TWI831707B - Liquid cooling assembly and server - Google Patents

Abstract

A liquid cooling assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connection pipe and a second connection pipe. The first liquid cooling plate includes a first heat dissipation part and a second heat dissipation part. The first heat dissipation part has a first fluid chamber. The second heat dissipation part is connected to the first heat dissipation part and has a first fluid channel. The second liquid cooling plate includes a third heat dissipation part and a fourth heat dissipation part. The third heat dissipation part has a second fluid chamber. The fourth heat dissipation part is connected to the third heat dissipation part and has a second fluid channel in fluid communication with the second fluid chamber. The first connection pipe is connected to the third heat dissipation part and the first heat dissipation part so as to connect the first fluid chamber to the second fluid chamber. The second connection pipe is connected to the second heat dissipation part and the fourth heat dissipation part so as to connect the first fluid channel to the second fluid channel.

Description

Liquid cooling plate components and servers

The invention relates to a liquid cooling plate assembly and a server.

Usually, in addition to the central processing unit (hereinafter referred to as CPU), the motherboard of the server also has a voltage regulator (Voltage regulator, later referred to as VR) chip to adjust the load voltage so that the CPU can work normally. At present, most CPUs dissipate heat through cold plates, while VR chips dissipate heat through heat dissipation fins combined with passive air cooling or active air cooling. However, as the performance of VR chips increases, VR chips generate more heat. Therefore, the traditional heat dissipation fins combined with passive air cooling or active air cooling no longer meet the requirements for the heat dissipation efficiency of VR chips. Therefore, researchers in this field are currently working on solving the aforementioned problems.

The present invention provides a liquid cooling plate assembly and a server that can efficiently dissipate heat for a VR chip.

An embodiment of the present invention discloses a liquid cooling plate assembly for thermally contacting two first heat sources and a plurality of second heat sources. The liquid cooling plate assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connecting pipe and at least a second connecting pipe. The first liquid cooling plate includes a first heat dissipation part and at least a second heat dissipation part. The first heat dissipation part is used for thermal contact with one of the first heat sources and has a first fluid chamber. The second heat dissipation part is connected to the first heat dissipation part and is used to thermally contact part of the second heat source. The second heat dissipation part has a first fluid channel. The second liquid cooling plate includes a third heat dissipation part and at least a fourth heat dissipation part. The third heat dissipation part is used for thermal contact with another first heat source and has a second fluid chamber. The fourth heat dissipation part is connected to the third heat dissipation part and is used to thermally contact part of the second heat source. The fourth heat dissipation part has a second fluid channel, and the second fluid channel is connected to the second fluid chamber. The first connecting pipe is connected to the third heat dissipation part and the first heat dissipation part, so that the second fluid chamber is connected to the first fluid chamber. The second connecting pipe is connected to the fourth heat dissipation part and the second heat dissipation part, so that the second fluid channel is connected to the first fluid channel.

Another embodiment of the present invention discloses a server including a casing, a motherboard and a liquid cooling plate assembly. The casing has an accommodation space. The motherboard is located in the accommodation space and has two first heat sources and a plurality of second heat sources. The liquid cooling plate assembly includes a first liquid cooling plate, a second liquid cooling plate, a first connecting pipe and at least a second connecting pipe. The first liquid cooling plate includes a first heat dissipation part and at least a second heat dissipation part. The first heat dissipation part is in thermal contact with one of the first heat sources and has a first fluid chamber. The second heat dissipation part is connected to the first heat dissipation part and is in thermal contact with part of the second heat source, and the second heat dissipation part has a first fluid channel. The second liquid cooling plate includes a third heat dissipation part and at least a fourth heat dissipation part. The third heat dissipation part is in thermal contact with another first heat source and has a second fluid chamber. The fourth heat dissipation part is connected to the third heat dissipation part and is in thermal contact with part of the second heat source. The fourth heat dissipation part has a second fluid channel, and the second fluid channel is connected to the second fluid chamber. The first connecting pipe is connected to the third heat dissipation part and the first heat dissipation part, so that the second fluid chamber is connected to the first fluid chamber. The second connecting pipe is connected to the fourth heat dissipation part and the second heat dissipation part, so that the second fluid channel is connected to the first fluid channel.

