WO2022227620A1

WO2022227620A1 - Heat sink and electronic device

Info

Publication number: WO2022227620A1
Application number: PCT/CN2021/139041
Authority: WO
Inventors: 李晓初; 李侃; 许伟强
Original assignee: 华为技术有限公司
Priority date: 2021-04-29
Filing date: 2021-12-17
Publication date: 2022-11-03
Also published as: CN115279112A

Abstract

The present application relates to the technical field of electronics, and provides a heat sink and an electronic device. The heat sink comprises a heat dissipation plate and a heat conduction sheet. The heat dissipation plate serves as a heat dissipation body of the heat sink and is provided with a heat dissipation channel, and the heat dissipation channel may be filled with a liquid medium. The heat conduction sheet may be disposed on a first surface of the heat dissipation plate, and in addition, the heat conduction sheet may deform under the action of the liquid medium, i.e., protruding toward the side facing away from the heat dissipation plate. When the heat sink provided by the present application is used for dissipating heat of a heating device, the heat conduction sheet may be in contact with the heating device, and the heat generated by the heating device may be conducted to the heat conduction sheet. The liquid medium flows in the heat dissipation channel, such that the heat may be diffused to various positions of the heat dissipation plate, thereby achieving the effect of heat balance while the purpose of dissipating the heat of the heating device is achieved.

Description

A radiator and electronic device

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of the Chinese patent application with the application number of 202110489271.8 and the application title of "a radiator and electronic equipment" filed with the China Patent Office on April 29, 2021, the entire contents of which are incorporated into this application by reference .

technical field

The present application relates to the field of electronic technology, and in particular, to a heat sink and electronic equipment.

Background technique

With the rapid development of computer and network technology, the power consumption of servers in a unit area of a data center is increasing. This makes the cooling demand of data centers higher and higher. In addition, with the increasing power consumption of servers, reducing the energy consumption of data centers has become an important requirement for data center construction.

Liquid-cooled heat dissipation technology, because it can achieve heat dissipation through the circulation of cooling water, and water is easy to obtain and relatively cheap, so liquid-cooled radiators based on liquid-cooled heat dissipation technology have become the preferred solution for data centers and even small computer rooms.

At present, most of the liquid cooling radiators in the server are set for a single heating device. When there are multiple heating devices, the multiple liquid cooling radiators corresponding to the multiple heating devices can be connected through pipes, so as to The cooling water can be circulated among the plurality of liquid cooling radiators. However, due to the high temperature in the server, and in order for the cooling water to flow between the liquid-cooled radiators, a relatively high pressure needs to be applied to the cooling water. The pipes used to connect the liquid cooling radiators are easily broken when used in a high temperature and high pressure environment for a long time, resulting in liquid leakage and, in severe cases, damage to the components in the server.

In addition, the liquid-cooling radiator in the server is also designed with an integrated structure, that is, one liquid-cooling radiator simultaneously dissipates heat from multiple heating devices. However, since the sizes of the heating devices are often different, the liquid-cooled radiator with an integrated structure may have difficulty in ensuring the flatness of the contact surface of the liquid-cooled radiator and multiple heating devices respectively, so that it cannot meet the requirements of each heating device. cooling requirements.

SUMMARY OF THE INVENTION

The present application provides a radiator and electronic equipment to reduce the risk of liquid leakage of the radiator, improve the flatness of the contact surface between the radiator and the heating device, improve the heat dissipation performance of the radiator, and improve the heat dissipation effect of the electronic equipment.

In a first aspect of the present application, a heat sink is provided, the heat sink includes a heat dissipation plate and a heat conduction sheet. The heat dissipation plate is used as the heat dissipation main body of the radiator, and is provided with a heat dissipation channel, and a liquid medium can be filled in the heat dissipation channel. The heat-conducting sheet can be arranged on the first surface of the heat-dissipating plate. In addition, the heat-conducting sheet can protrude toward the back side of the heat-dissipating plate under the action of the liquid medium, which is beneficial to improve the reliability of the contact between the heat-conducting sheet and the heating device. . When the heat sink provided by the present application is used to dissipate heat from a heat-generating device, the heat-conducting sheet can be in contact with the heat-generating device, so that the heat generated by the heat-generating device can be conducted to the heat-conducting sheet. The flow of the liquid medium in the heat dissipation channel can dissipate heat to various positions of the heat dissipation plate, so as to achieve the purpose of dissipating heat from the heating device, and also achieve the effect of heat balance.

