CN113038800A

CN113038800A - Liquid cooling heat radiation structure

Info

Publication number: CN113038800A
Application number: CN202110286896.4A
Authority: CN
Inventors: 李嵩蔚; 黄冠霖; 杨明璁
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2021-03-17
Filing date: 2021-03-17
Publication date: 2021-06-25

Abstract

The invention provides a liquid cooling heat dissipation structure, which comprises a cover body, a base plate, a heat exchange cavity, a heat dissipation fin unit and a blocking part, wherein the cover body covers the base plate, the heat exchange cavity is defined between the cover body and the base plate, and the heat dissipation fin unit and the blocking part are arranged in the heat exchange cavity. The baffle part divides a cooling liquid entering the heat exchange chamber to make the cooling liquid flow from the periphery of the radiating fin unit to the middle of the radiating fin unit so as to prevent the cooling liquid from passing through the radiating fin unit in a straight line, and the periphery of the radiating fin unit is also provided with a plurality of flow baffle protrusions to help the cooling liquid to flow through the radiating fin unit uniformly. Through the structural design of the invention, the effect of greatly improving the heat exchange efficiency can be achieved.

Description

Liquid cooling heat radiation structure

Technical Field

The invention relates to the field of liquid heat dissipation structures, in particular to a heat dissipation structure of a liquid (water) cooling head.

Background

With the demand of big data and cloud computing service being greatly increased, the heat dissipation demand of related electronic products is also increasing, and especially, the server of a large-scale computing center has increased computing density and greatly increased waste heat generated in a space with the same size.

The operation mechanism of the water cooling head or the water cooling plate is that the heat of the wafer is taken away by the working liquid, and the working liquid can be gradually heated when passing through the wafer, so that the temperature distribution of the wafer can be influenced by the configuration of the flow channel in the water cooling plate, the temperature close to the water inlet is lower, and the water outlet is higher.

However, in the new generation of chip design, the heating area is increased, so that the difference between the high temperature and the low temperature of the inlet and the outlet is larger, the temperature distribution of the chip is uneven, and the service life of the chip is reduced due to the larger temperature difference of the chip. Moreover, after the working liquid enters the water cooling head from the water inlet, the working liquid directly and quickly flows out from the water outlet in the water cooling head, and because the time for the working liquid to stay in the water cooling head is short, the contact time with the radiating fins in the water cooling head is shorter, and the heat source cannot be taken away by sufficient heat exchange.

Therefore, how to solve the above problems and disadvantages is a direction in which the present inventors and related manufacturers in the industry need to research and improve.

Disclosure of Invention

In order to solve the above problems, an object of the present invention is to provide a blocking portion between an inlet of a heat exchange chamber and a heat dissipating fin unit, wherein the blocking portion is used to divide a cooling fluid entering the heat exchange chamber from the inlet so that the cooling fluid flows from the periphery of the heat dissipating fin unit to the middle of the heat dissipating fin unit, thereby preventing the cooling fluid from passing through the heat dissipating fin unit linearly.

The invention also aims to uniformly distribute the flow field in the heat exchange chamber to reduce the temperature difference of the heating element, thereby achieving the liquid cooling heat dissipation structure with uniform temperature distribution.

The present invention also provides a liquid cooling heat dissipation structure, which utilizes a plurality of flow blocking protrusions located at the periphery of the heat dissipation fin unit to distribute the cooling liquid at the periphery to the area needing heat dissipation so as to effectively reduce the temperature difference of the heating element.

Another object of the present invention is to delay the residence time of the cooling liquid in the heat exchange chamber to ensure sufficient time for heat exchange with the cooling fin unit.

Another object of the present invention is to provide a plurality of ribs in a heat exchange chamber, wherein each rib is located between two adjacent sets of fins to block the cooling liquid flowing through each set of fins from flowing to another set of fins.

To achieve the above object, the present invention provides a liquid cooling heat dissipation structure, which comprises: a substrate having a heat exchange surface and a thermal contact surface; a heat radiation fin unit including a plurality of heat radiation fin groups arranged on the heat exchange surface, and each heat radiation fin group having a top surface and two inflow sides; a cover body combined with the substrate and covering the radiating fin units, a heat exchange cavity defined between the substrate and the cover body for accommodating the radiating fin units, the cover body having an inner side and a side wall, the inner side having a guide channel corresponding to the top surface of each radiating fin group, a peripheral channel group defined between the radiating fin units and the side wall, an inlet and an outlet respectively disposed on the cover body, the inlet communicating with the heat exchange cavity, the outlet communicating with the guide channel; a blocking portion is disposed in the heat exchange chamber and between the inlet and the cooling fin unit to isolate the inlet from the cooling fin unit, the blocking portion being adjacent to the inlet to allow a cooling liquid entering the heat exchange chamber from the inlet to be divided and flow along the peripheral channel toward a middle of the cooling fin unit, thereby preventing the cooling liquid from passing through the cooling fin unit in a straight line.

