TWM612914U - Liquid-cooling heat dissipation structure - Google Patents

Abstract

A liquid-cooled heat-dissipating structure includes a cover body covering a substrate and defining a heat exchange chamber in the Between the cover and the substrate, a heat dissipation fin unit and a block are arranged in the heat exchange chamber. The blocking portion divides a cooling liquid entering the heat exchange chamber first, so that the cooling fluid flows from the periphery of the heat dissipation fin unit and then to the middle of the heat dissipation fin unit, so as to prevent it from passing straight through the heat dissipation. The fin unit, the periphery of the heat dissipation fin unit is also optionally equipped with a plurality of baffle convex bodies to help the cooling liquid evenly flow through the heat dissipation fin unit. Through the structural design of this creation, the effect of greatly improving the heat exchange efficiency can be achieved.

Description

Liquid cooling structure

This creation is related to the field of liquid heat dissipation structures, especially the heat dissipation structure of a liquid (water) cold head.

As the demand for big data and cloud computing services has increased significantly, the heat dissipation requirements of related electronic products have also become higher, especially for servers in large computing centers, whose computing density has increased, and the waste heat generated in a space of the same size has also increased significantly In order to reduce the energy consumed for heat dissipation, liquids have recently been used to take the heat source away from the server and dissipate heat in other ways to solve the problem of high-density waste heat.

The operating mechanism of the water-cooling head or the water-cooling plate is that the working liquid takes away the heat of the chip. The working liquid will gradually heat up when passing through the chip. Therefore, the temperature distribution of the chip will be affected by the flow channel configuration in the water-cooling plate. The temperature near the water inlet is lower. , The water outlet is higher.

However, in the new-generation chip design, the heating area becomes larger, which makes the difference between the high and low temperature of the inlet and outlet larger, resulting in uneven temperature distribution of the chip. Due to the large difference in the temperature of the chip, the life of the chip is reduced. Furthermore, after the working fluid enters the water block from the water inlet, it flows directly and quickly through the water block and flows out from the water outlet. Because the working fluid stays in the water block for a short time, the contact time with the cooling fins in the water block is shorter. , Unable to fully heat exchange to take away the heat source.

Therefore, how to solve the above-mentioned problems and deficiencies is the direction that the creators of this project and related manufacturers in this industry urgently want to study and improve.

In order to improve the above-mentioned problems, one purpose of this creation is to provide a barrier between an inlet in a heat exchange chamber and a radiating fin unit, and the barrier allows one of the heat exchange chambers to enter the heat exchange chamber from the inlet. cool down The liquid is split so that the cooling fluid flows from the periphery of the heat dissipation fin unit to the middle of the heat dissipation fin unit, so as to prevent the cooling liquid from passing straight through the heat dissipation fin unit.

Another purpose of this creation is to make the flow field in the heat exchange chamber evenly distributed to reduce the temperature difference of the heating elements, and to achieve a liquid-cooled heat dissipation structure with uniform temperature distribution.

Another purpose of the present invention is to use a plurality of baffle protrusions located on the periphery of the heat dissipation fin unit to distribute the peripheral cooling liquid to the area where heat dissipation is required to effectively reduce the temperature difference of the heating element.

Another purpose of this creation is to delay the residence time of the cooling liquid in the heat exchange chamber, so as to ensure that there is enough time to exchange heat with the fin unit.

Another purpose of this creation is to provide a plurality of ribs in the heat exchange chamber, and each rib is located between two adjacent heat dissipation fin groups to block the cooling liquid flowing through each heat dissipation fin group from flowing to the other heat dissipation fin group . In order to achieve the above objective, the present invention provides a liquid-cooled heat dissipation structure, which includes: a substrate having a heat exchange surface and a thermal contact surface; a heat dissipation fin unit including a plurality of heat dissipation fin groups arranged on the heat exchange surface, and Each heat dissipation fin group has a top surface and two inflow sides; a cover system is combined with the substrate and covers the heat dissipation fin unit, and a heat exchange chamber is defined between the substrate and the cover to accommodate the A heat dissipation fin unit, the cover has an inner side and a side wall, the inner side is provided with a guide channel corresponding to the top surface of each heat dissipation fin group, and a peripheral flow channel group is defined between the heat dissipation fin unit and the side wall, An inlet and an outlet are separately provided on the cover, the inlet communicates with the heat exchange chamber, and the outlet communicates with the guide path; a block is arranged in the heat exchange chamber and is located between the inlet and the heat dissipation fin unit The inlet is separated from the heat dissipation fin unit, and the blocking portion is adjacent to the inlet so that a cooling liquid that enters the heat exchange chamber from the inlet is divided and flows along the peripheral flow path to a middle of the heat dissipation fin unit Flow, thereby preventing the cooling liquid from passing straight through the radiating fin unit.

