TW201511660A - Server - Google Patents
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- TW201511660A TW201511660A TW102132866A TW102132866A TW201511660A TW 201511660 A TW201511660 A TW 201511660A TW 102132866 A TW102132866 A TW 102132866A TW 102132866 A TW102132866 A TW 102132866A TW 201511660 A TW201511660 A TW 201511660A
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Abstract
Description
本發明系關於一種伺服器；特別關於一種具有一散熱模組的伺服器。 The present invention relates to a server; and more particularly to a server having a heat dissipation module.
隨著資訊科技的發展，電子裝置的使用也越來越普及。同時，為了滿足人們的各種需求，電子裝置的運算速度也越來越快，功能也越來越強大。以伺服器來說，可包括多個電子元件，例如多個中央處理器、多個儲存裝置、多個介面卡，如此，伺服器即可藉由上述模組以提高運算速度、擴充儲存容量以及功能。 With the development of information technology, the use of electronic devices has become more and more popular. At the same time, in order to meet people's various needs, the computing speed of electronic devices is getting faster and faster, and the functions are becoming more and more powerful. In the case of a server, a plurality of electronic components, such as a plurality of central processing units, a plurality of storage devices, and a plurality of interface cards, may be included, so that the server can increase the computing speed, expand the storage capacity, and the like by using the foregoing modules. Features.
然而，當電子元件的運算速度提高或是其數量增加時，電子元件所產生的熱量也隨之增加，電子元件的溫度升高，進而影響伺服器整體的正常運作。因此，伺服器往往設置具有多組風扇的散熱模組，以加速熱對流的方式對電子元件進行熱交換，進而降低伺服器的溫度。於習知技術中，可使用體積較大且功率較高的風扇或是增加風扇的數量，以提高散熱效率，進而使電子元件的溫度下降。然而，當風扇的數量增加或使用體積較大、功率較高時，會佔去電子元件的設置空間，甚而產生更多的噪音。此外，當每個電子元件(例 如二中央處理器)間隔設置時，習知技術的散熱模組無法有效同時對多個電子元件進行較佳的熱交換。因此，目前即需一種具有散熱模組的伺服器，在不增加設置散熱模組空間的情況下，仍能提高伺服器散熱效率。 However, when the operation speed of the electronic component is increased or the number thereof is increased, the amount of heat generated by the electronic component is also increased, and the temperature of the electronic component is increased, thereby affecting the normal operation of the entire server. Therefore, the server often sets a heat dissipation module with multiple sets of fans to accelerate the heat exchange of the electronic components by accelerating the heat convection, thereby reducing the temperature of the server. In the prior art, a fan having a large volume and a high power can be used or the number of fans can be increased to improve the heat dissipation efficiency, thereby lowering the temperature of the electronic component. However, when the number of fans is increased or the volume of use is large and the power is high, the installation space of the electronic components is taken up, and even more noise is generated. In addition, when each electronic component (example When the two central processing units are spaced apart, the conventional heat dissipation module cannot effectively perform heat exchange on a plurality of electronic components at the same time. Therefore, at present, a server having a heat dissipation module is needed, and the heat dissipation efficiency of the server can be improved without increasing the space of the heat dissipation module.
本發明提供一種伺服器，以提高伺服器散熱效率。 The invention provides a server to improve the heat dissipation efficiency of the server.
本發明的一實施例揭露一種伺服器，其包括一殼體、一主機板以及一散熱模組。主機板設於殼體內，且主機板包括多個熱源。散熱模組包括一冷卻板，冷卻板設於殼體內並熱接觸於多個熱源。冷卻板包括一基板、一外殼以及一散熱鰭片組。基板熱接觸於熱源上。外殼設於基板上，外殼及基板形成一腔室。散熱鰭片組設於基板上並位於腔室內。 An embodiment of the invention discloses a server including a housing, a motherboard, and a heat dissipation module. The motherboard is disposed in the housing, and the motherboard includes a plurality of heat sources. The heat dissipation module includes a cooling plate disposed in the housing and in thermal contact with the plurality of heat sources. The cooling plate includes a substrate, a casing, and a heat sink fin set. The substrate is in thermal contact with the heat source. The outer casing is disposed on the substrate, and the outer casing and the substrate form a chamber. The heat dissipation fins are disposed on the substrate and located in the chamber.
