1323151 九、發明說明： . 【發明所屬之技術領域】 .·, 纟發明涉及—種液冷散熱系統及其吸熱元件，特別传 、.指-種用於冷卻電子元件之液冷散熱系統及其吸熱元件。'、 •【先前技術】 隨著電子產業之迅速發展，電腦中電子元件之 ^大幅度提高’其產生之熱量亦隨之劇增，如何將電；元 件之熱量散發出去，以保證其正常運行， 解決之問題。眾所週知，安穿在主撼刼μ 宁菜者义兩 雷俨备& , 女裝在主機板上之中央處理器係 =糸、.4之核心，當電腦運行時，中央處理器產生 ==致I:，無法正常運行。為⑽發 中產生之熱量，通常在電路板之令 去。加裝—散熱裝置以便將其產生之熱量散發出 籲目前較常用之散熱裝置係風冷式散熱 處理器上覆蓋散熱片，散埶片妯祖策ρ在甲央 良^ 放…片材科選用銅或鋁等熱傳導性 f ，二增加散熱面積，散熱片往往較多。隨著中 .央處理器發埶量之燁鉍，« 鯰者r •大·惟，〜、丨 用之散熱片之體積亦逐漸增 大，准’叉到可利用空間、 能無法獲得突破性提高。 ”之限制’其散熱性 流動式散熱裝置，其原理係利用液體之循環 -# .、处理杰等熱源產生之熱量轉移到散熱片等散熱 …里散發18所不為一種典型液冷式散熱 裝置70其大致包括一驅動泵72、與中央處理器73接觸之 .吸熱元件74、一散熱器76及複數管件78，該等管件π將驅 •動泵72、吸熱元件74及散熱器乃依次連接，從而形成一封 ••閉之液體循環路徑。使用時，吸熱元件74吸收中央處理器 73產生之熱量，並將其内之液體加熱；被加熱之液體在驅 動栗72作用下沿管件78流向散熱器76，並將吸收之熱量傳 遞給散熱器76;最後，散熱器76將熱量散發到周圍環境中 籲去，如此往復循環，即可實現對中央處理器乃降溫之目的。 ”風冷式政熱裝置相比，該液冷式散熱裝置％之主要 優點包括：1)均溫性··由於液體，如水等具有較大之比熱容， 水能夠吸收大量熱量而保持溫度無明顯變化，突發之操作 都不會引起中央處理器73等之溫度瞬間大幅度變^匕，故更 有利於令央處理器73之穩定工作；2) #音較小：由於液冷 式散熱裝置70之散熱器76之表面積很大，所以只需要低轉 速風扇對其散熱就能起到很好之散熱效果；此外，驅動泵 春72之工作噪音—般亦不會很明顯，這樣液冷式散熱裝置％ 與風冷式散熱系統相比就安靜很多。 准，液冷式散熱裝置7〇亦存在一些不足，其中，最主 -要之問題係管件78與其他元件之連接處所發生之處茂漏問 題:從圖8可見，管件78與其他元件之間共有六個連接處， 換言之’液體在該液冷式散熱裝置7〇中循環流動過程中， 至少容易在該六個連接處產线漏。再者，與中央處理器 73接觸之吸熱元件74上設有兩個管件連接處，這增大了令 央處理器73由於液體洩漏而造成損毁之可能性。 叫3151 如上所述’液冷式散熱裝置具有良好之散熱性能，惟， 液冷式散熱裝置之洩漏問題亦阻礙或限制了液冷式散熱裝 置之廣泛應用。由此，如何降低液冷式散熱裝置中液體洩 漏之可能性成為業界需要解決之一個課題。 【發明内容】 有鑒於此，有必要提供一種液冷散熱系統及其吸熱元 件，這種液冷散熱系統及其吸熱元件可以降低液體洩漏之 φ可能性。 一種液冷散熱系統之吸熱元件，該吸熱元件包括：一 基板，蓋板，該蓋板罩設於該基板上；一腔室，該腔室 密封於該基板和該蓋板之間；一出口結構；及一入口結構； :中：該出口結構和該入口結構設於蓋板上並分別與該腔 至連通，該出口結構和入口結構兩者中之一 内，且兩者之間具有間隙。 於另1323151 IX. Invention description: [Technical field to which the invention belongs] . The invention relates to a liquid cooling system and a heat absorbing element thereof, and particularly to a liquid cooling system for cooling electronic components and Heat absorbing element. ', • [Prior Art] With the rapid development of the electronics industry, the electronic components in the computer have been greatly improved. The heat generated by it has also increased dramatically. How to heat the components; the heat of the components is dissipated to ensure their normal operation. , solve the problem. As we all know, the wearer wears the main 撼刼μ宁菜者义二雷俨备&, the central processor of the women's board on the motherboard = 糸, .4 core, when the computer is running, the central processor produces == I: I can't run normally. The heat generated in (10) is usually ordered on the board. Adding a heat sink to dissipate the heat generated by it. At present, the more commonly used heat sink is an air-cooled heat sink that covers the heat sink. The thermal conductivity f such as copper or aluminum increases the heat dissipation area, and the heat sink is often more. With the 埶 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 央 央 央 央 央 央 央 央 央improve. "The limitation" is the heat-dissipating flow-type heat-dissipating device. The principle is to use the circulation of the liquid-#., the heat generated by the heat source such as Jiejie is transferred to the heat sink, etc., and the 18 is not a typical liquid-cooled heat sink. 70 generally includes a drive pump 72, a heat absorbing element 74, a heat sink 76 and a plurality of tube members 78 in contact with the central processing unit 73. The tube members π connect the drive pump 72, the heat absorbing member 74 and the heat sink in sequence. , thereby forming a liquid circulation path of the closed liquid. In use, the heat absorbing element 74 absorbs the heat generated by the central processing unit 73 and heats the liquid therein; the heated liquid flows along the tube member 78 under the action of the driving pump 72 The heat sink 76 transmits the absorbed heat to the heat sink 76. Finally, the heat sink 76 dissipates the heat to the surrounding environment, so that the cycle is reciprocated, thereby achieving the purpose of cooling the central processing unit. Compared with the thermal device, the main advantages of the liquid-cooled heat sink include: 1) temperature uniformity. · Because liquid, such as water, has a large specific heat capacity, water can absorb a large amount of heat and maintain temperature. There is no obvious change, and the sudden operation will not cause the temperature of the central processing unit 73 and the like to change greatly in an instant, so that it is more favorable for the stable operation of the central processing unit 73; 2) #音 is smaller: due to liquid cooling The