TWI765606B - Liquid-cooling heat dissipation structure - Google Patents
Liquid-cooling heat dissipation structure Download PDFInfo
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- TWI765606B TWI765606B TW110109593A TW110109593A TWI765606B TW I765606 B TWI765606 B TW I765606B TW 110109593 A TW110109593 A TW 110109593A TW 110109593 A TW110109593 A TW 110109593A TW I765606 B TWI765606 B TW I765606B
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本發明係有關液體散熱結構領域,尤其關於一種液(水)冷頭的散熱結構。 The invention relates to the field of liquid heat dissipation structures, in particular to a heat dissipation structure of a liquid (water) cold head.
隨著大數據及雲端計算服務的需求大幅提升,相關電子產品的散熱需求也越來越高,尤其是大型運算中心的服務器,其運算密度提高,相同尺寸的空間中所產生的廢熱也大幅提昇,為了降低散熱所消耗的能源近來使用液體將熱源從服務器中帶走以其他方式散熱,藉以解決高密度廢熱所產生的問題。 With the substantial increase in demand for big data and cloud computing services, the heat dissipation requirements of related electronic products are also getting higher and higher, especially for servers in large computing centers, whose computing density has increased, and the waste heat generated in the same size space has also greatly increased , In order to reduce the energy consumption for heat dissipation, liquids are recently used to take away the heat source from the server to dissipate heat in other ways, so as to solve the problem of high-density waste heat.
水冷頭或水冷板的運作機制是由工作液體將晶片的熱量帶走,在通過晶片時工作液體會逐漸升溫,因此晶片溫度分佈會受水冷板內流道配置所影響,接近進水口溫度較低,出水口則較高。 The working mechanism of the water-cooled head or the water-cooled plate is that the heat of the wafer is taken away by the working liquid, and the working liquid will gradually heat up when passing through the wafer. Therefore, the temperature distribution of the wafer will be affected by the configuration of the flow channels in the water-cooled plate, and the temperature near the water inlet is lower. , the outlet is higher.
然而在新一世代晶片設計其發熱面積變大,使得進出口高低溫差更大,造成晶片溫度分佈不均,由於晶片溫度差異太大,造成晶片壽命減少。再者,工作液體從進水口進入水冷頭後,直接且快速經過水冷頭內從出水口流出,由於工作液體停留在水冷頭內的時間短,造成與水冷頭內的散熱鰭片接觸時間更短,無法充分熱交換帶走熱源。 However, in the new generation of chip design, the heating area becomes larger, which makes the temperature difference between the inlet and outlet larger, resulting in uneven temperature distribution of the chip, and the life of the chip is shortened due to the large temperature difference of the chip. Furthermore, after the working liquid enters the water block from the water inlet, it directly and quickly flows out of the water block through the water block. Since the working liquid stays in the water block for a short time, the contact time with the cooling fins in the water block is shorter. , the heat source cannot be taken away by sufficient heat exchange.
是以,要如何解決上述之問題與缺失,即為本案之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above-mentioned problems and deficiencies is the direction that the inventor of this case and the relevant manufacturers engaged in this industry are eager to research and improve.
為改善上述之問題,本發明之一目的在一熱交換腔室內的一進口與一散熱鰭片單元之間設有一擋部,藉由該擋部使從該進口進入該熱交換腔室的一冷卻 液體分流,以令該冷卻流體從該散熱鰭片單元的周邊再往散熱鰭片單元的中間流動,以阻止該冷卻液體直線經過該散熱鰭片單元。 In order to improve the above-mentioned problems, an object of the present invention is to provide a blocking portion between an inlet in a heat exchange chamber and a heat dissipation fin unit, through which a block from the inlet enters the heat exchange chamber. cool down The liquid is divided to make the cooling fluid flow from the periphery of the heat dissipation fin unit to the middle of the heat dissipation fin unit, so as to prevent the cooling liquid from passing through the heat dissipation fin unit in a straight line.
本發明另一目的使熱交換腔室內的流場均勻分佈以減少發熱元件的溫度差異,達到溫度分佈均勻的液冷散熱結構。 Another object of the present invention is to make the flow field in the heat exchange chamber evenly distributed so as to reduce the temperature difference of the heating elements and achieve a liquid-cooled heat dissipation structure with uniform temperature distribution.
本發明另一目的利用複數擋流凸體位於該散熱鰭片單元的周邊,以將周邊的冷卻液體分配到需要散熱的區域以有效降低發熱元件的溫差的液冷散熱結構。 Another object of the present invention is to use a plurality of baffle protrusions on the periphery of the heat dissipation fin unit to distribute the peripheral cooling liquid to the area that needs heat dissipation to effectively reduce the temperature difference of the heating element.
