TWM508705U - Electronic device and liquid cooling type heat dissipation structure thereof - Google Patents

Description

Electronic device and liquid cooling heat dissipation structure thereof

The present invention relates to an electronic device and a heat dissipating structure thereof, and more particularly to an electronic device and a liquid cooling type heat dissipating structure thereof.

With the increase in processing speed and performance of the central processing unit (CPU), the current heat generation of the CPU is increased, and the higher operating frequency also increases the wattage during operation, and the high temperature generated by the CPU reduces the CPU. Lifespan, especially when too much heat is not effectively removed, can easily cause system instability. In order to solve the problem of CPU overheating, a combination of a heat sink and a fan is generally used to remove heat by forced cooling, thereby achieving the effect of maintaining the normal operation of the CPU. However, the disturbing noise and high power consumption of conventional fans at high speeds are often difficult for manufacturers to overcome.

In order to solve the above-mentioned conventional problems, a water-cooling head heat dissipation structure is born. The conventional water-cooling head heat dissipating structure comprises a body and a cover body disposed on the seat body, wherein the seat body has a plurality of heat sinks, the bottom of the seat body directly contacts a heat source, and the cover body has a water inlet hole and a drainage. Thereby, the bottom of the base body is in contact with the heat source, so that the heat generated by the heat source can be conducted to the plurality of heat sinks, and then the cooling liquid flows through the circulation between the water inlet hole and the water outlet hole to The heat absorbed by the multiple heat sinks is quickly guided away to achieve rapid heat dissipation. However, the pumped stator used in the conventional water-cooling head heat dissipation structure must be placed on the outermost side, so that the pumped stator must be farther away from the heat source than the pumped rotor, so the pump used in the conventional water-cooling head heat dissipation structure is used. The design is limited.

The technical problem to be solved by the present invention is to provide an electronic device and a liquid-cooled heat dissipation structure thereof in view of the deficiencies of the prior art.

A liquid-cooled heat dissipation structure provided by one embodiment of the present invention includes: a heat dissipation module and a water supply module. The heat dissipation module includes a heat conductive substrate, a shunt plate, a baffle, and an outer casing. The heat conducting substrate has a heat conducting body contacting at least one heat source and a plurality of heat dissipating fins disposed on the heat conducting body. The splitter plate is disposed on a plurality of the heat dissipation fins. The baffle is disposed on the shunt plate. The outer casing is disposed on the heat conductive body and covers a plurality of the heat dissipation fins, the flow dividing plate, and the deflector. The water supply module includes an outer cover body disposed on the outer casing of the heat dissipation module and at least one pump disposed in the outer cover body, wherein an inner space of the outer cover body is divided Forming a first independent space adjacent to the outer casing and a second independent space remote from the outer casing and not communicating with the first independent space, the pump including a first independent a stator in the space and a rotor disposed in the second independent space, and the stator is closer to the outer casing of the heat dissipation module than the rotor; wherein an inner space of the outer casing The deflector is divided into a first accommodating space and a second accommodating space that is not in communication with the first accommodating space, and the baffle has at least one of the second accommodating spaces. The deflector is open, and the splitter plate has at least one shunt opening connected between the second receiving space and a third receiving space for accommodating a plurality of the heat dissipating fins. The water supply module includes at least one first connecting pipe and at least one connection between the first accommodating space connected to the outer casing and the second independent space of the outer cover a second connecting conduit between the second independent space of the outer cover and the second receiving space of the outer casing; wherein the outer casing has at least one communication a liquid inlet of the first accommodating space and at least one liquid outlet connected to the third accommodating space, and the cooling liquid is driven by the pumped rotor to at least one of the liquid inlets Input to the inside of the outer casing and outputted from the at least one liquid outlet to the The exterior of the outer casing.