In a possible implementation manner of the present application, the heat dissipation plate may be an integrally formed structure. The structure reliability of the heat dissipation plate is good, and the risk of liquid leakage can be effectively reduced.

In a possible implementation manner of the present application, the thermally conductive sheet is a flexible metal sheet, so that when the thermally conductive sheet is in contact with the heating device, a certain deformation occurs with the outline of the heating device, so that the thermally conductive sheet and the heating device are better fit. In addition, the heat conducting sheet can also be in direct contact with the liquid medium, which can effectively improve the heat exchange efficiency between the heating device and the liquid medium, thereby improving the heat dissipation performance of the radiator.

In a possible implementation manner of the present application, the thermally conductive sheet may be fixed to the heat dissipation plate through a fixing portion, and the material of the fixing portion may be a shape memory alloy. The shape memory alloy has a deformation amount in the direction away from the heat-dissipating plate under the action of the liquid medium, so that the fixing part exerts a force on the heat-conducting sheet away from the first surface of the heat-dissipating plate. In this way, by adjusting the metal elements constituting the shape memory alloy, the amount of deformation that can be generated by the fixing portion can be adjusted, thereby adjusting the distance between the thermally conductive sheet and the first surface of the heat dissipation plate.

When the fixing portion is specifically provided, the fixing portion may be an annular structure arranged along the peripheral side of the heat-conducting sheet, so that the heat-conducting sheet can be reliably fixed to the heat sink.

In a second aspect of the present application, an electronic device is provided, the electronic device includes a circuit board, and the heat sink of the first aspect. Wherein, the circuit board is provided with a heating device, the radiator is fixed on the circuit board, and the heat conducting sheet is in contact with the heating device. In addition, there may be a force between the portion of the thermally conductive sheet that protrudes away from the discrete thermal plate and the heat-generating device. In this way, the reliability of the contact between the heat-conducting sheet and the heat-generating device can be improved, so that the heat generated by the heat-generating device can be stably conducted to the heat-conducting sheet. Since the heat-conducting sheet can be in direct contact with the liquid medium in the heat-dissipating plate of the radiator, the liquid medium can carry the heat conducted to the heat-conducting sheet to various positions of the heat-dissipating plate during the flow of the liquid medium in the heat-dissipating channel, so as to realize the control of the heat-generating device. for cooling purposes.

In addition, a thermal interface material layer is provided between the thermally conductive sheet and the heating element, and the thermally conductive sheet is in contact with the heating element through the thermal interface material layer. The arrangement of the thermal interface material layer can effectively reduce the thermal resistance between the thermal conductive sheet and the heating device, thereby helping to improve the heat dissipation performance. In addition, disposing a thermal interface material between the heat-conducting sheet and the heating device can also improve the flatness of the contact surface between the heat-conducting sheet and the heating device, so as to improve the reliability of the contact between the two.

There can usually be multiple heating devices on the circuit board, and the thermal conductive sheet can be used for abutting with the multiple heating devices. In a specific implementation, there may be one heat-conducting sheet, the one heat-conducting sheet covers a plurality of heating devices, and in addition, the one heat-conducting sheet can be in contact with a plurality of heat-generating devices, so as to realize heat dissipation of the plurality of heat-generating devices. The heat dissipation of a plurality of heat-generating devices is realized by one heat-conducting sheet, which can effectively simplify the structure of the heat sink.

In another possible implementation manner of the present application, there are multiple thermally conductive sheets, wherein each thermally conductive sheet can abut against at least one of the multiple heating devices. It can reduce the mutual influence of heat dissipation between different heating devices, and can effectively improve the heat dissipation efficiency of the heating devices.

