TWM628952U - Liquid-cooling type heat dissipation module - Google Patents

Abstract

A liquid-cooled heat dissipation module is used to solve the problems of the conventional liquid-cooled heat dissipation system having many components and occupying a large space. The system includes: a casing with a circulating flow channel in the casing, and a concave part on the outer surface of the casing; a pump for guiding a working fluid to circulate in the circulating flow channel; and a cooling fan, combined with the casing, and an air inlet of the cooling fan communicates with the concave part.

Description

Liquid-cooled cooling module

This creation relates to a heat dissipation module, especially a liquid-cooled heat dissipation module that can help electronic devices maintain a proper working temperature.

Please refer to FIG. 1 , which is a conventional liquid-cooled heat dissipation system 9 . The conventional liquid-cooled heat dissipation system 9 has a heat absorption unit 91 , a heat dissipation unit 92 , a pump 93 and a pipe assembly 94 . The heat absorbing unit 91 can be attached to the heat source H of the electronic device. The tube assembly 94 is connected to the pump 93 and the heat absorbing unit 91 by a tube 941, and the pump 93 and the heat dissipation unit 92 are connected by a tube 942. The heat-absorbing unit 91 and the heat-dissipating unit 92 are connected by a pipe 943 .

According to the aforementioned structure, the pump 93 can drive the working fluid to flow in the pipe assembly 94 , and the working fluid that passes through the heat absorbing unit 91 to absorb heat and increase temperature can be cooled and cooled when passing through the heat dissipation unit 92 , and make the working fluid It is guided to the heat absorbing unit 91 again; in this way, the continuous cycle can keep the heat source H at a proper working temperature, so as to avoid the problem of overheating of the electronic device.

However, the conventional liquid-cooled heat dissipation system 9 has many components, and a certain installation space must be occupied between the components due to the requirement of assembly and combination, making it difficult to reduce the space occupied by the overall liquid-cooled heat dissipation system 9 , For thin and light electronic devices, the problem of setting space configuration is often encountered. Furthermore, if the tube assembly 94 of the conventional liquid-cooled heat dissipation system 9 cannot be tightly assembled with the corresponding components, it may lead to the leakage of the internal working fluid. Therefore, careful assembly is required, which is relatively time-consuming and labor-intensive. And the more components of the pipe fitting group 94, the higher the possibility of leakage; in addition, after a period of use, the pipe fitting group 94 will still have problems such as evaporation of the working fluid and aging and cracking of the pipe fittings. Shorter service life or more frequent need for overhaul and maintenance.

In view of this, it is still necessary to improve the conventional liquid cooling system.

In order to solve the above problems, the purpose of the present invention is to provide a liquid-cooled heat dissipation module, which can reduce the number of required components and reduce the space occupied by the assembly and combination of components, which can be applied to thin and light electronic devices.

The second purpose of this creation is to provide a liquid-cooled heat dissipation module, which can ensure that the working fluid will hardly leak or evaporate and gradually reduce the problem.

Another object of the present invention is to provide a liquid-cooled heat dissipation module, which can be assembled in advance so that it can be quickly assembled to a predetermined position of an electronic device.

Another object of the present invention is to provide a liquid-cooled heat dissipation module, which can dissipate heat efficiently by adding a heat dissipation fan.

The directionality described in the full text of this creation or its similar terms, such as "front", "back", "left", "right", "up (top)", "down (bottom)", "inside", "outside" , "sideways", etc., mainly refer to the directions of the attached drawings, and each directional or similar terms are only used to assist the description and understanding of the various embodiments of the present creation, and are not intended to limit the present creation.

The use of the quantifier "a" or "an" for the elements and components described in the full text of this creation is only for the convenience of use and to provide the general meaning of the scope of this creation; in this creation, it should be construed as including one or at least one, and a single The concept of also includes the plural case unless it is obvious that it means otherwise.

Similar terms such as "combination", "combination" or "assembly" mentioned in the whole text of this work mainly include the types of components that can be separated without destroying the components after connection, or the components cannot be separated after being connected, which are common knowledge in this field. can be based on the material or assembly requirements of the components to be connected. selector.