An electronic device provided by another embodiment of the present invention, the electronic device having at least one heat generating source, wherein the electronic device is internally mounted with a liquid cooling heat dissipating structure contacting at least one of the heat generating sources, wherein The liquid cooling heat dissipation structure comprises: a heat dissipation module and a water supply module. The heat dissipation module includes a heat conductive substrate, a shunt plate, a baffle, and an outer casing. The heat conducting substrate has a heat conducting body contacting at least one of the heat generating sources and a plurality of heat dissipating fins disposed on the heat conducting body. The splitter plate is disposed on a plurality of the heat dissipation fins. The baffle is disposed on the shunt plate. The outer casing is disposed on the heat conductive body and covers a plurality of the heat dissipation fins, the flow dividing plate, and the deflector. The water supply module includes an outer cover body disposed on the outer casing of the heat dissipation module and at least one pump disposed in the outer cover body, wherein an inner space of the outer cover body is divided Forming a first independent space adjacent to the outer casing and a second independent space remote from the outer casing and not communicating with the first independent space, the pump including a first independent a stator in the space and a rotor disposed in the second independent space, and the stator is closer to the outer casing of the heat dissipation module than the rotor. The inner space of the outer casing is divided into a first accommodating space by the baffle and a second accommodating space not communicating with the first accommodating space, the baffle having at least a baffle opening in the second accommodating space, and the shunt plate has at least one third accommodating space and a third accommodating space for accommodating a plurality of the heat dissipating fins a partition plate opening between the spaces; wherein the water supply module includes at least one of the first accommodating space connected to the outer casing and the second independent space of the outer cover a first connecting conduit and at least one second connecting conduit connected between the second independent space of the outer cover and the second receiving space of the outer casing; wherein the outer portion The housing has at least one liquid inlet connected to the first accommodating space and at least one liquid outlet connected to the third accommodating space, and the cooling liquid is driven by the pumped rotor. Inputting from at least one of the liquid input ports to the outside The inside of the housing is output from at least one of the liquid outlets to the outside of the outer casing.

A liquid-cooled heat dissipation structure according to another embodiment of the present invention includes: a heat dissipation module and a water supply module. The water supply module includes an outer cover body disposed on the heat dissipation module and at least one pump disposed in the outer cover body, wherein an inner space of the outer cover body is divided into a proximity heat dissipation mode a first independent space of the group and a second independent space away from the heat dissipation module and not connected to the first independent space, and the pump includes a stator disposed in the first independent space and a rotor disposed in the second independent space, and the stator is closer to the heat dissipation module than the rotor.

The beneficial effects of the present invention may be that the electronic device and the liquid-cooling heat dissipation structure thereof provided by the embodiment of the present invention may be divided into a first independent adjacent to the outer casing by the inner space of the outer cover body. a space and a second independent space remote from the outer casing and not in communication with the first independent space, the pump including a stator disposed in the first independent space and a first The inner space of the outer casing is divided into a first accommodating space by the baffle and a second accommodating space not communicating with the first accommodating space. And the water supply module includes at least one first connecting conduit between the first receiving space connected to the outer casing and the second independent space of the outer cover and at least one a second connecting conduit connected between the second independent space of the outer cover and the second receiving space of the outer casing" such that the stator is more than the rotor The outer casing adjacent to the heat dissipation module Or closer to the at least one heat generating source.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

D‧‧‧Electronic device

H‧‧‧heat source

Z‧‧‧Liquid cooled heat dissipation structure

M1‧‧‧ Thermal Module

1‧‧‧thermal substrate

10‧‧‧thermal body

11‧‧‧ Heat sink fins

11A‧‧‧First heat sink

11B‧‧‧second heat sink

2‧‧‧Splitter

20‧‧‧Diverter opening

21‧‧‧ Main body

22‧‧‧Protruding

23‧‧‧Depression

24‧‧‧Limited

3‧‧‧Baffle

30‧‧‧Baffle opening

31‧‧‧ vertical section

32‧‧‧ inclined section

33‧‧‧Extension

34‧‧‧First support

35‧‧‧Connecting Department

36‧‧‧Second support

4‧‧‧External housing

400‧‧‧ side

401‧‧‧ inner surface

41‧‧‧Liquid input

42‧‧‧Liquid outlet

R1‧‧‧First accommodation space

R2‧‧‧Second space

R3‧‧‧ third accommodating space

M2‧‧‧ water supply module

5‧‧‧Outer cover

5A‧‧‧First cover body

5B‧‧‧Second cover body

51‧‧‧First independent space

52‧‧‧Second independent space

6‧‧‧ pump

61‧‧‧ Stator

62‧‧‧Rotor

7‧‧‧First connecting line

71‧‧‧First end

72‧‧‧second end

8‧‧‧Second connection line

81‧‧‧First end

82‧‧‧second end

W‧‧‧Cooling liquid

S‧‧‧ screws

FIG. 1 is a schematic perspective view of a liquid-cooled heat dissipation structure of the present invention.