根據本發明所揭露的一種伺服器，冷卻板可同時與多個熱源進行熱交換，進而提升伺服器整體的散熱效率。。因此，相較於習知技術，多個熱源的熱量能同時迅速被帶走而使伺服器內的溫度大幅降低。藉此，冷卻板可同時與多個熱源進行熱交換，進而提升伺服器整體的散熱效率。 According to the server disclosed in the present invention, the cooling plate can exchange heat with a plurality of heat sources at the same time, thereby improving the heat dissipation efficiency of the entire server. . Therefore, compared with the prior art, the heat of a plurality of heat sources can be quickly taken away at the same time to greatly reduce the temperature in the server. Thereby, the cooling plate can exchange heat with a plurality of heat sources at the same time, thereby improving the heat dissipation efficiency of the entire server.
10‧‧‧伺服器 10‧‧‧Server
100‧‧‧機殼 100‧‧‧Chassis
200‧‧‧主機板 200‧‧‧ motherboard
210‧‧‧熱源 210‧‧‧heat source
220‧‧‧熱源 220‧‧‧heat source
230‧‧‧插槽 230‧‧‧ slots
231‧‧‧介面卡 231‧‧‧Interface card
300‧‧‧散熱模組 300‧‧‧ Thermal Module
310‧‧‧水冷式熱交換器 310‧‧‧Water-cooled heat exchanger
312‧‧‧出水口 312‧‧ ‧ water outlet
314‧‧‧入水口 314‧‧‧ water inlet
320‧‧‧風扇 320‧‧‧fan
322‧‧‧入風口 322‧‧‧Air inlet
324‧‧‧出風口 324‧‧‧air outlet
330‧‧‧風扇 330‧‧‧fan
332‧‧‧入風口 332‧‧‧Air inlet
334‧‧‧出風口 334‧‧‧air outlet
340‧‧‧風扇 340‧‧‧fan
342‧‧‧入風口 342‧‧‧air inlet
344‧‧‧出風口 344‧‧‧air outlet
350‧‧‧風扇 350‧‧‧fan
360‧‧‧循環管路 360‧‧‧Circulation line
362‧‧‧第一管路 362‧‧‧First line
364‧‧‧第二管路 364‧‧‧Second line
365‧‧‧第三管路 365‧‧‧ third pipeline
370‧‧‧水泵 370‧‧‧Water pump
380‧‧‧冷卻板 380‧‧‧Cooling plate
382‧‧‧入水端 382‧‧‧ into the water
384‧‧‧出水端 384‧‧‧ water outlet
385‧‧‧基板 385‧‧‧Substrate
386‧‧‧鰭片組 386‧‧‧Fin set
387‧‧‧外殼 387‧‧‧Shell
388‧‧‧腔室 388‧‧‧室
400‧‧‧電源供應器 400‧‧‧Power supply
第1圖系根據本發明一實施例的一伺服器的俯視示意圖。 1 is a top plan view of a server in accordance with an embodiment of the present invention.
第2圖系根據本發明一實施例的一冷卻板的結構示意圖。 2 is a schematic structural view of a cooling plate according to an embodiment of the present invention.
第3圖系根據本發明一實施例的一冷卻板的分解示意圖。 Figure 3 is an exploded perspective view of a cooling plate in accordance with an embodiment of the present invention.
請參考第1圖，其為根據本發明一實施例的一伺服器10的俯視示意圖。一伺服器10包括一機殼100、一主機板200、一散熱模組300以及一電源供應器400。 Please refer to FIG. 1 , which is a top plan view of a server 10 according to an embodiment of the invention. A server 10 includes a casing 100, a motherboard 200, a heat dissipation module 300, and a power supply 400.
