TWI839247B - Liquid cooling plate and server - Google Patents

Abstract

A liquid cooling plate is configured to be thermal contact with at least one first heat source and at least one second heat source. The liquid cooling plate includes at least one first heat dissipation part and a second heat dissipation part. The first heat dissipation part is configured to be thermal contact with the first heat source, and the first heat dissipation part has a fluid chamber. The second heat dissipation part is connected to the first heat dissipation part and is configured to be thermal contact with the second heat source. The second heat dissipation part has a fluid channel, and the fluid channel is in fluid communication with the fluid chamber.

Description

Liquid cooling plate and server

The present invention relates to a liquid cooling plate and a server.

In addition to the central processing unit (hereinafter referred to as CPU), the server motherboard usually has a voltage regulator (hereinafter referred to as VR) chip to adjust the load voltage so that the CPU can work normally. Currently, most CPUs are cooled by cold plates, while VR chips are cooled by heat sink fins with passive air cooling or active air cooling. However, as the performance of VR chips increases, VR chips generate more heat, so the traditional heat sink fins with passive air cooling or active air cooling are no longer in line with the heat dissipation efficiency of VR chips. Therefore, researchers in this field are currently working to solve the above problems.

The present invention provides a liquid cooling plate and a server, which can efficiently dissipate heat for VR chips.

A liquid cooling plate disclosed in an embodiment of the present invention is used for thermal contact with at least one first heat source and at least one second heat source. The liquid cooling plate includes at least one first heat sink and a second heat sink. The first heat sink is used for thermal contact with the first heat source and has a fluid chamber. The second heat sink is connected to the first heat sink and is used for thermal contact with the second heat source. The second heat sink has a fluid channel, and the fluid channel is connected to the fluid chamber.

Another embodiment of the present invention discloses a server, comprising a case, a motherboard and a liquid cooling plate. The case has a storage space. The motherboard is located in the storage space and has at least one first heat source and at least one second heat source. The liquid cooling plate comprises at least one first heat sink and a second heat sink. The first heat sink is in thermal contact with the first heat source and has a fluid chamber. The second heat sink is connected to the first heat sink and is in thermal contact with the second heat source. The second heat sink has a fluid channel, which is connected to the fluid chamber.

According to the liquid cooling plate and server disclosed in the above-mentioned embodiment, the first heat dissipation part of the liquid cooling plate is in thermal contact with the first heat source, the second heat dissipation part of the liquid cooling plate is connected to the first heat dissipation part and in thermal contact with the second heat source, and the fluid channel of the second heat dissipation part is connected to the fluid chamber, so that the cooling liquid in the fluid chamber of the first heat dissipation part can take away the heat generated by the first heat source, and the cooling liquid in the fluid channel of the second heat dissipation part can take away the heat generated by the second heat source. In this way, the liquid cooling plate can efficiently dissipate heat from the first heat source and the second heat source, thereby meeting the heat dissipation requirements of the first heat source and the second heat source.

The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figures 1 to 3. Figure 1 is a partial three-dimensional schematic diagram of a server disclosed according to an embodiment of the present invention. Figure 2 is an exploded schematic diagram of the liquid cooling plate and the motherboard of Figure 1. Figure 3 is a top view schematic diagram of the liquid cooling plate and the motherboard of Figure 1.

In this embodiment, the server 1 includes a housing 10, a motherboard 20 and a liquid cooling plate 30. In addition, the server 1 may also include other components, such as hard disks, fans and power supplies. In order to highlight the structure of the liquid cooling plate 30 of the server 1, the figure omits the aforementioned components.

In the present embodiment, the case 10 has a housing space 11, and the motherboard 20 is located in the housing space 11. The motherboard 20 has a plurality of first heat sources 21 and a plurality of second heat sources 22. In detail, the number of the first heat sources 21 is two, and the two first heat sources 21 are, for example, central processing units (CPUs). The number of the second heat sources 22 is, for example, 46, and the second heat sources 22 are, for example, voltage regulator chips. The second heat sources 22 are located around the two second heat sources 22. For example, part of the second heat sources 22 are located on opposite sides of one of the first heat sources 21, and another part of the second heat sources 22 are located on opposite sides of another first heat source 21.