FIG. 2 is a perspective exploded view of one of the viewing angles of the liquid cooling heat dissipation structure of the present invention.

FIG. 3 is a perspective exploded view of another viewing angle of the liquid cooling heat dissipation structure of the present invention.

4 is a side view showing the liquid cooling type heat dissipation structure of the present invention applied to an electronic device.

FIG. 5 is a schematic top view of the liquid cooling heat dissipation structure of the present invention.

Fig. 6 is a schematic cross-sectional view showing the A-A cut line of Fig. 5;

Fig. 7 is a schematic cross-sectional view showing the line B-B of Fig. 5;

Figure 8 is a schematic cross-sectional view of the C-C cut line of Figure 4;

Fig. 9 is a schematic cross-sectional view showing the D-D cut line of Fig. 5;

Fig. 10 is a schematic cross-sectional view showing the E-E cut line of Fig. 5;

The following is a specific example to illustrate the implementation of the "electronic device and its liquid-cooled heat dissipation structure" disclosed in the present disclosure, and those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in the present specification. The present invention can be implemented or applied in various other specific embodiments. The details of the present specification can also be modified and changed without departing from the spirit and scope of the present invention. In addition, the drawings of this creation are only for a brief illustration, and are not described in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosed content is not intended to limit the technical scope of the present creation.

As shown in FIG. 1 to FIG. 10 , the present invention provides a liquid-cooled heat dissipation structure Z, which includes a heat dissipation module M1 and a water supply module M2. The heat dissipation module M1 includes a heat-conducting substrate 1 and a manifold. 2. A deflector 3 and an outer casing 4.

First, as shown in FIG. 1 to FIG. 4, the heat-conducting substrate 1 has a heat-conducting body 10 contacting at least one heat source H (for example, a CUP or any heat-generating wafer) and a plurality of heat-dissipating fins 11 disposed on the heat-conducting body 10. . In addition, the diverter plate 2 is disposed in a plurality of scattered On the heat fin 11 , the baffle plate 3 is disposed on the shunt plate 2 , and the outer casing 4 is detachably disposed on the heat conductive body 10 by a plurality of screws S and covers the plurality of heat dissipating fins 11 and the shunt plate 2 . And the baffle 3.

Furthermore, as shown in FIG. 1 to FIG. 3 and FIG. 7 , the water supply module M2 includes an outer cover 5 disposed on the outer casing 4 of the heat dissipation module M1 and at least one pump disposed in the outer cover 5 . Pu 6. Furthermore, the outer cover 5 includes a first cover portion 5A and a second cover portion 5B disposed on the first cover portion 5A.

It should be noted that, as shown in FIG. 1 , FIG. 2 , FIG. 7 and FIG. 10 , the inner space of the outer cover 5 is divided into a first independent space 51 adjacent to the outer casing 4 and a remote from the outer casing 4 and The second independent space 52 in which the first independent spaces 51 are not connected to each other. Further, the pump 6 includes a stator 61 disposed in the first independent space 51 and a rotor 62 disposed in the second independent space 52, and the stator 61 is closer to the outer casing 4 of the heat dissipation module M1 than the rotor 62. In addition, the internal space of the outer casing 4 is divided by the deflector 3 into a first accommodating space R1 and a second accommodating space R2 that is not in communication with the first accommodating space R1. The baffle plate 3 has at least one baffle opening 30 that is connected between the second accommodating space R2 and the third accommodating space R3, and the shunt plate 2 has at least one connected to the second accommodating space R2 and A shunt plate opening 20 for accommodating the plurality of heat dissipating fins 11 between the third accommodating spaces R3.

