TWI799949B - Close loop liquid cooling burn-in apparatus and temperature control method thereof - Google Patents
Close loop liquid cooling burn-in apparatus and temperature control method thereof Download PDFInfo
- Publication number
- TWI799949B TWI799949B TW110130349A TW110130349A TWI799949B TW I799949 B TWI799949 B TW I799949B TW 110130349 A TW110130349 A TW 110130349A TW 110130349 A TW110130349 A TW 110130349A TW I799949 B TWI799949 B TW I799949B
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- control method
- temperature control
- liquid cooling
- close loop
- loop liquid
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Priority Applications (1)
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TW110130349A TWI799949B (en) | 2021-08-17 | 2021-08-17 | Close loop liquid cooling burn-in apparatus and temperature control method thereof |
Applications Claiming Priority (1)
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TW110130349A TWI799949B (en) | 2021-08-17 | 2021-08-17 | Close loop liquid cooling burn-in apparatus and temperature control method thereof |
Publications (2)
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TW202310709A TW202310709A (en) | 2023-03-01 |
TWI799949B true TWI799949B (en) | 2023-04-21 |
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TW110130349A TWI799949B (en) | 2021-08-17 | 2021-08-17 | Close loop liquid cooling burn-in apparatus and temperature control method thereof |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM508705U (en) * | 2015-06-12 | 2015-09-11 | Cooler Master Co Ltd | Electronic device and liquid cooling type heat dissipation structure thereof |
JP2020129605A (en) * | 2019-02-08 | 2020-08-27 | 富士電機株式会社 | Semiconductor module, semiconductor device, and method of manufacturing the same |
JP2020186658A (en) * | 2019-05-10 | 2020-11-19 | 株式会社村田製作所 | Cooling module and circuit board |
TWM612914U (en) * | 2021-03-17 | 2021-06-01 | 奇鋐科技股份有限公司 | Liquid-cooling heat dissipation structure |
TWM615379U (en) * | 2021-01-19 | 2021-08-11 | 伊士博國際商業股份有限公司 | Burn-in socket with flexible electrical connection built therein |
TWM621477U (en) * | 2021-08-17 | 2021-12-21 | 伊士博國際商業股份有限公司 | Close loop liquid cooling burn-in apparatus |
-
2021
- 2021-08-17 TW TW110130349A patent/TWI799949B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM508705U (en) * | 2015-06-12 | 2015-09-11 | Cooler Master Co Ltd | Electronic device and liquid cooling type heat dissipation structure thereof |
JP2020129605A (en) * | 2019-02-08 | 2020-08-27 | 富士電機株式会社 | Semiconductor module, semiconductor device, and method of manufacturing the same |
JP2020186658A (en) * | 2019-05-10 | 2020-11-19 | 株式会社村田製作所 | Cooling module and circuit board |
TWM615379U (en) * | 2021-01-19 | 2021-08-11 | 伊士博國際商業股份有限公司 | Burn-in socket with flexible electrical connection built therein |
TWM612914U (en) * | 2021-03-17 | 2021-06-01 | 奇鋐科技股份有限公司 | Liquid-cooling heat dissipation structure |
TWM621477U (en) * | 2021-08-17 | 2021-12-21 | 伊士博國際商業股份有限公司 | Close loop liquid cooling burn-in apparatus |
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Publication number | Publication date |
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TW202310709A (en) | 2023-03-01 |
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