surface area of the heat sink 76 of the heat sink 70 is large, so that only a low-speed fan is required to dissipate heat to achieve a good heat dissipation effect; in addition, the working noise of the drive pump spring 72 is generally not obvious, such a liquid The cold heat sink % is much quieter than the air-cooled heat sink system. Quasi-liquid-cooled heat sinks 7〇 also have some shortcomings, among which the most important problem is the leakage of the joint between the pipe fittings 78 and other components: as can be seen from Figure 8, between the pipe fittings 78 and other components There are a total of six joints, in other words, during the circulation of the liquid in the liquid-cooled heat sink 7〇, it is easy to at least leak the line at the six joints. Furthermore, the heat absorbing element 74 in contact with the central processing unit 73 is provided with two tube joints, which increases the likelihood that the processor 73 will be damaged by liquid leakage. Called 3151 as described above, the liquid-cooled heat sink has good heat dissipation performance. However, the leakage of the liquid-cooled heat sink also hinders or limits the wide application of the liquid-cooled heat sink. Therefore, how to reduce the possibility of liquid leakage in the liquid-cooled heat sink has become a problem to be solved in the industry. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a liquid cooling heat dissipating system and a heat absorbing member thereof, and the liquid cooling heat dissipating system and the heat absorbing member thereof can reduce the possibility of liquid leakage. A heat absorbing element of a liquid cooling heat dissipating system, the heat absorbing element comprising: a substrate, a cover plate, the cover plate is disposed on the substrate; a chamber sealed between the substrate and the cover plate; an outlet a structure; and an inlet structure; the middle: the outlet structure and the inlet structure are disposed on the cover plate and are respectively in communication with the cavity, and one of the outlet structure and the inlet structure, with a gap therebetween . Another
一種液冷散熱系統，包括：一吸熱元件，包括一密封 之腔室及與該腔室連通之—人口結構和-出π結構，豆中 該出口結構和人口結料者中之—被另—個包圍；一驅動 泵’=動系之人口和出σ分別與吸熱元件之出口結構和 入口、，·。構連通而形成供液體循環之通路；及—散熱 該散熱元件設於上述通路上。 …、 與習知技術相比 結構和入口結構之— 之出口結構和入口社 ，該液冷散熱系統之吸熱元件之出口 位於兩者中之另一㈣’該吸熱元件 構與管件連接所形成之兩個管件連接 8 1323151 處中’只有-個管件連接處之$漏會影響發熱元件，故該 .吸熱元件可以降低液體洩漏之可能性。 •【實施方式】 • 圖1揭不—種液冷散熱系統，該液冷散熱系統大體上包 .括一散熱元件1、一吸熱元件5、設於散熱元件i内之一驅動 果23(圖6中所示）、將吸熱元件5與散熱元件i連接之一第 一管體62及一第二管體^(圖玉中虛線所示），其中，該第 φ二管體64位於第一管體62内。 其中，該吸熱元件5與發熱元件，如中央處理器（圖中 未示）等緊密接觸，以便及時將中央處理器所產生之熱量 吸收並轉移給其内之液體。吸熱元件5之結構對液冷散熱系 ，’先之政熱性π有重要影響，故，以下將首先針對吸熱元件5 之具體結構進行闡述。 如圖2至圖5所示，吸熱元件5大體上包括一基板52及一 鲁蓋板54，該蓋板54直接罩設於該基板52上，進而在兩者之 間形成一密封之腔室。 • 該基板52之底部與中央處理器接觸，以便吸收中央處 理器所產生之熱量。為降低基板52與中央處理器之間之熱 阻，可以將基板5 2之底部設計成平板狀，以令基板$ 2與中 央處理器直接接觸。此外，根據設計需要，亦可以在基板 52與中央處理器之間塗覆一層導熱膠，以消除由於間隙等 所引起之熱阻。 該基板52之上部設有一矩形密封槽524，該密封槽524 9 1323151 沿基板52之周緣設置，用以安裝矩形密封圈56 (根據設計 需要，可以選取不同之密封圈，如〇形密封圈等）。另外， 在基板52之四角分別設有一穿孔526，該等穿孔526環繞該 ;密封槽524排佈。四個螺釘58自下向上穿過基板52上對應之 穿孔526後可與蓋板54螺合，從而將基板52固定在蓋板54 該蓋板54包括自其四邊垂直向下彎折形成之四個側壁 541 ’而且，當把蓋板54放置於基板52上時，該蓋板54之四 個侧壁541環設於基板52之外緣，並與基板52之外緣緊密接 觸0 在本實施例中，蓋板54上與基板52相接一側設有一内 凹部542,並在内凹部542内形成一内凹空間543。蓋板“上 另設有一矩形密封槽544，該密封槽544環繞内凹部542設置 並與基板52上之密封槽524相對應。在蓋板54之四角分別設 有一螺孔545，該等螺孔545分佈于蓋板54上之密封槽5料與 •蓋板54之邊緣之間，並與基板52上之四個穿孔526分別對 應，以便利用螺釘58將蓋板54與基板52組合形成上述吸熱 ；元件5。下面對蓋板54與基板52之組合過程作一簡要說明”。、 ' 首先，將蓋板54放置在基板52上使蓋板54之侧壁541環 繞基板52之外緣（如圖3中所示），並令密封圈％同時容納於 基板52及蓋板54上之密封槽524，544内。在此過程中，蓋 板54之側壁541起到導軌作用’把基板52導人蓋板“内並使 基板52上之穿孔526與蓋板54上相應之螺孔545迅速對準， 這有利於組裝，節省時間。 1323151 然後’令螺釘58自下向上穿過基板52上之穿孔526，並 螺合于蓋板54上對應之螺孔545内。在此過程中，密封圈56 受擠壓而產生變形，從而將内凹空間543密封。如此，蓋板 54和基板52共同組合成上述吸熱元件5。A liquid cooling heat dissipating system comprising: a heat absorbing element comprising a sealed chamber and communicating with the chamber - a population structure and a π structure, the outlet structure of the bean and the population of the population - being additionally Surrounded by; a drive pump '= the population of the dynamic system and the output σ and the outlet structure and inlet of the heat absorbing element, respectively. Connected to form a passage for liquid circulation; and - heat dissipation The heat dissipating member is disposed on the passage. ...the outlet structure and the inlet structure of the structure and the inlet structure compared with