TWI757176B - External reversible liquid cooling device - Google Patents

Abstract

An external reversible liquid cooling device for connecting to an electronic device with a heat source, and the external reversible liquid cooling device includes a cooling module, a power module, a base and a connecting bracket. The liquid cooling unit is connected to a heat source for heat exchange. Two side plates of the base body are located at two sides of the liquid cooling module, and are provided with sliding blocks and spring fixing plug. The two connecting brackets are connected to the electronic device, and are provided with arc-shaped sliding grooves and two fixing holes. The sliding block is assembled in the arc-shaped sliding groove, and the spring fixing plug is plugged in one of the two fixing holes. When the spring fixing plug is out of the fixing hole, the sliding block can slide along the arc-shaped sliding groove to drive the seat body and the liquid cooling module to turn over. When the spring fixing plug enters another fixing hole and is fixed, the turning angle of the seat body is maintained. The external reversible liquid cooling device can be installed outside the electronic device without affecting the cable installation, and providing high cooling efficiency and simple design.

Description

External reversible liquid cooling device

The invention relates to the field of heat flow, in particular to an external reversible liquid cooling device.

With the advancement of semiconductor technology, the integrated circuit per unit volume in the chip has increased, which has improved the computing efficiency and system performance. However, the thermal energy generated by a single chip, such as a central processing unit (CPU), is also constantly increasing. With the recent Intel Eagle Stream series, a single CPU has reached the 400W mark. Traditional air cooling methods such as fans can no longer meet the needs of heat dissipation, which may lead to subsequent overheating and shutdown problems.

Based on this, the demand for water cooling/liquid cooling began to appear on the table, but currently, the general high-energy-consuming electronic devices, such as industrial computers, servers, etc., have emerged. Usually, the liquid cooling system needs to be installed inside, but in addition to the need to customize a specific case, it is necessary to reserve the volume space of the radiator in the case. With the improvement of system performance, the internal space is reduced, which leads to the problems of limited design margin and difficult installation.

Another way is to use an externally mounted type, which requires the liquid cooling system of the whole machine room, but this is usually expensive, and the overall design is usually cumbersome, which leads to considerable inconvenience when installing lines and maintaining the system.

In order to solve the problems faced by the prior art, an external reversible liquid cooling device is provided herein. The external reversible liquid cooling device is used for connecting to an electronic device with a heat source. The external reversible liquid cooling device includes a cooling module, a power module, a base, and a connecting bracket.

The cooling module includes a liquid cooling unit, a pump and a heat sink. The heat sink is fixed on the heat source, and the liquid cooling unit is connected to the heat sink and the pump. The pump draws the coolant from the heat sink and transmits it to the liquid cooling unit through the water inlet pipe for cooling, and then the pump passes the cooled coolant through The water outlet pipe is transported to the heat sink. The power module is used to electrically connect the electronic device and the pump, and supply power to the pump.

The base body includes a base and two side plates, the base carries a cooling module, the two side plates are connected to two sides of the base and extend in a direction perpendicular to the base, and the two side plates are located on both sides of the cooling module, and the length of the side plates is greater than that of the cooling module The width of the group. A sliding block and a spring fixing pin are arranged on one side of each side plate. The two connecting brackets are respectively connected to the electronic device on both sides, and each connecting bracket is provided with an arc-shaped chute and two fixing holes. The sliding block is assembled in the arc-shaped chute, and the spring fixing pin is clamped in one of the two fixing holes. When the spring fixing pin is separated from the fixing hole, the sliding block can slide along the arc-shaped chute to drive the seat body and the cooling module to turn over.

In some embodiments, the external reversible liquid cooling device further includes a fixing frame. The fixing frame includes a plurality of first connecting ribs, second connecting ribs and two extending connecting pieces, the first connecting rib is connected with the electronic device and the second connecting rib, the second connecting rib is connected with the first connecting rib, and the two extending connecting pieces are respectively connected by the Both sides of the two connecting ribs extend out and are respectively connected to the two side plates of the base body.

In more detail, in some embodiments, the first connecting ribs include at least one upper connecting rib and at least one lower connecting rib arranged in pairs, and two side connecting ribs located on both sides.

In some embodiments, the cooling module further includes a fan, the fan is clamped on the side of the base facing the electronic device and adjacent to the liquid cooling unit, and the fan is electrically connected to the power module.