本發明另一目的係延緩冷卻液體在熱交換腔室內的停留時間,以確保有足夠時間跟散熱鰭片單元充分確實進行熱交換。 Another object of the present invention is to delay the residence time of the cooling liquid in the heat exchange chamber, so as to ensure sufficient time for sufficient and reliable heat exchange with the heat dissipation fin unit.
本發明另一目的在熱交換腔室內設置複數肋部,且每一肋部位於兩相鄰散熱鰭片組之間,以阻隔流經每一散熱鰭片組的冷卻液體流到另一散熱鰭片組。為達上述之目的,本發明提供一種液冷散熱結構,其包含:一基板具有一熱交換面及一熱接觸面;一散熱鰭片單元包括複數散熱鰭片組設置在該熱交換面,且每一散熱鰭片組具有一頂面及兩流入側;一蓋體係與該基板結合並蓋合在該散熱鰭片單元上方,一熱交換腔室界定在該基板與該蓋體之間容納該散熱鰭片單元,該蓋體具有一內側及一側壁,該內側設有一導引道對應每一散熱鰭片組的頂面,該散熱鰭片單元與該側壁之間界定一周邊流道組,一進口及一出口分設於該蓋體上,該進口連通該熱交換腔室,該出口連通該導引道;一擋部設置在該熱交換腔室內且位於該進口與該散熱鰭片單元之間將該進口與該散熱鰭片單元隔離,該擋部係鄰近該進口以使從該進口進入該熱交換腔室的一冷卻液體分流且沿該周邊流道組往散熱鰭片單元的一中間流動,藉此阻止該冷卻液體直線經過該散熱鰭片單元。 Another object of the present invention is to provide a plurality of ribs in the heat exchange chamber, and each rib is located between two adjacent sets of radiating fins to prevent the cooling liquid flowing through each set of radiating fins from flowing to another radiating fin film set. In order to achieve the above object, the present invention provides a liquid-cooled heat dissipation structure, which includes: a substrate having a heat exchange surface and a thermal contact surface; a heat dissipation fin unit including a plurality of heat dissipation fin sets disposed on the heat exchange surface, and Each heat dissipation fin set has a top surface and two inflow sides; a cover system is combined with the base plate and covered above the heat dissipation fin unit, and a heat exchange chamber is defined between the base plate and the cover body to accommodate the a heat dissipation fin unit, the cover body has an inner side and a side wall, the inner side is provided with a guide channel corresponding to the top surface of each heat dissipation fin group, and a peripheral flow channel group is defined between the heat dissipation fin unit and the side wall, An inlet and an outlet are respectively arranged on the cover, the inlet communicates with the heat exchange chamber, and the outlet communicates with the guide channel; a blocking portion is arranged in the heat exchange chamber and located between the inlet and the heat dissipation fin unit between the inlet and the cooling fin unit, the blocking portion is adjacent to the inlet so that a cooling liquid entering the heat exchange chamber from the inlet is divided and directed along the peripheral flow channel group to a cooling fin unit flow in the middle, thereby preventing the cooling liquid from passing through the heat dissipation fin unit in a straight line.
前述周邊流道組設有複數擋流凸體對應每一散熱鰭片組的兩流入側。 The aforementioned peripheral flow channel group is provided with a plurality of flow blocking protrusions corresponding to the two inflow sides of each heat dissipation fin group.
前述周邊流道組具有一第一及第二及第三周邊流道,該第一及第二周邊流道分別界定在該等流入側與該側壁之間,該第三周邊流道係界定在該擋部與該側壁之間且對應該進口,該周邊流道組的冷卻液體從該等流入側往散熱鰭片單元的該中間流動並經由該導引道從該出口流出。 The aforementioned peripheral flow channel group has a first, second and third peripheral flow channels, the first and second peripheral flow channels are respectively defined between the inflow sides and the side wall, and the third peripheral flow channel is defined in the Between the blocking portion and the side wall and corresponding to the inlet, the cooling liquid of the peripheral flow channel group flows from the inflow sides to the middle of the cooling fin unit and flows out of the outlet through the guide channel.
前述第三周邊流道選擇設有另一散熱鰭片單元。 The aforementioned third peripheral flow channel is optionally provided with another heat dissipation fin unit.