Description of drawings

1 is a schematic structural diagram of a traditional radiator;

FIG. 2 is a schematic structural diagram of a heat sink provided by an embodiment of the application;

3 is an exploded view of a heat sink provided by an embodiment of the application;

FIG. 4 is a schematic structural diagram of a heat sink provided by another embodiment of the present application;

Fig. 5 is the sectional view at A-A place in Fig. 4;

Fig. 6 is a partial structure enlarged view at B in Fig. 5;

FIG. 7 is a schematic structural diagram of a heat sink provided by another embodiment of the present application;

Fig. 8 is the sectional view at the C-C place in Fig. 7;

FIG. 9 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

10 is a schematic structural diagram of an electronic device provided by another embodiment of the present application;

11 is a schematic structural diagram of an electronic device provided by another embodiment of the present application;

FIG. 12 is a schematic structural diagram of an electronic device according to another embodiment of the present application.

Description of drawings:

01-circuit board; 02-radiator; 03-pipe;

1-radiator; 101-heat dissipation plate; 1011-heat dissipation channel; 1012-first side; 1013-window; 1014-accommodating space;

102 - thermal conductive sheet; 103 - fixed part; 104 - solder joint; 2 - circuit board; 3 - heating device; 4 - screw; 5 - thermal interface material layer.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

First, the application scenarios of the radiator provided in this application are introduced. With the rapid development of current electronic equipment, there are more and more high-power devices in the electronic equipment, which makes the power consumption per unit area of the electronic equipment larger and larger, and its heat dissipation requirement is higher and higher. However, high-power devices have high heat generation, and it is difficult to meet their heat dissipation requirements only by natural heat dissipation. Therefore, additional heat dissipation devices are required to dissipate heat. In this application, the high-power device may be, but not limited to, a chip, an insulated gate bipolar transistor (IGBT), or other common high-power devices. For the convenience of description, the above-mentioned high-power device is simply referred to as a heat-generating device in this application.

Liquid-cooled heat dissipation technology can use a pump to circulate the liquid medium in the heat dissipation channel to dissipate heat. Since radiators using liquid cooling technology have the advantages of balanced heat and low noise, they are more and more used in electronic equipment to dissipate heat from heat-generating devices.

Referring to FIG. 1 , FIG. 1 is a schematic diagram of an electronic device of a conventional radiator using liquid cooling technology. In the embodiment shown in FIG. 1 , the electronic device includes a circuit board 01 and a heating device (not shown in the figure) disposed on the circuit board 01 . Wherein, there are multiple heat-generating devices, and a heat sink 02 is provided corresponding to each heat-generating device. Two adjacent radiators 02 can be communicated with each other through pipes 03, so that the liquid medium can be circulated among the plurality of radiators 02, so as to realize the heat dissipation of the plurality of heating devices.

It can be understood that, in the embodiment shown in FIG. 1 , the pipe 03 for communicating with the radiator 02 is a flexible pipe, and the flexible pipe can facilitate the layout in the electronic device. However, it is difficult to ensure the sealing of the interface of the flexible pipe for connecting with the radiator 02, which is prone to leakage of the liquid medium. In addition, the heat generation of the heating device in the electronic equipment is relatively high, and the liquid medium needs a relatively high pressure to flow between the radiators 02, which will cause the flexible pipe to be easily aged and broken when used in a high temperature and high pressure environment for a long time, resulting in Liquid leakage, in severe cases, can cause damage to components in electronic equipment.

In other application scenarios, the multiple radiators 02 may also be connected through rigid pipes, but if rigid pipes are used, there is still a risk of liquid medium leakage at the interface of the rigid pipes. In addition, since it is difficult for rigid pipes to be installed in the narrow internal space of electronic equipment, it is only suitable for electronic equipment with sufficient internal space for setting rigid pipes, and the applicable scenarios are limited.

In order to solve the problem of liquid leakage mentioned above, some electronic devices have begun to use radiators with an integrated structure. In this way, a plurality of heat-generating devices can be dissipated at the same time through one radiator, thereby reducing the arrangement of pipes and reducing the risk of liquid leakage. However, the heights of heat-generating components in electronic equipment are usually inconsistent, which makes it difficult to ensure that the heat sink of the integrated structure can reliably contact each heat-generating device, so that it is difficult to meet the heat-dissipating requirements of each heat-generating device.