the prior art, the outlet of the heat absorbing element of the liquid cooling system is located at the other of the two (four) 'the heat absorbing element is connected with the pipe member The connection between the two pipe fittings 8 1323151 'only - the junction of the pipe fittings affects the heating element, so the heat absorbing element can reduce the possibility of liquid leakage. • [Embodiment] • Figure 1 reveals a liquid cooling system, the liquid cooling system generally includes a heat dissipating component 1, a heat absorbing component 5, and a driving component 23 disposed in the heat dissipating component i (Fig. 6), connecting the heat absorbing element 5 and the heat dissipating component i to the first pipe body 62 and the second pipe body (shown by a broken line in FIG. j), wherein the φ2nd pipe body 64 is located at the first Inside the tube 62. The heat absorbing element 5 is in close contact with a heat generating component such as a central processing unit (not shown) to absorb and transfer the heat generated by the central processing unit to the liquid therein. The structure of the heat absorbing element 5 has an important influence on the liquid-cooling heat-dissipating system, which is first described with respect to the specific structure of the heat-absorbing element 5. As shown in FIG. 2 to FIG. 5, the heat absorbing element 5 generally includes a substrate 52 and a slab cover 54. The cover plate 54 is directly disposed on the substrate 52 to form a sealed chamber therebetween. . • The bottom of the substrate 52 is in contact with the central processor to absorb the heat generated by the central processor. To reduce the thermal resistance between the substrate 52 and the central processing unit, the bottom of the substrate 52 can be designed as a flat plate to allow the substrate $2 to be in direct contact with the central processor. In addition, a layer of thermal paste may be applied between the substrate 52 and the central processing unit according to design requirements to eliminate thermal resistance caused by gaps and the like. A rectangular sealing groove 524 is disposed on the upper portion of the substrate 52. The sealing groove 524 9 1323151 is disposed along the periphery of the substrate 52 for mounting the rectangular sealing ring 56. (Depending on the design, different sealing rings, such as a 密封-shaped sealing ring, etc., may be selected. ). In addition, a plurality of through holes 526 are formed in the four corners of the substrate 52, and the through holes 526 are surrounded by the sealing grooves 524. The four screws 58 can be screwed into the cover plate 54 from the bottom through the corresponding through holes 526 on the substrate 52, thereby fixing the substrate 52 to the cover plate 54. The cover plate 54 is formed by bending vertically downward from the four sides thereof. The side wall 541 ′′, when the cover plate 54 is placed on the substrate 52 , the four side walls 541 of the cover plate 54 are annularly disposed on the outer edge of the substrate 52 and closely contact with the outer edge of the substrate 52. In the example, an inner concave portion 542 is disposed on the side of the cover plate 54 that is in contact with the substrate 52, and a concave space 543 is formed in the inner concave portion 542. The cover plate is further provided with a rectangular sealing groove 544, which is disposed around the inner concave portion 542 and corresponds to the sealing groove 524 on the substrate 52. A screw hole 545 is respectively disposed at four corners of the cover plate 54, and the screw holes are respectively provided. 545 is distributed between the sealing groove 5 of the cover plate 54 and the edge of the cover plate 54 and corresponding to the four through holes 526 on the substrate 52, so that the cover plate 54 and the substrate 52 are combined by the screw 58 to form the above heat absorption. Element 5. A brief description of the combination process of the cover plate 54 and the substrate 52 will be given below. First, the cover 54 is placed on the substrate 52 such that the side wall 541 of the cover 54 surrounds the outer edge of the substrate 52 (as shown in FIG. 3), and the sealing ring % is simultaneously accommodated in the substrate 52 and the cover 54. The upper sealing groove 524, 544. During this