The liquid-cooled heat dissipation module of the present invention includes: a casing with a circulating flow channel in the casing, and a concave part on the outer surface of the casing; a pump for guiding a working fluid in the circulating flow channel circulating flow; and a heat dissipation fan, combined with the casing, and an air inlet of the heat dissipation fan communicates with the concave part.

Accordingly, in the liquid-cooled heat dissipation module of the present invention, a circulating flow channel can be formed directly in the casing of the liquid-cooled heat dissipation module, and the pump and the heat dissipation fan can be integrated and connected to the casing, thereby Significantly reduces the number of components required, which not only reduces the space occupied by the assembly and combination of components, but also ensures that the working fluid will not leak because the components are not tightly assembled. There is a problem that the working fluid evaporates and gradually decreases; at the same time, the cooling fan can help the liquid-cooled heat dissipation module to dissipate heat efficiently. In addition, the liquid-cooled heat dissipation module of the present invention can also be assembled in advance, so that it can be quickly assembled to a predetermined position of the electronic device. Therefore, the liquid-cooled heat dissipation module of the present invention has the functions of improving space utilization and assembly efficiency, and is helpful for the development of light and thin electronic devices having the liquid-cooled heat dissipation module.

Wherein, the shell has a heat absorption area and a cooling area, the heat absorption area and the cooling area can be respectively located in the part of the circulating flow channel, the heat absorption area can be used to thermally connect a heat source, the heat dissipation fan can be located in the cooling area. . In this way, the cooling fan can effectively help the cooling area to cool down quickly, and has the effect of improving the heat dissipation efficiency.

Wherein, the concave portion can be communicated with the outer periphery of the casing, the casing can have a through hole located in the concave portion, the through hole is not communicated with the circulating flow channel, and the air inlet of the cooling fan can pass through the through hole from the concave portion. Introduce airflow. In this way, the housing can have a simpler structure to ensure that the air flow can smoothly flow into the cooling fan from the recessed portion, thereby reducing the manufacturing cost and improving the assembly efficiency.

Wherein, the cooling fan has at least one air outlet, and the air outlet may not face the concave The recessed portion communicates with a portion of the outer periphery of the housing. In this way, the chance of the exhausted hot air being sucked back to the cooling fan through the recessed portion can be reduced, which has the effect of avoiding the circulation of the hot air and reducing the heat dissipation efficiency.

Wherein, the casing can have a base plate and a sealing plate, the sealing plate and the base plate can be combined with each other to form the circulating flow channel together, the concave part can be located in the sealing plate, and the base plate is used for thermally connecting a heat source. In this way, the housing can have a simpler structure to ensure that the air flow can smoothly flow into the cooling fan from the recessed portion, thereby reducing the manufacturing cost and improving the assembly efficiency.

Wherein, the base plate may have a first hole, the sealing plate may have a second hole located in the concave portion, the first hole and the second hole are opposite to each other and can form the through hole together. In this way, the housing can form the through hole with a simpler structure, which has the effects of reducing manufacturing cost and improving assembly efficiency.

Wherein, the base plate may have a protruding portion, the first hole may be located in the protruding portion, and a peripheral edge of the first hole may form a ring wall, and the ring wall may abut against the sealing plate. In this way, it can be ensured that the through hole does not communicate with the circulating flow channel, and the height of the circulating flow channel here is not reduced due to the through hole, which has the effect of maintaining the smoothness of the flow of the working fluid.

The substrate has a first side and a second side opposite to each other, the sealing plate can be combined with the first side of the substrate, the cooling fan can have a fan frame combined with the second side of the substrate, the through-hole can be combined with the second side of the substrate. The holes can be located in the fan frame, so that the air inlets of the cooling fan are formed by the through holes. In this way, the base plate of the cooling fan can be used as the cover plate on the air inlet side, so as to simplify the overall liquid-cooled heat dissipation module components, and has the effects of improving assembly efficiency and reducing axial thickness.