前述擋流凸體分布在該第一及第二周邊流道,且設置在該蓋體的側壁或該基板的熱交換面。 The aforesaid baffle protrusions are distributed in the first and second peripheral flow channels, and are arranged on the side wall of the cover or the heat exchange surface of the base plate.
前述兩相鄰散熱鰭片組之間設有一肋部,且每一肋部具有一自由端與該蓋體的內側接觸或結合一起。 A rib is disposed between the two adjacent sets of heat dissipation fins, and each rib has a free end that is in contact with or combined with the inner side of the cover.
前述肋部具有另一自由端與該基板的熱交換面結合一起。 The aforementioned rib has another free end which is combined with the heat exchange surface of the base plate.
前述擋部設置在該基板的熱交換面或設置在該蓋體的內側。 The aforementioned blocking portion is arranged on the heat exchange surface of the base plate or on the inner side of the cover body.
11:基板 11: Substrate
111:熱交換面 111: heat exchange surface
112:熱接觸面 112: Thermal Contact Surface
12:蓋體 12: Cover
121:內側 121: Inside
122:側壁 122: Sidewall
123:導引道 123: Guiding Road
124:進口 124: Import
125:出口 125: Exit
127:擋流凸體 127: Blocking convex body
13、18:散熱鰭片單元 13, 18: cooling fin unit
131:鰭片 131: Fins
132:流道 132: runner
134:頂面 134: top surface
135:流入側 135: Inflow side
136:非流入側 136: Non-inflow side
137:散熱鰭片組 137: Cooling fin group
138:肋部 138: Ribs
1381:自由端 1381: Free End
14:熱交換腔室 14: Heat Exchange Chamber
15:擋部 15: Stopper
17:周邊流道組 17: Peripheral runner group
171:第一周邊流道 171: The first peripheral runner
172:第二周邊流道 172: Second peripheral runner
173:第三周邊流道 173: The third peripheral runner
19:冷卻液體 19: Cooling liquid
21:進液接頭 21: Inlet connector
22:出液接頭 22: Outlet connector
第1A圖為本發明立體分解示意圖;第1B圖為本發明立體組合示意圖;第1C圖係為本發明組合剖視示意圖:第2圖為本發明俯視透視示意圖;第3圖係為本創做設有擋流凸體之俯視透視示意圖;第4A至4C圖係為擋流凸體的各種不同形狀之示意圖。 Figure 1A is a schematic exploded perspective view of the present invention; Figure 1B is a schematic diagram of a three-dimensional assembly of the present invention; Figure 1C is a schematic cross-sectional view of the assembly of the present invention; Figure 2 is a schematic top perspective view of the present invention; Figure 3 is a creative work A schematic top perspective view of a flow blocking protrusion; Figures 4A to 4C are schematic views of various shapes of the flow blocking protrusion.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.
本發明提供一種液冷散熱結構例如為一液(水)冷頭(water block)係為液(水)冷迴路(liquid cooling loop)的一部分,用以接觸一發熱元件以幫助該發熱元件散熱,且液冷散熱結構通過管體連通外部的散熱單元及/或泵浦。本發 明藉由在液冷散熱單元內的一熱交換腔室設一擋部以對進入該熱交換腔室內的一冷卻液體先進行分流,令分流的冷卻流體流到一散熱鰭片單元的周邊後再往該散熱鰭片單元的中間流動,以阻止該冷卻流體直線經過該散熱鰭片單元,該本發明亦選擇搭配設有複數擋流凸體對應該散熱鰭片單元以幫助冷卻液體均勻流經該散熱鰭片單元,詳細結構如下所述。 The present invention provides a liquid cooling heat dissipation structure, for example, a liquid (water) cooling head (water block) is a part of a liquid (water) cooling loop (liquid cooling loop), used to contact a heating element to help the heating element to dissipate heat, And the liquid-cooled heat dissipation structure is connected to the external heat dissipation unit and/or the pump through the pipe body. this hair It is obvious that a block portion is provided in a heat exchange chamber in the liquid-cooled heat dissipation unit to divide a cooling liquid entering the heat exchange chamber first, so that the divided cooling fluid flows to the periphery of a heat dissipation fin unit. Then flow to the middle of the heat dissipation fin unit to prevent the cooling fluid from passing through the heat dissipation fin unit in a straight line. In the present invention, a plurality of baffle protrusions corresponding to the heat dissipation fin unit are also selected to help the cooling liquid flow evenly through the heat dissipation fin unit. The detailed structure of the heat dissipation fin unit is as follows.
