TW201511661A - Server - Google Patents

Abstract

A server includes a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a liquid-cooling heat exchanger, a circulation pipelines and multiple fans. The liquid-cooling heat exchanger is disposed on a side of the motherboard. The circulation pipelines are connected to the liquid-cooling heat exchanger and the cooling plate for forming a circulating waterway. The fan is adjacent to the liquid-cooling heat exchanger. The cooling plate performs heat exchange with the heat source, the heat energy is transferred to the liquid-cooling heat exchanger, and the fan accelerates the heat-exchange rate between the liquid-cooling heat exchanger and outside air. Therefore, the heat dissipation of the server is improved.

Description

server

The present invention relates to a server; and more particularly to a server having a heat dissipation module.

With the development of information technology, the use of electronic devices has become more and more popular. At the same time, in order to meet people's various needs, the computing speed of electronic devices is getting faster and faster, and the functions are becoming more and more powerful. In the case of a server, it may include a plurality of electronic components, such as a plurality of central processing units, a plurality of storage devices, and a plurality of interface cards. Thus, the server can increase the computing speed and expand the storage capacity by using the foregoing modules. And features.

However, when the operation speed of the electronic component is increased or the number thereof is increased, the heat generated by the electronic component is also increased, and the temperature of the electronic component is increased, thereby affecting the normal operation of the entire server. Therefore, the server is often provided with a plurality of sets of fan modules to accelerate the heat convection to heat the electronic components, thereby reducing the temperature of the server. In the prior art, a fan having a large volume and a high power can be used or the number of fans can be increased to improve the heat dissipation efficiency, thereby lowering the temperature of the electronic component. However, when the number of fans is increased or the volume of use is large and the power is high, the installation space of the electronic components is taken up, and even more noise is generated. Therefore, there is currently a need to have The heat dissipation module server can improve the heat dissipation efficiency of the server without increasing the space of the heat dissipation module.

The invention provides a server to improve the heat dissipation efficiency of the server.

The invention discloses a server comprising a motherboard and a heat dissipation module. The motherboard includes a heat source. The heat dissipation module includes a cooling plate, a water-cooled heat exchanger, a set of circulation lines, and a plurality of fans. The cooling plate is in thermal contact with the heat source. The water-cooled heat exchanger is disposed on one side of the motherboard. The circulation line connects the water-cooled heat exchanger and the cooling plate to form a circulating water path. The fan is adjacent to the water cooled heat exchanger.

In summary, according to a server disclosed in the present invention, the heat generated by the heat source is transferred to the water-cooled heat exchanger by the cooling plate, and the fan rotates to accelerate the heat exchange rate between the water-cooled heat exchanger and the outside. Therefore, compared with the prior art, the heat of the heat source is quickly taken away to greatly reduce the temperature, and the heat dissipation efficiency of the server is greatly improved. Furthermore, the server of the present invention reduces the number of fans installed, but improves the heat dissipation efficiency of the server and also achieves the power saving effect.

10‧‧‧Server

100‧‧‧Chassis

200‧‧‧ motherboard

210‧‧‧heat source

230‧‧‧ slots

231‧‧‧Interface card

300‧‧‧ Thermal Module

310‧‧‧Water-cooled heat exchanger

312‧‧ ‧ water outlet

314‧‧‧ water inlet

320‧‧‧fan

322‧‧‧Air inlet

324‧‧‧air outlet

330‧‧‧fan

332‧‧‧Air inlet

334‧‧‧air outlet

340‧‧‧fan

342‧‧‧air inlet

344‧‧‧air outlet

350‧‧‧fan

360‧‧‧Circulation line

362‧‧‧First line

364‧‧‧Second line

365‧‧‧ third pipeline

370‧‧‧Water pump

380‧‧‧Cooling plate

382‧‧‧ into the water

384‧‧‧ water outlet

400‧‧‧Power supply

1 is a top plan view of a server in accordance with an embodiment of the present invention.

Please refer to FIG. 1 , which is a top plan view of a server 10 according to an embodiment of the invention. A server 10 includes a casing 100, a motherboard 200, a heat dissipation module 300, and a power supply 400.

In the embodiment, the motherboard 200 is disposed in the casing 100. The motherboard 200 includes a heat source 210, a plurality of slots 230, and a plurality of interface cards 231. In the present embodiment, the heat source 210 is a central processing unit, but is not intended to limit the present invention. In other embodiments, the heat source is a wafer set, a storage device, or a power supply, and the number of heat sources can be multiple and separated by a distance. When the server 10 is in operation, the heat source 210 generates thermal energy. In this embodiment, the slots 230 are respectively located on both sides of the heat source 210, and the interface card 231 is disposed on the slot 230. When the server 10 is running, the interface card 231 also generates thermal energy.