Wherein, the base plate has an opposite first side and a second side, the sealing plate can be combined with the first side of the base plate oppositely, and the base plate can have two flow holes respectively located at the head end and the tail end of the circulation channel , the two-flow hole can pass through the first side and the second side of the substrate, a shell of the pump can be combined with the second side of the substrate or connected with the second side of the substrate by integral molding, the two-flow hole The hole communicates with the inside of the housing. In this way, the circulation channel can directly communicate with the inside of the pump to save the The components used to connect the two have the functions of improving the convenience and efficiency of assembly.

Wherein, the base plate may have two flow holes respectively located at the head end and the tail end of the circulation flow channel and may be connected to the outer periphery of the base plate, a casing of the pump may have a liquid inlet and a liquid outlet, the The pump can be connected by a conduit to the liquid inlet and one of the flow holes, and can be connected to the liquid outlet and another flow hole by another conduit. In this way, the pump can be in an external form, and the two conduits can be changed according to installation requirements, so as to be suitable for various electronic devices with different installation space constraints, which has the effects of improving installation convenience and practicability.

The liquid-cooled heat dissipation module may further include an auxiliary heat sink, and the auxiliary heat sink may be thermally connected to the substrate. In this way, it has the effect of improving the overall heat dissipation efficiency.

Wherein, the auxiliary radiator may be located in the circulation flow channel. In this way, the arrangement of the auxiliary radiator also helps to improve the heat dissipation efficiency of the working fluid.

Wherein, the auxiliary radiator may be at least one heat pipe or vapor chamber. In this way, the form, quantity and configuration of the auxiliary radiator can be selected according to requirements such as installation space or heat dissipation efficiency, which has the effect of improving product design flexibility and performance.

Wherein, the sealing plate can have a hollow part, the base plate can have a convex wall, the convex wall can encircle a through hole, the sealing plate can abut against the convex wall, and the hollow part can be connected with the through hole Alignment connection. In this way, it is convenient to process the sealing plate along the hollow portion to form the concave portion, and besides the through hole, the casing has another air flow channel that is formed by the hollow portion and the through hole to pass through from top to bottom. In order to assist in improving the airflow rate of the two sides of the casing, it has the functions of improving manufacturing convenience and heat dissipation efficiency.

Wherein, the casing may have several rough structures, and the several rough structures may be located in the circulating flow channel. In this way, the contact area with the working fluid can be increased by the rough structures, which has the effect of improving the heat dissipation efficiency.

The liquid-cooled heat dissipation module may further include at least one enhanced heat dissipation component, the heat dissipation fan At least one air outlet is provided, and the reinforced heat dissipation component can be connected to the casing and positioned at the air outlet. In this way, the air flow driven by the cooling fan can be used to improve the heat dissipation efficiency of the enhanced heat dissipation component, which has the effect of improving the overall heat dissipation efficiency.

[This creation]

1: Shell

1a: Substrate

1b: Sealing plate

11: Circulation channel

12: Depressed part

13: Through hole

13a: first hole

13b: Second hole

14: Projection

15: Ring Wall

16: Flow hole

17: Basket Empty Department

18: Convex Wall

181: Through hole

2: Pump

21: Shell cover

211: liquid inlet

212: Liquid outlet

22: Impeller

23: Catheter

3: cooling fan

31: air inlet

32: fan frame

33: Fan wheel

34: Air outlet

4: Auxiliary radiator

5: Strengthen the heat dissipation components

E1: head end

E2: tail end

H: heat source

L: working fluid

P: rough structure

S1: first side

S2: Second side

T: outer surface

Z1: endothermic zone

Z2: Cooling Zone

(accustomed)

9: Liquid-cooled cooling system

91: Endothermic unit

92: cooling unit

93: Pump

94: Pipe Fittings

941,942,943: Pipe Fittings

H: heat source

[Fig. 1] A diagram of a conventional liquid-cooled heat dissipation system.

[Fig. 2] An exploded perspective view of the casing and the cooling fan of the first embodiment of the present invention.

[Fig. 3] An exploded perspective view of the casing of the first embodiment of the present invention.

[Fig. 4] The top view of the first embodiment of the present invention without the sealing plate.

[Fig. 5] A cross-sectional view taken along the line A-A in Fig. 4 according to the first embodiment of the present invention.