process, the side wall 541 of the cover 54 acts as a guide rail to "guide the substrate 52 into the cover" and quickly align the perforations 526 on the substrate 52 with the corresponding screw holes 545 on the cover 54, which facilitates Assembly, saving time. 1323151 Then the screw 58 is passed through the through hole 526 on the base plate 52 from the bottom up and screwed into the corresponding screw hole 545 of the cover plate 54. In the process, the sealing ring 56 is pressed. The deformation is generated to seal the concave space 543. Thus, the cover plate 54 and the substrate 52 are combined to form the above-described heat absorbing element 5.
為進一步確保吸熱元件5之密封性，可在蓋板54之側壁 541與基板52之外緣之間另設一密封圈。此外，亦可通焊接 等方式使蓋板54之側壁541與基板52之外周形成一體，這樣 设计亦可以進一步提升吸熱元件5之密封之可靠性。 此外，在蓋板54上另設有可供液體流入、流出内凹空 間543之一内管547和一外管540，該内管547同軸地設置于 外管546内。内管547及外管546自蓋板54上之内凹部542向 上延伸而形成，並在兩管之間形成一環形空間。 該壞形空間通過蓋板54上位於内管547和外管之間 之四個缺：548與内凹空間543連通；而内管547通過蓋板二 上位於内管547内之—通孔549與内凹空間⑷ 之，環形空間與内管547通過該内凹空 此： 該環形空間及内管547形成兩條路 =此 為；此ς ^ ^ ^供液體流入及流出吸 .，』件〜中-條路徑作為液體流 時’則另-條路徑作為液體流出吸·，、、兀件5之途從 缺。 夂熟7^件5之途徑；反之亦 你个X把例，.,㈣玄㈣夜 板54上之缺口 548及外管％成為出及熱疋件5,故蓋 應地’内管547供液體流人吸熱&件、7^，出口結構；相 ’故蓋板54上之通孔 11 1323151 549及内管547成為吸熱元件5之入口結構。這樣佈置，液體 將沿内管547流入吸熱元件5，並直接衝擊到基板52之中心 區域，以便吸收基板52上之熱量。為提升液體與基板52之 間之熱交換效率，可提高液體流入吸熱元件5時之速度，在 本實施例中，係通過改變内管547之橫截面形狀來對液體進 行力口速。 如圖3所示，内管547之橫截面面積自其自由端向蓋板 54通孔549方向逐漸減小，通過這種橫截面面積逐漸減小之 變截面結構，可對液體進行加速。眾所週知，液體在管體 内之流量與流速之關係可通過液體連續性方程表示，如下： Q=VA (其中，Q為液體之流量；V為液體之流速；A為 管體之橫截面面積）。在液冷散熱系統中，液體之流量基本 上恒定，即VA=定值，該公式表明液體之流速與管體之橫 截面面積成反比。因此，當管體之橫截面面積逐漸減小時， 液體之流速相應地逐漸增加。 如上所述，内管547之變截面結構可對流入吸熱元件5 之液體進行加速，液體流入吸熱元件5後將以較高流速直接 衝擊到基板52上。這有利於增強液體與基板52之間之熱交 換效果，故，液體可以從基板52上吸收更多熱量，及時冷 卻與其接觸之中央處理器。液體吸收基板52上之熱量後， 將沿蓋板54上之缺口 548流出吸熱元件5，並沿第一管體62 和第二管體64之間之環形空間流向散熱元件1，並最終通過 散熱元件1將熱量散發到周圍環境中去。 12 1323151 散熱元件1通過第一管體62及第二管體64與吸熱元件5 連接，從而形成一密閉之循環迴路。散熱元件1之具體結 構，及其與吸熱元件5之具體連接關係如下文所述。 如圖6及圖7所示，該散熱元件1主要包括一底座10、一 設置在底座10之水箱體20、一與水箱體20連接並一同設置 在底座10上之散熱組件30及一通過水箱體20與底座10連通 之蓋體40。 φ 底座10包括一凹槽12、沿底座10之邊緣間隔分佈之複 數螺孔14，及設於凹槽12中間之一插座16，該插座16將凹 槽12劃分為一第一流道122及一第二流道124。蓋體40之結 構與底座10基本相同，該蓋體40上設有一凹槽42和複數之 螺孔44。 水箱體20為上、下開口之中空方盒狀體，其具有一槽 底及兩兩相對之四側壁21，水箱體20—側設有用來裝設驅 動泵23之插槽24。水箱體20上、下端四角處設有四個孔洞 籲27，以供螺釘60穿設。在水箱體20之前側壁21上之中部設 有一液體出口 25和一液體入口 26。如圖7所示，液體出口 25 - 和驅動泵23之出口連通，並同軸地設於水箱體20之液體入 口 26内。水箱體20之液體出口 25通過第二管體64與吸熱元 件5上之内管547連通；而水箱體20之液體入口 26通過第一 管體62與吸熱元件5上之外管546連通。 此外，該水箱體20内另設有一下隔板22、一上隔板29 及一對插板28，該插板28平行地設於水箱體20—側壁21之 13 1323151 中部用以將該下隔板22和上隔板29固定於水箱體20内。驅 動泵23、下隔板22及上隔板29—同將水箱體20内部劃分為 ' 三個部分，即第一通道210、第二通道230和第三通道240。 - 該第一通道210將驅動泵23之入口（圖中未示）與底座 10上之凹槽12連通；而第二通道230與蓋體40上之凹槽42連 通，並未與第一通道210直接連通。另外，第二通道230通 過設於水箱體20前側壁21上之一傾斜溝槽262而與第一管 I體62和第二管體64之間之環形空間相連通。該第三通道240 未與第一通道210和第二通道230直接連通，而通過底座10 上之凹槽12和蓋體40上之凹槽42分別與第一通道210和第 二通道230間接連通。 散熱組件30夾設在底座10與蓋體40之間並與水箱體20 連接，散熱組件30包括一散熱器31、一裝設在散熱器31 — 侧之風扇32及位於散熱器31底部與頂部之兩換熱板33， 34。換熱板33包括一平板330及自平板向下延伸之複數散熱 •鰭片（圖中未示），該平板330上另設有複數圓孔334,該 等圓孔334分別與底座10上之螺孔14相對應。換熱板34包括 一平板340及自平板340向上延伸之複數散熱鰭片342,該平 ： 板340上另設有複數圓孔344，該等圓孔344分別與蓋體40上 之螺孔44相對應。 組裝時，令螺釘60分別穿過底座10上之螺孔14和蓋體 40上之螺孔44，並分別螺合於相應之平板330上之圓孔 334、平板340上之圓孔344及水箱體20上之孔洞27内，如 此，即可將底座10、水箱體20、散熱組件30和蓋體40組合 1323151 在一起形成上述之散熱元件1。為避免洩漏，可在底座10與 換熱板33連接處、底座10與水箱體20之底部連接處分別設 有一密封圈100。與此類似，在蓋體40與換熱板34連接處、 \ 蓋體40與水箱體20之頂部連接處亦分別設有一密封圈100。 如上所述，吸熱元件5與散熱元件1可以分別預先組 裝，已經預組裝之吸熱元件5和散熱元件1通過第一管體62 和第二管體64連接，具體連接方式為：第一管體62之兩端 I分別與吸熱元件5上之外管546及水箱體20上之液體入口 26 連接；而第二管體64之兩端分別與吸熱元件5上之内管547 及水箱體20上之液體出口 25連接。如此，吸熱元件5和散熱 元件1通過第一管體62及設于第一管體62内之第二管體64 連接，形成一密閉之液體循環迴路，即形成上述之液冷散 熱系統。 該液冷散熱系統在使用過程中，液體在驅動泵23作用 下單向流動，其流動方向如圖1及圖7中之箭頭所示。液體 •之循環路徑為：首先，吸熱元件5内之液體吸收發熱元件產 生之熱量，並在驅動泵23之作用下經過吸熱元件5上之缺口 548、第一管體62和第二管體64之間之環形空間、水箱體20 ： 上之溝槽262流入第二通道230内；之後，液體經過蓋體40 上之凹槽42而流入第三通道240内，其中，當液體流過蓋體 40上之凹槽42時與蓋體40内之散熱鰭片342進行熱交換，使 液體初步冷卻；然後，液體依次流過底座10内之第二流道 124、第一流道122，在此過程中，液體與底座10内之散熱 鰭片進行熱交換，而使液體完全冷卻；接下來，被冷卻之 15 液體在驅動栗23作用下，經第—通道21()流入驅動栗23内； 最後，被冷卻之液體自驅動泵23之出口流處，依次經過水 相體20上之液體出σ25、第二管體64、内管⑷、吸熱元件 5上之通孔549而回流到吸熱元件5内，再次吸收發熱元件產 生之熱量。如此往復循環，即可實現冷卻發熱元件之目的。 另外’由於第二管體64設于第一管體62内，為避免由 於膏曲等因素而引起之第一管體62和第二管體Μ之間之環 形空間堵塞’可在第一管體62和第二管體64之間設一彈箬 66。該彈簧66可起到支撐第—管體62之作用，從而避免第 -管體62和第二管體64之間之環形空間堵塞。該彈簧的既 可以從吸熱70件5延伸至散熱元件i，亦可以僅設置在第一 管體=之-段區間内。此外，彈簧66之外徑既可以不小於 第一管體62之内徑，亦可以略小於第一管體62之内徑。 上述所述為本發明液冷散熱系統之一實施利，其與傳 統液冷式散熱裳置相比至少具有下述優點： 1) 吸熱元件5和散熱元件1都可以預先組裝，形成兩個模 組；故該液冷散熱系統結構緊湊，便於組裝、拆卸維修； 2) 吸熱元件5上之内管547與第二管體64、外管546和第 一官體62分別形成一連接處，然，由於内管547與第二管體 64之連接處設于外管546和第一管體62内，故即使内管μ? 