Furthermore, with reference to FIG. 1 to FIG. 3 and FIG. 7 , the water supply module M2 includes at least one second independent space 52 connected to the first accommodating space R1 of the outer casing 4 and the outer cover 5 . A first connecting line 7 between the first connecting line 7 and at least one second connecting space 8 connected to the second independent space 52 of the outer cover 5 and the second receiving space R2 of the outer casing 4. In addition, as shown in FIG. 6 and FIG. 10, the outer casing 4 has at least one liquid input port 41 communicating with the first accommodating space R1 and at least one liquid output port 42 communicating with the third accommodating space R3, and is cooled. The liquid W is driven by the rotor 62 of the pump 6 to be input from at least one liquid input port 41 to the inside of the outer casing 4, and is output from the at least one liquid outlet port 42 to the outside of the outer casing 4.

Furthermore, as shown in FIG. 2 and FIG. 3, one of the first connecting lines 7 A first end portion 81 of the first end portion 71 and the second connecting conduit 8 are respectively connected to opposite side ends 400 of the outer casing 4, and a second end portion 72 and a second portion of the first connecting conduit 7 A second end portion 82 of the connecting line 8 is connected to the top end of the outer cover 5.

Furthermore, as shown in FIG. 2, FIG. 3, and FIG. 10, the plurality of heat dissipation fins 11 can be divided into two oppositely disposed first heat dissipation portions 11A and one connected between the two first heat dissipation portions 11A. The second heat radiating portion 11B, and the splitter plate 2 has a main body portion 21 contacting the two first heat radiating portions 11A, and a projection portion 22 projecting downward from the bottom end of the main body portion 21 to contact the second heat radiating portion 11B. A recessed portion 23 recessed downward from the top end of the main body portion 21, and a limiting portion 24 projecting upward from the top end of the main body portion 21.

Further, as shown in FIGS. 2, 3, and 7, the deflector 3 is restrained between the inner surface 401 of the outer casing 4 and the splitter plate 2. The deflector 3 has a vertical portion 31 that abuts against the inner surface 401 of the outer casing 4, and extends obliquely laterally from a bottom end of the vertical portion 31 toward a first predetermined direction to laterally abut against the outer casing 4. The inclined portion 32 of the surface 401, both extending laterally from the vertical portion 31 toward a second predetermined direction to laterally abut the extension portion 33 of the inner surface 401 of the outer casing 4, the two vertical portions 31, the inclined portion 32 And the two extending portions 33 extend downward to abut against the main body portion 21 of the splitter plate 2 and respectively contact the first supporting portion 34 of the two limiting portions 24, and are connected between the two first supporting portions 34 The connecting portion 35 and the two extending downward from the vertical portion 31, the inclined portion 32, and the two extending portions 33 are respectively positioned in the two recessed portions 23 of the splitter plate 2 and respectively contact the two limiting portions 24. The second support portion 36.

It should be noted that the cooling liquid W is driven by the rotor 62 of the pump 6 to be input from at least one liquid input port 41 to the inside of the outer casing 4, and is output from the at least one liquid outlet port 42 to the outer casing 4. The outside. In addition, the flow order of the cooling liquid W may be sequentially referred to FIGS. 6, 7, 8, 9, 7, and 10.

Referring to FIG. 4, the creation additionally provides an electronic device D (such as a computer). The main unit), wherein the electronic device D has at least one heat source H, and the inside of the electronic device is mounted with a liquid cooling heat dissipation structure contacting at least one heat source. It should be noted that the electronic device D uses a liquid-cooled heat dissipation structure Z disposed on at least one heat source H to provide a heat source H for water cooling. Of course, the electronic device D can also be replaced with any heat dissipation carrier. For example, the heat dissipation carrier plate may be a heat dissipation plate, and the liquid cooling heat dissipation structure Z may be placed on the heat dissipation plate to improve the overall heat dissipation performance of the heat dissipation plate.