In more detail, in some embodiments, the power module is installed on the two first connecting ribs of the fixing frame.

In more detail, in some embodiments, the externally-connected reversible liquid cooling device further includes a heat conduction component. The heat conduction assembly includes two fixed joints and a plurality of flexible heat conduction pipes. The two fixed joints are respectively used to connect the heat source and the base. Two ends of each flexible heat conduction pipe are respectively connected to the two fixed joints, and the fixed joint connected to the base is adjacent to the fan.

Further, in some embodiments, the length of the first connector is greater than or equal to 85 mm.

In some embodiments, the side plate of the base body further includes a riveting stud, and the spring fixing pin is installed in the riveting stud.

In some embodiments, the base body further includes two front plates, the two front plates are respectively bent and extended from one side of the two side plates, and are located on the front side of the liquid cooling unit.

In some embodiments, the distance from the cooling module to the electronic device is greater than or equal to 135 mm.

To sum up, the external reversible liquid cooling device can be directly installed outside electronic devices such as industrial computers and servers, and is simple in design and easy to install. Furthermore, through the slidable design of the seat body and the connecting bracket, the seat body and the cooling module can be turned over, which makes the overall installation easier and does not affect the installation of the original input and output ports, so as to achieve high cooling efficiency and low cooling efficiency. Efficacy of cost, simplicity of design, and ease of installation.

FIG. 1 is a schematic perspective view of a first embodiment of an external reversible liquid cooling device. As shown in FIG. 1 , the external reversible liquid cooling device 1 is used for connecting to an electronic device 500 having a heat source 510 . The external reversible liquid cooling device 1 includes a cooling module 10 , a power module 20 , a base 30 , and a connecting bracket 40 . Here, the electronic device 500 is represented by a server, and the heat source 510 is the CPU of the server. In the figure, the top cover of the electronic device 500 is removed, and the connection method is clearly shown. The external reversible liquid cooling device 1 is installed at the I/O at the rear end of the server, however, this is only an example, not a limitation.

The cooling module 10 includes a liquid cooling unit 11 , a pump 13 and a cold plate 15 . The heat sink 15 is fixed on the heat source 510, and the liquid cooling unit 11 is connected to the heat sink 15 and the pump 13. The cooling liquid from the heat sink 15 is extracted through the pump 13 and sent to the liquid cooling unit 11 through the water inlet pipe 17A for cooling. , and then the pump 13 pressurizes the cooled cooling liquid, passes through the liquid cooling unit 11 and then returns it to the heat sink 15 through the water outlet pipe 17B to achieve a heat exchange cycle. Here, the pump 13 of the cooling module 10 can be further replaced with a compressor, and the liquid in the liquid cooling unit 11 can be water or a liquid refrigerant. The power module 20 can be electrically connected to the electronic device 500 , for example, connected to the input and output ports, and used to supply power to the pump 13 . Here, the cooling module 10 is realized by matching the two liquid cooling units 11 with the common pump 13 , however, this is only an example, and can actually be adjusted according to actual needs. In addition, the configurations of the water inlet pipe 17A and the water outlet pipe 17B are presented for the sake of clarity, and are not intended to be limiting.

The base 30 includes a base 31 and two side plates 33 . The base 31 supports the cooling module 10 , and the two side plates 33 are connected to two sides of the base 31 and extend in a direction substantially perpendicular to the base 31 . The side plates 33 are located on both sides of the cooling module 10 , and the length of the side plates 33 is greater than the width of the cooling module 10 . A sliding block 35 and a spring fixing pin 37 are provided on one surface of each side plate 33 . The two connecting brackets 40 are respectively connected to the electronic device 500 on both sides. In this embodiment, the connecting brackets 40 are directly connected to the electronic device 500 , but in fact, indirect connection can also be adopted. Each connecting bracket 40 is provided with an arc-shaped sliding slot 41 and two fixing holes 43 . The sliding block 35 is assembled in the arc-shaped sliding slot 41 , and the spring fixing pin 37 is clamped in one of the two fixing holes 43 .