與第二管體64之連接處發生洩漏，亦不會影響發熱元件， 如中央處理器等； 3)水箱體20上之液體入口 26和液體出口乃亦係内外 16 1323151 官没置，樣，整個系統只有兩個連接處之洩漏會影響發 熱兀件，即外管546與第一管體62之間之連接處，和水箱體 -20上之液體入口 26與第一管體62之間之連接處；而傳 液冷散熱裝置70 一般包括六個連接處，且每一連接處之茂 漏都會影響發熱元件；故，與傳統之液冷散熱裝置％相比， 本發明已明顯降低了液體茂漏之可能性，提升了系統之使 用可靠性； • 4)如圖1所示，由於第二管體64設于第一管體62内，故 只有第一管體62會佔據系統（電腦）内之空間，可減少整 個液冷散熱系統之體積，有利於簡化整個液冷系統之結構。 綜上所述，本發明符合發明專利要件，爰依法提出專 =申叫淮，以上該者僅為本發明之較佳實施例，舉凡熟 悉本案技藝之人士，在爰依本發明精神所作之等效修飾或 變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明液冷散熱系統之立體圖。 • 圖2係圖1中吸熱元件及部分管體之立體放大圖。 圖3係圖2之局部剖視圖。 圖4係圖2之立體分解圖。 圖5係圖4中之蓋板之底部朝上時之立體放大圖。 圖6係圖.1中之散熱元件之部分分解圖。 圖7係圖6中之水箱體之剖視圖。 圖8係一種典型液冷式散熱裝置之立體組合圖。 17 1323151 主要元件符號說明 散熱元件 1 底座 10 凹槽 12 ' 42 螺孔 14、44 插座 16 第一流道 122 第二流道 124 水箱體 20 側壁 21 下隔板 22 驅動果 23 插槽 24 液體出口 25 液體入口 26 孔洞 27 插板 28 上隔板 29 第一通道 210 第二通道 230 第三通道 240 溝槽 262 散熱組件 30 散熱器 31 風扇 32 換熱板 33、34 平板 330 ' 340 圓孔 334、344 散熱鰭片 342 蓋體 40 螺釘 60 密封圈 100 吸熱元件 5 基板 52 密封槽 524 穿孔 526 螺釘 58 蓋板 54 側壁 541 内凹 542 内凹空間 543 18 1323151 密封槽 544 外管 546 缺口 548 密封圈 56 第二管體 64 螺孔 545 内管 547 通孔 549 第一管體 62 彈簧 66To further ensure the tightness of the heat absorbing element 5, a seal ring may be provided between the side wall 541 of the cover plate 54 and the outer edge of the substrate 52. Further, the side wall 541 of the cover 54 may be integrally formed with the outer periphery of the substrate 52 by soldering or the like, and the design may further improve the reliability of the sealing of the heat absorbing element 5. Further, an inner tube 547 for allowing liquid to flow into and out of the inner recess 543 and an outer tube 540 are provided on the cover plate 54, and the inner tube 547 is coaxially disposed in the outer tube 546. The inner tube 547 and the outer tube 546 are formed to extend upward from the inner recess 542 of the cover plate 54, and an annular space is formed between the two tubes. The bad space communicates with the recessed space 543 through the four gaps 548 between the inner tube 547 and the outer tube of the cover plate 54; and the inner tube 547 passes through the through hole 549 of the cover tube 2 located in the inner tube 547. And the concave space (4), the annular space and the inner tube 547 pass through the inner hollow: the annular space and the inner tube 547 form two paths=this is; this ς ^ ^ ^ for liquid inflow and outflow suction, When the medium-to-strip path is used as the liquid flow, the other path is used as the liquid to flow out, and the path of the element 5 is absent. The way to familiarize with 7^5; vice versa, you have an X case, ., (4) Xuan (4) No. 548 on the night board 54 and the outer tube % become the hot and cold parts 5, so the cover should be 'inner tube 547 for The liquid is inhaled & the member, the outlet structure; the through hole 11 1323151 549 and the inner tube 547 on the cover plate 54 become the inlet structure of the heat absorbing element 5. With this arrangement, liquid will flow along the inner tube 547 into the heat absorbing element 5 and directly impinge on the central portion of the substrate 52 to absorb heat on the substrate 52. In order to increase the heat exchange efficiency between the liquid and the substrate 52, the speed at which the liquid flows into the heat absorbing member 5 can be increased. In the present embodiment, the liquid velocity is applied to the liquid by changing the cross-sectional shape of the inner tube 547. As shown in Fig. 3, the cross-sectional area of the inner tube 547 gradually decreases from the free end thereof toward the through hole 549 of the cover plate 54, and the variable cross-sectional structure in which the cross-sectional area is gradually reduced can accelerate the liquid. It is well known that the relationship between the flow rate and flow rate of a liquid in a tube can be expressed by the liquid continuity equation as follows: Q = VA (where Q is the flow rate of the liquid; V is the flow rate of the liquid; A is the cross-sectional area of the tube) . In a liquid cooling system, the flow rate of the liquid is substantially constant, i.e., VA = constant value, which indicates that the flow rate of the liquid is inversely proportional to the cross-sectional area of the tube. Therefore, as the cross-sectional area of the tube gradually decreases, the flow rate of the liquid gradually increases accordingly. As described above, the variable cross-sectional structure of the inner tube 547 accelerates the liquid flowing