在本實施例中，主機板200設置於機殼100內。主機板200包括二熱源210、220、多個插槽230、多個介面卡231。熱源210、220間隔設置，即彼此相隔一距離。在本實施例中，熱源210、220分別是一中央處理器(Central Processing Unit)，但非用以限定本發明。在其他實施例中，熱源是一晶片組、一儲存裝置或一電源供應器，且熱源的數量可為大於二的正整數。當伺服器10運轉時，熱源210、220通電運作而會產生熱能。在本實施例中，插槽230分別位於熱源210、220的兩側，而介面卡231設置於插槽230上。當伺服器10運轉時，介面卡231通電運作亦會產生熱能。 In the embodiment, the motherboard 200 is disposed in the casing 100. The motherboard 200 includes two heat sources 210 and 220, a plurality of slots 230, and a plurality of interface cards 231. The heat sources 210, 220 are spaced apart, i.e., separated from each other by a distance. In the present embodiment, the heat sources 210 and 220 are respectively a central processing unit, but are not intended to limit the present invention. In other embodiments, the heat source is a wafer set, a storage device, or a power supply, and the number of heat sources can be a positive integer greater than two. When the server 10 is in operation, the heat sources 210, 220 are energized to generate thermal energy. In this embodiment, the slots 230 are respectively located on both sides of the heat sources 210 and 220, and the interface card 231 is disposed on the slot 230. When the server 10 is running, the interface card 231 is energized to generate thermal energy.
在本實施例中，散熱模組300設置於機殼100內，但散熱模組300的設置位置非用以限定本發明。散熱模組300包括一冷卻板380、一水冷式熱交換器310(liquid-cooling heat exchanger或liquid-cooling radiator)、一組循環管路360以及多個風扇320、330、340、350。 In this embodiment, the heat dissipation module 300 is disposed in the casing 100, but the installation position of the heat dissipation module 300 is not intended to limit the present invention. The heat dissipation module 300 includes a cooling plate 380, a liquid-cooling heat exchanger 310 (liquid-cooling heat exchanger), a set of circulation lines 360, and a plurality of fans 320, 330, 340, and 350.
請同時參考第1圖至第3圖，第2圖系根據本發明一實施例的一冷卻板的結構示意圖，第3圖系根據本發明 一實施例的一冷卻板的分解示意圖。冷卻板380同時熱接觸於熱源210、220。在本實施例中，冷卻板380包括一入水端382、一出水端384、一基板385、一外殼387以及一散熱鰭片組386。基板385同時熱接觸於熱源210、220上。外殼387設於基板385上。如此，外殼387及基板385共同形成一腔室388，且腔室388連通入水端382以及出水端384。散熱鰭片組386設於基板385上並位於腔室388內。散熱鰭片組386自熱源210延伸至另一熱源220。 Please refer to FIG. 1 to FIG. 3 simultaneously. FIG. 2 is a schematic structural view of a cooling plate according to an embodiment of the present invention, and FIG. 3 is a diagram according to the present invention. An exploded schematic view of a cooling plate of an embodiment. The cooling plate 380 is in thermal contact with the heat sources 210, 220 at the same time. In the present embodiment, the cooling plate 380 includes a water inlet end 382, a water outlet end 384, a substrate 385, a housing 387, and a heat dissipation fin set 386. The substrate 385 is simultaneously in thermal contact with the heat sources 210, 220. The outer casing 387 is disposed on the substrate 385. As such, the outer casing 387 and the base plate 385 together form a chamber 388, and the chamber 388 communicates with the water end 382 and the water outlet end 384. The heat sink fin set 386 is disposed on the substrate 385 and located in the chamber 388. The heat sink fin set 386 extends from the heat source 210 to another heat source 220.