The aforementioned peripheral flow channel group is provided with a plurality of baffle convex bodies corresponding to the two inflow sides of each heat dissipation fin group.

The aforementioned peripheral flow channel group has a first, second and third peripheral flow channels, the first and second peripheral flow channels are respectively defined between the inflow sides and the side wall, and the third peripheral flow channel is defined in The cooling liquid between the blocking portion and the side wall corresponding to the inlet of the peripheral flow channel flows from the inflow sides to the middle of the heat dissipation fin unit and flows out from the outlet via the guide channel.

The aforementioned third peripheral flow channel is optionally provided with another heat dissipation fin unit.

The aforementioned baffle protrusions are distributed in the first and second peripheral flow channels, and are arranged on the side wall of the cover or the heat exchange surface of the substrate.

A rib is provided between the two adjacent heat dissipation fin groups, and each rib has a free end that contacts or combines with the inner side of the cover.

The aforementioned rib has another free end that is combined with the heat exchange surface of the substrate.

The aforementioned blocking portion is provided on the heat exchange surface of the substrate or on the inner side of the cover.

11: substrate

111: heat exchange surface

112: Thermal contact surface

12: Lid

121: inside

122: side wall

123: Guiding Road

124: Import

125: exit

127: Baffle convex body

13, 18: cooling fin unit

131: Fins

132: Runner

134: Top Surface

135: Inflow side

136: non-inflow side

137: cooling fin set

138: Ribs

14: Heat exchange chamber

15: Block

17: Peripheral runner group

171: The first peripheral flow channel

172: Second peripheral flow channel

173: Third peripheral flow channel

19: Cooling liquid

21: Inlet connector

22: Outlet connector

Figure 1A is a three-dimensional exploded schematic diagram of the creation; Figure 1B is a schematic diagram of the creation three-dimensional combination; Figure 1C is a schematic cross-sectional view of the creation combination: Figure 2 is a schematic top view perspective diagram of the creation; Figure 3 is a creative creation The top perspective schematic diagram of the baffle convex body; Figures 4A to 4C are schematic diagrams of various shapes of the baffle convex body.

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.

This creation provides a liquid cooling heat dissipation structure, for example, a water block is a part of a liquid cooling loop, which is used to contact a heating element to help the heating element dissipate heat. In addition, the liquid-cooled heat dissipation structure communicates with the external heat dissipation unit and/or pump through the tube body. In this creation, a baffle is provided in a heat exchange chamber in the liquid cooling unit to divert a cooling liquid entering the heat exchange chamber first, so that the divided cooling fluid flows to the periphery of a heat dissipation fin unit Then it flows to the middle of the radiating fin unit to prevent the cooling fluid from passing straight through the radiating fin unit. This creation also chooses to have a plurality of baffle convex bodies corresponding to the radiating fin unit to help the cooling liquid flow evenly. The detailed structure of the heat dissipation fin unit is as follows.

Please refer to Figure 1A for the three-dimensional exploded diagram of the creation; Figure 1B for the three-dimensional composition diagram of the creation; Figure 1C for the cross-sectional schematic diagram of the creation combination: Figure 2 is the top perspective schematic diagram of the creation. As shown in these figures, the liquid-cooled heat dissipation structure of this creation includes a substrate 11 and a cover 12 covering the substrate 11, and a heat exchange chamber 14 is defined between the substrate 11 and the cover 12 for a cooling liquid 19 The flow and a blocking portion 15 are arranged in the heat exchange chamber 14, and a heat dissipation fin unit 13 is arranged in the heat exchange chamber 14. The substrate 11 has a heat exchange surface 111 and a thermal contact surface 112. The cover 12 has an inner side 121 and a side wall 122. The inner side 121 faces the heat exchange surface 111 of the substrate 11 and has a guide channel 123. , An inlet 124 and an outlet 125 are separately provided on the cover 12, the inlet 124 communicates with the heat exchange chamber 14, the outlet 125 communicates with the guide channel 123, and the side wall 122 is ringed on the outer edge of the cover 12 The substrate 11 is bonded. A liquid inlet connector 21 and a liquid outlet connector 22 are respectively connected to the inlet 124 and the outlet 125. The blocking portion 15 is provided on the heat exchange surface 111 of the substrate 11 or the inner side 121 of the cover 12, and is located behind the inlet 124, except that it blocks the cooling liquid 19 from flowing into the heat exchange chamber 14 from the inlet 124 and directly flows through the heat dissipation. Fin unit 13, and the cold liquid 19 is divided into two sides and then flows through the fin unit 13, as described in detail later.