According to the liquid cooling plate assembly and the server disclosed in the above embodiments, the cooling liquid can flow through the first fluid chamber of the first heat dissipation part of the first liquid cooling plate and the third heat dissipation part of the second liquid cooling plate. The second fluid chamber, the second fluid channel of the fourth heat dissipation part of the second liquid cooling plate, and the first fluid channel of the second heat dissipation part of the first liquid cooling plate can make the cooling liquid and heat contact the first heat source. The heat dissipation part and the second heat dissipation part perform heat exchange to take away the heat generated by the first heat source, and the second heat dissipation part and the fourth heat dissipation part that are in thermal contact with the second heat source perform heat exchange to take away the second heat source. the heat generated. In this way, the liquid cooling plate can efficiently dissipate heat from the first heat source and the second heat source, thereby meeting the heat dissipation requirements required by the first heat source and the second heat source.

The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the patent application scope of the present invention.

See Figures 1 to 3. FIG. 1 is a partial perspective view of a server disclosed according to an embodiment of the present invention. FIG. 2 is an exploded schematic diagram of the liquid cooling plate assembly and the motherboard in FIG. 1 . FIG. 3 is a top view of the liquid cooling plate assembly and the motherboard of FIG. 1 .

In this embodiment, the server 1 includes a chassis 10 , a motherboard 20 and a liquid cooling plate assembly 30 . In addition, the server 1 may also include other components, such as hard drives, fans, and power supplies. In order to highlight the structure of the liquid cooling plate of the server 1, these aforementioned components are omitted from the drawing.

In this embodiment, the casing 10 has an accommodating space 11 , and the motherboard 20 is located in the accommodating space 11 . The motherboard 20 has a plurality of first heat sources 21 and a plurality of second heat sources 22 . Specifically, the number of the first heat sources 21 is two, and the two first heat sources 21 are, for example, central processing units (CPUs). The number of second heat sources 22 is, for example, 46, and these second heat sources 22 are, for example, voltage regulator wafers. These second heat sources 22 are located around the two second heat sources 22 . For example, some of the second heat sources 22 are located on opposite sides of one of the first heat sources 21 , and another part of the second heat sources 22 are located on opposite sides of the other first heat source 21 .

The liquid cooling plate assembly 30 includes a first liquid cooling plate 31 , a second liquid cooling plate 32 , a first connecting pipe 33 and two second connecting pipes 34 . In addition, the liquid cooling plate assembly 30 may also include a third connecting pipe 35 and a fourth connecting pipe 36 .

The first liquid cooling plate 31 includes a first heat dissipation part 311 and two second heat dissipation parts 312. The first heat dissipation part 311 includes a first base 3111, a first cover 3112 and a plurality of first fin structures 3113. The first base 3111 is used to thermally contact one of the first heat sources 21 to absorb the heat generated by the first heat source 21 . The first cover 3112 is installed on the first base 3111, and the first cover 3112 and the first base 3111 together form a first fluid chamber 3114. These first fin structures 3113 are spaced apart from each other in the first fluid chamber 3114, and a three-dimensional shovel tooth flow channel is formed in the first fluid chamber 3114 to increase the contact between the coolant and the first heat dissipation part 311. area to improve heat exchange efficiency. The two second heat dissipation parts 312 are respectively integrally connected to two opposite sides of the first base 3111, and the width W1 of the first heat dissipation part 311 is greater than the width W2 of the two second heat dissipation parts 312. The first heat dissipation part 311 and the two second heat dissipation parts 312 are both I-shaped. The two second heat dissipation parts 312 are in thermal contact with parts of the second heat sources 22 located on opposite sides of one of the first heat sources 21 , and each of the two second heat dissipation parts 312 has a first fluid channel 3121 .

It should be noted that the first fin structure 3113 is an optional structure and can be configured or omitted according to the required heat exchange efficiency. In addition, the first cover 3112 of the first heat dissipation part 311 is not limited to being coupled to the first base 3111 in an assembly manner. In other embodiments, the first cover of the first heat dissipation part may be integrally formed with the first base.