FIG. 2 and FIG. 3 are partial enlarged views of an external reversible liquid cooling device. FIG. 4 is a perspective view of the inverted state of the first embodiment of the external reversible liquid cooling device. The perspectives of FIGS. 2 and 3 are from the inside of the casing of the electronic device 500 toward the outside of the casing. As shown in FIG. 2 to FIG. 4 , when the spring fixing pin 37 is pressed and disengaged from the original fixing hole 43 , the sliding block 35 can slide along the arc-shaped chute 41 to drive the base body 30 and the cooling module 10 to turn over. , is presented by flipping the plane to 90 degrees, but in fact, more fixing holes 43 can be designed to design different flip angles, such as 30 degrees, 60 degrees, and so on. When the spring fixing pin 37 enters the other fixing hole 43 and is fixed, the tilting angle of the seat body 30 can be maintained. In this way, the cable installation and lamp signal inspection on the output/output port will not be affected by the externally-connected reversible liquid cooling device 1 .

In more detail, referring to FIGS. 1 and 4 again, the cooling module 10 further includes a fan 19 , and the fan 19 is snapped on the side of the base 30 facing the electronic device 500 and adjacent to the liquid cooling unit 11 . The fan 19 is electrically connected to the power module 20 . Through the fan 19, the heat energy can be quickly exported to the outside.

In addition, due to consideration of installation and inversion, the distance from the cooling module 10 to the electronic device 500 is greater than or equal to 135 mm, and the water inlet pipe 17A and the water outlet pipe 17B are made of hoses to maintain the mobility of inversion.

Referring to FIGS. 1 to 4 again, preferably, the two side plates 33 of the base body 30 further include riveting studs 39, and the spring fixing pins 37 are installed in the riveting studs 39 to prevent the spring fixing pins 37 from being deformed or biased. shift. The spring fixing pin 37 can protrude from the riveting stud 39 to be installed in the fixing hole 43 . Further, the base body 30 further includes two front plates 32 , and the base body 30 further includes two front plates 32 . The front plate 32 is bent and extended from one side of the side plate 33 and is located at the front side of the liquid cooling unit 11 . Further, it can also be fixed with the liquid cooling unit 11 by means of locking. In this way, the cooling module 10 is limited in position through the base 31 , the front plate 32 and the side plate 33 .

FIG. 5 is a schematic perspective view of a second embodiment of an external reversible liquid cooling device. As shown in FIG. 5 , and referring to FIGS. 1 and 4 at the same time, the difference from the first embodiment is that the side plate 33 of the second embodiment is shorter, and the electronic device 500 is connected to the electronic device 500 through the fixing frame 60 . The fixing frame 60 includes a plurality of first connecting ribs 61 , second connecting ribs 63 and two extending connecting members 65 . The first connecting rib 61 is connected to the electronic device 500 and the second connecting rib 63 . In more detail, the first connecting rib 61 includes an upper connecting rib 611 and a lower connecting rib 613 arranged in a pair in the middle, and side connecting ribs 615 on both sides. The first connecting rib 61 can be fixed on the electronic device 500 by means of locking. The second connecting ribs 63 connect the first connecting ribs 61 . The two extending connecting pieces 65 are respectively extended from two sides of the second connecting rib 63 and are respectively connected to the two side plates 33 of the base body 30 . The two extending connecting pieces 65 and the side connecting ribs 615 are generally extended from the second connecting rib 63 to the front and rear sides. This structure is only an example and not intended to be limiting. The purpose of the fixing frame 60 is to improve the rigidity of the external reversible liquid cooling device 1 and the electronic device 500 to be assembled, so as to maintain a longer service cycle.

Further, the power module 20 is mounted on the two first connecting ribs 61 of the fixing frame 60 . In addition, in this embodiment, the length of the first connecting rib 61 is greater than or equal to 85 mm, so as to provide a margin for the base body 30 and the cooling module 10 to be turned over, and to facilitate assembly.

FIG. 6 is a three-dimensional schematic diagram of a third embodiment of an external reversible liquid cooling device. As shown in FIG. 6 , as shown in FIG. 6 , the external reversible liquid cooling device 1 further includes a heat conduction component 70 . The heat conduction assembly 70 includes two fixed joints 71 and a plurality of flexible heat conduction pipes 73. The two fixed joints 71 are respectively used to connect the heat source 510 and the base body 30 (not explicitly shown in the figure), and two ends of each flexible heat conduction pipe 73 are respectively Connected to two fixed joints 71 . In this way, in addition to the liquid cooling method, the waste heat is exported to the outside through heat conduction. Although not clearly shown in the figure, it can be understood from the structural relationship that the fixed joint 71 connected to the base body 30 is adjacent to the fan 19 in order to achieve a faster heat conduction effect. Although FIG. 6 shows the structure of FIG. 1 and FIG. 4 , it should be understood that, as in FIG. 5 , a fixing frame 60 may also be installed in FIG. 6 to further improve the rigidity of the assembly.