[Effective effect of the embodiment]

The beneficial effects of the present invention may be that the electronic device D and the liquid-cooling heat dissipation structure Z thereof provided by the present embodiment can be divided into a first independent adjacent outer casing 4 by the inner space of the outer cover 5. a space 51 and a second independent space 52 remote from the outer casing 4 and not communicating with the first independent space 51. The pump 6 includes a stator 61 disposed in the first independent space 51 and a second independent space disposed in the second independent space. The inner space of the outer casing 4 is divided into a first accommodating space R1 and a second accommodating space R2 that is not connected to the first accommodating space R1, and The water supply module M2 includes at least one first connecting line 7 connected between the first accommodating space R1 of the outer casing 4 and the second independent space 52 of the outer cover 5 and at least one connected to the outer cover 5 The second connecting conduit 8" between the second independent space 52 and the second receiving space R2 of the outer casing 4 is designed such that the stator 61 is closer to the outer casing 4 of the heat dissipation module M1 than the rotor 62, Or closer to at least one heat source H.

The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the schema are included in the scope of protection of the present creation. .

Z‧‧‧Liquid cooled heat dissipation structure

M1‧‧‧ Thermal Module

1‧‧‧thermal substrate

10‧‧‧thermal body

11‧‧‧ Heat sink fins

11A‧‧‧First heat sink

11B‧‧‧second heat sink

2‧‧‧Splitter

20‧‧‧Diverter opening

21‧‧‧ Main body

22‧‧‧Protruding

23‧‧‧Depression

24‧‧‧Limited

3‧‧‧Baffle

31‧‧‧ vertical section

32‧‧‧ inclined section

33‧‧‧Extension

34‧‧‧First support

35‧‧‧Connecting Department

36‧‧‧Second support

4‧‧‧External housing

400‧‧‧ side

41‧‧‧Liquid input

42‧‧‧Liquid outlet

M2‧‧‧ water supply module

5‧‧‧Outer cover

5A‧‧‧First cover body

5B‧‧‧Second cover body

6‧‧‧ pump

62‧‧‧Rotor

7‧‧‧First connecting line

71‧‧‧First end

72‧‧‧second end

8‧‧‧Second connection line

81‧‧‧First end

82‧‧‧second end

S‧‧‧ screws

Claims (10)