The second liquid cooling plate 32 includes a third heat dissipation part 321 and two fourth heat dissipation parts 322. The third heat dissipation part 321 includes a second base 3211, a second cover 3212 and a plurality of second fin structures 3213. The second base 3211 is used to thermally contact another first heat source 21 to absorb the heat generated by the first heat source 21 . The second cover 3212 is installed on the second base 3211, and the second cover 3212 and the second base 3211 together form a second fluid chamber 3214. These second fin structures 3213 are spaced apart from each other in the second fluid chamber 3214, and a three-dimensional shovel tooth flow channel is formed in the second fluid chamber 3214 to increase the distance between the coolant and the third heat dissipation part 321. contact area to improve heat exchange efficiency. The two fourth heat dissipation parts 322 are respectively integrally connected to two opposite sides of the second base 3211, and the width W3 of the third heat dissipation part 321 is greater than the width W4 of the two fourth heat dissipation parts 322. The third heat dissipation part 321 and the two fourth heat dissipation parts 322 are both I-shaped. The two fourth heat dissipation parts 322 are in thermal contact with parts of the second heat source 22 located on opposite sides of the other first heat source 21 , and the two fourth heat dissipation parts 322 each have a second fluid channel 3221 .

It should be noted that the second fin structure 3213 is an optional structure and can be configured or omitted according to the required heat exchange efficiency. In addition, the second cover 3212 of the third heat dissipation part 321 is not limited to being coupled to the second base 3211 in an assembly manner. In other embodiments, the second cover of the third heat dissipation part may be integrally formed with the second base.

The opposite ends of the first connecting tube 33 are respectively connected to the first cover 3112 of the first heat dissipation part 311 and the second cover 3212 of the third heat dissipation part 321, so that the first fluid chamber 3114 of the first heat dissipation part 311 and The second fluid chamber 3214 of the third heat dissipation part 321 is connected.

Opposite ends of one of the second connecting tubes 34 are respectively connected to one of the fourth heat dissipation parts 322 and one of the second heat dissipation parts 312, so that the second fluid channel 3221 of the fourth heat dissipation part 322 is connected to the second heat dissipation part. The first fluid channel 3121 of the portion 312. The opposite ends of the other second connecting tube 34 are respectively connected to the other fourth heat dissipation part 322 and the other second heat dissipation part 312, so that the second fluid channel 3221 of the fourth heat dissipation part 322 is connected to the second heat dissipation part. The first fluid channel 3121 of the portion 312.

The opposite ends of the third connecting pipe 35 are connected to the third heat dissipation part 321 and one of the fourth heat dissipation parts 322 respectively, so that the second fluid chamber 3214 of the third heat dissipation part 321 is connected to the third heat dissipation part 322 . Two fluid channels 3221.

The two opposite ends of the fourth connecting pipe 36 are respectively connected to the two ends of the two second heat dissipation parts 312 respectively away from the two fourth heat dissipation parts 322, so that the two first fluid channels 3121 of the two second heat dissipation parts 312 are connected. The two second heat dissipation parts 312, the two fourth heat dissipation parts 322 and the fourth connecting pipe 36 are U-shaped together.

