TW202137865A - Liquid cooling module and its liquid cooling head - Google Patents
Liquid cooling module and its liquid cooling head Download PDFInfo
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- TW202137865A TW202137865A TW110106161A TW110106161A TW202137865A TW 202137865 A TW202137865 A TW 202137865A TW 110106161 A TW110106161 A TW 110106161A TW 110106161 A TW110106161 A TW 110106161A TW 202137865 A TW202137865 A TW 202137865A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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Abstract
Description
本發明有關於一種散熱模組,尤指一種液冷模組及其液冷頭。The invention relates to a heat dissipation module, in particular to a liquid cooling module and its liquid cooling head.
在科技的進步與普及下,各種電子裝置或電腦設備早已成為人們日常生活中不可或缺的角色,例如筆記型電腦、桌上型電腦、網路伺服器等。一般來說,這些產品的內部的電子元件在運作時都會提升溫度,而高溫容易造成元件的損壞。因此,散熱機制便是這些電子產品相當重要且必須的設計。一般的散熱設計除了以風扇提供氣流進行對流冷卻,或是以特殊材質的散熱單元進行貼附而產生傳導降溫之外,水冷式機制亦是一種有效而常見的散熱設計。With the advancement and popularization of technology, various electronic devices or computer equipment have long become indispensable roles in people's daily lives, such as notebook computers, desktop computers, and network servers. Generally speaking, the internal electronic components of these products will increase the temperature during operation, and high temperature can easily cause damage to the components. Therefore, the heat dissipation mechanism is a very important and necessary design for these electronic products. In addition to general heat dissipation design using fans to provide airflow for convection cooling, or attaching heat dissipation units of special materials to conduct conduction cooling, water-cooling mechanisms are also an effective and common heat dissipation design.
水冷式散熱的原理簡單來說,一般是以液體(例如水或冷卻劑)作為散熱媒介,並利用一個持續運作的水泵或幫浦在所應用的系統內形成不斷的循環。液體在密閉的管路內流動,而這些管路則分佈至系統內的各電子元件(例如中央處理單元)的表面上。當溫度相對較低的液體流經這些溫度相對較高的電子元件時,便會吸收其熱量以減緩其溫度的升高。接著,再隨著管路對外界或其他散熱機制進行熱交換來釋放熱量以降低液體溫度,並再使液體重新回到系統內進行循環與散熱。To put it simply, the principle of water-cooled heat dissipation is generally to use liquid (such as water or coolant) as the heat dissipation medium, and a continuously operating water pump or pump is used to form a continuous circulation in the applied system. Liquid flows in closed pipelines, and these pipelines are distributed on the surface of various electronic components (such as central processing units) in the system. When the relatively low temperature liquid flows through these relatively high temperature electronic components, it will absorb its heat to slow down its temperature rise. Then, as the pipeline exchanges heat with the outside or other heat dissipation mechanisms to release heat to reduce the temperature of the liquid, the liquid is returned to the system for circulation and heat dissipation.
然而,由於一般電腦設備、主機或伺服器設備的內部空間有限,只能以所設置的環境的空間加以利用,且水冷式散熱又須具有管路之流入與流出的設計,使得管路的設置會相對複雜。是故,如何設計出具有良好散熱功效之水冷散熱結構,並能同時兼顧整體管路配置、減少佔據空間以利在狹小環境中設置,和有效完成與其他管路銜接並避免漏水情況發生,便為本案發展的主要目的。However, due to the limited internal space of general computer equipment, host or server equipment, it can only be used in the space of the environment where it is installed, and water-cooled heat dissipation must have the design of the inflow and outflow of pipelines, making the installation of pipelines It will be relatively complicated. Therefore, how to design a water-cooled heat dissipation structure with good heat dissipation efficiency, while taking into account the overall pipeline configuration, reducing the occupied space to facilitate installation in a small environment, and effectively completing the connection with other pipelines and avoiding water leakage. The main purpose of the development of this case.
本發明之一目的在於提供一種液冷模組及其液冷頭,用以解決以上先前技術所提到的困難。One purpose of the present invention is to provide a liquid cooling module and its liquid cooling head to solve the above-mentioned difficulties mentioned in the prior art.
本發明之一實施例提供一種液冷頭。液冷頭包括一機殼、一第一進水通道、一傳熱結構、一集水結構、一排水通道與一泵浦組。機殼包括一殼體、一擋板和一底座。殼體、擋板和底座依序組合為一體。殼體與擋板之間形成一上腔室。擋板與底座之間形成一下腔室。連通開口位於擋板上,並接通彼此層疊之上腔室與下腔室。第一進水通道位於殼體之一側,且接通上腔室,用以送入一源頭之工作流體至上腔室內。傳熱結構位於下腔室內,夾合於擋板與底座之間,用以帶走工作流體之熱能。集水結構位於下腔室內,用以集合通過傳熱結構之工作流體。排水通道位於殼體之一側且接通下腔室。泵浦組用以將下腔室內之工作流體往排水通道排出。An embodiment of the present invention provides a liquid cold head. The liquid cooling head includes a casing, a first water inlet channel, a heat transfer structure, a water collection structure, a drainage channel and a pump group. The casing includes a shell, a baffle and a base. The shell, the baffle and the base are sequentially combined into one body. An upper chamber is formed between the shell and the baffle. A lower chamber is formed between the baffle and the base. The communication opening is located on the baffle plate and connects the upper chamber and the lower chamber stacked on each other. The first water inlet channel is located on one side of the housing and is connected to the upper chamber for feeding a source working fluid into the upper chamber. The heat transfer structure is located in the lower chamber and is sandwiched between the baffle and the base to take away the heat energy of the working fluid. The water collecting structure is located in the lower chamber for collecting the working fluid passing through the heat transfer structure. The drainage channel is located on one side of the housing and connects to the lower chamber. The pump group is used to discharge the working fluid in the lower chamber to the drainage channel.
