TWM565471U - Liquid cooling heat dissipation structure - Google Patents

Abstract

A liquid-cooled heat dissipation structure is applied to an electronic device and covers a circuit board including a central processing unit and at least one chip; the heat dissipation structure includes at least a heat conductive substrate and a liquid cooling head; wherein the heat conductive substrate Having a first surface and a second surface opposite to each other, and the second surface of the thermally conductive substrate faces the circuit board and can be in contact with the central processing unit and the at least one wafer for deriving heat of the central processing unit and the at least one wafer Wherein, the liquid cooling head is disposed on the first surface of the heat-conducting substrate, and accommodates a chamber, wherein the chamber is provided with a cooling liquid, and the chamber is provided with a cooling liquid inlet and a cooling liquid outlet. In this way, the cooling liquid is driven to flow from the cooling liquid inlet and the cooling liquid outlet through a water pump, and is continuously circulated and cooled to quickly derive the heat of the heat conductive substrate.

Description

Liquid cooled heat dissipation structure

This creation is related to the heat dissipation structure, especially a liquid-cooled heat dissipation structure that is used to quickly derive the heat source generated by the electronic components on the circuit board.

Press, the components on the board, especially the board of the computer motherboard, including many wafers, such as: South and North Bridge chips, display chips, MOS chips, etc., and a central processing unit (CPU), which will work A large amount of heat is generated, which causes the temperature to rise, which in turn affects the working efficiency. Therefore, the heat source must be derived by the heat dissipation structure.

The existing heat dissipation technologies for electronic products generally include air-cooled and liquid-cooled. The air-cooled heat-dissipating system utilizes the pumping and blowing of the fan to flow the airflow to derive the heat source of the electronic component, thereby lowering the temperature; and the liquid-cooling heat-dissipating system uses the heat energy of the liquid to absorb the object, is transmitted to the heat sink component, and then passes through the air cooling. Or passive heat dissipation to dissipate heat. The heat transfer coefficient and heat capacity based on liquid are much higher than air, so the heat dissipation efficiency of liquid cooling is higher than that of air cooling. As shown in Fig. 1, the circuit board 4 of the conventional computer motherboard generally uses the liquid-cooled heat dissipation structure 5 for the central processing unit 41 to ensure its operational efficiency. As for the other wafers 42 on the circuit board 4 (e.g., MOS wafers), the air-cooled heat dissipation fins 6 are still used for heat dissipation due to cost considerations due to the high cost of the liquid-cooled heat dissipation structure 5. However, the heat generation of the MOS wafer 42 is also high, and the heat dissipation fins 6 must have sufficient area to achieve good heat dissipation efficiency, which will cause a disadvantage of occupying a large space and affecting the internal space configuration of the casing.

In view of this, how to improve the above problems is the primary issue that the creative office wants to solve.

The main purpose of the present invention is to provide a liquid-cooled heat dissipation structure that simultaneously contacts a plurality of electronic component heat sources on a circuit board with a heat-conducting substrate, and derives the heat of the heat-conductive substrate by a liquid-cooled heat dissipation module. High efficiency of liquid cooling and effective cost control. In addition, this creation replaces the conventional heat sink fin structure and achieves the effect of miniaturization.

For the purpose of the foregoing, the present invention provides a liquid-cooled heat dissipation structure covering a circuit board including a central processing unit and at least one chip, the heat dissipation structure including: a heat-conducting substrate having a first side opposite thereto And a second surface, the thermally conductive substrate faces the circuit board with the second surface, and can be pressed against the central processing unit and the at least one chip for deriving heat of the central processing unit and the at least one wafer; a cold head disposed on the first surface of the heat-conducting substrate and accommodating a chamber, wherein the chamber is provided with a cooling liquid, and the chamber is provided with a cooling liquid inlet and a cooling liquid outlet, by cooling The liquid is used to derive the heat of the thermally conductive substrate.

In one embodiment, the thermally conductive substrate can be stepped in accordance with a height difference between the central processing unit and the at least one wafer.

In an embodiment, a seal preventing leakage is provided between the liquid cooling head and the heat conducting substrate.

In one embodiment, the liquid cooling head is further driven by a water pump to drive the cooling liquid to flow from the cooling liquid inlet and the cooling liquid outlet, and continuously perform circulating cooling to quickly derive heat of the heat conductive substrate.

The thermally conductive substrate is locked to the circuit board by a plurality of screws.

The above objects and advantages of the present invention are not to be understood in detail from the detailed description and the accompanying drawings.

1‧‧‧thermal substrate

11‧‧‧ first side

12‧‧‧ second side

13‧‧‧Perforation

14‧‧‧ screws

2‧‧‧liquid cold head

21‧‧ ‧ room

22‧‧‧Cooling liquid inlet

23‧‧‧Cooling liquid outlet

24‧‧‧ screws

25‧‧‧Seal

3‧‧‧Circuit board

31‧‧‧Central processor

32‧‧‧ wafer

Figure 1 is a perspective exploded view of a conventional structure

Figure 2 is a perspective view of the creation; Figure 3 is a three-dimensional exploded view of the creation; Figure 4 is a schematic view of the assembly between the creation and the circuit board; Figure 5 is a schematic cross-sectional view of the assembly state between the creation and the circuit board.