[Fig. 6] An exploded perspective view of the second embodiment of the present invention.

[Fig. 7] The top view of the second embodiment of the present invention without the sealing plate.

[Fig. 8] The second embodiment of the present invention is a cross-sectional view taken along the line B-B in Fig. 7.

[Fig. 9] An exploded perspective view of the third embodiment of the present invention.

In order to make the above-mentioned and other purposes, features and advantages of this creation more obvious and easy to understand, the preferred embodiments of this creation are given below, and are described in detail with the accompanying drawings; in addition, the same symbols are marked in different drawings. are considered to be the same, and their descriptions will be omitted.

Please refer to FIG. 2, which is the first embodiment of the liquid-cooled heat dissipation module of the present invention, which includes a casing 1, a pump 2 and a heat dissipation fan 3. The pump 2 and the heat dissipation fan 3 are both installed in the housing 1 .

The outer shell 1 is generally in the shape of a thin plate, so that it can be installed in a light and thin electronic device. built-in. The casing 1 can be made of, for example, copper, aluminum, titanium, stainless steel or other thermally conductive materials. Please refer to Figures 3 and 4. The casing 1 has a circulating flow channel 11 for supplying a working fluid L (marked at Fig. 5) circulating flow, for example, in the direction of the arrow shown in Fig. 4. The casing 1 may have a heat-absorbing zone Z1 and a cooling zone Z2. The heat-absorbing zone Z1 and the cooling zone Z2 are respectively located at the part of the circulating flow channel 11, so that the working fluid L can flow through the heat-absorbing zone Z1 and the cooling zone. Zone Z2; wherein, the housing 1 can be thermally connected to the heat source H of the electronic device by the heat absorbing zone Z1, and the cooling fan 3 can be positioned approximately in the cooling zone Z2 to help the cooling zone Z2 to rapidly cool down.

Please refer to Figures 2 and 4, the outer surface T of the casing 1 has a concave portion 12 connected to the outer circumference of the casing 1, so that after the casing 1 is placed in an electronic device such as a notebook or a mobile phone, even if it is attached Connected to the casing, circuit board or other forms of substrates of the electronic device, a space for introducing airflow can still be formed by the recess 12 to ensure that the airflow can flow into the cooling fan 3 smoothly. The casing 1 has a through hole 13 located in the concave portion 12, the through hole 13 passes through two opposite sides of the casing 1, and the through hole 13 is not communicated with the circulation channel 11; the cooling fan 3 is assembled to the After the casing 1 is installed, the cooling fan 3 can introduce airflow from the recessed portion 12 through the through hole 13 . In this embodiment, the concave portion 12 and the through hole 13 can be selectively disposed in the cooling zone Z2 , and the cooling fan 3 can be positioned opposite to the concave portion 12 . In other embodiments, the recessed portion 12 can also extend to any position of the housing 1 as long as the airflow on one side of the housing 1 can flow from the recessed portion 12 through the through hole 13 to the other side of the housing 1 That's it.

Please refer to FIGS. 3 and 5, the present invention does not limit the type of the casing 1. For example, the casing 1 of this embodiment may have a base plate 1a and a sealing plate 1b, and the base plate 1a has an opposite first One side S1 and a second side S2, the sealing plate 1b is located on the first side S1 of the substrate 1a, the second side S2 of the substrate 1a can be thermally connected to the heat source H, and the sealing plate 1b can be connected to the substrate 1a The two are combined relative to each other to form the circulating flow channel 11 therebetween; the recessed portion 12 is located on the sealing plate 1b. Wherein, the substrate 1a may be composed of a single-layer board or a stack of several layers. In this embodiment, a single-layer board is used. The board is taken as an example to illustrate, but it is not limited to this.