A liquid-cooling heat dissipation structure includes: a heat dissipation module, the heat dissipation module includes: a heat-conducting substrate, the heat-conducting substrate has a heat-conducting body contacting at least one heat source and a plurality of settings a heat dissipating fin on the heat conducting body; a shunt plate disposed on the plurality of heat dissipating fins; a baffle plate disposed on the shunt plate; and an outer portion a housing, the outer housing is disposed on the heat conducting body and covers a plurality of the heat dissipation fins, the flow dividing plate, and the deflector; and a water supply module, wherein the water supply module includes a An outer cover body disposed on the outer casing of the heat dissipation module and at least one pump disposed in the outer cover body, wherein an inner space of the outer cover body is divided into an adjacent outer casing a first independent space and a second independent space remote from the outer casing and not communicating with the first independent space, the pump including a stator and a setting disposed in the first independent space In the second independent space An inner rotor, wherein the stator is closer to the outer casing of the heat dissipation module than the rotor; wherein an inner space of the outer casing is divided into a first accommodation space by the deflector a second accommodating space that is not in communication with the first accommodating space, the baffle has at least one baffle opening in the second accommodating space, and the shunt plate has at least one connection a flow divider opening between the second accommodating space and a third accommodating space for accommodating the plurality of the heat dissipation fins; wherein the water supply module includes at least one connected to the outer portion a first connecting conduit between the first receiving space of the housing and the second independent space of the outer cover and at least one second independent space and a second independent space connected to the outer cover a second connecting line between the second accommodating spaces of the outer casing; The outer casing has at least one liquid inlet connected to the first accommodating space and at least one liquid outlet connected to the third accommodating space, and the cooling liquid passes through the pump. The driving of the rotor is input from at least one of the liquid input ports to the inside of the outer casing, and is output from at least one of the liquid outlets to the outside of the outer casing. The liquid cooling heat dissipation structure according to claim 1, wherein a first end portion of the first connecting pipe and a first end portion of the second connecting pipe are respectively connected to the outer casing Two opposite end ends, and a second end portion of the first connecting pipe and a second end portion of the second connecting pipe are connected to a top end of the outer cover body, wherein the plurality of heat dissipation portions The fin is divided into two opposite first heat dissipating portions and a second heat dissipating portion connected between the two first heat dissipating portions, and the shunt plate has a contact with the two first heat dissipating portions. a main body portion, a protrusion protruding downward from the bottom end of the main body portion to contact the second heat dissipating portion, a recess portion recessed downward from a top end of the main body portion, and a body from the main body A limit portion that protrudes upward from the top of the portion. The liquid cooling heat dissipation structure according to claim 2, wherein the deflector is restrained between an inner surface of the outer casing and the flow dividing plate, and the deflector has an upward topping a vertical portion of the inner surface of the outer casing, a slope extending laterally obliquely from a bottom end of the vertical portion toward a first predetermined direction to laterally abut against the inclined portion of the inner surface of the outer casing And two extending laterally from the vertical portion toward a second predetermined direction to laterally abut the extension of the inner surface of the outer casing, two from the vertical portion, the inclined portion, and The two extending portions extend downward to abut the main body portion of the flow dividing plate and respectively contact the first supporting portions of the two limiting portions, and are connected to the two first supporting portions The connecting portion between the two, and the two extending from the vertical portion, the inclined portion, and the two extending portions are respectively positioned in the two recessed portions of the splitter plate and respectively contact two a second support portion of the limiting portion. An electronic device having at least one heat source, the electronic device The liquid-cooled heat-dissipating structure of the liquid-cooled heat-dissipating structure includes: a heat-dissipating module, the heat-dissipating module includes: a heat-conducting substrate, The heat conducting substrate has a heat conducting body contacting at least one of the heat generating sources and a plurality of heat dissipating fins disposed on the heat conducting body; a shunt plate disposed on the plurality of the heat dissipating fins; a diversion flow a baffle plate disposed on the shunt plate; and an outer casing disposed on the heat conducting body and covering the plurality of the fins, the shunt plate, and the And a water supply module, the water supply module includes an outer cover body disposed on the outer casing of the heat dissipation module and at least one pump disposed in the outer cover body The inner space of the outer cover is divided into a first independent space adjacent to the outer casing and a second independent space away from the outer casing and not communicating with the first independent space. Pump includes a setting a stator in the first independent space and a rotor disposed in the second independent space, and the stator is closer to the outer casing of the heat dissipation module than the rotor; wherein the outer portion The inner space of the casing is divided into a first accommodating space and a second accommodating space that is not in communication with the first accommodating space, and the baffle has at least one located at the a baffle opening in the accommodating space, and the shunt plate has at least one connected between the second accommodating space and a third accommodating space for accommodating the plurality of the fins a water distribution module, wherein the water supply module includes at least one first connecting line connected between the first accommodating space of the outer casing and the second independent space of the outer cover And at least one second connecting line connected between the second independent space of the outer cover and the second receiving space of the outer casing; wherein the outer casing has at least one connection Liquid passing through the first accommodating space a body input port and at least one liquid outlet connected to the third accommodating space, and the cooling liquid is driven by the pumped rotor to be input to the outer casing from at least one of the liquid input ports The inside of the body is output from at least one of the