依據本發明一或複數個實施例,上述之液冷頭更包含一第二進水通道。第二進水通道位於殼體之另側,且接通上腔室,用以送入另一源頭之工作流體至上腔室內。第一進水通道與第二進水通道分別相對地位於殼體上。According to one or more embodiments of the present invention, the above-mentioned liquid-cooled head further includes a second water inlet channel. The second water inlet channel is located on the other side of the housing and is connected to the upper chamber for feeding working fluid from another source into the upper chamber. The first water inlet channel and the second water inlet channel are respectively located on the housing opposite to each other.
依據本發明一或複數個實施例,在上述之液冷頭中, 第一進水通道與排水通道位於殼體之同側,或者,第一進水通道與排水通道相對地位於殼體上。According to one or more embodiments of the present invention, in the above-mentioned liquid cooling head, the first water inlet channel and the drain channel are located on the same side of the housing, or the first water inlet channel and the drain channel are located on the housing opposite to each other.
依據本發明一或複數個實施例,在上述之液冷頭中,擋板更具有至少一連通間隙。連通間隙位於連通開口與第一進水通道之間,並接通上腔室與下腔室。According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head, the baffle further has at least one communication gap. The communication gap is located between the communication opening and the first water inlet channel, and connects the upper chamber and the lower chamber.
依據本發明一或複數個實施例,在上述之液冷頭中,傳熱結構包含多個彼此並列之鰭片。底座具有一第一導流結構與一第二導流結構。這些鰭片、集水結構、第一導流結構與第二導流結構皆形成於底座面向該殼體之一底座內表面。第一導流結構與第二導流結構位於傳熱結構之同側,用以將通過這些鰭片之工作流體分別引導至集水結構。集水結構位於第一導流結構與第二導流結構之間。According to one or more embodiments of the present invention, in the above-mentioned liquid-cooled head, the heat transfer structure includes a plurality of fins arranged side by side. The base has a first diversion structure and a second diversion structure. The fins, the water collecting structure, the first diversion structure and the second diversion structure are all formed on the inner surface of a base facing the casing. The first diversion structure and the second diversion structure are located on the same side of the heat transfer structure, and are used to guide the working fluid passing through the fins to the water collection structure respectively. The water collection structure is located between the first diversion structure and the second diversion structure.
依據本發明一或複數個實施例,在上述之液冷頭中,集水結構包含一圓盤本體與三個流道。圓盤本體位於底座之底座內表面。這些流道彼此形成於圓盤本體面向殼體之一圓盤表面上,用以分別接收從這些鰭片、第一導流結構與第二導流結構送來之工作流體。According to one or more embodiments of the present invention, in the above-mentioned liquid cold head, the water collecting structure includes a disc body and three flow channels. The disc body is located on the inner surface of the base of the base. The flow channels are mutually formed on a disc surface of the disc body facing the casing, and are used for receiving the working fluid sent from the fins, the first diversion structure and the second diversion structure respectively.
依據本發明一或複數個實施例,在上述之液冷頭中,泵浦組包含一驅動組件與一扇葉組件。驅動組件能夠非接觸地轉動扇葉組件。扇葉組件包含扇葉及穿設該扇葉的一軸棒,集水結構包含一軸棒固定件,該機殼包括一擋片 。軸棒固定件位於這些流道之交匯處。擋片夾合於圓盤本體與扇葉,且覆蓋這些流道。擋片具有一開孔,且軸棒穿過擋片設於軸棒固定件上。殼體之二相對面分別具有一上凹槽與一下凹槽。下凹槽垂直對齊上凹槽,且與上凹槽彼此氣密隔絕。上凹槽容置驅動組件,下凹槽容置扇葉組件。扇葉組件可樞轉地位於軸棒固定件與下凹槽內。According to one or more embodiments of the present invention, in the above-mentioned liquid cooling head, the pump unit includes a driving component and a fan blade component. The drive assembly can rotate the fan blade assembly without contact. The fan blade assembly includes a fan blade and a shaft rod passing through the fan blade, the water collection structure includes a shaft rod fixing member, and the casing includes a baffle. The shaft rod holder is located at the intersection of these runners. The baffle is sandwiched between the disc body and the fan blade, and covers these flow channels. The blocking piece has an opening, and the shaft rod passes through the blocking piece and is arranged on the shaft rod fixing member. The two opposite surfaces of the shell respectively have an upper groove and a lower groove. The lower groove is vertically aligned with the upper groove, and is airtightly isolated from the upper groove. The upper groove accommodates the drive assembly, and the lower groove accommodates the fan blade assembly. The fan blade assembly is pivotally located in the shaft fixing part and the lower groove.