The radiator provided by the present application aims to solve the problems existing in the radiator of the above-mentioned integrated structure, so as to improve the flatness of the contact surface between the radiator and the heating device, and realize the reliable contact between the radiator and the heating device, so as to realize the anti-heating effect. Effective heat dissipation of the device. In order to understand the heat sink provided by the embodiment of the present application, the specific arrangement manner of the heat sink is described in detail below with reference to the accompanying drawings.

The terms used in the following embodiments are for the purpose of describing particular embodiments only, and are not intended to be limitations of the present application. As used in the specification of this application and the appended claims, the singular expressions "a," "an," "above," "the," and "the" are intended to also include, for example, "an or Multiple" is the expression unless the context clearly dictates otherwise. It should also be understood that, in the following embodiments of the present application, "at least one" and "one or more" refer to one, two or more than two. The term "and/or", used to describe the association relationship of related objects, indicates that there can be three kinds of relationships; for example, A and/or B, can indicate: A alone exists, A and B exist at the same time, and B exists alone, A and B can be singular or plural. The character "/" generally indicates that the associated objects are an "or" relationship.

References in this specification to "one embodiment" or "some embodiments" and the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in other embodiments," etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean "one or more but not all embodiments" unless specifically emphasized otherwise. The terms "including", "including", "having" and their variants mean "including but not limited to" unless specifically emphasized otherwise.

Referring to FIG. 2 , FIG. 2 is a schematic structural diagram of a heat sink 1 according to an embodiment of the present application. The heat sink 1 includes a heat dissipation plate 101, and the heat dissipation plate 101 can be made of, but not limited to, a metal material or a non-metal material with good thermal conductivity. A heat dissipation channel 1011 is provided in the heat dissipation plate 101, and the heat dissipation channel 1011 may be filled with a liquid medium. In FIG. 2, the flow direction of the liquid medium is indicated by a dashed line with an arrow. In this application, the liquid medium can be, but is not limited to, kerosene, water or other common fluid medium. In addition, it is worth mentioning that FIG. 2 only shows a possible flow direction of the liquid medium, which can also flow in the opposite direction to the direction shown in FIG. 2 , which is not specifically limited in this application. .

As shown in FIG. 2 , in the present application, the heat dissipation plate 101 may be an integrally formed structure. The heat dissipation plate 101 designed with an integral molding structure can effectively reduce the risk of liquid leakage of the radiator 1 . In addition, in addition to the above structure, the heat dissipation plate 101 may also include a liquid inlet and a liquid outlet. The liquid medium can enter the heat dissipation channel 1011 of the heat dissipation plate 101 through the liquid inlet, and can be discharged from the heat dissipation plate 101 through the liquid outlet. .

Referring to FIG. 2, the heat sink 1 of the present application may further include a heat-conducting sheet 102. The heat-conducting sheet 102 is disposed on the first surface 1012 of the heat-dissipating plate 101. The heat-conducting sheet 102 can be used to contact the heating device and absorb the heat generated by the heating device. . The thermally conductive sheet 102 may be a sheet-like structure made of a metal material or a non-metallic material with good thermal conductivity. Exemplarily, the thermally conductive sheet 102 is a flexible metal sheet. In a possible embodiment of the present application, the material of the heat-conducting sheet 102 may be the same as the material of the heat-dissipating plate 101 . In addition, the shape of the heat-conducting sheet 102 is not limited to the rectangle shown in FIG. 2 , and may also be other possible regular shapes such as circles and triangles, and may also be some irregular shapes, which can be specifically determined according to the layout of the heating device to be dissipated. Make settings.

Referring to FIG. 3 , FIG. 3 is an exploded view of a heat sink 1 according to an embodiment of the present application. In the present application, the thermally conductive sheet 102 may be in direct contact with the liquid medium. In specific implementation, as shown in FIG. 3 , before the heat-conducting sheet 102 and the heat-dissipating plate 101 are assembled, the first surface 1012 of the heat-dissipating plate 101 may be provided with a window 1013 . exposed. The heat-conducting sheet 102 can be fixed to the heat sink 101 along the arrow direction shown in FIG. 3 , so that the heat-conducting sheet 102 blocks the windows 1013 on the heat sink 101 , thereby forming a sealed heat sink 1 .