In this embodiment, the cover of the first heat dissipation part 311 is used to connect a liquid inlet pipe I, and the fourth heat dissipation part 322 to which the fourth connecting pipe 36 is not connected is used to connect a liquid outlet pipe O. The liquid inlet pipe I, the liquid cooling plate assembly 30 and the liquid outlet pipe O can form a coolant circulation together with a pump (not shown) and a radiator (not shown), for example. For example, the pump can drive the coolant (not shown) into the first fluid chamber 3114 of the first heat dissipation part 311 through the liquid inlet pipe I, so that the coolant can exchange heat with the first heat dissipation part 311 and bring The heat generated by one of the first heat sources 21 is removed. Then, the coolant enters the second fluid chamber 3214 of the third heat dissipation part 321 through the first connecting pipe 33, so that the coolant can exchange heat with the third heat dissipation part 321 and take away the heat generated by the other first heat source 21. of heat. Then, the cooling liquid enters the second fluid channel 3221 of one of the fourth heat dissipation parts 322 through the third connecting pipe 35, and then sequentially passes through one of the second connecting pipes 34 and the first fluid channel of one of the second heat dissipating parts 312. 3121, the fourth connecting pipe 36, the first fluid channel 3121 and the second connecting pipe 34 of the other second heat dissipating part 312 flow to the second fluid channel 3221 of the other fourth heat dissipating part 322, and take away these second The heat generated by heat source 22. Then, the coolant flows to the radiator through the liquid outlet pipe O and is cooled. In this way, by repeating the above process, the liquid cooling plate assembly 30 can efficiently dissipate heat for the first heat sources 21 and the second heat sources 22 to meet the heat dissipation requirements of the first heat sources 21 and the second heat sources 22 . In detail, after the second heat sources 22 are dissipated by the liquid cooling plate assembly 30 , the temperature distribution of the second heat sources 22 is between 55.2 and 69.3 degrees Celsius, which is far lower than the critical temperature of the second heat sources 22 . 85 degrees. In addition, traditional heat dissipation methods for the second heat source 22 can only allow the temperature distribution of the second heat source 22 to be between 57.1 and 76.1 degrees Celsius. Therefore, compared with traditional heat dissipation methods, the liquid cooling plate assembly 30 of this embodiment can further reduce the temperature of the second heat source 22 . The temperature of the second heat source 22.

In this embodiment, the two second heat dissipation parts 312 are respectively integrally connected to the two opposite sides of the first base 3111, and the two fourth heat dissipation parts 322 are respectively integrally connected to the opposite sides of the second base 3211. The configuration on both sides allows the first liquid cooling plate 31 and the second liquid cooling plate 32 to have sufficient structural strength and saves the manufacturing cost of the first liquid cooling plate 31 and the second liquid cooling plate 32 .

It should be noted that the two second heat dissipation parts 312 are not limited to being integrally connected to two opposite sides of the first base 3111, and the two fourth heat dissipation parts 322 are not limited to being integrally connected to the second base. The opposite sides of 3211. In other embodiments, the two second heat dissipation parts can be respectively assembled on two opposite sides of the first base, and the two fourth heat dissipation parts can be respectively assembled on two opposite sides of the second base.

In this embodiment, through the design of the first connecting pipe 33 , the second connecting pipe 34 , the third connecting pipe 35 and the fourth connecting pipe 36 , the first liquid cooling plate 31 and the second liquid cooling plate 32 can be The fluid channels and fluid chambers are connected, so that the overall liquid cooling plate assembly 30 is suitable for a variety of complex situations, making the liquid cooling plate assembly 30 universally applicable to different machine models. In addition, the liquid cooling plate assembly 30 can support harsh environments, is highly stable, and has a long service life.

It should be noted that the third connecting pipe 35 is an optional component. In other embodiments, the second fluid chamber of the third heat dissipation part can communicate with the second fluid channel of the fourth heat dissipation part through the internal flow channel of the second base.

In addition, the opposite sides of each first heat source 21 of the motherboard 20 are not limited to having second heat sources 22 . In other embodiments, each first heat source of the motherboard may have a second heat source on only one side. Under such a configuration, the first liquid cooling plate may have only one second heat dissipation part, the second liquid cooling plate may have only one fourth heat dissipation part, and the number of the second connecting pipes may be only one to connect the aforementioned third heat dissipation part. The second heat dissipation part and the fourth heat dissipation part, and the fourth connecting pipe can be omitted.

In this embodiment, the first liquid cooling plate 31 and the second liquid cooling plate 32 can be made of metal materials, such as aluminum or copper, which have better thermal conductivity and further improve the resistance of the liquid cooling plate assembly 30 to the first heat source. 21 and the heat dissipation effect of the second heat source 22.

The above-mentioned liquid cooling plate assembly 30 is not limited to application in the server 1. The liquid cooling plate assembly 30 can be applied in other types of electronic products according to requirements.