In this embodiment, the heat dissipation module 300 is disposed in the casing 100, but the installation position of the heat dissipation module 300 is not intended to limit the present invention. The heat dissipation module 300 includes a cooling plate 380, a liquid-cooling heat exchanger 310 (liquid-cooling heat exchanger), a set of circulation lines 360, and a plurality of fans 320, 330, 340, and 350. The cooling plate 380 is in thermal contact with the heat source 210. The cooling plate 380 has a chamber (not shown) and a fin set (not shown), and the fins are disposed in the chamber. The water-cooled heat exchanger 310 is disposed on one side of the motherboard 200. Fans 320, 330, 340, 350 are adjacent to water-cooled heat exchanger 310. The circulation line 360 connects the water-cooled heat exchanger 310 and the cooling plate 380. As such, the circulation line 360, the water-cooled heat exchanger 310, and the cooling plate 380 together form a circular waterway. A fluid can flow in the circulating water passage to transfer heat from the cooling plate 380 to the water-cooled heat exchanger 310. It should be noted that the location and number of the water-cooled heat exchanger 310 and the fans 320, 330, 340, 350 are not intended to limit the invention. In other embodiments, the water-cooled heat exchanger 310 and the fans 320, 330, 340, 350 may be disposed outside the casing 100, and the number of the fans 320, 330, 340, 350 may be a positive integer greater than one.

The setting position of the fan is described in detail below. In the present embodiment, the fans 320, 330, 340, 350 are disposed between the water-cooled heat exchanger 310 and the cooling plate 380, and the fans 320, 330, 340, 350 are side by side. Taking the fans 320, 330, and 340 as an example, the fans 320, 330, and 340 respectively have an air inlet 322, 332, 342 and an air outlet 324, 334, 344, and the air inlets 322, 332, 342 face the water-cooled heat exchanger 310. . The air outlets 334, 344 face the heat source 210, and the air outlet 324 faces the slot 230. In the present embodiment, the width of the water-cooled heat exchanger 310 is substantially the same as the total width of the fans 320, 330, 340, 350. Thus, when the server 10 is in operation, the rotation of the fans 320, 330, 340, 350 can be The heat exchange between the water-cooled heat exchanger 310 and the outside air is increased.

In other embodiments, the heat dissipation module 300 further includes at least one air hood (not shown) located at the air inlets 322, 332, 342 or the air outlets 324, 334, 344 of the fans 320, 330, 340, respectively. When the air hood is disposed at the air inlets 322, 332, and 342 of the fans 320, 330, and 340, the external air can be effectively guided. The fans 320, 330, 340 are entered. When the air guiding hood is disposed at the air outlets 324, 334, and 344 of the fan, the airflow generated by the fans 320, 330, and 340 is guided to improve the air guiding rate, thereby improving the heat dissipation efficiency.

In this example, the heat dissipation module 300 further includes a water pump 370 disposed in the circulation line 360. The water-cooled heat exchanger 310 has a water inlet 314 and a water outlet 312. The cooling plate 380 has a water inlet end 382 and a water outlet end 384, and the water inlet end 382 and the water outlet end 384 respectively communicate with the chamber. The circulation line 360 includes a first line 362, a second line 364, and a third line 365. The two ends of the first line 362 are respectively connected to the water outlet 312 of the water-cooled heat exchanger 310 and one end of the water pump 370. The two ends of the second line 364 are respectively connected to the other end of the water pump 370 and the water inlet end 382 of the cooling plate 380. Both ends of the third line 365 are connected to the water outlet end 384 of the cooling plate 380 and the water inlet 314 of the water-cooled heat exchanger 310, respectively. In other words, in the present embodiment, the water pump 370 is connected between the water outlet 312 of the water-cooled heat exchanger 310 and the water inlet end 382 of the cooling plate 380.

The power supply 400 is disposed on the other side of the motherboard 200, but the number and setting position of the power supply 400 are adjusted according to actual needs.