請參閱第1A圖為本發明立體分解示意圖;第1B圖為本發明立體組合示意圖;第1C圖係為本發明組合剖視示意圖:第2圖為本發明俯視透視示意圖。如這些圖所示本發明的液冷散熱結構包括一基板11及一蓋體12蓋合該基板11,一熱交換腔室14界定在該基板11與該蓋體12之間供一冷卻液體19流動,及一擋部15設置在該熱交換腔室14內,一散熱鰭片單元13設置在該熱交換腔室14內。該基板11具有一熱交換面111及一熱接觸面112,該蓋體12具有一內側121及一側壁122,該內側121係面對該基板11之熱交換面111且具有一導引道123,一進口124及一出口125分設於該蓋體12上,該進口124連通該熱交換腔室14,該出口125連通該導引道123,該側壁122環設在該蓋體12外緣接合該基板11。一進液接頭21及一出液接頭22分別連接該進口124及出口125。該擋部15係設置在該基板11的熱交換面111或該蓋體12的內側121,且位於進口124後方,除了阻擋該冷卻液體19從進口124流入熱交換腔室14直接流經該散熱鰭片單元13,並且使該冷液體19被分流成兩側再流經散熱鰭片單元13,詳如後述。
Please refer to Figure 1A is a schematic exploded perspective view of the present invention; Figure 1B is a schematic three-dimensional combined schematic view of the present invention; Figure 1C is a schematic cross-sectional view of the combined structure of the present invention; Figure 2 is a schematic top perspective view of the present invention. As shown in these figures, the liquid cooling structure of the present invention includes a
該散熱鰭片單元13具有複數個鰭片131間隔設置且該等鰭片131之間具有流道132,該散熱鰭片單元13具有一頂面134及兩流入側135及兩非流入側136,該頂面134鄰近或鄰接該蓋體12的內側121且對應該導引道123,該兩流入側135係為相對側且連通該等鰭片131之間的流道132,該兩非流入側136亦為相對側且鄰接該兩流入側135。該散熱鰭片單元13係設置或形成在該基板11的熱交換面111
上,亦即該散熱鰭片單元13與該基板11係為一體或非一體製成。另外該兩非流入側136分別鄰近該蓋體12的進口124及出口125,而該擋部15係鄰近該進口124並位於該進口124與該散熱鰭片單元13的非流入側136之間。
The heat dissipation fin unit 13 has a plurality of
再者,本實施圖中表示該散熱鰭片單元13具有複數個散熱鰭片組137,且兩相鄰散熱鰭片組137之間設有一肋部138,該單一肋部138的厚度相較於單一鰭片131的厚度還厚。該散熱鰭片單元13及/或該肋部138係為一體成型在該基板11的熱交換面111上,或與該基板11為分離的個別元件以一結合手段結合(該結合手段例如焊接其包括硬焊、軟焊及超音波焊接等)在該基板11的熱交換面111上。每一肋部138具有一自由端1381(如圖的上端)鄰近該蓋體12的內側121或與該內側121接觸或結合一起。
Furthermore, the present drawing shows that the heat dissipation fin unit 13 has a plurality of heat
在該散熱鰭片單元13與該側壁122之間形成一周邊流道組17在該散熱鰭片單元13的周邊。該周邊流道組11包括一第一周邊流道171、一第二周邊流道172及一第三周邊流道173。其中該第一及第二周邊流道171、172分別位於該等流入側135與側壁122之間,該第三周邊流道173位於該擋部15與該側壁122之間對應該進口124,也就是說該進口124位於該第三周邊流道173的上方,且第三周邊流道173的兩端分別連通該第一及第二周邊流道171、172。另一散熱鰭片單元18選擇設置或形成在該第三周邊流道173且位於該進口124的下方。關於散熱鰭片單元18不侷限於前述的實施,若所對應的發熱元件的發熱區域較少,係可減少散熱鰭片單元18設置在該第三周邊流道173。
A peripheral
該冷卻液體19通過該進液接頭21從該蓋體12的進口124流入該熱交換腔室14的第三周邊流道173,該冷卻液體19不僅被進口124後方的擋部15阻擋直線通過該散熱鰭片單元13,且還被分成兩股相反流向分別從該第三周邊流道173的兩端經過該第一周邊流道171及該第二周邊流道172,然後在第一及第二周邊流道171、172的冷卻液體19進一步從該散熱鰭片單元13的兩流入側135往該散熱鰭片
單元13的一中間流動,然後該冷卻液體19通過該導引道123從該出口125及該出液接頭22流出該熱交換腔室14。其中該肋部138用以阻隔流經每一散熱鰭片組137的冷卻液體19流到另一散熱鰭片組137。藉此設計,以使分流後的冷卻液體19尚未被加熱,且得以用相同的液體溫度流經每一散熱鰭片組137。
The cooling
再者,由於該擋部15阻擋流入該熱交換腔室14的冷卻液體19直線流過散熱鰭片單元13,得以延緩冷卻液體19在熱交換腔室內14的停留時間,使該冷卻液體19可以跟散熱鰭片單元13充分的進行熱交換後再將熱帶走。
Furthermore, since the blocking
請繼續參考第3圖為本發明設有擋流凸體之俯視透視示意圖。如圖所示,在另一實施,複數擋流凸體127在該周邊流道組17,例如分佈在該第一周邊流道171及第二周邊流道172對應該散熱鰭片單元13的該等流入側135,且每一散熱鰭片組137對應到至少兩個相對的擋流凸體127。該等擋流凸體127在本實施表示設置在該蓋體12的側壁122,但不限於此,亦可設置在該基板11的熱交換面111。藉由該每一擋流凸體127使得在該第一周邊流道171及第二周邊流道172流動的冷卻液體19被導引流向該散熱鰭片單元13的每一散熱鰭片組137,減少該冷卻液體19集中在流動方向末端,該冷卻液體19更均勻的在液冷散熱結構內流動。另外,不侷限於前述實施,本發明可以根據不同的散熱需求,使每一散熱鰭片組137對應到多個相對的擋流凸體127。因此,在設計時可根據發熱元件的各發熱區域的溫度不同設置該擋流凸體127,例如在溫度低的區域設置兩個相對的擋流凸體127,溫度高的區域設置四個或更多相對的擋流凸體127。