According to the liquid cooling plate assembly and the server disclosed in the above embodiments, the cooling liquid can flow through the first fluid chamber of the first heat dissipation part of the first liquid cooling plate and the third heat dissipation part of the second liquid cooling plate. The second fluid chamber, the second fluid channel of the fourth heat dissipation part of the second liquid cooling plate, and the first fluid channel of the second heat dissipation part of the first liquid cooling plate can make the cooling liquid and heat contact the first heat source. The heat dissipation part and the second heat dissipation part perform heat exchange to take away the heat generated by the first heat source, and the second heat dissipation part and the fourth heat dissipation part that are in thermal contact with the second heat source perform heat exchange to take away the second heat source. the heat generated. In this way, the liquid cooling plate can efficiently dissipate heat from the first heat source and the second heat source, thereby meeting the heat dissipation requirements required by the first heat source and the second heat source.

Furthermore, through the design of the first connecting pipe, the second connecting pipe, the third connecting pipe and the fourth connecting pipe, the fluid channels and fluid chambers of the first liquid cooling plate and the second liquid cooling plate can be connected. , making the overall liquid-cooling plate assembly suitable for a variety of complex situations, making the liquid-cooling plate assembly universally applicable to a variety of different models.

Although the present invention has been disclosed in the foregoing preferred embodiments, they are not intended to limit the present invention. Anyone skilled in the similar art can make some modifications and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention is The scope of patent protection for an invention shall be determined by the scope of the patent application attached to this specification.

1:Server 10:Chassis 11: Accommodation space 20: Motherboard 21:The first heat source 22:Second heat source 30: Liquid cooling plate assembly 31: First liquid cooling plate 311: First heat dissipation part 3111:First pedestal 3112:First cover 3113: First fin structure 3114: First fluid chamber 312: Second heat dissipation part 3121: First fluid channel 32: Second liquid cooling plate 321: The third heat dissipation part 3211:Second pedestal 3212:Second cover 3213: Second fin structure 3214: Second fluid chamber 322: The fourth heat dissipation part 3221: Second fluid channel 33:First connecting pipe 34:Second connecting pipe 35:Third connecting pipe 36:Fourth connecting pipe W1,W2,W3,W4: Width I: liquid inlet pipe O: Outlet pipe

FIG. 1 is a partial perspective view of a server disclosed according to an embodiment of the present invention. FIG. 2 is an exploded schematic diagram of the liquid cooling plate assembly and the motherboard in FIG. 1 . FIG. 3 is a top view of the liquid cooling plate assembly and the motherboard of FIG. 1 .

20: Motherboard

21:The first heat source

22:Second heat source

30: Liquid cooling plate assembly

31: First liquid cooling plate

32: Second liquid cooling plate

33:First connecting pipe

34:Second connecting pipe

35:Third connecting pipe

36:Fourth connecting pipe

I: liquid inlet pipe

O: Outlet pipe

Claims (10)