Referring to FIG. 4 , FIG. 4 shows a schematic structural diagram of a heat sink 1 according to an embodiment. 3 and 4 together, in the present application, after the heat-conducting sheet 102 seals the openings 1013 of the heat-dissipating plate 101, the heat-conducting sheet 102 can be in direct contact with the liquid medium in the heat-dissipating channel 1011 of the heat-dissipating plate 101 . In addition, in the present application, the thickness of the thermally conductive sheet 102 can also be made much smaller than the thickness of the heat dissipation plate 101 . By setting the thickness of the heat-conducting sheet 102 to be small, the heat-conducting sheet 102 can be deformed in a direction away from the heat dissipation plate 101 under the action of the pressure and temperature of the liquid medium.

With the heat sink 1 provided in the present application, the heat-conducting sheet 102 can be in contact with the heat-generating device to be dissipated, and can conduct the absorbed heat generated by the heat-generating device to the liquid medium. The heat spreads to various positions of the heat dissipation plate 101 along with the flow of the liquid medium in the heat dissipation channel 1011 , so as to achieve the purpose of dissipating heat from the heating device and achieve the effect of heat balance.

In an embodiment of the present application, in order to enable the thermally conductive sheet 102 to be sealed on the opening 1013 of the heat dissipation plate 101 , at least part of the thermally conductive sheet 102 may be located in the opening 1013 . For specific implementation, please refer to FIG. 5 , which is a cross-sectional view of the heat sink 1 in FIG. 4 at A-A. In addition, the thermal conductive sheet 102 and the heat dissipation plate 101 may be fixed by, but not limited to, welding or bonding. Referring to FIG. 6 , FIG. 6 is an enlarged view of a partial structure at B in FIG. 5 . In the embodiment shown in FIG. 6 , the heat-conducting sheet 102 and the heat-dissipating plate 101 are welded through the welding point 104 . It can be understood that the solder joints 104 are continuously arranged along the edge of the heat-conducting sheet 102 to improve the reliability of the connection between the heat-conducting sheet 102 and the heat dissipation plate 101 and reduce the problem of liquid leakage of the heat sink 1 .

6 , after the heat-conducting sheet 102 seals the openings 1013 of the heat-dissipating plate 101 , an accommodation space 1014 may be formed between the heat-conducting sheet 102 and the heat-dissipating plate 101 . It can be known from the description of the above embodiments that the thermal conductive sheet 102 can be in contact with the liquid medium, and the liquid medium can be accommodated in the accommodating space 1014 .

Referring to FIG. 7 , FIG. 7 is a schematic structural diagram of a heat sink 1 provided by another embodiment of the present application. In this embodiment of the present application, the thermal conductive sheet 102 is fixed to the heat dissipation plate 101 through the fixing portion 103 . The fixing portion 103 may be an annular structure disposed along the peripheral side of the thermally conductive sheet 102 to achieve reliable connection between the thermally conductive sheet 102 and the heat dissipation plate 101 . It is worth mentioning that, in this application, the ring structure is not only the rectangular ring structure shown in FIG. 7 , but also a ring structure with a regular shape such as a circular ring structure, or other possible ring structures with irregular shapes. The structure can be specifically set according to the edge shape of the thermally conductive sheet 102 . It can be understood from the above description of the connection method between the thermally conductive sheet 102 and the heat dissipation plate 101 , the fixing portion 103 can also be fixed to the heat dissipation plate 101 by welding or bonding, but not limited to.

In a possible embodiment of the present application, the fixing portion 103 may be made of a shape memory alloy. Shape memory alloy (SMA) is a material composed of two or more metal elements with shape memory effect (SME) through thermoelasticity and martensitic transformation and its inversion.

When the heat-conducting sheet 102 is fixed to the heat-dissipating plate 101 by the fixing portion 103 made of memory alloy, the height of the fixing portion 103 above the first surface 1012 of the heat-dissipating plate 101 before the radiator 1 passes the liquid medium is denoted as L1, In this application, the height L1 is described as the initial height of the fixing portion 103 . When the liquid medium is passed into the radiator 1 , the fixed portion 103 may be deformed in the direction away from the heat dissipation plate 101 under the action of the pressure and temperature of the liquid medium. The height of the surface 1012 is denoted as L2, and in the present application, the height L2 is denoted as the height after deformation of the fixing portion 103, where L1<L2.