Please continue to refer to FIG. 3 , which is a schematic top perspective view of the present invention with a flow blocking protrusion. As shown in the figure, in another implementation, a plurality of
請繼續參考第4A至4C圖係為擋流凸體的各種不同形狀之示意圖。如圖所示,前述的擋流凸體127不侷限於半圓形,也可以是三角形(如第4A圖)或方形(如第4B圖)或L形(如第4C圖)等任意幾何形狀。
Please continue to refer to FIGS. 4A to 4C , which are schematic diagrams of various shapes of the baffle protrusions. As shown in the figure, the aforesaid baffle
藉由上述的結構,以使進入熱交換腔室14的冷卻液體19的流場均勻的流動分佈,以減少發熱元件的溫度差異,使得發熱元件溫度均勻分佈。
With the above-mentioned structure, the flow field of the cooling
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but the above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of the application of the present invention should still fall within the scope of the patent of the present invention.
11:基板 11: Substrate
111:熱交換面 111: heat exchange surface
112:熱接觸面 112: Thermal Contact Surface
12:蓋體 12: Cover
121:內側 121: Inside
122:側壁 122: Sidewall
123:導引道 123: Guiding Road
124:進口 124: Import
125:出口 125: Exit
13、18:散熱鰭片單元 13, 18: cooling fin unit
134:頂面 134: top surface
135:流入側 135: Inflow side
136:非流入側 136: Non-inflow side
15:擋部 15: Stopper
21:進液接頭 21: Inlet connector
22:出液接頭 22: Outlet connector
Claims (9)
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN203288577U (en) * | 2013-05-31 | 2013-11-13 | 杭州祥博电气有限公司 | IGBT liquid cooling radiator structure for extra-high voltage flexible DC power transmission |
US20140252585A1 (en) * | 2013-03-08 | 2014-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Cooling Packaged Semiconductor Devices |
TWM511640U (en) * | 2015-08-11 | 2015-11-01 | Cooler Master Co Ltd | Liquid cooling type water-cooling head with diversion design and heat dissipation structure thereof |
CN205161010U (en) * | 2015-11-23 | 2016-04-13 | 深圳市正仁电子有限公司 | Water -cooling board |
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Patent Citations (4)
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US20140252585A1 (en) * | 2013-03-08 | 2014-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Cooling Packaged Semiconductor Devices |
CN203288577U (en) * | 2013-05-31 | 2013-11-13 | 杭州祥博电气有限公司 | IGBT liquid cooling radiator structure for extra-high voltage flexible DC power transmission |
TWM511640U (en) * | 2015-08-11 | 2015-11-01 | Cooler Master Co Ltd | Liquid cooling type water-cooling head with diversion design and heat dissipation structure thereof |
CN205161010U (en) * | 2015-11-23 | 2016-04-13 | 深圳市正仁电子有限公司 | Water -cooling board |
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