The heat-dissipating fin unit 13 has a plurality of fins 131 arranged at intervals with a flow channel 132 between the fins 131. The heat-dissipating fin unit 13 has a top surface 134, two inflow sides 135 and two non-inflow sides 136, The top surface 134 is adjacent to or adjacent to the inner side 121 of the cover 12 and corresponds to the guide channel 123. The two inflow sides 135 are opposite sides and communicate with the flow channel 132 between the fins 131. The two non-inflow sides 136 is also the opposite side and adjacent to the two inflow sides 135. The heat dissipation fin unit 13 is arranged or formed on the heat exchange surface 111 of the substrate 11, that is, the heat dissipation fin unit 13 and the substrate 11 are made integrally or non-integrally. In addition, the two non-inflow sides 136 are respectively adjacent to the inlet 124 and the outlet 125 of the cover 12, and the blocking portion 15 is adjacent to the inlet 124 and is located between the inlet 124 and the non-inflow side 136 of the heat dissipation fin unit 13.

Furthermore, this embodiment shows that the heat dissipation fin unit 13 has a plurality of heat dissipation fin groups 137, and a rib 138 is provided between two adjacent heat dissipation fin groups 137, and the thickness of the single rib 138 is compared with The thickness of the single fin 131 is still thick. The heat dissipation fin unit 13 and/or the ribs 138 are integrally formed on the heat exchange surface 111 of the substrate 11, or individual components separated from the substrate 11 are combined by a bonding means (the bonding means such as welding its Including brazing, soldering, ultrasonic welding, etc.) on the heat exchange surface 111 of the substrate 11. Each rib 138 has a free end (the upper end in the figure) adjacent to the inner side 12 of the cover 12 or is in contact with or combined with the inner side 12.

A peripheral flow channel group 17 is formed between the heat dissipation fin unit 13 and the side wall 122 at the periphery of the heat dissipation fin unit 13. The peripheral flow channel group includes a first peripheral flow channel 171, a second peripheral flow channel 172 and a third peripheral flow channel 173. The first and second peripheral flow passages 171 and 172 are respectively located between the inflow sides 135 and the side wall 122, and the third peripheral flow passage 173 is located between the blocking portion 15 and the side wall 122 corresponding to the inlet 124. That is to say, the inlet 124 is located above the third peripheral flow passage 173, and two ends of the third peripheral flow passage 173 are respectively connected to the first and second peripheral flow passages 171 and 172. Another diffuse fin unit 18 is optionally arranged or formed in the third peripheral flow channel 173 and located below the inlet 124. Regarding the radiating fin 18 is not limited In the foregoing implementation, if the corresponding heating element has a smaller heating area, the number of heat dissipation fins 18 disposed on the third peripheral flow channel 173 can be reduced.

The cooling liquid 19 flows into the third peripheral flow channel 173 of the heat exchange chamber 14 from the inlet 124 of the cover 12 through the liquid inlet connector 21. The cooling liquid 19 is not only blocked by the stopper 15 behind the inlet 124 from passing straight through the The heat dissipation fin unit 13 is also divided into two opposite flows from both ends of the third peripheral flow path 173 through the first peripheral flow path 171 and the second peripheral flow path 172, and then in the first and second The cooling liquid 19 in the peripheral flow channels 171 and 172 further flows from the two inflow sides 135 of the heat dissipation fin unit 13 to a middle of the heat dissipation fin unit 13, and then the cooling liquid 19 passes through the guide channel 123 from the outlet 125 And the liquid outlet connector 22 flows out of the heat exchange chamber 14. The rib 138 is used to block the cooling liquid 19 flowing through each heat dissipation fin group 137 from flowing to another heat dissipation fin group 137. With this design, the divided cooling liquid 19 has not been heated yet, and can flow through each heat dissipation fin group 137 with the same liquid temperature.

Furthermore, since the blocking portion 15 blocks the cooling liquid 19 flowing into the heat exchange chamber 14 from flowing straight through the radiating fin unit 13, the residence time of the cooling liquid 19 in the heat exchange chamber 14 can be delayed, so that the cooling liquid 19 can be After fully performing heat exchange with the radiating fin unit 13, the heat is removed.