Please refer to Figures 2 to 5, which show the liquid-cooled heat dissipation structure provided for this creation. The circuit board 3 includes a circuit board of a computer motherboard, and is provided with a central processing unit 31 (CPU) and at least one chip 32, such as a south and north bridge wafer, a display wafer, and the like. The circuit board heat dissipation structure of the present invention comprises a heat conductive substrate 1 and a liquid cooling head 2, wherein the cooling medium used in the liquid cooling head 2 is not limited to water, and the cooling water referred to below generally refers to liquid refrigerant.

As shown in FIG. 2, the heat-conductive substrate 1 is made of a metal (for example, copper) having good heat conductivity, and is formed into a single plate-like structure having a first surface 11 and a second surface 12 opposite thereto, and is provided with a plurality of The perforations 13 are used to lock the thermally conductive substrate 1 to the circuit board 3 using a plurality of screws 14. The heat-conductive substrate 1 faces the circuit board 3 with its second surface 12 as shown in FIG. 4, and is in close contact with the central processing unit 31 and the various types of wafers 32, thereby the central processing unit 31 and various types. The heat extraction of the wafer 32. In this embodiment, in order to match the height difference between the central processing unit 31 and the various types of wafers 32, the thermally conductive substrate 1 can be stepped to simultaneously abut the central processing unit 31 and various types of wafers as shown in FIG. 32.

The liquid cooling head 2 is disposed on the first surface 11 of the heat conductive substrate 1 for guiding heat of the heat conductive substrate 1. As shown in Fig. 3, the liquid cooling head 2 is recessed with a chamber 21 for accommodating cooling water, and is provided with a cooling liquid inlet 22 and a cooling liquid outlet 23 for the cooling water to enter and exit. The liquid cooling head 2 is also fixed to the heat conducting substrate 1 by screws 24 . In other embodiments, the liquid cooling head 2 and the heat conducting substrate 1 are integrally formed, and the chamber 21 is coupled to the heat conducting substrate 1 . The communication is such that the cooling water directly contacts the thermally conductive substrate 1 to derive its heat. In the embodiment, a sealing member 25 is disposed between the liquid cooling head 2 and the heat conducting substrate 1 to prevent leakage of cooling water.

With the above structure, as shown in FIG. 5, the heat-conductive substrate 1 covers and contacts the heat source that abuts the circuit board 3, including the central processing unit 31 and the various types of wafers 32, to derive the working waste heat, and to ensure stable work efficiency. Cooling water is injected into the chamber 21 from the cooling liquid inlet 22, The heat source of the heat-conducting substrate 1 is discharged through the cooling liquid outlet 23, and the new cooling water is again passed through a water pump (not shown) to drive the cooling liquid to flow from the cooling liquid inlet 22 and the cooling liquid outlet 23 to continuously circulate. Cool to quickly extract heat from the thermally conductive substrate.

The advantage of the present invention is that the heat-dissipating substrate 1 is used to contact all the heat sources of the circuit board 3, and the heat-dissipating heat of the heat-conducting substrate 1 is performed by a liquid-cooling head 2, thereby making the cost effective control possible. All of the heat sources of the circuit board 3 have the high efficiency of liquid cooling. In addition, since all the heat sources are cooled by liquid cooling, that is, replacing the conventional heat sink fin structure, the overall volume of the creation is also reduced, and the miniaturization advantage is advantageous for the space configuration in the casing.

However, the above description of the embodiments is merely illustrative of the present invention and is not intended to limit the present invention. Therefore, the replacement of equivalent elements should still be within the scope of the present invention.

In summary, it can be made clear to the skilled person that the creation can achieve the aforementioned objectives, and it has already met the requirements of the Patent Law and submitted an application according to law.

Claims (7)

A liquid-cooled heat dissipation structure is applied to an electronic device and covers a circuit board including a central processing unit and at least one chip. The heat dissipation structure includes: a heat-conducting substrate having a first surface opposite thereto a second surface, the thermally conductive substrate faces the circuit board with the second surface, and can be pressed against the central processing unit and the at least one chip for deriving heat of the central processing unit and the at least one wafer; a head disposed on the first surface of the heat-conducting substrate and accommodating a chamber, wherein the chamber is provided with a cooling liquid, and the chamber is provided with a cooling liquid inlet and a cooling liquid outlet, by the cooling The liquid is directed to the heat of the thermally conductive substrate. The liquid-cooled heat dissipation structure of claim 1, wherein the heat-conducting substrate is stepped in accordance with a height difference between the central processing unit and the at least one wafer. The liquid-cooled heat dissipation structure according to claim 1, wherein a seal for preventing leakage is provided between the liquid cooling head and the heat conductive substrate. The liquid-cooled heat dissipation structure of claim 1, wherein the thermally conductive substrate is locked to the circuit board by a plurality of screws. The liquid-cooling heat dissipation structure according to claim 1, wherein the heat-conducting substrate and the liquid-cooling head are integrally formed. The liquid-cooled heat dissipation structure according to claim 1, wherein the cooling liquid is water or a liquid refrigerant. The liquid-cooled heat dissipation structure according to claim 1, wherein the liquid cooling head drives the cooling liquid to flow from the cooling liquid inlet and the cooling liquid outlet through a water pump, and continuously performs circulating cooling to quickly derive the heat of the heat-conducting substrate. .