Referring to FIG. 8 , FIG. 8 is a cross-sectional view at C-C in FIG. 7 . FIG. 8 shows the structural arrangement of the heat sink 1 when the fixing portion 103 is deformed. It can be understood that when the fixing portion 103 is deformed, it can exert a force on the thermally conductive sheet 102 along the back discrete thermal plate 101, thereby driving the thermally conductive sheet 102 to move toward the back discrete thermal plate 101 together, so that the thermally conductive sheet 102 and The distance between the first surfaces 1012 of the heat dissipation plate 101 is relatively large.

It can be known from the above definition of shape memory alloy that in the present application, the amount of deformation that can be generated by the fixing portion 103 can be adjusted by adjusting the metal elements constituting the shape memory alloy. It is worth mentioning that after the fixed portion 103 is deformed, even if the liquid medium in the radiator 1 is evacuated, or the type, temperature or pressure of the liquid medium is changed, the fixed portion 103 will not be restored to the original height, but is maintained at the deformation height. Therefore, the heat sink 1 provided in this embodiment of the present application can adjust the deformation amount that the fixing portion 103 can generate, so that it can meet the heat dissipation requirements of the heating device 3 of the electronic device in various scenarios, thereby expanding the Applicable scene of radiator 1.

After understanding the radiator 1 provided in the present application, the specific arrangement of the radiator 1 used in the electronic device and the realization of the heat dissipation of the heating device 3 by the radiator 1 are introduced next.

Referring to FIG. 9 , FIG. 9 provides an electronic device according to a possible embodiment of the present application, and the electronic device may be, but not limited to, a cabinet or a server. The electronic device may include a circuit board 2, which may be, but is not limited to, a printed circuit board (PCB).

9, the electronic device may also include a heating device 3 disposed on the circuit board 2, the heating device 3 may be, but not limited to, a central processing unit (central processing unit, CPU), artificial intelligence (artificial intelligence, AI), System on chip (SoC), and other high-power chips that require separate heat dissipation, or IGBTs, etc.

The radiator 1 provided in any of the above embodiments can be disposed on the side of the heating device 3 away from the circuit board 2, and the radiator 1 is fixedly connected to the circuit board 2, and the connection method can be but not limited to screw connection. In the embodiment shown in FIG. 9 , the heat sink 1 is fixed to the circuit board 2 by screws 4 .

In order to realize the heat dissipation of the heat sink 1 to the heat generating device 3 , the heat conducting sheet 102 of the heat sink 1 can be in contact with the heat generating device 3 . In this application, the abutment between the heat-conducting sheet 102 and the heating device 3 refers to the contact between the two, and there is a certain force, so as to ensure the effective contact between the two, so that the heat generated by the heating device 3 can be stably conducted to the Thermally conductive sheet 102 . It is worth mentioning that the thermal conductive sheet 102 and the heating device 3 may be in direct contact, or other structures may be provided on the thermal conductive sheet 102 and the heating device 3 to achieve indirect contact between the two.

9 , a thermal interface material (thermal interface material, TIM) layer may also be provided between the thermally conductive sheet 102 and the heating device 3, and the thermally conductive sheet 102 is in contact with the heating device 3 through the thermal interface material 5. The thermal interface material layer 5 may be provided between the thermally conductive sheet 102 and the heating device 3 by, but not limited to, coating, so as to reduce the contact thermal resistance between the two, thereby improving the heat dissipation performance. In addition, by disposing the thermal interface material layer 5 between the thermally conductive sheet 102 and the heating device 3, the flatness of the contact surface between the thermally conductive sheet 102 and the heating device 3 can also be improved, so as to improve the reliability of their contact.