into the heat absorbing element 5, and the liquid flows into the heat absorbing element 5 and directly impinges on the substrate 52 at a relatively high flow rate. This facilitates the enhanced heat exchange between the liquid and the substrate 52 so that the liquid can absorb more heat from the substrate 52 and cool the central processor in contact with it in time. After the liquid absorbs the heat on the substrate 52, it will flow out of the heat absorbing element 5 along the notch 548 on the cover plate 54, and flow along the annular space between the first tube body 62 and the second tube body 64 to the heat dissipating member 1, and finally through the heat dissipation. Element 1 dissipates heat to the surrounding environment. 12 1323151 The heat dissipating component 1 is connected to the heat absorbing element 5 through the first pipe body 62 and the second pipe body 64, thereby forming a closed loop. The specific structure of the heat dissipating member 1 and its specific connection relationship with the heat absorbing member 5 are as follows. As shown in FIG. 6 and FIG. 7 , the heat dissipating component 1 mainly includes a base 10 , a water tank body 20 disposed on the base 10 , a heat dissipating component 30 connected to the water tank body 20 and disposed on the base 10 , and a water tank The cover 40 of the body 20 is in communication with the base 10. The φ base 10 includes a recess 12, a plurality of screw holes 14 spaced along the edge of the base 10, and a socket 16 disposed in the middle of the recess 12, the socket 16 dividing the recess 12 into a first flow path 122 and a Second flow path 124. The structure of the cover 40 is substantially the same as that of the base 10. The cover 40 is provided with a recess 42 and a plurality of screw holes 44. The water tank body 20 is a hollow square box-shaped body with upper and lower openings, and has a groove bottom and two opposite side walls 21, and the water tank body 20 is provided with a slot 24 for mounting the drive pump 23. Four holes 27 are provided at the four corners of the upper and lower ends of the water tank body 20 for the screws 60 to pass through. A liquid outlet 25 and a liquid inlet 26 are provided in the upper side wall 21 of the water tank body 20. As shown in Fig. 7, the liquid outlet 25 - communicates with the outlet of the drive pump 23 and is coaxially disposed within the liquid inlet 26 of the water tank body 20. The liquid outlet 25 of the water tank body 20 communicates with the inner tube 547 on the heat absorbing element 5 through the second tube body 64; and the liquid inlet 26 of the water tank body 20 communicates with the outer tube 546 of the heat absorbing element 5 through the first tube body 62. In addition, the water tank body 20 is further provided with a lower partition 22, an upper partition 29 and a pair of inserts 28, which are arranged in parallel in the middle of the water tank body 20 - the side wall 21 13 1323151 for the next The partition 22 and the upper partition 29 are fixed in the water tank body 20. The drive pump 23, the lower partition 22, and the upper partition 29 define the interior of the water tank 20 as 'three sections, i.e., the first passage 210, the second passage 230, and the third passage 240. - the first passage 210 communicates the inlet (not shown) of the drive pump 23 with the recess 12 on the base 10; and the second passage 230 communicates with the recess 42 on the cover 40, not with the first passage 210 is directly connected. Further, the second passage 230 communicates with the annular space between the first pipe body 62 and the second pipe body 64 through one of the inclined grooves 262 provided on the front side wall 21 of the water tank body 20. The third passage 240 is not in direct communication with the first passage 210 and the second passage 230, and is indirectly connected to the first passage 210 and the second passage 230 through the groove 12 on the base 10 and the groove 42 on the cover 40, respectively. . The heat dissipating component 30 is interposed between the base 10 and the cover 40 and connected to the water tank body 20. The heat dissipating component 30 includes a heat sink 31, a fan 32 mounted on the side of the heat sink 31, and a bottom and a top of the heat sink 31. The two heat exchange plates 33, 34. The