依據本發明一或複數個實施例,上述之液冷頭更包含二外接通道與一管線。這些外接通道位於殼體之二相對側。管線位於上腔室內,且連接這些外接通道,並且與該腔室氣密隔絕。According to one or more embodiments of the present invention, the above-mentioned liquid cooling head further includes two external channels and a pipeline. These external channels are located on the two opposite sides of the shell. The pipeline is located in the upper chamber, connects these external channels, and is airtightly isolated from the chamber.
依據本發明一或複數個實施例,在上述之液冷頭中,擋板具有一溝槽,機殼更包含一管蓋,管蓋覆蓋溝槽,以形成所述管線。According to one or more embodiments of the present invention, in the above-mentioned liquid cooling head, the baffle has a groove, and the casing further includes a pipe cover covering the groove to form the pipeline.
依據本發明一或複數個實施例,在上述之液冷頭中,殼體包含一定位槽。定位槽位於上腔室內,且凹設於殼體面向擋板之內面。機殼更包含一定位肋,定位肋一體成形連接管蓋之外表面,且伸入且抵靠定位槽內,用以定位所述管蓋。According to one or more embodiments of the present invention, in the above-mentioned liquid cooling head, the housing includes a positioning groove. The positioning groove is located in the upper chamber and is recessed on the inner surface of the shell facing the baffle. The casing further includes a positioning rib, which is integrally formed to connect to the outer surface of the pipe cover and extends into and abuts against the positioning groove for positioning the pipe cover.
本發明之一實施例提供一種液冷模組。液冷模組包括一上述液冷頭、一塔型液冷排裝置、一前管路與一後管路。塔型液冷排裝置包括一上箱體、一下箱體與一散熱層疊結構。上箱體包含一進水口、一出水口、多個相互隔離的第一腔室。其中一第一腔室連接進水口,其中另一第一腔室連接出水口。下箱體垂直地疊設在液冷頭之頂部,包含多個相互隔離的第二腔室。散熱層疊結構包含複數散熱鰭片組與複數鰭管層。這些散熱鰭片組與這些鰭管位於上箱體與下箱體之間。這些鰭管彼此平行並列且位於任二相鄰之這些散熱鰭片組之間。這些鰭管分別接通第一腔室及第二腔室,使得一S型路徑形成於上箱體、散熱層疊結構與下箱體內。前管路接通進水口與液冷頭之排水通道。後管路接通出水口與液冷頭之第一進水通道。An embodiment of the present invention provides a liquid cooling module. The liquid cooling module includes an above-mentioned liquid cooling head, a tower-type liquid cooling exhaust device, a front pipeline and a rear pipeline. The tower type liquid cooling device includes an upper box body, a lower box body and a heat dissipation stack structure. The upper box body includes a water inlet, a water outlet, and a plurality of first chambers isolated from each other. One of the first chambers is connected to the water inlet, and the other first chamber is connected to the water outlet. The lower box is vertically stacked on the top of the liquid cold head, and contains a plurality of second chambers isolated from each other. The heat dissipation laminated structure includes a plurality of heat dissipation fin groups and a plurality of fin tube layers. The heat dissipation fin groups and the fin tubes are located between the upper box body and the lower box body. The fin tubes are parallel to each other and located between any two adjacent heat dissipation fin groups. These fin tubes are respectively connected to the first chamber and the second chamber, so that an S-shaped path is formed in the upper box body, the heat dissipation stack structure and the lower box body. The front pipeline connects the water inlet and the drainage channel of the liquid cooling head. The rear pipeline connects the water outlet and the first water inlet channel of the liquid cooling head.
依據本發明一或複數個實施例,在上述之液冷模組中,塔型液冷排裝置更包含一外掛風扇。外掛風扇位於散熱層疊結構之一側,固定於上箱體與下箱體之間,用以朝散熱鰭片組輸出氣流。According to one or more embodiments of the present invention, in the above-mentioned liquid cooling module, the tower-type liquid cooling exhaust device further includes an external fan. The external fan is located on one side of the heat dissipation stack structure and is fixed between the upper box body and the lower box body for outputting airflow to the heat dissipation fin group.
依據本發明一或複數個實施例,在上述之液冷模組中,外掛風扇與液冷頭之第一進水通道皆位於液冷模組之同側。According to one or more embodiments of the present invention, in the above-mentioned liquid cooling module, the external fan and the first water inlet channel of the liquid cooling head are both located on the same side of the liquid cooling module.
依據本發明一或複數個實施例,在上述之液冷模組中,該外殼在對應該第一進水通道旁的一側面具有一朝外斜向擴張的斜板。According to one or more embodiments of the present invention, in the above-mentioned liquid cooling module, the housing has a sloping plate that expands obliquely outwards on a side surface corresponding to the first water inlet channel.