The peripheral flow channel set is provided with a plurality of flow blocking protrusions corresponding to two inflow sides of each heat dissipation fin set.

The peripheral channel set has a first and a second and a third peripheral channels, the first and the second peripheral channels are respectively defined between the two inflow sides and the side wall, the third peripheral channel is defined between the baffle part and the side wall and corresponds to the inlet, the cooling liquid of the peripheral channel set flows from the two inflow sides to the middle of the radiator fin unit and flows out from the outlet through the guide channel.

Another heat dissipation fin unit is selectively disposed in the third peripheral flow channel.

The flow blocking convex bodies are distributed on the first and second peripheral flow channels and are arranged on the side wall of the cover body or the heat exchange surface of the base plate.

A rib is arranged between the two adjacent radiating fin groups, and each rib is provided with a free end which is contacted or combined with the inner side of the cover body.

The rib has another free end joined to the heat exchange surface of the base plate.

The blocking part is arranged on the heat exchange surface of the base plate or on the inner side of the cover body.

By means of the structure, the flow field of the cooling liquid entering the heat exchange cavity is uniformly distributed in a flowing manner, so that the temperature difference of the heating element is reduced, and the temperature of the heating element is uniformly distributed.

Drawings

FIG. 1A is a schematic exploded perspective view of the present invention;

FIG. 1B is a perspective view of the present invention;

FIG. 1C is a schematic sectional view of the present invention in combination:

FIG. 2 is a schematic top perspective view of the present invention;

FIG. 3 is a schematic top perspective view of the present invention with a baffle projection;

fig. 4A to 4C are schematic views of various shapes of the baffle projections.

Description of reference numerals: a substrate 11; a heat exchange surface 111; a thermal contact surface 112; a lid 12; an inner side 121; a side wall 122; a guide passage 123; an inlet 124; an outlet 125; a flow blocking protrusion 127; the

radiator fin units

13, 18; a fin 131; a flow passage 132; a top surface 134; an inflow side 135; a non-inflow side 136; a heat-dissipating fin group 137; ribs 138 heat exchange chambers 14; a stopper 15; a peripheral flow path group 17; a first peripheral flow passage 171; a second peripheral channel 172; a third peripheral flow passage 173; a cooling liquid 19; a liquid inlet joint 21; and a liquid outlet joint 22.

Detailed Description

The above objects, together with the structural and functional features thereof, are accomplished by the preferred embodiments according to the accompanying drawings.

The invention provides a liquid cooling heat dissipation structure, such as a liquid (water) cooling head (water block), which is a part of a liquid (water) cooling loop (liquid cooling loop) and is used for contacting a heating element to help the heating element dissipate heat, and the liquid cooling heat dissipation structure is communicated with an external heat dissipation unit and/or a pump through a pipe body. The invention relates to a liquid cooling heat radiation unit, which is characterized in that a heat exchange chamber in the liquid cooling heat radiation unit is provided with a baffle part to firstly split a cooling liquid entering the heat exchange chamber, and the split cooling liquid flows to the periphery of a heat radiation fin unit and then flows to the middle of the heat radiation fin unit to prevent the cooling liquid from linearly passing through the heat radiation fin unit.

FIG. 1A is a schematic exploded view of the present invention; FIG. 1B is a perspective view of the present invention;

FIG. 1C is a schematic sectional view of the present invention in combination: FIG. 2 is a schematic top perspective view of the present invention. As shown in these figures, the liquid-cooled heat dissipation structure of the present invention includes a substrate 11 and a cover 12 covering the substrate 11, a heat exchange chamber 14 defined between the substrate 11 and the cover 12 for a cooling liquid 19 to flow, and a baffle 15 disposed in the heat exchange chamber 14, and a heat dissipation fin unit 13 disposed in the heat exchange chamber 14. The substrate 11 has a heat exchanging surface 111 and a thermal contact surface 112, the cover 12 has an inner side 121 and a side wall 122, the inner side 121 faces the heat exchanging surface 111 of the substrate 11 and has a guiding channel 123, an inlet 124 and an outlet 125 are separately disposed on the cover 12, the inlet 124 communicates with the heat exchanging chamber 14, the outlet 125 communicates with the guiding channel 123, and the side wall 122 is disposed around the outer edge of the cover 12 to engage with the substrate 11. An inlet connector 21 and an outlet connector 22 are connected to the inlet 124 and the outlet 125, respectively. The blocking portion 15 is disposed on the heat exchanging surface 111 of the base plate 11 or the inner side 121 of the cover 12 and behind the inlet 124, except for blocking the cooling liquid 19 from flowing into the heat exchanging chamber 14 from the inlet 124 and directly flowing through the heat dissipating fin unit 13, and enabling the cooling liquid 19 to be divided into two sides and then flow through the heat dissipating fin unit 13, as will be described later.