In the following, a server with one of the structures of the external reversible liquid cooling device 1 of the second embodiment is installed as an experimental example, and a server of the same specification that is not installed with the external reversible liquid cooling device 1 and is simply air-cooled by a fan is used as a comparison For example, to compare the temperature of each part. When the room temperature is 25 degrees and 35 degrees, respectively, compare the temperature of each element, as shown in Table 1. In this experimental example, the cooling module 10 includes two liquid cooling units 11 , pumps 13 and two heat sinks 15 , two CPUs connected to the server, the specifications of the CPUs are Whitley 270W Dual from Intel Corporation, and the liquid cooling unit 11 The coolant in it is water. Table 1 ambient temperature 25 degrees C 35 degrees C device Specification temperature Comparative example (degree C) PASS/FAIL Experimental example (degree C) PASS/FAIL Comparative example (degree C) PASS/FAIL Experimental example (degree C) PASS/FAIL CPU1 105 75.0 PASS 58 PASS 86 PASS 67 PASS CPU2 105 82 PASS 55 PASS 94 PASS 64 PASS PCH 79 44.0 PASS 40.0 PASS 56.0 PASS 51.0 PASS HDD 60 34.0 PASS 32.0 PASS 44.0 PASS 42.0 PASS DIMMs 85 42.0 PASS 38.0 PASS 51.0 PASS 50.0 PASS PSU1 50 37.1 PASS 29.9 PASS 50.9 FAIL 39.8 PASS PSU2 50 41.0 PASS 32.5 PASS 53.7 FAIL 43.4 PASS BMC chip 70 54.9 PASS 46.0 PASS 65.1 PASS 57.5 PASS LAN Chip 85 55.7 PASS 41.6 PASS 65.8 PASS 54.5 PASS M2 (1) 70 53.9 PASS 35.3 PASS 64.8 PASS 46.8 PASS M2 (2) 70 52.4 PASS 38.4 PASS 62.8 PASS 50.7 PASS

As shown in Table 1 above, the experimental example shows that, compared with the air-cooled comparative example, the external reversible liquid cooling device 1 can effectively dissipate heat, thereby maintaining the stability of the system performance.

From the foregoing description, it can be understood that the external reversible liquid cooling device 1 can be directly installed outside the electronic device 500 such as an industrial computer, a server, etc., especially, the position behind the input and output ports does not require special design of the casing, The internal space is allocated, the overall design is simple, and the electronic device 500 is provided with a larger design margin. In addition, through the slidable design of the base body 30 and the connecting bracket 40, the base body 30 and the cooling module 10 can be driven to turn over, so that the overall installation is easier and the installation of the original input and output ports is not affected. Achieve high cooling efficiency, low cost, simple design and easy installation.

It should be understood that when an element is referred to as being "connected" or "disposed" to another element, it may mean that the element is directly on the other element, or there may also be intervening elements through which the element is connected to the other element. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element, it will be understood that the intervening elements are not explicitly defined at the time.

Furthermore, when relative terms such as "lower" and "upper", "front" and "rear" may be used herein to describe one element's relationship to another element, it should be understood that relative terms are intended to include elements other than those shown in the figures. A different orientation of the device other than the orientation of the device. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. This only represents a relative orientation relationship, not an absolute orientation relationship.

Although the technical content of the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person who is familiar with the art, makes some changes and modifications without departing from the spirit of the present invention, should be included in the present invention. Therefore, the protection scope of the present invention should be determined by the scope of the appended patent application.

1: External reversible liquid cooling device 10: Cooling module 11: Liquid cooling unit 13: Pump 15: heat sink 17A: Water inlet pipe 17B: Outlet pipe 19: Fan 20: Power Module 30: seat body 31: Base 32: Front panel 33: Side panels 35: Slider 37: Spring retaining pin 39: Riveted stud 40: Connect the bracket 41: Arc chute 43:Fixing hole 60: Fixed frame 61: The first connecting rib 611: Upper connecting rib 613: Lower connecting rib 615: Side connecting ribs 63: Second connecting rib 65: Extension connector 70: Thermal Conductive Components 71: Fixed connector 73: Flexible heat pipe 500: Electronics 510: Heat Source

FIG. 1 is a schematic perspective view of a first embodiment of an external reversible liquid cooling device. FIG. 2 and FIG. 3 are partial enlarged views of an external reversible liquid cooling device. FIG. 4 is a perspective view of the inverted state of the first embodiment of the external reversible liquid cooling device. FIG. 5 is a schematic perspective view of a second embodiment of an external reversible liquid cooling device. FIG. 6 is a three-dimensional schematic diagram of a third embodiment of an external reversible liquid cooling device.