The substrate 1a of the present embodiment may be recessed on the surface of the first side S1 to form the circulation flow channel 11, and the substrate 1a may further have a first hole 13a, and the first hole 13a may be aligned on the substrate 1a to form the circulation Within the concave range of the flow channel 11, the sealing plate 1b may have a second hole 13b located in the concave portion 12; after the sealing plate 1b and the base plate 1a are relatively combined, the first hole 13a and the second hole 13b The through holes 13 are opposite and can be formed together. The structure of the substrate 1a and the sealing plate 1b where the through hole 13 is formed may be any type. For example, but not limited to, the substrate 1a of this embodiment may have a protruding portion 14, and the protruding portion 14 corresponds to The concave portion 12 protrudes toward the second side S2 , the first hole 13 a is located in the protruding portion 14 , and a peripheral edge of the first hole 13 a can form a ring wall 15 , so that the ring wall 15 can abut and combine the The sealing plate 1b prevents the through hole 13 from communicating with the circulating flow channel 11 , and the height of the circulating flow channel 11 here is not reduced due to the through hole 13 being provided.

On the other hand, please refer to Figures 3 and 4 again, the base plate 1a may further have two flow holes 16 , the second flow holes 16 are respectively located at the head end E1 and the tail end E2 of the circulation channel 11 and communicate with the pump Pump 2 , so that the working fluid L can flow into the circulation flow channel 11 through one of the flow holes 16 , and then leave the circulation flow channel 11 through the other flow hole 16 to flow through the pump 2 . In this embodiment, the two flow holes 16 can penetrate through the first side S1 and the second side S2 of the substrate 1a, so that the pump 2 can be disposed on the second side S2 of the substrate 1a.

In addition, please refer to Figures 3 and 5, the casing 1 may have several rough structures P, the several rough structures P are located in the circulation flow channel 11, and the several rough structures P can increase the relationship between the working fluid and the working fluid. The contact area of L can improve the heat dissipation efficiency; for example, the rough structure P can be in the form of capillary structure, groove, bump or column, and the rough structures P can be connected to the substrate 1a or the sealing plate. 1b is integrally formed and connected. Wherein, when the plurality of rough structures P are several convex pillars disposed in the circulating flow channel 11 at intervals, the height of each of the rough structures P may be approximately the same as the depth of the circulating flow channel 11 (excluding the convex column). the same at the outlet 14), so that the rough structures P can abut the sealing plate 1b or the base plate 1a provides the effect of auxiliary support, which helps the circulation flow channel 11 to maintain a substantially constant volume and prevents the casing 1 from being locally deformed.

Referring to Figures 3 and 4, the pump 2 of this embodiment may have a cover 21, the cover 21 may be connected to the second side S2 of the substrate 1a, and the second flow hole 16 of the substrate 1a The pair is located in the housing 21 , so that the circulating flow channel 11 can directly communicate with the inside of the pump 2 . The pump 2 further has an impeller 22 located in the casing 21, so that when the impeller 22 rotates, the working fluid L is sucked into the casing 21 from the rear end E2 of the circulation channel 11, and then the working fluid L is sucked into the casing 21. The working fluid L is re-introduced into the head end E1 of the circulation channel 11 , so that the working fluid L can circulate continuously in the circulation channel 11 . Wherein, the cover 21 can be combined with the second side S2 of the substrate 1a, or integrally formed and connected with the second side S2 of the substrate 1a, which is not limited in the present invention.

Referring to Figures 4 and 5, the cooling fan 3 can be combined with the casing 1 and located in the cooling zone Z2. An air inlet 31 of the cooling fan 3 communicates with the concave portion 12 , so that when the casing 1 is placed on the casing, circuit board or other forms of substrates of the electronic device with the sealing plate 1b, the concave portion 12 can still provide air intake. The space for wind ensures that the airflow can smoothly flow into the air inlet 31 of the cooling fan 3 . In this embodiment, the cooling fan 3 may have a fan frame 32 and a fan wheel 33, the fan frame 32 may be combined with the second side S2 of the substrate 1a, and the fan wheel 33 is rotatably disposed on the fan In other words, the base plate 1a of the cooling fan 3 can be used as a cover on its air inlet side, that is, the through hole 13 of the base plate 1a can be located inside the fan frame 32, so that the through hole 13 can form the heat dissipation The air inlet 31 of the fan 3 makes the components of the overall liquid-cooled heat dissipation module simpler, and the axial thickness is also thinner. The cooling fan 3 may further have at least one air outlet 34. When the cooling fan 3 is a centrifugal fan, the air outlet 34 may be formed by the substrate 1a and the fan frame 32 together; the cooling fan 3 is an axial fan. In the state, the air outlet 34 can be disposed on the fan frame 32, which is understood by those skilled in the art, and is not limited to the type disclosed in the drawings. In this way, when the fan wheel 33 rotates, the external airflow can flow into the fan frame 32 through the air inlet 31 (the through hole 13 ), and then flow out through the air outlet 34 to strengthen the casing The cooling efficiency of the cooling zone Z2 of 1.