A liquid cooling plate assembly for thermal contact with two first heat sources and a plurality of second heat sources. The liquid cooling plate assembly includes: a first liquid cooling plate, including: a first heat dissipation part for thermal contact therein. a first heat source having a first fluid chamber; and at least a second heat dissipation part connected to the first heat dissipation part and used to thermally contact some of the second heat sources, and the at least one second heat dissipation part is The heat dissipation part has a first fluid channel; a second liquid cooling plate, including: a third heat dissipation part for thermal contact with another first heat source and having a second fluid chamber; and at least a fourth The heat dissipation part is connected to the third heat dissipation part and used to thermally contact the second heat sources of the part. The at least one fourth heat dissipation part has a second fluid channel, and the second fluid channel is connected to the second fluid channel. body chamber; a first connecting tube connected to the third heat dissipation part and the first heat dissipating part, so that the second fluid chamber is connected to the first fluid chamber; and at least one second connecting tube connected to the At least one fourth heat dissipation part and the at least one second heat dissipation part allow the second fluid channel to communicate with the first fluid channel. The liquid cooling plate assembly according to claim 1, further comprising a third connecting pipe connecting the third heat dissipation part and the at least one fourth heat dissipation part, so that the second fluid chamber is connected to the second fluid channel. The liquid cooling plate assembly of claim 2 further includes a fourth connecting pipe, the number of the at least one second heat dissipation part and the number of the at least one fourth heat dissipation part is two, and the two second heat dissipation parts The two fourth heat dissipation parts are respectively connected to two opposite sides of the first heat dissipation part, the two fourth heat dissipation parts are respectively connected to the two opposite sides of the third heat dissipation part, the number of the at least one second connection pipe is two, and the two second heat dissipation parts are respectively connected to the two fourth heat dissipation parts through the two second connecting pipes, so that the two first fluid channels of the two second heat dissipation parts are respectively connected to the two second fluid channels of the two fourth heat dissipation parts, The third connecting pipe is connected to one of the fourth heat dissipating parts, and the opposite ends of the fourth connecting pipe are respectively connected to the two ends of the two second heat dissipating parts respectively away from the two fourth heat dissipating parts, so that the two second The two first fluid channels of the heat dissipation part are connected. The liquid cooling plate assembly of claim 3, wherein the first heat dissipation part and the two second heat dissipation parts jointly form an I-shape, the third heat dissipation part and the two fourth heat dissipation parts form a common I-shape, and the two The second heat dissipation part, the two fourth heat dissipation parts and the fourth connecting pipe jointly form a U shape. The liquid cooling plate assembly of claim 1, wherein the width of the first heat dissipation part is greater than the width of the at least one second heat dissipation part, and the width of the third heat dissipation part is greater than the width of the at least one fourth heat dissipation part. The liquid cooling plate assembly of claim 1, wherein the first heat dissipation part includes a first base, a first cover and a plurality of first fin structures, and the first base is connected to the at least one first fin structure. Two heat dissipation parts, the first cover is disposed on the first base, the first cover and the first base jointly form the first fluid chamber, and the first fin structures are spaced apart from each other. In the first fluid chamber, the third heat dissipation part includes a second base, a second cover and a plurality of second fin structures. The second base is connected to the at least one fourth heat dissipation part, and the second cover The body is disposed on the second base, the second cover body and the second base jointly form the second fluid chamber, and the second fin structures are spaced apart from each other and are disposed in the second fluid chamber. A server includes: a chassis having an accommodation space; a motherboard located in the accommodation space and having two first heat sources and a plurality of second heat sources; and a liquid cooling plate assembly, including: a The first liquid cooling plate includes: a first heat dissipation part that is in thermal contact with one of the first heat sources and has a first fluid chamber; and at least a second heat dissipation part that is connected to the first heat dissipation part and heats in contact with some of the second heat sources, and the at least one second heat dissipation part has a first fluid channel; a second liquid cooling plate including: a third heat dissipation part thermally contacted with the other first heat source, And has a second fluid chamber; and at least a fourth heat dissipation part, connected to the third heat dissipation part, and thermally contacted with some of the second heat sources, the at least one fourth heat dissipation part has a second fluid channel , the second fluid channel is connected to the second fluid chamber; a first connecting pipe is connected to the third heat dissipation part and the first heat dissipation part, so that the second fluid chamber is connected to the first fluid chamber ; And at least one second connecting pipe, connected to the at least one fourth heat dissipation part and the at least one second heat dissipation part, so that the second fluid channel is connected to the first fluid channel. The server according to claim 7, further comprising a third connecting pipe connecting the third heat dissipation part and the at least one fourth heat dissipation part, so that the second fluid chamber is connected to the third heat dissipation part. Two fluid channels. The server according to claim 8 further includes a fourth connecting pipe, the number of the at least one second heat dissipation part and the number of the at least one fourth heat dissipation part are both two, and the two second heat dissipation parts are respectively connected. On two opposite sides of the first heat dissipation part, the two fourth heat dissipation parts are respectively connected to the two opposite sides of the third heat dissipation part. The number of at least one second connecting pipe is two, and the two second heat dissipation parts respectively pass through The two second connecting pipes are connected to the two fourth heat dissipation parts, so that the two first fluid channels of the two second heat dissipation parts are respectively connected to the two second fluid channels of the two fourth heat dissipation parts, and the third The connecting pipe is connected to one of the fourth heat dissipating parts, and the opposite ends of the fourth connecting pipe are respectively connected to the two ends of the two second heat dissipating parts respectively away from the two fourth heat dissipating parts, so that the two second heat dissipating parts are The two first fluid channels are connected. The server of claim 7, wherein the width of the first heat dissipation part is greater than the width of the at least one second heat dissipation part, and the width of the third heat dissipation part is greater than the width of the at least one fourth heat dissipation part.

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