如此,透過以上各實施例之所述架構,本發明除了能達到良好散熱功效之外,也有利於應用在相關的電腦設備、主機或伺服器設備上。In this way, through the structures described in the above embodiments, the present invention can not only achieve good heat dissipation efficiency, but is also beneficial to be applied to related computer equipment, host or server equipment.
以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等,本發明之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced by it, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings.
以下將以圖式揭露本發明之複數個實施例,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明實施例中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Hereinafter, a plurality of embodiments of the present invention will be disclosed in the form of drawings. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in the embodiment of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements are shown in the drawings in a simple and schematic manner.
現以一實施例進行本發明所提出之液冷頭2的實施說明。請參見第1A圖至第4B圖。其中第1A圖與第2B圖為該液冷頭2的立體示意圖;第1C圖為該液冷頭2的元件分解示意圖;第2A圖為一殼體20與一擋板35的組裝示意圖;第2B圖至第2D圖為不同擋板的變化示意圖;第3A圖至第3D圖為工作流體於該液冷頭2內的流動方向示意圖;第4A圖與第4B圖為一底座30與一集水結構31的設置示意圖。Now an embodiment is used to describe the implementation of the liquid-cooled
如第1A圖至第1C圖所示,本發明的該液冷頭2主要包括一機殼10、一泵浦組26、一第一進水通道21、一第二進水通道22與一排水通道23。泵浦組26包含一驅動組件260與一扇葉組件261。機殼10包括一上蓋200、一殼體20、一擋板35和一底座30。上蓋200、殼體20、擋板35和底座30彼此依序組合為一體。殼體10與擋板35之間形成一上腔室(如儲水腔201)。該擋板35與該底座30之間形成一下腔室301。上腔室(如儲水腔201)與下腔室301彼此層疊。殼體20之二相對面分別具有一上凹槽28與下凹槽29。上凹槽28用以容置驅動組件 260。下凹槽29垂直對齊上凹槽28,且與上凹槽28彼此氣密隔絕。下凹槽29用以容置扇葉組件261。驅動組件260能夠非接觸地轉動扇葉組件261舉例來說,驅動組件 260能夠非接觸地磁感應扇葉組件261轉動。As shown in Figures 1A to 1C, the
其中該殼體20是作為該液冷頭2的主要結構件,其一端設置該第一進水通道21,用以送入一源頭之工作流體,另一端則設置該第二進水通道22與該排水通道23,換句話說,第二進水通道22與排水通道23位於殼體20之同側,與第一進水通道21分別相對地位於殼體20上,第二進水通道22用以送入另一源頭之工作流體。該殼體20還具有機電腔室以容置該驅動組件 260。該液冷頭2還包括具有一特定厚度的一單孔鎖固環24和一雙孔鎖固環25,該單孔鎖固環24用以鎖固該第一進水通道21,而該雙孔鎖固環25用以鎖固該第二進水通道22與該排水通道23,以避免這些通道的銜接處產生漏水。The
該殼體20設置於該上蓋200與該底座30之間,而該擋板35設置於該殼體20與該底座30之間。在該底座30面向該殼體20的底座內表面30A上設置有該集水結構31、一第一導流結構32、一第二導流結構33與一傳熱結構34,該傳熱結構34包含多個彼此並列之鰭片341。該集水結構31位於該第一導流結構32與該第二導流結構33之間,該集水結構31、該第一導流結構32與該第二導流結構33連接於該傳熱結構34或毗鄰該傳熱結構34的同側。該第一導流結構32與該第二導流結構33皆形成於該底座30之該底座內表面30A。此外,機殼10之殼體20更包括一擋片27。該擋片27位於該扇葉組件261與該集水結構31之間,可協助該集水結構31集水,以防止工作流體回流。該擋片27具有一開孔270。擋片27例如為銅片,然而本發明不限於此。The
如第1C圖和第2A圖所示,當該擋板35組裝於該殼體20後,上腔室例如為形成於該殼體20與該擋板35之間的儲水腔201,用以提供工作流體暫時存儲。該擋板35同時設置於該傳熱結構34的上方,並分隔出上層的該儲水腔201與該傳熱結構34所容置的下腔室301(請見3A圖至第3C圖)。該擋板35還具有一連通開口350,該連通開口350連通上層的該儲水腔201與下層的該下腔室301。如此,當工作流體從第一進水通道21或第二進水通道22流入該儲水腔201後,工作流體就可接著穿過該連通開口350往下流動到該下腔室301中。As shown in Figures 1C and 2A, when the