In addition, the liquid-cooled heat dissipation module may also include an auxiliary heat sink 4, which may be, for example, at least one heat pipe and/or a vapor chamber, and the auxiliary heat sink 4 may be thermally connected to the substrate 1a to assist Absorb heat energy from heat source H. Wherein, the auxiliary radiator 4 may be located in the circulating flow channel 11 . In this embodiment, a heat pipe disposed in the circulating flow channel 11 is used as an example for illustration, but it is not limited thereto. The auxiliary radiator 4 of the present embodiment may be partially located in the cooling zone Z2.

When the liquid-cooled heat dissipation module of the first embodiment of the present invention is installed in an electronic device, the heat source H can be thermally connected to the substrate 1a of the casing 1, so that the heat absorption zone Z1 of the casing 1 can quickly absorb the heat of the heat source H. heat up. By rotating the impeller 22 of the pump 2, the working fluid L can be driven to flow in from the head end E1 of the circulating flow channel 11, and flow to the tail end E2 along the circulating flow channel 11, and the working fluid L can be When flowing through the heat-absorbing zone Z1 , the heat-absorbing zone Z1 of the casing 1 can be cooled by absorbing heat energy. The working fluid L, which has absorbed heat and heated up, circulates and flows through the operation of the pump 2, and when it flows through the cooling zone Z2 again, the cooling fan 3 increases the airflow rate around the cooling zone Z2, thereby helping the cooling zone Z2. The cooling zone Z2 cools down rapidly, so that the working fluid L flowing here can also quickly release heat energy to cool down, so as to effectively exert its heat-absorbing ability when it flows through the heat-absorbing zone Z1 again, so that the overall liquid-cooled heat dissipation module can dissipate heat. The improved efficiency enables the electronic device to maintain a proper operating temperature.

Please refer to Figures 6 and 7, which are the second embodiment of the liquid-cooled heat dissipation module of the present invention. This embodiment is substantially the same as the above-mentioned first embodiment. In this embodiment, the sealing plate 1b of the housing 1 may have a hollow portion 17 so as to form the concave portion 12 along the hollow portion 17 of the sealing plate 1b. Correspondingly, the substrate 1a may have a protruding wall 18 protruding toward the first side S1, the protruding wall 18 surrounds a through hole 181, and the through hole 181 penetrates the first side S1 and the second side S1 of the substrate 1a. side S2. When the base plate 1a is combined with the sealing plate 1b oppositely, the sealing plate 1b abuts against the convex wall 18 and the ring wall 15, so that the hollow part 17 is aligned with the through hole 181, and the first hole 13a It is aligned and communicated with the second hole 13b, so that in addition to the through hole 13, the casing 1 has another hollow portion 17 formed by the basket. The air flow channel formed with the through hole 181 up and down is used to help improve the air flow rate of the two sides of the casing 1 .

Please refer to Figures 7 and 8. On the other hand, the auxiliary radiator 4 of this embodiment is illustrated by a temperature equalizing plate disposed in the circulation flow channel 11 as an example, but it can also be replaced by the aforementioned first embodiment The illustrated heat pipe, or having the vapor chamber and the heat pipe at the same time, is not limited in the present invention. In addition, the liquid-cooled heat dissipation module of this embodiment may further include at least one reinforced heat dissipation component 5, which may be, for example, a set of fins, and the reinforced heat dissipation component 5 may be connected to the second side of the substrate 1a S2 is preferably located in the cooling zone Z2 to enhance the heat dissipation efficiency of the cooling zone Z2. In this embodiment, the enhanced heat dissipation component 5 can be connected to the housing 1 and positioned at the air outlet 34 of the heat dissipation fan 3 , for example, the enhanced heat dissipation assembly 5 can be disposed outside the air outlet 34 of the heat dissipation fan 3 or partially Extending into the air outlet 34 can utilize the airflow driven by the cooling fan 3 to improve the heat dissipation efficiency of the enhanced heat dissipation component 5 .