The liquid cooling plate 30 includes two first heat sinks 31 and a second heat sink 32. The two first heat sinks 31 are in thermal contact with the two first heat sources 21, respectively, to absorb the heat generated by the two first heat sources 21. The two first heat sinks 31 have the same structure, so only one of the first heat sinks 31 is described in detail below. The first heat sink 31 includes a base 311, a cover 312, and a plurality of fin structures 313. The cover 312 is mounted on the base 311, and the cover 312 and the base 311 together form a fluid chamber 314. The fin structures 313 are arranged in the fluid chamber 314 at intervals from each other.

In this embodiment, the liquid cooling plate 30 may further include a first connecting pipe 33. Two opposite ends of the first connecting pipe 33 are respectively connected to the covers 312 of the two first heat sinks 31, so that the fluid chambers 314 of the two first heat sinks 31 are connected.

The second heat dissipation portion 32 is, for example, U-shaped, and the second heat dissipation portion 32 has a fluid channel 321. The second heat dissipation portion 32 includes two heat contact sections 322 and a connecting section 323. The two heat contact sections 322 are integrally connected to opposite sides of the base 311 of each first heat dissipation portion 31, and the width W1 of the two first heat dissipation portions 31 is greater than the width W2 of the two heat contact sections 322. The two heat contact sections 322 are in thermal contact with these second heat sources 22 to absorb the heat generated by these second heat sources 22. The opposite ends of the connecting section 323 are integrally connected to the two heat contact sections 322, and one of the first heat dissipation portions 31 is located between the other first heat dissipation portion 31 and the connecting section 323. Different parts of the fluid channel 321 are located in the second heat contact section 322 and the connecting section 323 respectively.

It should be noted that the width W1 of the two first heat dissipation portions 31 is not limited to be greater than the width W2 of the two thermal contact sections 322, but can be adjusted to be equal to or less than the width of the two thermal contact sections according to the size of the heat source.

In this embodiment, one end of one of the heat contact sections 322 away from the connecting section 323 has a liquid inlet 3221, and the other end of the heat contact section 322 away from the connecting section 323 has a liquid outlet 3222. The liquid inlet 3221 and the liquid outlet 3222 are respectively located at two opposite ends of the fluid channel 321 of the second heat dissipation portion 32. It should be noted that the liquid inlet is not limited to being located at one end of one of the heat contact sections away from the connecting section, and the liquid outlet is not limited to being located at one end of the other heat contact section away from the connecting section, but the positions of the liquid inlet and the liquid outlet can be adjusted according to needs.

In addition, the liquid cooling plate 30 may further include a second connecting tube 34. The opposite ends of the second connecting tube 34 are respectively connected to the cover 312 of the first heat sink 31 farther from the connecting section 323 and the liquid inlet 3221 of one of the heat contact sections 322, so that the fluid chamber 314 of the first heat sink 31 closer to the connecting section 323 is connected to the fluid channel 321 through the first connecting tube 33, the fluid chamber 314 of the first heat sink 31 farther from the connecting section 323, the second connecting tube 34 and the liquid inlet 3221.

In this embodiment, the cover 312 of the first heat sink 31 closer to the connection section 323 is used for connecting a liquid inlet pipe I, and the liquid outlet 3222 of the heat contact section 322 is used for connecting a liquid outlet pipe O. The liquid inlet pipe I, the liquid cooling plate 30 and the liquid outlet pipe O can form a cooling liquid circulation together with a pump (not shown) and a heat sink (not shown). For example, the pump can drive the cooling liquid (not shown) through the liquid inlet pipe I into the fluid chamber 314 of one of the first heat sinks 31, so that the cooling liquid can exchange heat with the first heat sink 31 and take away the heat generated by one of the first heat sources 21. Next, the cooling liquid enters the fluid chamber 314 of another first heat sink 31 through the first connecting pipe 33, so that the cooling liquid can exchange heat with the first heat sink 31 and take away the heat generated by another first heat source 21. Next, the cooling liquid enters the fluid channel 321 of the second heat sink 32 through the second connecting pipe 34, so that the cooling liquid can exchange heat with the second heat sink 32 and take away the heat generated by these second heat sources 22. Next, the cooling liquid flowing through the fluid channel 321 of the second heat sink 32 flows to the radiator through the liquid outlet pipe O and is cooled. In this way, by repeating the above process, the liquid cooling plate 30 can efficiently dissipate heat for these first heat sources 21 and these second heat sources 22, and meet the heat dissipation requirements required by the first heat source 21 and the second heat source 22. Specifically, after the second heat sources 22 are cooled by the liquid cooling plate 30, the temperature of the second heat sources 22 is distributed between 55.2 and 69.3 degrees Celsius, which is much lower than the critical temperature of 85 degrees Celsius of the second heat sources 22. In addition, the conventional cooling method for the second heat sources 22 can only allow the temperature of the second heat sources 22 to be distributed between 57.1 and 76.1 degrees Celsius, so compared with the conventional cooling method, the liquid cooling plate 30 of this embodiment can further reduce the temperature of the second heat sources 22.