然而,本發明的概念並不限於此,也就是關於該擋板35的相關連通構造還可作其他設計。舉例來說,在第2B圖至第2D圖中示意了三種不同的擋板B35、C35、D35,其中該擋板B35具有兩連通間隙B351、B352,該擋板C35具有一連通間隙C351,而該擋板D35則具有一連通間隙D351。這些連通間隙B351、B352、C351、D351分別位於該連通開口350與第二進水通道25之間。However, the concept of the present invention is not limited to this, that is, the related communication structure of the
是以,該些連通間隙B351、B352、C351、D351同樣可以提供工作流體加以穿過而往下流動。可以理解的是,視工作流體流動的速度或是輸送的水壓的不同,工作流體可能會先從上述的連通間隙穿過,或是從位置相對較遠的該連通開口350穿過。換句話說,若設計了上述的連通間隙時,搭配原有的該連通開口350就能產生分流的效果,使得相對低溫的工作流體可被平均地導引至該傳熱結構34或該下腔室301的各處而能平均地與該傳熱結構34進行熱量交換,讓該液冷頭2內呈現出良好的均溫情形。當然,上述的連通間隙的位置、形狀、大小或數量等可不以第2B圖至第2D圖所示為限,其形狀例如是正方形、三角形、圓形等形狀亦可,且各種形狀穿孔的邊長可為波浪或鋸齒狀等等。Therefore, the communication gaps B351, B352, C351, and D351 can also provide working fluid to pass through and flow downward. It is understandable that, depending on the flow speed of the working fluid or the delivered water pressure, the working fluid may first pass through the above-mentioned communication gap or pass through the
第3A圖是以該第二進水通道22的管口延伸方向作垂直剖面示意;第3B圖是以該第一進水通道21的管口延伸方向作垂直剖面示意;第3C圖是以該排水通道23的管口延伸方向作垂直剖面示意;第3D圖是以該第一進水通道21、該第二進水通道22與該排水通道23的管徑方向作水平剖面示意。工作流體的流動方式如第3A圖至第3D圖中的箭號方向所示。該下腔室301是由該殼體20、該擋板35與該底座30所共同界定出,除了該傳熱結構34外,該集水結構31、該第一導流結構32與該第二導流結構33也容置於該下腔室301中。Figure 3A is a vertical cross-sectional view of the extension direction of the nozzle of the second
如第3A圖至第3D圖所示,進入液冷頭2的工作流體可以選擇從該第一進水通道21流入,或是從該第二進水通道22流入。從該第二進水通道22流入的工作流體會先流入該儲水腔201,之後轉向穿過該連通開口350往下流動到該下腔室301中。從該第一進水通道21流入的工作流體可有部份先流入該儲水腔201,也可有部份直接轉向穿過該連通開口350往下流動到該下腔室301中。接著,工作流體可通過該傳熱結構34的內部而與該傳熱結構34進行熱量交換。最後,工作流體進入到該扇葉組件261的下方而被該扇葉組件261向上吸取,進而往鄰近的該排水通道23流出該液冷頭2。As shown in FIGS. 3A to 3D, the working fluid entering the liquid-cooled
第4A圖示意了該扇葉組件261與該擋片27設置於該集水結構31上的情形。如上所述,該集水結構31是位於該第一導流結構32與該第二導流結構33之間。其次,第4B圖還示意了該集水結構31具有一圓盤本體310、三個流道31a、31b、31c以及一軸棒固定件31d,其中該些流道31a、31b、31c彼此形成於該圓盤本體310面向該殼體20之一圓盤表面310A上,更具體地,流道31a、31b、31c彼此等角地形成於圓盤本體310面向殼體20之圓盤表面310A上。該流道31a是直接連接或鄰近於該傳熱結構34,而該流道31b則是鄰近於該第一導流結構32,該流道31c則是鄰近於該第二導流結構33。然而,本發明不限流道31a、31b、31c為等角地形成於圓盤本體310上。該軸棒固定件31d位於流道31a、31b、31c之交匯處。該第一導流結構32與該第二導流結構33為一多溝渠式設計,該圓盤本體310為圓盤狀設計。該扇葉組件261可樞轉地位於該軸棒固定件31d與該下凹槽29內。FIG. 4A illustrates a situation where the
如第1D圖所示,該扇葉組件261包含扇葉262及穿設在該扇葉262中的軸棒263,其中,該軸棒263具有彼此相對的底端263B與頂端263A,該軸棒263的設置方式可使該軸棒263的底端263B透過開孔270設置在該軸棒固定件31d或使該軸棒263的頂端263A設置在該殼體20之下凹槽29內(第2A圖),且可在位於該扇葉262與該軸棒固定件31d之間的該軸棒263中加設環形麥拉墊片(圖中未示),以避免該扇葉262在轉動時與該軸棒固定件31d產生磨損。於一實施例中,該扇葉組件261的該扇葉262包含底盤264及設置在底盤264上的複數個葉片266,底盤264具有一鏤空部265。該扇葉組件261轉動時,該鏤空部265能將該扇葉262下方的工作流體向上吸取,進而從鄰近的該排水通道23流出該液冷頭2,但不以此為限。As shown in Figure 1D, the