The cooling fin unit 13 has a plurality of fins 131 arranged at intervals and flow channels 132 between the fins 131, the cooling fin unit 13 has a top surface 134 and two inflow sides 135 and two non-inflow sides 136, the top surface 134 is adjacent to or adjacent to the inner side 121 of the cover 12 and corresponds to the guide channel 123, the two inflow sides 135 are opposite sides and communicate with the flow channels 132 between the fins 131, and the two non-inflow sides 136 are also opposite sides and adjacent to the two inflow sides 135. The heat sink fin unit 13 is disposed or formed on the heat exchanging surface 111 of the substrate 11, i.e., the heat sink fin unit 13 and the substrate 11 are integrally or non-integrally formed. The two non-inflow sides 136 are respectively adjacent to the inlet 124 and the outlet 125 of the cover 12, and the baffle 15 is adjacent to the inlet 124 and located between the inlet 124 and the non-inflow side 136 of the fin unit 13.

Furthermore, this embodiment shows that the cooling fin unit 13 has a plurality of cooling fin sets 137, and a rib 138 is disposed between two adjacent cooling fin sets 137, and the thickness of the rib 138 is thicker than that of the single fin 131. The radiator fin unit 13 and/or the rib 138 are integrally formed on the heat exchanging surface 111 of the base plate 11, or are separately formed from the base plate 11 and are bonded to the heat exchanging surface 111 of the base plate 11 by a bonding means (such as welding including brazing, soldering, ultrasonic welding, etc.). Each rib 138 has a free end (e.g., upper end) adjacent to the inner side 12 of the cover 12 or contacting or engaging the inner side 12.

A set of peripheral channels 17 is formed between the finstock 13 and the sidewall 122 at the periphery of the finstock 13. The peripheral channel set includes a first peripheral channel 171, a second peripheral channel 172 and a third peripheral channel 173. The first and second

peripheral channels

171, 172 are respectively located between the two inflow sides 135 and the sidewall 122, the third peripheral channel 173 is located between the blocking portion 15 and the sidewall 122 corresponding to the inlet 124, that is, the inlet 124 is located above the third peripheral channel 173, and two ends of the third peripheral channel 173 are respectively connected to the first and second

peripheral channels

171, 172. Another fin unit 18 is optionally disposed or formed in the third peripheral channel 173 below the inlet 124. The heat dissipation fins 18 are not limited to the above embodiments, and if the heat generating area of the corresponding heat generating component is less, the number of the heat dissipation fins 18 disposed in the third peripheral channel 173 can be reduced.

The cooling liquid 19 flows into the third peripheral channel 173 of the heat exchange chamber 14 from the inlet 124 of the cover 12 through the liquid inlet connector 21, the cooling liquid 19 is not only blocked by the blocking portion 15 behind the inlet 124 and passes through the finunit 13 in a straight line, but also divided into two opposite flow directions to pass through the first peripheral channel 171 and the second peripheral channel 172 from two ends of the third peripheral channel 173, and then the cooling liquid 19 in the first and second

peripheral channels

171, 172 further flows from two inflow sides 135 of the finunit 13 to a middle of the finunit 13, and then the cooling liquid 19 flows out of the heat exchange chamber 14 from the outlet 125 and the liquid outlet connector 22 through the guide channel 123. The ribs 138 block the cooling liquid 19 flowing through each of the heat dissipating fin sets 137 from flowing to another heat dissipating fin set 137. The design is such that the diverted cooling liquid 19 is not heated yet and flows through each of the heat dissipating fin sets 137 at the same liquid temperature.

Furthermore, since the blocking portion 15 blocks the cooling liquid 19 flowing into the heat exchange chamber 14 from flowing through the heat dissipating fin unit 13, the retention time of the cooling liquid 19 in the heat exchange chamber 14 is delayed, so that the cooling liquid 19 can exchange heat with the heat dissipating fin unit 13 sufficiently and then carry away the heat.