heat exchange plate 33 includes a flat plate 330 and a plurality of heat dissipation fins (not shown) extending from the flat plate. The flat plate 330 is further provided with a plurality of circular holes 334 respectively formed on the base 10. The screw holes 14 correspond. The heat exchange plate 34 includes a flat plate 340 and a plurality of heat radiating fins 342 extending upward from the flat plate 340. The flat plate 340 is further provided with a plurality of circular holes 344 respectively, and the circular holes 344 and the screw holes 44 of the cover 40 respectively. Corresponding. During assembly, the screws 60 are respectively passed through the screw holes 14 in the base 10 and the screw holes 44 in the cover 40, and are respectively screwed into the circular holes 334 on the corresponding flat plate 330, the circular holes 344 on the flat plate 340, and the water tank. In the hole 27 in the body 20, the base 10, the water tank body 20, the heat dissipating component 30 and the cover 40 can be combined 1323551 to form the above-mentioned heat dissipating component 1. To avoid leakage, a seal ring 100 may be provided at the junction of the base 10 and the heat exchange plate 33, and at the bottom of the base 10 and the water tank body 20, respectively. Similarly, a sealing ring 100 is also respectively disposed at the junction of the cover 40 and the heat exchange plate 34, and the top joint of the cover 40 and the water tank 20. As described above, the heat absorbing element 5 and the heat dissipating component 1 can be pre-assembled separately, and the heat absorbing component 5 and the heat dissipating component 1 that have been pre-assembled are connected by the first pipe body 62 and the second pipe body 64, and the specific connection manner is: the first pipe body The two ends I of the 62 are respectively connected to the outer tube 546 of the heat absorbing element 5 and the liquid inlet 26 of the water tank body 20; and the two ends of the second tube body 64 are respectively connected to the inner tube 547 and the water tank body 20 on the heat absorbing element 5. The liquid outlet 25 is connected. Thus, the heat absorbing element 5 and the heat dissipating element 1 are connected by the first tube body 62 and the second tube body 64 provided in the first tube body 62 to form a closed liquid circulation circuit, that is, the above liquid cooling and heat dissipation system is formed. During the use of the liquid cooling system, the liquid flows unidirectionally under the action of the driving pump 23, and the flow direction thereof is indicated by the arrows in Figs. 1 and 7. The circulation path of the liquid is: first, the liquid in the heat absorbing element 5 absorbs the heat generated by the heat generating element, and passes through the notch 548, the first tube body 62 and the second tube body 64 on the heat absorbing element 5 under the action of the driving pump 23. Between the annular space, the water tank body 20: the upper groove 262 flows into the second passage 230; after that, the liquid flows into the third passage 240 through the groove 42 on the cover 40, wherein when the liquid flows through the cover When the groove 42 on the 40 is heat exchanged with the heat dissipation fins 342 in the cover 40, the liquid is initially cooled; then, the liquid sequentially flows through the second flow path 124 and the first flow path 122 in the base 10, in the process. The liquid exchanges heat with the heat dissipating fins in the base 10 to completely cool the liquid; then, the cooled liquid 15 flows into the driving pump 23 through the first passage 21 () under the action of the driving pump 23; The cooled liquid flows from the outlet of the driving pump 23, and sequentially passes through the liquid out of the water phase body 20, σ25, the second tube 64, the inner tube (4), the through hole 549 in the heat absorbing element 5, and flows back to the heat absorbing element 5. Inside, the heat generated by the heating element is again absorbed. By repeating the cycle, the purpose of cooling the heating element can be achieved. In addition, since the second pipe body 64 is disposed in the first pipe body 62, in order to avoid the blockage of the annular space between the first pipe body 62 and the second pipe body due to the squeaking and