詳細來說,通過該傳熱結構34的工作流體會從中間和兩側加以流出,其中從中間流出的部份會直接進入到該流道31a中,而從兩側流出的部份則會分別進入到該第一導流結構32或該第二導流結構33。是以,在該殼體20、該擋板35與該底座30的空間包圍下,從該第一導流結構32流出的工作流體可被導引至該流道31b,從該第二導流結構33流出的工作流體可被導引至該流道31c。是以,藉由該第一導流結構32、該第二導流結構33與該集水結構31的設計,對工作流體流動的導引與集中效果可有效提升,使得該扇葉組件261能更利於進行吸取與排水。In detail, the working fluid passing through the
第5A圖依據一實施例之液冷頭3的立體示意圖。第5B圖為此實施例之液冷頭3的元件分解示意圖。如第5A圖與第5B圖所示,液冷頭3與上述液冷頭2大致相同,其差異在於,液冷頭3為一體式雙腔體,其中該第一進水通道21與該排水通道23相對地位於該殼體20上,且位於該殼體20之半部分。該液冷頭3更包含二外接通道220、221與一管線290。該些外接通道220、221分別位於殼體20之二相對側,且位於該殼體20之另半部分。在本實施例中,液冷頭3之孔位增加至4個,使得管路走水路線可變得更加彈性,進而減少管線290對系統的佔有空間。管線290固定地位於殼體20內(意即儲水腔201內),且連接該些外接通道220、221,並且與儲水腔201氣密隔絕。不同於從排水通道23送出之工作流體,外接通道220用以送入又一源頭之工作流體(如第5A圖中的箭號所示),經過管線290而從外接通道221流出。FIG. 5A is a three-dimensional schematic diagram of a liquid cold head 3 according to an embodiment. Figure 5B is an exploded schematic view of the components of the liquid cold head 3 of this embodiment. As shown in Figures 5A and 5B, the liquid-cooled head 3 is substantially the same as the above-mentioned liquid-cooled
第6圖依據一實施例之液冷頭之殼體20的分解示意圖。如第5B圖與第6圖所示,更具體地,該擋板35具有一溝槽353。該溝槽353形成於該擋板35面向殼體20之一面。殼體20更包含一管蓋600。管蓋600覆蓋溝槽353以形成上述管線290。該殼體20包含二定位槽211。該些定位槽211位於該上腔室(如儲水腔201)內,且間隔地凹設於該殼體20面向該擋板35之內面359。該管蓋600更包含二定位肋610。此二定位肋610分別一體成形連接管蓋600之外表面。其中,當該殼體20與該擋板35彼此組合時,每個定位肋610分別匹配地插入其中一定位槽211,用以定位該管蓋600。FIG. 6 is an exploded schematic view of the
現以一實施例進行本發明所提出之液冷模組4的實施說明。請參見第7A圖至第9圖。其中第7A圖至第7C圖為該液冷模組4的立體示意圖;第7D圖為該液冷模組4的元件分解示意圖;第8A圖為該液冷模組4作垂直剖視的立體示意圖;第8B圖為工作流體於該液冷模組4內的流動方向示意圖;第9圖為該液冷模組4與一外掛風扇50的設置示意圖。An embodiment is now used to describe the implementation of the
如第7A圖至第7D圖所示,本發明的該液冷模組4主要包含有兩大部份,其一是一塔型液冷排裝置40,而另一是一液冷頭2’,且該塔型液冷排裝置40是垂直地疊設在該液冷頭2’上。該液冷頭2’即上述的實施例所使用的液冷頭。然而,為了與該塔型液冷排裝置40作垂直整合,此實施例的該液冷頭2’中的一第一進水通道21’與一排水通道23’是採用L型的噴嘴,同時該液冷模組4還包括一前管路41與一後管路42,以使該液冷頭2’透過該前管路41與該後管路42與該塔型液冷排裝置40形成上下的水路循環。As shown in FIGS. 7A to 7D, the
詳細來說,該塔型液冷排裝置40還包括一上箱體43、一下箱體44與一散熱層疊結構450。該上箱體43具有一進水口431與一出水口432,其中該上箱體43以該進水口431連接於該前管路41,並以該出水口432連接於該後管路42。其次,前管路41接通該進水口431與該排水通道23,且後管路42接通該出水口432與第一進水通道21’。散熱層疊結構450包含複數個散熱鰭片組45。這些散熱鰭片組45位於上箱體43與下箱體44之間。每一個散熱鰭片組45由一排複數散熱鰭片疊合於上箱體43與下箱體44之間。可以理解的是,該塔型液冷排裝置40與該液冷頭2’之間的疊設還須要使用或另外設計出相關的鎖固件或卡合結構,以加強彼此的結合強度。In detail, the tower-type
在第7A圖與第7B圖中還示意了該液冷模組4還包括一外殼400,在第7C圖與第7D圖中則是分別呈現了移除該外殼400後的外觀與分解示意。如第7A圖與第7B圖所示,該外殼400在對應該排水通道23’與該第一進水通道21’的兩端上是呈現出無遮蔽,也就是當該外殼400完成組裝後會露出該塔型液冷排裝置40所具有的散熱鰭片組45(請見第7D圖)。其次,位於側邊的該前管路41與該後管路42還可提供擋風功能,搭配該外殼400的設計除了能使外界空氣進入到該些散熱鰭片組45的氣流通道之外,還能減少氣流的阻抗以使氣流更加集中,進而提升該些散熱鰭片組45的氣冷效果。It is also shown in FIGS. 7A and 7B that the
是故,如第7B圖所示,可進一步設計該外殼400在對應該第一進水通道21’旁的側面為朝外斜向擴張的斜板401,以利氣流的集中流入。Therefore, as shown in Fig. 7B, the side surface of the
