sealed via a gasket; A water pump section for circulating a cooling liquid into a passage by an impeller; the forced air cooling mechanism includes a motor-driven fan and radiating fins formed on the main body and the main body housing; A cooling device for an electronic device, wherein a pump section and a liquid flow path are formed as an integrated structure. 2. The cooling device for an electronic device according to claim 1, wherein said radiating fins are formed on a cover portion of said water pump portion and a cover portion of said heat absorber. 3. The cooling device according to claim 1, wherein said gasket is made of a member having a diaphragm function.