水冷式熱交換器310設置於主機板200的一側。風扇320、330、340、350鄰近於水冷式熱交換器310。循環管路360連接水冷式熱交換器310以及冷卻板380。如此，循環管路360、水冷式熱交換器310以及冷卻板380共同形成一循環水路。一流體可流動於循環水路內，以使冷卻板380的熱量傳遞至水冷式熱交換器310。需要注意的是，水冷式熱交換器310以及風扇320、330、340、350的設置位置以及數量非用以限定本發明。在其他實施例中，水冷式熱交換器310以及風扇320、330、340、350可設置於機殼100外，風扇320、330、340、350的數量可為大於一的正整數。 The water-cooled heat exchanger 310 is disposed on one side of the motherboard 200. Fans 320, 330, 340, 350 are adjacent to water-cooled heat exchanger 310. The circulation line 360 connects the water-cooled heat exchanger 310 and the cooling plate 380. As such, the circulation line 360, the water-cooled heat exchanger 310, and the cooling plate 380 together form a circulating water path. A fluid can flow in the circulating water passage to transfer heat from the cooling plate 380 to the water-cooled heat exchanger 310. It should be noted that the location and number of the water-cooled heat exchanger 310 and the fans 320, 330, 340, 350 are not intended to limit the invention. In other embodiments, the water-cooled heat exchanger 310 and the fans 320, 330, 340, 350 may be disposed outside the casing 100, and the number of the fans 320, 330, 340, 350 may be a positive integer greater than one.
以下詳細介紹風扇的設置位置。在本實施例中，風扇320、330、340、350設置於水冷式熱交換器310以及冷卻板380之間，且風扇320、330、340、350並排設置(side by side)。以風扇320、330、340為例，風扇320、330、340分別 具有一入風口322、332、342以及一出風口324、334、344，入風口322、332、342朝向水冷式熱交換器310。出風口334、344朝向熱源210，出風口324朝向插槽230。在本實施例中，水冷式熱交換器310的寬度實質上與風扇320、330、340、350的總寬度相同，如此，當伺服器10運轉時，風扇320、330、340、350的轉動可提升水冷式熱交換器310與外界空氣的熱交換。 The setting position of the fan is described in detail below. In the present embodiment, the fans 320, 330, 340, 350 are disposed between the water-cooled heat exchanger 310 and the cooling plate 380, and the fans 320, 330, 340, 350 are side by side. Taking fans 320, 330, and 340 as an example, fans 320, 330, and 340 respectively There is an air inlet 322, 332, 342 and an air outlet 324, 334, 344, and the air inlets 322, 332, 342 face the water-cooled heat exchanger 310. The air outlets 334, 344 face the heat source 210, and the air outlet 324 faces the slot 230. In the present embodiment, the width of the water-cooled heat exchanger 310 is substantially the same as the total width of the fans 320, 330, 340, 350. Thus, when the server 10 is in operation, the rotation of the fans 320, 330, 340, 350 can be The heat exchange between the water-cooled heat exchanger 310 and the outside air is increased.
在其他實施例中，散熱模組300更包括至少一導風罩(未繪示)，分別位於風扇320、330、340的入風口322、332、342或出風口324、334、344。當導風罩設於風扇320、330、340的入風口322、332、342時，可有效導引外界氣體進入風扇320、330、340。當導風罩設於風扇的出風口324、334、344時，進而提升散熱效率，藉以導引風扇320、330、340產生的氣流，提高導風率。 In other embodiments, the heat dissipation module 300 further includes at least one air hood (not shown) located at the air inlets 322, 332, 342 or the air outlets 324, 334, 344 of the fans 320, 330, 340, respectively. When the air guiding hood is disposed at the air inlets 322, 332, 342 of the fans 320, 330, 340, the external air can be effectively guided into the fans 320, 330, 340. When the air guiding hood is disposed at the air outlets 324, 334, and 344 of the fan, the heat dissipation efficiency is further improved, thereby guiding the airflow generated by the fans 320, 330, and 340 to improve the air guiding rate.