如第8A圖所示,散熱層疊結構450更包含複數鰭管層460。每個該鰭管層460包括複數個鰭管46,該些鰭管46彼此平行並列且位於任二相鄰之該些散熱鰭片組45之間。該些鰭管46和該些散熱鰭片組45的設置方式是一排鰭管46旁插設一排散熱鰭片組45而形成多排交互插置。此外,此實施例是設計該上箱體43具有相互隔離的多個第一腔室430,這些第一腔室430依序排列,其中首位第一腔室430連接該入水口431,末位第一腔室430連接該出水口432。該下箱體44則具有相互隔離的多個第二腔室440,這些第二腔室440依序排列。該些第二腔室440的分佈範圍對應於該些第一腔室430的分佈範圍。該些鰭管46在該些第二腔室440與該些第一腔室430之間形成流體連通。該些鰭管46分別接通該些第一腔室430以及該些第二腔室440,使得一S型路徑形成於該上箱體43、該散熱層疊結構450與該下箱體44內 (第8B圖)。As shown in FIG. 8A, the heat dissipation laminated
請同時參見第8A圖與第8B圖。當工作流體逐漸注滿其中一第一腔室430時,工作流體即可通過相應的一至多個鰭管46而下降至相應的第二腔室440中。而在工作流體保持著一定的水壓與水量之下,工作流體就會在該些第二腔室440中從前端朝著後端流動,或可被擠壓而再次通過相應的一至多個鰭管46而上升至下一個或相鄰的第一腔室430中。如此,經過多次反覆地進行下降與上升的過程,工作流體就能充分地與該些散熱鰭片組45進行熱量交換。工作流體於該液冷模組4的流動方向可如第8B圖中的實心箭號所示。但可以理解的是,實際的流動情形將不限於此,也可能會視狀況而改變流動型態。Please refer to Figure 8A and Figure 8B at the same time. When the working fluid gradually fills one of the
由此實施例的示意可知,從該排水通道23’流出的是相對溫度較高的工作流體,故在該前管路41中的工作流體會較熱。由於該些第二腔室440只有與該些鰭管46流體連通的出口,故於該些第一腔室430、該鰭管46及該些第二腔室440中流動的工作流體最後會被擠壓而流動至該出水口432,最後流入至該後管路42中。在該後管路42中的工作流體會具有相對較低的溫度,從而能重新回到該液冷頭2’中進行冷卻。而在該後管路42中具有相對較低溫度的工作流體可再接受入風側的外界氣流(如第8B圖中的空心箭號所示)進行氣冷降溫,進而提高散熱效果。From the schematic of the embodiment, it can be seen that the working fluid flowing out from the drain channel 23' is relatively high temperature, so the working fluid in the
在第9圖中是以該液冷模組4移除了該外殼400後的外觀作示意。如第9圖所示,該液冷模組4可與該外掛風扇50作搭配設置,該外掛風扇50位於該散熱層疊結構450之一側,固定於該上箱體43與該下箱體44之間,用以朝該散熱鰭片組45輸出氣流。該外掛風扇50的最佳設置位置即是該第一進水通道21’上方的該些散熱鰭片組45所露出的部份。換句話說,該外掛風扇50與該液冷頭2’之該21’皆位於該液冷模組4之同側。In FIG. 9, the appearance of the
須了解到,本發明上述的該液冷頭可以例如是水冷頭,且液冷模組例如是水冷模組,然而,本發明不限於此。It should be understood that the above-mentioned liquid-cooled head of the present invention may be, for example, a water-cooled head, and the liquid-cooled module may be, for example, a water-cooled module. However, the present invention is not limited to this.
如此,透過以上各實施例之所述架構,本發明除了能達到良好散熱功效之外,也有利於應用在相關的電腦設備、主機或伺服器設備上。In this way, through the structures described in the above embodiments, the present invention can not only achieve good heat dissipation efficiency, but is also beneficial to be applied to related computer equipment, host or server equipment.
最後,上述所揭露之各實施例中,並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,皆可被保護於本發明中。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Finally, the various embodiments disclosed above are not intended to limit the present invention. Anyone who is familiar with this technique can make various changes and modifications without departing from the spirit and scope of the present invention, and they can all be protected in this invention. Inventing. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.