In this embodiment, the fin structure 313 of the first heat sink 31 can increase the contact area between the first heat sink 31 and the cooling liquid, thereby improving the heat exchange efficiency. It should be noted that the fin structure 313 is an optional structure and can be configured or omitted according to the required heat exchange efficiency. In addition, the cover of the first heat sink is not limited to being combined with the base in an assembled manner. In other embodiments, the cover of the first heat sink can be formed integrally with the base.

In this embodiment, the two heat contact sections 322 are integrally connected to the opposite sides of the base 311 of each first heat dissipation portion 31, and the opposite ends of the connecting section 323 are integrally connected to the two heat contact sections 322. This facilitates the production and installation of the liquid cooling plate 30, extends the service life of the liquid cooling plate 30, and makes the liquid cooling plate 30 suitable for a variety of different scenarios.

It should be noted that the two thermal contact sections 322 are not limited to being integrally connected to the opposite sides of the base 311 of each first heat sink 31, and the opposite ends of the connecting section 323 are not limited to being integrally connected to the two thermal contact sections 322. In other embodiments, the two thermal contact sections may be assembled to the opposite sides of the base of each first heat sink, and the opposite ends of the connecting section may be assembled to the two thermal contact sections.

In addition, since the liquid cooling plate 30 has only a small number of connecting pipes (such as the first connecting pipe 33 and the second connecting pipe 34), there are fewer pipe connection points, which can reduce the risk of hydraulic pressure loss and leakage, thereby increasing the safety index.

It should be noted that the first connecting tube 33 and the second connecting tube 34 are optional components. In other embodiments, the liquid cooling plate may not have the first connecting tube and the second connecting tube. In such a configuration, the bases of the two first heat sinks can be directly connected, so that the fluid chambers of the two first heat sinks can be connected through the internal flow channels of the two bases, and the fluid chamber of one of the first heat sinks can be connected to the fluid channel of the second heat sink through another internal channel of the base of the first heat sink.

In this embodiment, the liquid cooling plate 30 may be made of metal material, such as aluminum or copper, which has a better thermal conductivity, and further enhances the heat dissipation effect of the liquid cooling plate 30 on the first heat source 21 and the second heat source 22.

It should be noted that the motherboard 20 is not limited to having two first heat sources 21. In other embodiments, the motherboard may have only one first heat source, so the liquid cooling plate may have only one first heat dissipation portion. In addition, the second heat sources 22 of the motherboard 20 are not limited to being located on two opposite sides of the first heat source 21. In other embodiments, the second heat sources of the motherboard may be located on only one side of the first heat source, so the second heat dissipation portion of the liquid cooling plate may have only one thermal contact section without another thermal contact section and a connecting section.

The liquid cooling plate 30 is not limited to being applied to the server 1 , and the liquid cooling plate 30 can be applied to other types of electronic products according to needs.

According to the liquid cooling plate and server disclosed in the above embodiment, the first heat sink of the liquid cooling plate is in thermal contact with the first heat source, the second heat sink of the liquid cooling plate is connected to the first heat sink and in thermal contact with the second heat source, and the fluid channel of the second heat sink is connected to the fluid chamber, so that the cooling liquid in the fluid chamber of the first heat sink can take away the heat generated by the first heat source, and the cooling liquid in the fluid channel of the second heat sink can take away the heat generated by the second heat source. In this way, the liquid cooling plate can efficiently dissipate heat from the first heat source and the second heat source, thereby meeting the heat dissipation requirements of the first heat source and the second heat source.