Please refer to fig. 3, which is a schematic top perspective view of the flow blocking protrusion of the present invention. As shown, in another embodiment, a plurality of flow blocking protrusions 127 are disposed on the peripheral channel group 17, for example, distributed on the first peripheral channel 171 and the second peripheral channel 172 corresponding to the two inflow sides 135 of the fin unit 13, and each fin group 137 corresponds to at least two opposite flow blocking protrusions 127. The plural flow blocking protrusions 127 are disposed on the side wall 122 of the cover 12 in this embodiment, but are not limited thereto, and may be disposed on the heat exchange surface 111 of the base plate 11. By means of each of the flow blocking protrusions 127, the cooling liquid 19 flowing through the first peripheral channel 171 and the second peripheral channel 172 is guided to flow to each of the cooling fin sets 137 of the cooling fin unit 13, so that the concentration of the cooling liquid 19 at the end of the flowing direction is reduced, and the cooling liquid 19 flows more uniformly in the liquid-cooled heat dissipation structure. In addition, the present invention is not limited to the foregoing embodiments, and each of the heat dissipating fin sets 137 may correspond to a plurality of opposite flow blocking protrusions 127 according to different heat dissipation requirements. Therefore, the baffle protrusions 127 may be designed according to the temperature of each heat generating region of the heat generating element, for example, two opposite baffle protrusions 127 may be provided in a region where the temperature is low, and four or more opposite baffle protrusions 127 may be provided in a region where the temperature is high.

Please refer to fig. 4A to fig. 4C, which are schematic views of different shapes of the flow blocking convex body. As shown in the figure, the flow blocking protrusion 127 is not limited to a semi-circular shape, but may be any geometric shape such as a triangle (as shown in fig. 4A), a square (as shown in fig. 4B), or an L-shape (as shown in fig. 4C).

By means of the structure, the flow field of the cooling liquid 19 entering the heat exchange chamber 14 is uniformly distributed, so that the temperature difference of the heating element is reduced, and the temperature of the heating element is uniformly distributed.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A liquid-cooled heat dissipating structure, comprising:

a substrate having a heat exchange surface and a thermal contact surface;

a heat radiation fin unit, which comprises a plurality of heat radiation fin groups arranged on the heat exchange surface and is provided with a top surface and two inflow sides;

a cover body combined with the substrate and covering the radiating fin unit, a heat exchange cavity defined between the substrate and the cover body and accommodating the radiating fin unit, the cover body having an inner side and a side wall, the inner side having a guide channel corresponding to the top surface of the radiating fin unit, a peripheral channel set defined between the radiating fin unit and the side wall, an inlet and an outlet respectively disposed on the cover body, the inlet communicating with the heat exchange cavity, the outlet communicating with the guide channel;

and the blocking part is arranged in the heat exchange cavity and positioned between the inlet and the radiating fin unit, and the blocking part is positioned at the rear part of the inlet so as to enable cooling liquid entering the heat exchange cavity from the inlet to be divided and flow to the middle of the radiating fin unit along the peripheral flow channel, thus preventing the cooling liquid from passing through the radiating fin unit in a straight line.

2. The liquid-cooled heat dissipation structure of claim 1, wherein: the peripheral flow channel set is provided with a plurality of flow blocking protrusions corresponding to two inflow sides of each radiating fin set.

3. The liquid-cooled heat dissipating structure of claim 1 or 2, wherein: the peripheral channel group is provided with a first peripheral channel, a second peripheral channel and a third peripheral channel, the first peripheral channel and the second peripheral channel are respectively defined between the two inflow sides and the side wall, the third peripheral channel is defined between the baffle part and the side wall and corresponds to the inlet, and the cooling liquid of the peripheral channel group flows from the two inflow sides to the middle of the radiating fin unit and flows out from the outlet through the guide channel.

4. The liquid-cooled heat dissipation structure of claim 3, wherein: the third peripheral flow channel is provided with another heat dissipation fin unit.

5. The liquid-cooled heat dissipation structure of claim 3, wherein: the plurality of flow blocking protrusions are distributed on the first peripheral flow channel and the second peripheral flow channel and are arranged on the side wall of the cover body or the heat exchange surface of the substrate.

6. The liquid-cooled heat dissipation structure of claim 1, wherein: the blocking part is arranged on the heat exchange surface of the base plate or on the inner side of the cover body.