在本實例中，散熱模組300更包括一水泵370，設於循環管路360中。水冷式熱交換器310具有一入水口314以及一出水口312。循環管路360包括一第一管路362、一第二管路364以及一第三管路365。第一管路362的兩端分別連接水冷式熱交換器310的出水口312以及水泵370的一端，第二管路364的兩端分別連接水泵370的另一端以及冷卻板380的入水端382。第三管路365的兩端分別連接冷卻板380的出水端384以及水冷式熱交換器310的入水口314。換句話說， 水泵370連接水冷式熱交換器310的出水口312以及冷卻板380的入水端382之間。 In this example, the heat dissipation module 300 further includes a water pump 370 disposed in the circulation line 360. The water-cooled heat exchanger 310 has a water inlet 314 and a water outlet 312. The circulation line 360 includes a first line 362, a second line 364, and a third line 365. The two ends of the first line 362 are respectively connected to the water outlet 312 of the water-cooled heat exchanger 310 and one end of the water pump 370. The two ends of the second line 364 are respectively connected to the other end of the water pump 370 and the water inlet end 382 of the cooling plate 380. Both ends of the third line 365 are connected to the water outlet end 384 of the cooling plate 380 and the water inlet 314 of the water-cooled heat exchanger 310, respectively. in other words, The water pump 370 is connected between the water outlet 312 of the water-cooled heat exchanger 310 and the water inlet end 382 of the cooling plate 380.
電源供應器400設置於主機板200的另一側，但電源供應器400的數量和設置位置依實際需求而進行調整。 The power supply 400 is disposed on the other side of the motherboard 200, but the number and setting position of the power supply 400 are adjusted according to actual needs.
以下介紹散熱模組300進行散熱的流程。首先，當伺服器10運轉時，熱源210、220、介面卡231、電源供應器400以及主機板200上的電子元件運作而產生熱量。藉由水泵370運轉產生的抽力，水冷式熱交換器310內的一低溫的流體自出水口312經第一管路362流至水泵370內。接著，流體依序經第二管路364以及入水端382進入冷卻板380內。因為熱源210、220同時熱接觸於冷卻板380的基板385，致使熱源210、220產生的熱量會傳遞至基板385，以使熱源210、220的熱量與冷卻板380進行熱交換。接著，熱量自基板385傳遞至散熱鰭片組386，流體於腔室388中與散熱鰭片組386進行熱交換。當熱量傳遞至流體時，流體的溫度因吸收熱量而升高。然後，高溫的流體自冷卻板380的出水端384並經由第三管路365而流至水冷式熱交換器310的入水口314，高溫流體的熱量傳遞至水冷式熱交換器310，而水冷式熱交換器310可與外界氣體進行熱交換，以帶走熱量。如此，流體的溫度能迅速下降。因為風扇320、330、340、350的運轉，更可加速外界氣體的熱對流。同時風扇導引外界氣體進入伺服器10內，氣體與熱源210、220、介面卡231、電源供應器400以及 主機板200上的電子元件進行熱交換，帶走熱量。如此，伺服器10內的溫度可迅速下降，進而維持伺服器10的穩定運作。當水冷式熱交換器310內的流體溫度下降後，流體可再流出水冷式熱交換器310，以與冷卻板380再進行熱交換。 The following describes the heat dissipation process of the heat dissipation module 300. First, when the server 10 is in operation, the heat sources 210, 220, the interface card 231, the power supply 400, and the electronic components on the motherboard 200 operate to generate heat. A low temperature fluid in the water-cooled heat exchanger 310 flows from the water outlet 312 through the first line 362 to the water pump 370 by the pumping force generated by the operation of the water pump 370. Next, the fluid enters the cooling plate 380 sequentially through the second line 364 and the water inlet end 382. Because the heat sources 210, 220 are simultaneously in thermal contact with the substrate 385 of the cooling plate 380, the heat generated by the heat sources 210, 220 is transferred to the substrate 385 to exchange heat between the heat sources 210, 220 and the cooling plate 380. Then, heat is transferred from the substrate 385 to the heat dissipation fin set 386, and the fluid exchanges heat with the heat dissipation fin group 386 in the chamber 388. When heat is transferred to the fluid, the temperature of the fluid rises due to the absorption of heat. Then, the high temperature fluid flows from the water outlet end 384 of the cooling plate 380 and through the third line 365 to the water inlet 314 of the water-cooled heat exchanger 310, and the heat of the high temperature fluid is transferred to the water-cooled heat exchanger 310, and the water-cooled type The heat exchanger 310 can exchange heat with outside air to remove heat. As such, the temperature of the fluid can drop rapidly. Because of the operation of the fans 320, 330, 340, 350, the thermal convection of the outside air can be accelerated. At the same time, the fan guides the outside air into the server 10, the gas and heat sources 210, 220, the interface card 231, the power supply 400, and The electronic components on the motherboard 200 exchange heat to remove heat. As such, the temperature within the server 10 can drop rapidly, thereby maintaining stable operation of the server 10. When the temperature of the fluid in the water-cooled heat exchanger 310 drops, the fluid can flow out of the water-cooled heat exchanger 310 to exchange heat with the cooling plate 380.