Although the present invention is disclosed as above with the aforementioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

1: Server 10: Chassis 11: Storage space 20: Motherboard 21: First heat source 22: Second heat source 30: Liquid cooling plate 31: First heat sink 311: Base 312: Cover 313: Fin structure 314: Fluid chamber 32: Second heat sink 321: Fluid channel 322: Thermal contact section 3221: Liquid inlet 3222: Liquid outlet 323: Connection section 33: First connection tube 34: Second connection tube W1, W2: Width I: Liquid inlet tube O: Liquid outlet tube

FIG. 1 is a partial three-dimensional schematic diagram of a server disclosed according to an embodiment of the present invention. FIG. 2 is a schematic diagram of the liquid cooling plate and the motherboard of FIG. 1 when disassembled. FIG. 3 is a schematic diagram of the liquid cooling plate and the motherboard of FIG. 1 when viewed from above.

20: Motherboard

21: The first heat source

22: Second heat source

30: Liquid cooling plate

31: First heat dissipation unit

32: Second heat dissipation unit

321: Fluid channel

322: Thermal contact section

323: Connection segment

33: First connecting pipe

34: Second connecting pipe

I: Liquid inlet pipe

O: Liquid outlet pipe

Claims (9)

A liquid cooling plate is used for thermally contacting at least one first heat source and at least one second heat source. The liquid cooling plate comprises: at least one first heat sink, which is used for thermally contacting the at least one first heat source and has a fluid chamber; and a second heat sink, which is connected to the at least one first heat sink and is used for thermally contacting the at least one second heat source, and the second heat sink has a fluid channel, which is connected to the fluid chamber; wherein the second heat sink comprises two thermal contact sections and a connecting section, the two thermal contact sections are respectively connected to opposite sides of the at least one first heat sink and are used for thermally contacting a plurality of second heat sources, the opposite ends of the connecting section are respectively connected to the two thermal contact sections, and different parts of the fluid channel are respectively located in the two thermal contact sections and the connecting section. The liquid cooling plate as described in claim 1, wherein the two heat contact sections and the connecting section are integrally connected. The liquid cooling plate as described in claim 1, wherein the width of the at least one first heat dissipation portion is greater than the width of the two heat contact sections. The liquid cooling plate as described in claim 1, wherein the number of the at least one first heat sink is two, the two first heat sinks are respectively used for thermal contact with two first heat sources, one of the first heat sinks is located between the other first heat sink and the connecting section, and the two fluid chambers of the two first heat sinks are connected. The liquid cooling plate as described in claim 4, wherein the fluid chamber of one of the two first heat dissipation parts closer to the connecting section is connected to the fluid channel through the fluid chamber of the other one. The liquid cooling plate as described in claim 5 further comprises a first connecting tube and a second connecting tube, wherein the two fluid chambers of the two first heat dissipation parts are connected through the first connecting tube, and the fluid chamber of one of the first heat dissipation parts is connected to the fluid channel through the second connecting tube. The liquid cooling plate as described in claim 6, wherein one end of the heat contact section away from the connecting section has a liquid inlet, and the other end of the heat contact section away from the connecting section has a liquid outlet, the liquid inlet and the liquid outlet are located at opposite ends of the fluid channel, and the second connecting tube is connected to the fluid channel through the liquid inlet. The liquid cooling plate as described in claim 1, wherein the at least one first heat dissipation part comprises a base, a cover and a plurality of fin structures, the base is connected to the second heat dissipation part, the cover is disposed on the base, the cover and the base together form the fluid chamber, and the fin structures are disposed in the fluid chamber at intervals from each other. A server comprises: a case having a storage space; a motherboard located in the storage space and having at least one first heat source and a plurality of second heat sources; and a liquid cooling plate comprising: at least one first heat sink thermally contacting the at least one first heat source and having a fluid chamber; and a second heat sink connected to the at least one first heat sink and thermally contacting the second heat sources, and the second The heat dissipation part has a fluid channel, which is connected to the fluid chamber; wherein the second heat dissipation part includes two heat contact sections and a connecting section, the two heat contact sections are respectively connected to the opposite sides of the at least one first heat dissipation part and are used for thermal contact with the second heat sources, the opposite ends of the connecting section are respectively connected to the two heat contact sections, and different parts of the fluid channel are respectively located in the two heat contact sections and the connecting section.

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