The following describes the heat dissipation process of the heat dissipation module 300. First, when the server 10 is in operation, the heat source 210, the interface card 231, the power supply 400, and the electronic components on the motherboard 200 operate to generate heat. A low temperature fluid in the water-cooled heat exchanger 310 flows from the water outlet 312 through the first line 362 to the water pump 370 by the pumping force generated by the operation of the water pump 370. Then, the fluid is in order The second line 364 and the water inlet end 382 enter the cooling plate 380. Since the heat source 210 is in thermal contact with the cooling plate 380, heat generated by the heat source 210 is transferred to the cooling plate 380 to exchange heat between the heat of the heat source 210 and the cooling plate 380. As such, heat is transferred to the fluid, and the temperature of the fluid rises due to the absorption of heat. Then, the high temperature fluid flows from the water outlet end 384 of the cooling plate 380 and through the third line 365 to the water inlet 314 of the water-cooled heat exchanger 310, and the heat of the high temperature fluid is transferred to the water-cooled heat exchanger 310, and the water-cooled type The heat exchanger 310 can exchange heat with outside air to remove heat. As such, the temperature of the fluid can drop rapidly. Because of the operation of the fans 320, 330, 340, 350, the thermal convection of the outside air can be accelerated. At the same time, the fan guides the outside air into the server 10, and the gas exchanges heat with the heat source 210, the interface card 231, the power supply 400, and the electronic components on the motherboard 200 to remove heat. As such, the overall temperature within the server 10 can be rapidly reduced, thereby maintaining stable operation of the server 10. When the temperature of the fluid in the water-cooled heat exchanger 310 drops, the fluid can flow out of the water-cooled heat exchanger 310 to exchange heat with the cooling plate 380.

As a whole, since the heat source 210 is the largest source of heat of the server 10, when the heat of the heat source 210 is quickly taken away by the heat dissipation module 300, the temperature in the server 10 is greatly reduced, thereby maintaining the stable operation of the server 10. . Even if the airflow entering the server 10 by the fans 320, 330, 340, 350 has absorbed the heat of the water-cooled heat exchanger 310, it will not affect the subsequent airflow in the server 10 and other electronic components. Heat exchange.

In addition, it is used in larger quantities or in power than conventional techniques. A higher fan (for example, a fan of the type 4056), the heat dissipation module 300 of the server 10 disclosed in the present invention uses a small number of fans with a small volume and a small power (for example, a fan of the type 4028). The heat dissipation efficiency of the overall server 10 can be effectively improved. In this way, the server 10 can be equipped with more electronic components or a central processing unit to improve the function and calculation rate of the server.

In summary, according to a server disclosed in the present invention, the heat generated by the heat source is transferred to the water-cooled heat exchanger by the cooling plate, and the fan rotates to accelerate the heat exchange rate between the water-cooled heat exchanger and the outside air. Therefore, compared with the prior art, the temperature of the heat source is greatly reduced, and the heat dissipation efficiency of the server is greatly improved. Therefore, the server disclosed by the present invention solves the problem of poor heat dissipation of the prior art server. Furthermore, the server of the present invention reduces the number of fans or reduces the volume thereof, but improves the heat dissipation efficiency of the server and also achieves the power saving effect.

The present disclosure is disclosed in the foregoing preferred embodiments. However, it is not intended to limit the disclosure, and the skilled person can make some changes and refinements without departing from the spirit and scope of the disclosure. The scope of patent protection shall be subject to the definition of the scope of the patent application attached to this specification.

10‧‧‧Server

100‧‧‧Chassis

200‧‧‧ motherboard

210‧‧‧heat source

230‧‧‧ slots

231‧‧‧Interface card

300‧‧‧ Thermal Module

310‧‧‧Water-cooled heat exchanger

312‧‧ ‧ water outlet

314‧‧‧ water inlet

320‧‧‧fan

322‧‧‧Air inlet

324‧‧‧air outlet

330‧‧‧fan

332‧‧‧Air inlet

334‧‧‧air outlet

340‧‧‧fan

342‧‧‧air inlet

344‧‧‧air outlet

350‧‧‧fan

360‧‧‧Circulation line

362‧‧‧First line

364‧‧‧Second line

365‧‧‧ third pipeline

370‧‧‧Water pump

380‧‧‧Cooling plate

382‧‧‧ into the water

384‧‧‧ water outlet

400‧‧‧Power supply

Claims (8)

A server includes: a motherboard including a heat source; and a heat dissipation module comprising: a cooling plate thermally contacting the heat source; a water-cooled heat exchanger disposed on one side of the motherboard; a circulation line connecting the water-cooled heat exchanger and the cooling plate to form a circulation water path; and a plurality of fans adjacent to the water-cooled heat exchanger. The server of claim 1, wherein the heat source is a central processor. The server of claim 1, wherein the fans are disposed between the water-cooled heat exchanger and the cooling plate. The server of claim 3, wherein the fans are arranged side by side. The server of claim 1, wherein each of the fans has an air inlet, and the air inlets face the water-cooled heat exchanger. The server of claim 1, wherein each of the fans has an air outlet, and at least one of the air outlets faces the heat source. The server of claim 1, wherein the heat dissipation module further comprises a water pump disposed in the circulation line. The server of claim 7, wherein the water-cooled heat exchanger has a water outlet, the cooling plate has a water inlet, the water pump connecting the water outlet of the water-cooled heat exchanger and the water inlet end of the cooling plate between.