整體來看，因為熱源210、220是伺服器10的最大熱量來源，當熱源210、220的熱量迅速被散熱模組300帶走後，伺服器10內的溫度即會大幅下降，進而維持伺服器10的穩定運作。即使藉由風扇320、330、340、350導引而進入伺服器10內的氣流已經吸收了水冷式熱交換器310的熱量，也不會影響接下來氣流於伺服器10內與其他電子元件的熱交換。 As a whole, since the heat sources 210 and 220 are the largest sources of heat of the server 10, when the heat of the heat sources 210 and 220 is quickly taken away by the heat dissipation module 300, the temperature in the server 10 is greatly reduced, thereby maintaining the server. 10 stable operation. Even if the airflow entering the server 10 by the fans 320, 330, 340, 350 has absorbed the heat of the water-cooled heat exchanger 310, it will not affect the subsequent airflow in the server 10 and other electronic components. Heat exchange.
此外，因為冷卻板380同時熱接觸於熱源210、220，散熱模組300能有效率地對熱源210、220進行散熱。再者，散熱鰭片組386自熱源210延伸至熱源220，如此利用到熱源210、220之間的空間進行熱傳導，增加了散熱鰭片組386的數量和接觸面積，如此更能提升整體的散熱效率。 In addition, since the cooling plate 380 is in thermal contact with the heat sources 210 and 220 at the same time, the heat dissipation module 300 can efficiently dissipate heat from the heat sources 210 and 220. Moreover, the heat dissipation fin group 386 extends from the heat source 210 to the heat source 220, so that heat is transferred to the space between the heat sources 210 and 220, which increases the number and contact area of the heat dissipation fin group 386, thereby improving the overall heat dissipation. effectiveness.
再者，相較於習知技術中使用數量較多或是功率較高的風扇(例如採用型號為4056的風扇)，本發明揭露的伺服器10的散熱模組300採用數量較少、體積和功率較小的風扇(例如採用型號為4028的風扇)，卻可有效提升整體伺服器10的散熱效率。是故，伺服器10更可裝設更多的電子元件或中央處理器，以提升伺服器10的功能和運作速率。 Furthermore, the heat dissipation module 300 of the server 10 disclosed in the present invention is smaller in number and volume than the fan used in the prior art (for example, a fan of the model 4056). A fan with a lower power (for example, a fan of the type 4028) can effectively improve the heat dissipation efficiency of the overall server 10. Therefore, the server 10 can be equipped with more electronic components or a central processing unit to improve the function and operating speed of the server 10.
總上所述，根據本發明所揭露的一種伺服器，冷卻板可同時與多個熱源進行熱交換，並且冷卻板的散熱鰭片組自一熱源延伸至另一熱源，冷卻板與多個熱源之間可有效進行熱交換。因此，相較於習知技術，本發明之冷卻板增加了其散熱鰭片組的數量和接觸面積，熱源的熱量迅速被帶走而使溫度大幅降低，伺服器的散熱效率大幅提升。是以，本發明揭露的伺服器解決了習知技術伺服器散熱不佳的問題。另外，風扇轉動可以加速水冷式熱交換器與外界氣體的熱交換速率，亦提升伺服器的散熱效率。再者，本發明之伺服器減少了風扇的設置數量或減少其體積，卻提高了伺服器的散熱效率，並達到省電的功效。 In summary, according to the server disclosed in the present invention, the cooling plate can exchange heat with a plurality of heat sources at the same time, and the heat dissipation fin group of the cooling plate extends from one heat source to another heat source, the cooling plate and the plurality of heat sources. Effective heat exchange between them. Therefore, compared with the prior art, the cooling plate of the present invention increases the number and contact area of the heat dissipating fin group, and the heat of the heat source is quickly taken away to greatly reduce the temperature, and the heat dissipation efficiency of the server is greatly improved. Therefore, the server disclosed by the present invention solves the problem of poor heat dissipation of the prior art server. In addition, the fan rotation can accelerate the heat exchange rate between the water-cooled heat exchanger and the outside air, and also improve the heat dissipation efficiency of the server. Moreover, the server of the present invention reduces the number of fans or reduces the volume thereof, but improves the heat dissipation efficiency of the server and achieves the power saving effect.