In the embodiment shown in FIG. 9 , the heat-conducting sheet 102 is fixed to the heat dissipation plate 101 through the fixing portion 103 . In this embodiment, the distance between the heat-conducting sheet 102 and the first surface 1012 of the heat dissipation plate 101 is large, so The thermally conductive sheet 102 is disposed closer to the heat-generating device 3 , which facilitates the contact between the thermally-conductive sheet 102 and the heat-generating device 3 . As can be seen from FIG. 9 , when the height of the heating device 3 is higher than the circuit board 2 , since the thermal conductive sheet 102 is a thin sheet structure, when the thermal conductive sheet 102 is in contact with the heating device 3 , the thermal conductive sheet 102 can be deformed to a certain extent. . In this way, the flatness of the contact surface between the heat-conducting sheet 102 and the heating device 3 can be improved, and the stable contact between the heat-conducting sheet 102 and the heating device 3 can be achieved, and the damage of the radiator 1 can be avoided, which is beneficial to improve the heat dissipation. Structural stability of device 1.

In addition, reference may be made to FIG. 10 , which is a schematic structural diagram of an electronic device according to another possible embodiment of the present application. In this embodiment, the thermally conductive sheet 102 is directly fixed to the heat dissipation plate 101 . Since the thermally conductive sheet 102 may have a thin sheet structure, the thermally conductive sheet 102 may be deformed to protrude toward the side facing away from the heat dissipation plate 101 under the action of the liquid medium. It can be understood that there may be a force between the portion of the thermally conductive sheet 102 that protrudes away from the discrete heat plate 101 and the heating device 3 to achieve reliable contact between the thermally conductive sheet 102 and the heating device 3 , thereby improving heat dissipation performance.

In the embodiments shown in FIGS. 9 and 10 , the heat sink 1 can be used to dissipate heat from a heat generating device 3 . However, a plurality of heat-generating devices 3 are usually disposed on the circuit board 2 of an electronic device at the same time, and the heat sink 1 provided in the present application can dissipate heat from the plurality of heat-generating devices 3 at the same time. For specific implementation, reference may be made to FIG. 11 , which is a schematic structural diagram of an electronic device provided by a possible embodiment of the present application. In this embodiment, a plurality of thermally conductive sheets 102 may be disposed on the heat dissipation plate 101 , wherein each thermally conductive sheet 102 may be in contact with at least one heating device 3 . Exemplarily, referring to FIG. 11 , each heat-conducting sheet 102 can be in contact with one heat-generating device 3, so that separate heat dissipation can be achieved for each heat-generating device 3, which can avoid the mutual influence of heat dissipation among the heat-generating devices 3, so that the heat dissipation between the heat-generating devices 3 can be avoided. The heat dissipation efficiency of the heating device 3 is effectively improved. In addition, since the heights of the plurality of heat generating devices 3 may be different. Exemplarily, in the embodiment shown in FIG. 11 , the heights of the two heating devices 3 are different, but since the thermal conductive sheet 102 can be a thin sheet structure, it can deform adaptively when it is in contact with the heating device 3 . Therefore, the effective area of the heat-conducting sheet 102 in contact with the heating device 3 can be larger, so as to improve the efficiency of heat exchange between the two.

Continuing to refer to FIG. 11 , in this embodiment of the present application, according to the specific arrangement of the heating device 3 , the location of the thermally conductive sheet 102 on the heat dissipation plate 101 , and the area of the thermally conductive sheet 102 or the area protruding from the heat dissipation plate 101 can be determined. The height of the first surface 1012 is set, so that the arrangement of the thermally conductive sheet 102 on the heat dissipation plate 101 is more flexible. In addition, since each heat-conducting sheet 102 can be set according to its corresponding heating device 3 , its area can be set smaller, which is beneficial to improve the structural reliability of the heat sink 1 .

When the heat generation of the heat-generating devices 3 arranged close to each other is similar, each heat-conducting sheet 102 can also be in contact with two or more heat-generating devices 3 that are close to each other, which can reduce the amount of heat generated by the heat-conducting sheets 102 on the heat dissipation plate 101. The number is set so as to simplify the processing process of the heat sink 1 .

11, in the embodiment of the present application, the projection of the heating device 3 on the heat dissipation plate 101 can also be made to fall within the contour range of the thermal conductive sheet 102 in contact with it, so as to help increase the thermal conductivity of the thermal conductive sheet 102 and heat generation. Contact area between devices 3, thereby improving heat dissipation performance.