the like, the first pipe can be A magazine 66 is disposed between the body 62 and the second tube body 64. The spring 66 can function to support the first tubular body 62 to avoid clogging of the annular space between the first tubular body 62 and the second tubular body 64. The spring may extend from the heat absorbing member 70 to the heat dissipating member i, or may be disposed only in the first tube body. Further, the outer diameter of the spring 66 may be not less than the inner diameter of the first tubular body 62 or may be slightly smaller than the inner diameter of the first tubular body 62. The above description is one of the liquid cooling and heat dissipation systems of the present invention, which has at least the following advantages compared with the conventional liquid cooling heat dissipation device: 1) Both the heat absorbing element 5 and the heat dissipating component 1 can be pre-assembled to form two modes. The liquid cooling system is compact, easy to assemble, disassemble and repair; 2) the inner tube 547 on the heat absorbing element 5 forms a joint with the second tube 64, the outer tube 546 and the first body 62, respectively Since the connection between the inner tube 547 and the second tube body 64 is provided in the outer tube 546 and the first tube body 62, even if a leak occurs at the junction between the inner tube μ? and the second tube body 64, the heat is not affected. Components, such as a central processing unit, etc.; 3) The liquid inlet 26 and the liquid outlet on the water tank body 20 are also internal and external. 1 1323151 is not placed, so that only the leakage of the two joints in the whole system will affect the heating element, that is, outside The junction between the tube 546 and the first tube 62, and the junction between the liquid inlet 26 on the tank body 20 and the first tube 62; and the liquid transfer cooling device 70 generally includes six connections. And the leakage of each joint will affect the heating element; Compared with the liquid cooling device of the system, the invention has obviously reduced the possibility of liquid leakage and improved the reliability of the system; 4) as shown in Fig. 1, since the second pipe body 64 is set at the first In the tube body 62, only the first tube body 62 occupies the space in the system (computer), which can reduce the volume of the entire liquid cooling system, and is advantageous for simplifying the structure of the entire liquid cooling system. In summary, the present invention complies with the requirements of the invention patent, and the above is only a preferred embodiment of the present invention. The above is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention are in accordance with the spirit of the present invention. Modifications or changes shall be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a liquid cooling system of the present invention. • Fig. 2 is a perspective enlarged view of the heat absorbing element and a part of the tube body of Fig. 1. Figure 3 is a partial cross-sectional view of Figure 2. Figure 4 is an exploded perspective view of Figure 2. Figure 5 is a perspective enlarged view of the cover of Figure 4 with the bottom facing upward. Figure 6 is a partially exploded view of the heat dissipating component of Figure 1. Figure 7 is a cross-sectional view of the water tank body of Figure 6. Figure 8 is a perspective assembled view of a typical liquid cooled heat sink. 17 1323151 Main component symbol Description Heat sink element 1 Base 10 Groove 12 ' 42 Screw hole 14, 44 Socket 16 First flow path 122 Second flow path 124 Water tank body 20 Side wall 21 Lower partition 22 Drive fruit 23 Slot 24 Liquid outlet 25 Liquid inlet 26 Hole 27 Insert plate 28 Upper partition 29 First passage 210 Second passage 230 Third passage 240 Groove 262 Heat sink assembly 30 Heat sink 31 Fan 32 Heat exchanger plates 33, 34 Plate 330 ' 340 Round holes 334, 344 Heat sink fin 342 Cap 40 Screw 60 Seal 100 Heat absorbing element 5 Substrate 52 Sealing groove 524 Perforation 526 Screw 58 Cover 54 Side wall 541 Recessed 542 Recessed space 543 18 1323151 Sealing groove 544 Outer tube 546 Notch 548 Sealing ring 56 Two tube body 64 screw hole 545 inner tube 547 through hole 549 first tube body 62 spring 66
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