1: External reversible liquid cooling device

10: Cooling module

11: Liquid cooling unit

13: Pump

15: heat sink

17A: Water inlet pipe

17B: Outlet pipe

19: Fan

20: Power Module

30: seat body

31: Base

32: Front panel

33: Side panels

40: Connect the bracket

43:Fixing hole

500: Electronics

510: Heat Source

Claims (10)

An external reversible liquid cooling device for connecting to an electronic device with a heat source, comprising: A cooling module includes a liquid cooling unit, a pump and a heat dissipation base, the heat dissipation base is connected to the liquid cooling unit through a water inlet pipe, the heat dissipation base is used for fixing on the heat source, and the liquid cooling unit is connected to the heat dissipation and the pump, the pump extracts a cooling liquid from the heat sink, and sends it to the liquid cooling unit through a water inlet pipe for cooling, and then the pump sends the cooled cooling liquid to the cooling liquid through a water outlet pipe heat sink; a power module for electrically connecting the electronic device and the pump to supply power to the pump; A base includes a base and two side plates, the base supports the cooling module, the two side plates are connected to the two sides of the base and extend in a direction perpendicular to the base, and the two side plates are located at two sides of the cooling module and the length of the side plates is greater than the width of the cooling module, and one side of each of the side plates is provided with a sliding block and a spring fixing pin; and Two connecting brackets are respectively connected to the electronic device on both sides, and each connecting bracket defines an arc-shaped sliding slot and two fixing holes, wherein the sliding block is assembled in the arc-shaped sliding slot, and the spring fixing pin is clamped. In one of the two fixing holes, when the spring fixing pin is separated from the fixing hole, the sliding block can slide along the arc-shaped chute to drive the base and the cooling module to turn over, and when the spring fixing pin enters the After the other fixing hole is fixed, the turning angle of the base body can be maintained. The externally connected reversible liquid cooling device according to claim 1, further comprising a fixing frame, and the fixing frame comprises a plurality of first connecting ribs, a second connecting rib and two extending connecting pieces, and the first connecting ribs are connected to each other. the electronic device and the second connecting rib, the second connecting rib is connected to the first connecting ribs, the two extending connecting pieces are respectively extended from two sides of the second connecting rib, and are respectively connected to the two side panel. The externally connected reversible liquid cooling device according to claim 2, wherein the first connecting ribs comprise at least one upper connecting rib and at least one lower connecting rib arranged in pairs, and two side connecting ribs located on both sides. The externally connected reversible liquid cooling device according to claim 1 or claim 2, wherein the cooling module further comprises a fan, the fan is clamped on the side of the base facing the electronic device and adjacent to the liquid A cooling unit, the base carries the fan, and the fan is electrically connected to the power module. The externally connected reversible liquid cooling device according to claim 4, further comprising a heat conduction component, the heat conduction component includes two fixed joints and a plurality of flexible heat conduction pipes, the two fixed joints are respectively used for connecting the heat source and the base body , the two ends of each of the flexible heat-conducting pipes are respectively connected to the two fixed joints, and the fixed joint connected to the base is adjacent to the fan. The externally connected reversible liquid cooling device according to claim 2, wherein the power module is arranged on the two first connecting ribs of the fixing frame. The externally connected reversible liquid cooling device according to claim 2, wherein the length of the first connecting rib is greater than or equal to 85 mm. The externally connected reversible liquid cooling device according to claim 1, wherein the two side plates of the base further comprise a riveting stud, and the spring fixing pin is installed in the riveting stud. The externally connected reversible liquid cooling device according to claim 1, wherein the base body further comprises two front plates, the two front plates are respectively bent and extended from one side of the two side plates, and are located on the front side of the liquid cooling unit. The externally connected reversible liquid cooling device according to claim 1, wherein the distance from the cooling module to the electronic device is greater than or equal to 135 mm.

Images