雖然本揭露以前述的較佳實施例揭露如上，然其並非用以限定本揭露，任何熟習相像技藝者，在不脫離本揭露之精神與範圍內，當可作些許更動與潤飾，因此本揭露之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 The present disclosure is disclosed in the foregoing preferred embodiments. However, it is not intended to limit the disclosure, and the skilled person can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of patent protection shall be subject to the definition of the scope of the patent application attached to this specification.
10‧‧‧伺服器 10‧‧‧Server
100‧‧‧機殼 100‧‧‧Chassis
200‧‧‧主機板 200‧‧‧ motherboard
210‧‧‧熱源 210‧‧‧heat source
220‧‧‧熱源 220‧‧‧heat source
230‧‧‧插槽 230‧‧‧ slots
231‧‧‧介面卡 231‧‧‧Interface card
300‧‧‧散熱模組 300‧‧‧ Thermal Module
310‧‧‧水冷式熱交換器 310‧‧‧Water-cooled heat exchanger
312‧‧‧出水口 312‧‧ ‧ water outlet
314‧‧‧入水口 314‧‧‧ water inlet
320‧‧‧風扇 320‧‧‧fan
322‧‧‧入風口 322‧‧‧Air inlet
324‧‧‧出風口 324‧‧‧air outlet
330‧‧‧風扇 330‧‧‧fan
332‧‧‧入風口 332‧‧‧Air inlet
334‧‧‧出風口 334‧‧‧air outlet
340‧‧‧風扇 340‧‧‧fan
342‧‧‧入風口 342‧‧‧air inlet
344‧‧‧出風口 344‧‧‧air outlet
350‧‧‧風扇 350‧‧‧fan
360‧‧‧循環管路 360‧‧‧Circulation line
362‧‧‧第一管路 362‧‧‧First line
364‧‧‧第二管路 364‧‧‧Second line
365‧‧‧第三管路 365‧‧‧ third pipeline
370‧‧‧水泵 370‧‧‧Water pump
380‧‧‧冷卻板 380‧‧‧Cooling plate
382‧‧‧入水端 382‧‧‧ into the water
384‧‧‧出水端 384‧‧‧ water outlet
400‧‧‧電源供應器 400‧‧‧Power supply
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102132866A TW201511660A (en) | 2013-09-11 | 2013-09-11 | Server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102132866A TW201511660A (en) | 2013-09-11 | 2013-09-11 | Server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201511660A true TW201511660A (en) | 2015-03-16 |
Family
ID=53186936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102132866A TW201511660A (en) | 2013-09-11 | 2013-09-11 | Server |
Country Status (1)
| Country | Link |
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| TW (1) | TW201511660A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108121423A (en) * | 2018-01-30 | 2018-06-05 | 深圳市智通电子有限公司 | A kind of server liquid-cooling heat radiator |
| TWI771096B (en) * | 2021-07-06 | 2022-07-11 | 技嘉科技股份有限公司 | Notebook computer |
-
2013
- 2013-09-11 TW TW102132866A patent/TW201511660A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108121423A (en) * | 2018-01-30 | 2018-06-05 | 深圳市智通电子有限公司 | A kind of server liquid-cooling heat radiator |
| TWI771096B (en) * | 2021-07-06 | 2022-07-11 | 技嘉科技股份有限公司 | Notebook computer |
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