2、2’、3:液冷頭 10:機殼 20:殼體 200:上蓋 201:儲水腔 21、21’:第一進水通道 211:定位槽 22:第二進水通道 220、221:外接通道 23、23’:排水通道 24:單孔鎖固環 25:雙孔鎖固環 26:泵浦組 260:驅動組件 261:扇葉組件 262:扇葉 263:軸棒 263A:頂端 263B:底端 264:底盤 265:鏤空部 266:葉片 27:擋片 270:開孔 28:上凹槽 29:下凹槽 290:管線 30:底座 30A:底座內表面 301:下腔室 31:集水結構 31a、31b、31c:三個流道 31d:軸棒固定件 310:圓盤本體 310A:圓盤表面 32:第一導流結構 33:第二導流結構 34:傳熱結構 341:鰭片 35、B35、C35、D35:擋板 350:連通開口 B351、B352、C351、D351:連通間隙 353:溝槽 359:內面 4:液冷模組 40:塔型液冷排裝置 400:外殼 401:斜板 41:前管路 42:後管路 43:上箱體 430:第一腔室 431:進水口 432:出水口 44:下箱體 440:第二腔室 45:散熱鰭片組 450:散熱層疊結構 46:鰭管 460:鰭管層 50:外掛風扇 600:管蓋 610:定位肋2, 2’, 3: Liquid cooling head 10: Chassis 20: shell 200: upper cover 201: water storage cavity 21, 21’: The first water inlet channel 211: positioning slot 22: The second water inlet channel 220, 221: external channel 23, 23’: Drainage channel 24: Single hole locking ring 25: Double hole locking ring 26: Pump group 260: drive components 261: Fan Blade Assembly 262: fan blade 263: Shaft 263A: Top 263B: bottom 264: Chassis 265: Hollow 266: blade 27: baffle 270: Hole 28: upper groove 29: Lower groove 290: pipeline 30: base 30A: The inner surface of the base 301: Lower Chamber 31: Catchment structure 31a, 31b, 31c: three runners 31d: Axle rod fixing 310: Disc body 310A: Disc surface 32: The first diversion structure 33: The second diversion structure 34: Heat transfer structure 341: Fins 35, B35, C35, D35: baffle 350: Connecting opening B351, B352, C351, D351: connecting gap 353: Groove 359: Inside 4: Liquid cooling module 40: Tower type liquid cooling device 400: Shell 401: inclined plate 41: Front line 42: rear pipeline 43: upper box 430: first chamber 431: Water Inlet 432: water outlet 44: lower box 440: second chamber 45: cooling fin set 450: Heat dissipation stack structure 46: Fin tube 460: fin tube layer 50: external fan 600: pipe cover 610: positioning rib
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 第1A圖與第1B圖依據一實施例之液冷頭的立體示意圖; 第1C圖為此實施例之液冷頭的元件分解示意圖; 第1D圖為此實施例之扇葉組件的立體示意圖; 第2A圖為此實施例之殼體與擋板的組裝示意圖; 第2B圖至第2D圖為不同擋板的變化示意圖; 第3A圖至第3D圖為工作流體於液冷頭內的流動方向示意圖; 第4A圖與第4B圖為此實施例之底座與集水結構的設置示意圖; 第5A圖依據一實施例之液冷頭的立體示意圖; 第5B圖為此實施例之液冷頭的元件分解示意圖; 第6圖依據一實施例之液冷頭之殼體的分解示意圖; 第7A圖至第7C圖為液冷模組的立體示意圖; 第7D圖為液冷模組的元件分解示意圖; 第8A圖為液冷模組作垂直剖視的立體示意圖; 第8B圖為工作流體於液冷模組內的流動方向示意圖;以及 第9圖為依據一實施例之液冷模組與外掛風扇的設置示意圖。In order to make the above and other objectives, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: Fig. 1A and Fig. 1B are three-dimensional schematic diagrams of a liquid-cooled head according to an embodiment; Figure 1C is an exploded schematic diagram of the components of the liquid cold head of this embodiment; Figure 1D is a three-dimensional schematic diagram of the fan blade assembly of this embodiment; Figure 2A is a schematic diagram of the assembly of the housing and the baffle of this embodiment; Figures 2B to 2D are schematic diagrams of the changes of different baffles; 3A to 3D are schematic diagrams of the flow direction of the working fluid in the liquid-cooled head; Figures 4A and 4B are schematic diagrams of the arrangement of the base and water collection structure of this embodiment; FIG. 5A is a three-dimensional schematic diagram of a liquid-cooled head according to an embodiment; Figure 5B is an exploded schematic diagram of the components of the liquid cold head of this embodiment; Fig. 6 is an exploded schematic diagram of the housing of the liquid cold head according to an embodiment; Figures 7A to 7C are three-dimensional schematic diagrams of the liquid cooling module; Figure 7D is an exploded schematic diagram of the components of the liquid cooling module; Figure 8A is a three-dimensional schematic diagram of the liquid cooling module in a vertical cross-sectional view; Figure 8B is a schematic diagram of the flow direction of the working fluid in the liquid cooling module; and FIG. 9 is a schematic diagram of the arrangement of a liquid cooling module and an external fan according to an embodiment.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic deposit information (please note in the order of deposit institution, date and number) without Foreign hosting information (please note in the order of hosting country, institution, date, and number) without
20:殼體 20: shell
201:儲水腔 201: water storage cavity
22:第二進水通道 22: The second water inlet channel
30:底座 30: base
301:下腔室 301: Lower Chamber
32:第一導流結構 32: The first diversion structure
34:傳熱結構 34: Heat transfer structure
35:擋板 35: bezel
350:連通開口 350: Connecting opening
Claims (14)
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US202063000511P | 2020-03-27 | 2020-03-27 | |
US63/000,511 | 2020-03-27 | ||
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US63/038,191 | 2020-06-12 |
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US10265812B2 (en) * | 2015-08-12 | 2019-04-23 | International Business Machines Corporation | Liquid-cooled, composite heat sink assemblies |
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