Please refer to FIG. 9, which is the third embodiment of the liquid-cooled heat dissipation module of the present invention. This embodiment provides an external pump 2, which is suitable for electronic devices with different installation space constraints.

To be more specific, in this embodiment, the two flow holes 16 of the substrate 1a can be respectively connected to the outer periphery of the substrate 1a, and the casing 21 can have a liquid inlet 211 and a liquid outlet 212, and can be connected by a conduit 23 is connected to the liquid inlet 211 and one of the flow holes 16 , and another conduit 23 is connected to the liquid outlet 212 and the other flow hole 16 . Accordingly, when the impeller 22 of the pump 2 rotates, the working fluid L can be sucked into the casing 21 through one of the conduits 23 from the rear end E2 of the circulating flow channel 11, and then the working fluid L can pass through another A conduit 23 is re-introduced into the head end E1 of the circulating flow channel 11 , so that the working fluid L can circulate continuously in the circulating flow channel 11 . In addition, the liquid-cooled heat dissipation modules of the above-mentioned first and second embodiments can also be applied to the pump 2 of this embodiment in an external form as long as the arrangement of the two flow holes 16 is modified. Usually the knowledgeable person understands it, and gives it according to the needs of use. to adjuster.

In addition, please refer to FIG. 2 , the air outlet 34 is preferably selected not to communicate with the recessed portion 12 to the outer periphery of the housing 1 , so as to reduce the exhausted hot air being sucked back to the heat dissipation through the recessed portion 12 The opportunity of fan 3 to avoid hot air circulation and reduce heat dissipation efficiency. Taking the embodiment shown in FIG. 9 as an example, the part where the recessed portion 12 communicates with the outer periphery of the casing 1 is one of the long sides and the short side of the casing 1 , and the cooling fan 3 with a single air outlet 34 is used in this embodiment. , so the air outlet 34 can be selected to face the other long side of the casing 1; on the contrary, in the embodiment using the cooling fan 3 with two air outlets 34, the two air outlets 34 can be directed towards the casing respectively. The other long side and the other short side of 1 , or at least one of the air outlets 34 is not connected to the outer periphery of the casing 1 toward the recessed portion 12 , such as the types disclosed in the foregoing embodiments.

To sum up, the liquid-cooled heat dissipation module of the present invention can directly form a circulating flow channel in the shell of the liquid-cooled heat dissipation module, and integrate the pump and the heat dissipation fan to connect the shell together. , so as to greatly reduce the number of required components, which can not only reduce the space occupied by the assembly and combination of components, but also ensure that the working fluid will not leak because the components are not tightly assembled. There is no problem that the working fluid evaporates and gradually decreases; at the same time, the cooling fan can help the liquid-cooled heat dissipation module to dissipate heat efficiently. In addition, the liquid-cooled heat dissipation module of the present invention can also be assembled in advance, so that it can be quickly assembled to a predetermined position of the electronic device. Therefore, the liquid-cooled heat dissipation module of the present invention has the functions of improving space utilization and assembly efficiency, and is helpful for the development of light and thin electronic devices having the liquid-cooled heat dissipation module.

Although the present creation has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present creation. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present creation. Therefore, the protection scope of this creation shall include all changes within the meaning and equivalent scope recorded in the appended patent application scope. In addition, when several of the above-mentioned embodiments can be combined, the present invention includes any combination of implementation aspects.