Please continue to refer to Figure 3 for a top perspective view of the creation with a baffle convex body. As shown in the figure, in another implementation, a plurality of baffle protrusions 127 are distributed in the peripheral flow channel group 17, for example, distributed in the first peripheral flow channel 171 and the second peripheral flow channel 172 corresponding to the heat dissipation fin unit 13 The inflow side 135 is equal, and each heat dissipation fin group 137 corresponds to at least two opposite flow blocking protrusions 127. The flow blocking protrusions 127 are shown to be provided on the side wall 122 of the cover 12 in this embodiment, but are not limited to this, and may also be provided on the heat exchange surface 111 of the substrate 11. The cooling liquid 19 flowing in the first peripheral flow channel 171 and the second peripheral flow channel 172 is guided to flow to each heat dissipation fin group 137 of the heat dissipation fin unit 13 by each of the baffle protrusions 127, To reduce the concentration of the cooling liquid 19 at the end of the flow direction, the cooling liquid 19 will be more evenly distributed in the liquid cooling heat dissipation. Flow within the structure. In addition, it is not limited to the foregoing implementation, and the present invention can make each heat dissipation fin group 137 correspond to a plurality of opposed flow blocking protrusions 127 according to different heat dissipation requirements. Therefore, in the design, the baffle protrusion 127 can be set according to the temperature of each heating area of the heating element. For example, two opposing baffle protrusions 127 are provided in a low temperature area, and four or more baffle protrusions are provided in a high temperature area. Multiple opposing baffle convex bodies 127.

Please continue to refer to Figures 4A to 4C which are schematic diagrams of various shapes of the baffle convex body. As shown in the figure, the aforementioned baffle convex body 127 is not limited to a semicircle, but can also be any geometric shape such as a triangle (as shown in Figure 4A), a square (as shown in Figure 4B), or an L shape (as shown in Figure 4C). .

With the above structure, the flow field of the cooling liquid 19 entering the heat exchange chamber 14 can be uniformly distributed, so as to reduce the temperature difference of the heating element, so that the temperature of the heating element is evenly distributed.

This creation has been described in detail above, but what is described above is only a preferred embodiment of this creation, and should not limit the scope of implementation of this creation. That is to say, all equal changes and modifications made in accordance with the scope of this creation application shall still fall within the scope of the patent coverage of this creation.

11: substrate

111: heat exchange surface

112: Thermal contact surface

12: Lid

121: inside

122: side wall

123: Guiding Road

124: Import

125: exit

13, 18: cooling fin unit

134: Top Surface

135: Inflow side

136: non-inflow side

15: Block

21: Inlet connector

22: Outlet connector

Claims (7)

A liquid-cooled heat dissipation structure, comprising: a substrate having a heat exchange surface and a thermal contact surface; a heat dissipation fin unit, including a plurality of heat dissipation fin groups arranged on the heat exchange surface, and having a top surface and two inflows Side; a cover, which is combined with the substrate and covered above the heat dissipation fin unit, a heat exchange chamber is defined between the substrate and the cover to accommodate the heat dissipation fin unit, the cover has an inner side And a side wall, the inner side is provided with a guide channel corresponding to the top surface of the heat dissipation fin unit, a peripheral flow channel group is defined between the heat dissipation fin unit and the side wall, an inlet and an outlet are separately provided on the cover , The inlet communicates with the heat exchange chamber, and the outlet communicates with the guide path; a block is arranged in the heat exchange chamber and between the inlet and the heat dissipation fin unit, and the block is located at the inlet A rear side is used to divert a cooling liquid entering the heat exchange chamber from the inlet and flow to a middle of the heat dissipation fin unit along the peripheral flow channel, thereby preventing the cooling liquid from passing straight through the heat dissipation fin unit. The liquid-cooled heat dissipation structure according to claim 1, wherein the peripheral flow channel group is provided with a plurality of baffle protrusions corresponding to two inflow sides of each heat dissipation fin group. The liquid-cooled heat dissipation structure according to claim 1, wherein the peripheral flow channel group has a first, second and third peripheral flow channels, and the first and second peripheral flow channels are respectively defined on the inflow sides and the Between the side walls, the third peripheral flow channel is defined between the blocking portion and the side wall and corresponds to the inlet of the peripheral flow channel. The cooling liquid flows from the inflow sides to the middle of the heat dissipation fin unit and passes through the guide The approach path flows out from this exit. According to the liquid-cooled heat dissipation structure of claim 3, the third peripheral flow channel is optionally provided with another heat dissipation fin unit. The liquid-cooled heat dissipation structure according to claim 2, wherein the peripheral flow channel group has a first, second and third peripheral flow channels, and the first and second peripheral flow channels are respectively defined on the inflow sides and the Between the side walls, the third peripheral flow channel is defined between the blocking portion and the side wall and corresponds to the inlet of the peripheral flow channel. The cooling liquid flows from the inflow sides to the middle of the heat dissipation fin unit and passes through the guide The approach channel flows out from the outlet, and the baffle protrusions are distributed in the first and second peripheral flow channels, and are arranged on the side wall of the cover or the heat exchange surface of the substrate. The liquid-cooled heat dissipation structure according to claim 1, wherein the blocking portion is arranged on the heat exchange surface of the substrate or arranged on the inner side of the cover. According to the liquid-cooled heat dissipation structure of claim 5, the third peripheral flow channel is optionally provided with another heat dissipation fin unit.

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