liquid outlets to the outside of the outer casing. The electronic device of claim 4, wherein a first end portion of the first connecting conduit and a first end portion of the second connecting conduit are respectively connected to opposite sides of the outer casing And a second end portion of the first connecting pipe and a second end portion of the second connecting pipe are connected to a top end of the outer cover body, wherein the plurality of the heat dissipating fins are divided a first heat dissipating portion disposed opposite to each other and a second heat dissipating portion connected between the two first heat dissipating portions, and the shunt plate has a main body portion contacting the two first heat dissipating portions, a projection protruding downward from the bottom end of the main body portion to contact the second heat dissipating portion, a recess portion recessed downward from a top end of the main body portion, and a top portion from the main body portion a limit portion that protrudes upward. The electronic device of claim 5, wherein the baffle is constrained between an inner surface of the outer casing and the diverter plate, and the baffle has an upwardly abutting outer portion a vertical portion of the inner surface of the housing, an inclined portion extending laterally obliquely from a bottom end of the vertical portion toward a first predetermined direction to laterally abut against the inner surface of the outer casing, two Extending laterally from the vertical portion toward a second predetermined direction to laterally abut the extension of the inner surface of the outer casing, two from the vertical portion, the inclined portion, and two The extension portion extends downward to abut the body portion of the splitter plate and respectively contacts the first support portion of the two limiting portions, and is connected between the two first support portions. a connecting portion, and two extending downward from the vertical portion, the inclined portion, and the two extending portions to be respectively positioned in the two recessed portions of the splitter plate and respectively contacting the two of the limits a second support portion of the position. A liquid cooling heat dissipation structure, the liquid cooling heat dissipation structure comprising: a heat dissipation module: a water supply module, the water supply module includes an outer cover body disposed on the heat dissipation module and at least one pump disposed in the outer cover body, wherein an inner space of the outer cover body is divided into one a first independent space adjacent to the heat dissipation module and a second independent space away from the heat dissipation module and not communicating with the first independent space, and the pump includes a first independent device a stator in the space and a rotor disposed in the second independent space, and the stator is closer to the heat dissipation module than the rotor. The liquid-cooling heat dissipation structure of claim 7, wherein the heat dissipation module comprises: a heat-conducting substrate, a shunt plate, a baffle, and an outer casing, wherein the heat-conducting substrate has a contact with at least one heat a heat conducting body of the source and a plurality of heat dissipating fins disposed on the heat conducting body, the shunt plate being disposed on the plurality of heat dissipating fins, the baffle plate being disposed on the shunt plate, and the outer portion The housing is disposed on the heat conducting body and covers the plurality of the heat dissipation fins, the flow dividing plate, and the deflector, wherein the water supply module includes a front portion disposed on the heat dissipation module An outer cover body on the housing and at least one pump disposed in the outer cover body, wherein an inner space of the outer cover body is divided into a first independent space adjacent to the outer casing and a distance away from the outer a second independent space of the housing and not communicating with the first independent space, the pump comprising a stator disposed in the first independent space and a rotor disposed in the second independent space, And the stator is closer than the rotor The outer casing of the heat dissipation module, wherein the inner space of the outer casing is divided into a first accommodating space by the baffle and a first part that is not connected to the first accommodating space The accommodating space has at least one baffle opening in the second accommodating space, and the baffle has at least one connected to the second accommodating space and one for receiving And a partitioning plate opening between the third accommodating spaces of the plurality of heat dissipating fins, wherein the water supply module includes at least one first accommodating space connected to the outer casing and the outer cover a first connecting conduit between the second independent spaces of the body and at least one second independent space connected to the outer cover a second connecting line between the second accommodating spaces of the outer casing. The liquid-cooling heat dissipation structure according to claim 8, wherein a first end portion of the first connecting pipe and a first end portion of the second connecting pipe are respectively connected to the outer casing Two opposite end ends, and a second end portion of the first connecting pipe and a second end portion of the second connecting pipe are connected to a top end of the outer cover body, wherein the plurality of heat dissipation portions The fin is divided into two opposite first heat dissipating portions and a second heat dissipating portion connected between the two first heat dissipating portions, and the shunt plate has a contact with the two first heat dissipating portions. a main body portion, a protrusion protruding downward from the bottom end of the main body portion to contact the second heat dissipating portion, a recess portion recessed downward from a top end of the main body portion, and a body from the main body A limit portion that protrudes upward from the top of the portion. The liquid cooling heat dissipation structure according to claim 9, wherein the baffle is restrained between an inner surface of the outer casing and the flow dividing plate, and the baffle has an upward topping a vertical portion of the inner surface of the outer casing, a slope extending laterally obliquely from a bottom end of the vertical portion toward a first predetermined direction to laterally abut against the inclined portion of the inner surface of the outer casing And two extending laterally from the vertical portion toward a second predetermined direction to laterally abut the extension of the inner surface of the outer casing, two from the vertical portion, the inclined portion, and The two extending portions extend downward to abut the main body portion of the flow dividing plate and respectively contact the first supporting portions of the two limiting portions, and are connected to the two first supporting portions The connecting portion between the two, and the two extending from the vertical portion, the inclined portion, and the two extending portions are respectively positioned in the two recessed portions of the splitter plate and respectively contact two a second support portion of the limiting portion.