1: Shell

1a: Substrate

1b: Sealing plate

11: Circulation channel

12: Depressed part

13: Through hole

13a: first hole

13b: Second hole

14: Projection

15: Ring Wall

16: Flow hole

2: Pump

21: Shell cover

22: Impeller

3: cooling fan

31: air inlet

32: fan frame

33: Fan wheel

34: Air outlet

4: Auxiliary radiator

E1: head end

E2: tail end

P: rough structure

S1: First side

S2: Second side

T: outer surface

Claims (16)

A liquid-cooled heat dissipation module, comprising: a casing with a circulating flow channel in the casing, and a concave part on the outer surface of the casing; a pump for guiding a working fluid to circulate in the circulating flow channel ; and a cooling fan, combined with the casing, and an air inlet of the cooling fan communicates with the recessed portion. The liquid-cooled heat dissipation module of claim 1, wherein the housing has a heat absorption area and a cooling area, the heat absorption area and the cooling area are respectively located in parts of the circulation flow channel, and the heat absorption area is used for thermally connecting a The heat source, and the pair of cooling fans are located in the cooling zone. The liquid-cooled heat dissipation module of claim 1, wherein the concave portion communicates with the outer periphery of the casing, the casing has a through hole located in the concave portion, the through hole does not communicate with the circulation flow channel, and the inlet of the cooling fan The tuyere introduces airflow from the recess through the through hole. The liquid-cooled heat dissipation module of claim 3, wherein the heat dissipation fan has at least one air outlet, and the air outlet does not communicate with the portion of the outer periphery of the casing toward the recessed portion. The liquid-cooled heat dissipation module of claim 3, wherein the housing has a base plate and a sealing plate, the sealing plate and the base plate are combined oppositely to form the circulating flow channel, the recessed portion is located on the sealing plate, the base plate Used to thermally connect a heat source. The liquid-cooled heat dissipation module of claim 5, wherein the base plate has a first hole, the sealing plate has a second hole located in the concave portion, the first hole and the second hole are opposite to and together form the Through hole. The liquid-cooled heat dissipation module of claim 6, wherein the base plate has a protruding portion, the first hole is located in the protruding portion, and a peripheral edge of the first hole forms a ring wall, and the ring wall abuts and combines with the Seal plate. The liquid-cooled heat dissipation module of claim 5, wherein the base plate has a first side and a second side opposite to each other, the sealing plate is combined with the first side of the base plate oppositely, and the heat dissipation fan has a fan The frame is combined with the second side of the base plate, and the pair of through holes are located in the fan frame, so that the through holes form the air inlet of the cooling fan. The liquid-cooled heat dissipation module of claim 5, wherein the base plate has a first side and a second side opposite to each other, the sealing plate is combined with the first side of the base plate oppositely, and the base plate has two flow holes respectively located in The head end and the tail end of the circulation channel, the two flow holes penetrate through the first side and the second side of the substrate, and a casing of the pump is combined with the second side of the substrate or with the second side of the substrate are integrally formed and connected, and the two flow holes communicate with the inside of the shell. The liquid-cooled heat dissipation module of claim 5, wherein the base plate has two flow holes respectively located at the head end and the tail end of the circulation flow channel and communicated to the outer periphery of the base plate, and a casing of the pump has an inlet A liquid port and a liquid outlet, the pump is connected with the liquid inlet and one of the flow holes by a conduit, and is connected with the liquid outlet and another flow hole by another conduit. The liquid-cooled heat dissipation module of claim 5 further comprises an auxiliary heat sink, and the auxiliary heat sink is thermally connected to the substrate. The liquid-cooled heat dissipation module of claim 11, wherein the auxiliary radiator is located in the circulation flow channel. The liquid-cooled heat dissipation module of claim 11, wherein the auxiliary heat sink is at least one heat pipe or a vapor chamber. The liquid-cooled heat dissipation module of claim 5, wherein the sealing plate has a hollow portion, the base plate has a convex wall, the convex wall surrounds a through hole, the sealing plate abuts against the convex wall, the The hollow part of the basket is in alignment and communication with the through hole. The liquid-cooled heat dissipation module of claim 1, wherein the casing has a plurality of rough structures, and the plurality of rough structures are located in the circulation flow channel. The liquid-cooled heat dissipation module of any one of claims 1 to 15, further comprising at least one enhanced heat dissipation component, the heat dissipation fan has at least one air outlet, and the enhanced heat dissipation component is connected to the housing and located at the air outlet.

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