TWI799949B - Close loop liquid cooling burn-in apparatus and temperature control method thereof - Google Patents

Close loop liquid cooling burn-in apparatus and temperature control method thereof Download PDF

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Publication number
TWI799949B
TWI799949B TW110130349A TW110130349A TWI799949B TW I799949 B TWI799949 B TW I799949B TW 110130349 A TW110130349 A TW 110130349A TW 110130349 A TW110130349 A TW 110130349A TW I799949 B TWI799949 B TW I799949B
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TW
Taiwan
Prior art keywords
control method
temperature control
liquid cooling
close loop
loop liquid
Prior art date
Application number
TW110130349A
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Chinese (zh)
Other versions
TW202310709A (en
Inventor
孫偉志
劉少淇
陳蘊函
洪義豪
楊志明
宋定謙
Original Assignee
伊士博國際商業股份有限公司
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Priority to TW110130349A priority Critical patent/TWI799949B/en
Publication of TW202310709A publication Critical patent/TW202310709A/en
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Publication of TWI799949B publication Critical patent/TWI799949B/en

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TW110130349A 2021-08-17 2021-08-17 Close loop liquid cooling burn-in apparatus and temperature control method thereof TWI799949B (en)

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Application Number Priority Date Filing Date Title
TW110130349A TWI799949B (en) 2021-08-17 2021-08-17 Close loop liquid cooling burn-in apparatus and temperature control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110130349A TWI799949B (en) 2021-08-17 2021-08-17 Close loop liquid cooling burn-in apparatus and temperature control method thereof

Publications (2)

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TW202310709A TW202310709A (en) 2023-03-01
TWI799949B true TWI799949B (en) 2023-04-21

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TW110130349A TWI799949B (en) 2021-08-17 2021-08-17 Close loop liquid cooling burn-in apparatus and temperature control method thereof

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM508705U (en) * 2015-06-12 2015-09-11 Cooler Master Co Ltd Electronic device and liquid cooling type heat dissipation structure thereof
JP2020129605A (en) * 2019-02-08 2020-08-27 富士電機株式会社 Semiconductor module, semiconductor device, and method of manufacturing the same
JP2020186658A (en) * 2019-05-10 2020-11-19 株式会社村田製作所 Cooling module and circuit board
TWM612914U (en) * 2021-03-17 2021-06-01 奇鋐科技股份有限公司 Liquid-cooling heat dissipation structure
TWM615379U (en) * 2021-01-19 2021-08-11 伊士博國際商業股份有限公司 Burn-in socket with flexible electrical connection built therein
TWM621477U (en) * 2021-08-17 2021-12-21 伊士博國際商業股份有限公司 Close loop liquid cooling burn-in apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM508705U (en) * 2015-06-12 2015-09-11 Cooler Master Co Ltd Electronic device and liquid cooling type heat dissipation structure thereof
JP2020129605A (en) * 2019-02-08 2020-08-27 富士電機株式会社 Semiconductor module, semiconductor device, and method of manufacturing the same
JP2020186658A (en) * 2019-05-10 2020-11-19 株式会社村田製作所 Cooling module and circuit board
TWM615379U (en) * 2021-01-19 2021-08-11 伊士博國際商業股份有限公司 Burn-in socket with flexible electrical connection built therein
TWM612914U (en) * 2021-03-17 2021-06-01 奇鋐科技股份有限公司 Liquid-cooling heat dissipation structure
TWM621477U (en) * 2021-08-17 2021-12-21 伊士博國際商業股份有限公司 Close loop liquid cooling burn-in apparatus

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Publication number Publication date
TW202310709A (en) 2023-03-01

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