Referring to Figure 12, Figure 12 illustrates another possible embodiment of an electronic device. In this embodiment, the heat sink 1 is provided with a heat-conducting sheet 102, and the heat-conducting sheet 102 covers a plurality of heat-generating devices 3. In addition, the heat-conducting sheet 102 can be in contact with a plurality of heat-generating devices 3, so as to realize the Heat dissipation of the heating device 3 . The heat dissipation of the plurality of heating devices 3 is realized by one heat conducting sheet 102 , which can effectively simplify the structure of the heat sink 1 .

In addition, the projections of the plurality of heating devices 3 on the heat dissipation plate 101 may all be located within the contour range of the thermally conductive sheet 102 , so as to increase the contact area between the heating devices 3 and the thermally conductive sheet 102 and improve the heat dissipation performance.

It can be understood that, in the embodiments shown in FIG. 11 and FIG. 12 , the heat conducting sheet 102 is fixed to the heat dissipation plate 101 through the fixing portion 103 . When the heat-conducting sheet 102 is directly fixed on the heat dissipation plate 101 and the heat sink 1 is used to dissipate heat from the plurality of heat-generating devices 3, the corresponding relationship between the heat-conducting sheet 102 and the heat-generating devices 3 can be set with reference to the above-mentioned embodiment. This is not repeated here.

In the electronic device provided by the present application, the heat generated by the heating device 3 can be conducted to the thermally conductive sheet 102 . Since the heat-conducting sheet 102 can be in direct contact with the liquid medium in the heat-dissipating plate 101 of the radiator 1 , the liquid medium can bring the heat conducted to the heat-conducting sheet 102 to various positions of the heat-dissipating plate 101 during the flow of the liquid medium in the heat-dissipating channel 1011 . , so as to achieve the purpose of dissipating heat to the heating device 3 .

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, and should cover within the scope of protection of this application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

A radiator is characterized by comprising a heat dissipation plate and a heat conducting sheet, wherein:

The heat dissipation plate has a heat dissipation channel, and the heat dissipation channel can be filled with a liquid medium;

The heat-conducting sheet is fixed on the first surface of the heat-dissipating plate, and the heat-conducting sheet has a deformation amount that protrudes away from the heat-dissipating plate under the action of the liquid medium.
The heat sink according to claim 1, wherein the thermally conductive sheet is a flexible metal sheet, and the thermally conductive sheet is in direct contact with the liquid medium.
The heat sink according to claim 1 or 2, wherein the heat conducting sheet is fixed to the heat dissipation plate through a fixing part, and the material of the fixing part is a shape memory alloy.
The radiator according to claim 3, wherein the shape memory alloy has a deformation amount in a direction away from the heat dissipation plate under the action of the liquid medium, so as to impose a direction away from the first heat dissipation sheet on the thermal conductive sheet. force on one side.
The heat sink according to claim 3 or 4, wherein the fixing portion is an annular structure arranged along the peripheral side of the thermally conductive sheet.
The heat sink according to any one of claims 1 to 5, characterized in that, the heat dissipation plate is an integral molding structure.
An electronic device, characterized by comprising a circuit board, and the radiator according to any one of claims 1 to 6, wherein the circuit board is provided with a heating device, and the radiator is fixed to the circuit board , the heat-conducting sheet is in contact with the heat-generating device, and the heat-conducting sheet has a force between the protruding part away from the heat dissipation plate and the heat-generating device.
The electronic device according to claim 7, wherein the thermal conductive sheet is in contact with the heating device, specifically comprising: a thermal interface material layer is provided between the thermal conductive sheet and the heating device, the The thermally conductive sheet is in contact with the heating device through the thermal interface material layer.
The electronic device according to claim 7 or 8, characterized in that, there are a plurality of the heat generating devices, and the heat conducting sheet is in contact with the plurality of the heat generating devices.
The electronic device according to claim 9, wherein there is one heat conducting sheet, and one heat conducting sheet covers a plurality of the heating devices.
The electronic device according to claim 9, wherein there are a plurality of the heat-conducting sheets, wherein each of the heat-conducting sheets is in contact with at least one of the heat-generating devices among the plurality of heat-generating devices.